PCB
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The document discusses the process of printed circuit board (PCB) design, fabrication, and installation. It covers: - The key components of a PCB including pads, traces, vias, and layers - The PCB fabrication process including film generation, drilling, electroplating, imaging, etching, solder mask application, and silkscreening - How components are attached to the board through surface mount or through-hole methods and the importance of carefully soldering to avoid shorts
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Types of PCB Designing Layers
The document discusses three types of printed circuit board (PCB) layers: single sided, double sided, and multiple layers. Single sided PCBs were the original invention and provide a mechanical base for components, though they have limitations with large numbers of connections. Double sided PCBs allow connections on both sides and through holes, addressing complexity issues. Multiple layer PCBs build on double sided by adding internal layers for power and ground, enabling even more complex and compact circuits in a smaller space.
PCB
A printed circuit board (PCB) is used in electronics to build electronic devices. It provides both a place to mount electronic components and the means to electrically connect them. A PCB has conducting copper layers that are typically coated with a green solder mask. Unwanted copper is removed via etching, leaving only the desired copper traces. Components, pads, traces, vias, and metal layers make up the basic structure and function of a PCB.
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This document provides an overview of printed circuit board (PCB) design. It defines a PCB as a board that mechanically supports and electrically connects electronic components using conductive tracks and pads. The document describes the different types of PCBs, including single-sided, double-sided, and multi-layer boards. It outlines the key steps in PCB design, including designing the circuit, placing components, routing wires, and manufacturing. Common PCB design software and features like schematic capture and component placement are also summarized.
Introduction to PCB Design
A printed circuit board (PCB) is a non-conductive board that mechanically supports and electrically connects electronic components using copper tracks etched onto laminated sheets. PCBs can be single-sided, double-sided, or multilayer. They were first developed in the 1930s and are used to build circuit board assemblies, with common types including single-sided, double-sided, and multilayer boards.
pcb
This document discusses printed circuit boards (PCBs). It provides an introduction and overview of what a PCB is, the need for PCBs, types of PCBs including general, trace, single layer and double layer, and the design process for trace PCBs. It also outlines some advantages like lower costs for mass production and reduced wiring, and disadvantages such as difficulty repairing or redesigning a PCB. Finally, it provides some examples of PCB applications.
PCB Designing
Sorry to say but the college spelling is wrong actually "technology" word is missing. Its by mistake.
A presentation on printed circuit board designing. A brief discussion on pcb fabrication. Basic steps involved in it.
Introduction to PCB Designing
A printed circuit board (PCB) is a non-conductive board that mechanically supports and electrically connects electronic components using copