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PCB DESIGNING
BY :-
ANANT PRAKASHVERMA
161020012003
Electrical ENGINEERING
Institute of Infrastructure Research And
Management(IITRAM)
History of Printed Circuit Board
• First working device to use a printed circuit board (PCB) was
radio, invented by Paul Eisler. in 1942.
• First double sided PCB were produced in 1947.
• In 1960 multi layer-production began (4+ layer)
• In 2010 PCB production became multi-billion dollar market.
Introduction to a Printed Circuit Board
• A printed circuit board (PCB) :mechanically supports and electrically
connects, electronic components using conductive tracks, pads and other
features etched from copper sheets laminated onto a non-
conductive substrate. Components are generally soldered on PCB.
• PCB's can be single sided (one copper layer), double sided (two copper
layers) or multi-layer.
• A PCB populated with electronic components is called a printed circuit
assembly (PCA), printed circuit board assembly or PCB assembly (PCBA)
• Manufacturing circuit with PCB
is cheaper and faster.
What PCB is made of
• A basic PCB starts with a copper-clad fiberglass material
or thin copper sheets attached to either side of the board. It
consist of :-
Copper Foil
Copper Plating
Solder Flow
Solder Mask
Trace
Slots and Cut-outs
PCB CHARACTERISTICS
• Through-hole technology
The first PCBs used through-hole technology, mounting electronic
components by leads inserted through holes on one side of the board
and soldered onto copper traces on the other side. Boards may be
single-sided, with an un plated component side, or more compact
double-sided boards, with components soldered on both sides
PCB CHARACTERISTICS (cont.)
•Surface-mount technology
Surface-mount technology emerged in the 1960s, gained
momentum in the early 1980s and became widely used by the mid-
1990s. Components were mechanically redesigned to have small
metal tabs or end caps that could be soldered directly onto the PCB
surface, instead of wire leads to pass through holes
FABRICATION
Following are the basic steps of PCB design.
• Imaging
• Panelization
• Depaneling
• Etching
• Drilling
• Assembly
• Electrical Test
FABRICATION (cont.)
• Imaging : before manufacturing the
PCB fabrication data is generated by
computer aided design(CAD),
such as Siemens-NX, Autodesk, etc.
This data is read into the CAM(Computer Aided Manufacturing)
FABRICATION (cont.)
• Panelization : It’s a procedure whereby a number of PCBs
grouped for manufacturing onto a larger board(panel). There
are two type of panels
1. Assembly panel
2.Bare- Board manufacturing panel
FABRICATION (cont.)
• Depaneling: The panel is eventually broken into individual
PCBs. Its done by lasers it cuts the panel and reduce stress on
circuit board
• Copper Patterning : This step is to replicated the pattern on
copper foil. Subsequent etching removes the unwanted copper.
Some of the technique used for hybrid circuit.
1. Silk screen printing .
2. Photoengraving .
3. PCB milling .
4. CNC laser plotter.
FABRICATION (cont.)
Etching process
Chemical etch
• Chemical etching is usually done with
ammonium per sulphate or ferric chloride.
• For PTH (plated-through holes), additional steps of electroless
deposition are done after the holes are drilled, then copper is
electroplated to build up the thickness, the boards are screened,
and plated with tin/lead. The tin/lead becomes the resist leaving
the bare copper to be etched away.
Cont.…
FABRICATION (cont.)
Laser Etch
• A new process creating new standards and the demise of the
chemical process is plasma etch. In addition to no etch-back,
this process also eliminates imaging, or film error using a
direct imaging process, which transfers the layer image directly
to the material
FABRICATION (cont.)
• Drilling: Holes through a PCB are typically drilled with small
diameter drill bits made of tungsten carbide. Drilling is generally
performed by automated drilling machines.
• Assembly: In this step the board is
filled with electronic component ,using
variety of soldering techniques this is
known as printed circuit board assembly
(PCBA).
Industry Applications of PCB
• Automotive Industry
• Medical Industry
• Defence
• Scientific Instrumentation
• Broadcasting
• Power management
• Retail Industry
….etc.
Power supply board
• A power supply is a device that supplies electric power to
an electrical load.
• Power converters that convert one form of electrical energy
to another.
• Power supplies for electronic devices can be broadly divided
into two type
1. Linear power supplies
2. Switching power supplies.
Power supply board (contd.)
• Linear power supplies:
Linear power converters process the input power directly, with all
active power conversion components operating in their linear
operating regions. Example our power meter.
• Switching power supplies:
The input power is converted to AC or to DC pulses before
processing, by components that operate predominantly in non-
linear modes (e.g., transistors)
THANK YOU

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PCB Designing

  • 1. PCB DESIGNING BY :- ANANT PRAKASHVERMA 161020012003 Electrical ENGINEERING Institute of Infrastructure Research And Management(IITRAM)
  • 2. History of Printed Circuit Board • First working device to use a printed circuit board (PCB) was radio, invented by Paul Eisler. in 1942. • First double sided PCB were produced in 1947. • In 1960 multi layer-production began (4+ layer) • In 2010 PCB production became multi-billion dollar market.
  • 3. Introduction to a Printed Circuit Board • A printed circuit board (PCB) :mechanically supports and electrically connects, electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non- conductive substrate. Components are generally soldered on PCB. • PCB's can be single sided (one copper layer), double sided (two copper layers) or multi-layer. • A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB assembly (PCBA) • Manufacturing circuit with PCB is cheaper and faster.
  • 4. What PCB is made of • A basic PCB starts with a copper-clad fiberglass material or thin copper sheets attached to either side of the board. It consist of :- Copper Foil Copper Plating Solder Flow Solder Mask Trace Slots and Cut-outs
  • 5. PCB CHARACTERISTICS • Through-hole technology The first PCBs used through-hole technology, mounting electronic components by leads inserted through holes on one side of the board and soldered onto copper traces on the other side. Boards may be single-sided, with an un plated component side, or more compact double-sided boards, with components soldered on both sides
  • 6. PCB CHARACTERISTICS (cont.) •Surface-mount technology Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s and became widely used by the mid- 1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly onto the PCB surface, instead of wire leads to pass through holes
  • 7. FABRICATION Following are the basic steps of PCB design. • Imaging • Panelization • Depaneling • Etching • Drilling • Assembly • Electrical Test
  • 8. FABRICATION (cont.) • Imaging : before manufacturing the PCB fabrication data is generated by computer aided design(CAD), such as Siemens-NX, Autodesk, etc. This data is read into the CAM(Computer Aided Manufacturing)
  • 9. FABRICATION (cont.) • Panelization : It’s a procedure whereby a number of PCBs grouped for manufacturing onto a larger board(panel). There are two type of panels 1. Assembly panel 2.Bare- Board manufacturing panel
  • 10. FABRICATION (cont.) • Depaneling: The panel is eventually broken into individual PCBs. Its done by lasers it cuts the panel and reduce stress on circuit board • Copper Patterning : This step is to replicated the pattern on copper foil. Subsequent etching removes the unwanted copper. Some of the technique used for hybrid circuit. 1. Silk screen printing . 2. Photoengraving . 3. PCB milling . 4. CNC laser plotter.
  • 11. FABRICATION (cont.) Etching process Chemical etch • Chemical etching is usually done with ammonium per sulphate or ferric chloride. • For PTH (plated-through holes), additional steps of electroless deposition are done after the holes are drilled, then copper is electroplated to build up the thickness, the boards are screened, and plated with tin/lead. The tin/lead becomes the resist leaving the bare copper to be etched away. Cont.…
  • 12. FABRICATION (cont.) Laser Etch • A new process creating new standards and the demise of the chemical process is plasma etch. In addition to no etch-back, this process also eliminates imaging, or film error using a direct imaging process, which transfers the layer image directly to the material
  • 13. FABRICATION (cont.) • Drilling: Holes through a PCB are typically drilled with small diameter drill bits made of tungsten carbide. Drilling is generally performed by automated drilling machines. • Assembly: In this step the board is filled with electronic component ,using variety of soldering techniques this is known as printed circuit board assembly (PCBA).
  • 14. Industry Applications of PCB • Automotive Industry • Medical Industry • Defence • Scientific Instrumentation • Broadcasting • Power management • Retail Industry ….etc.
  • 15. Power supply board • A power supply is a device that supplies electric power to an electrical load. • Power converters that convert one form of electrical energy to another. • Power supplies for electronic devices can be broadly divided into two type 1. Linear power supplies 2. Switching power supplies.
  • 16. Power supply board (contd.) • Linear power supplies: Linear power converters process the input power directly, with all active power conversion components operating in their linear operating regions. Example our power meter. • Switching power supplies: The input power is converted to AC or to DC pulses before processing, by components that operate predominantly in non- linear modes (e.g., transistors)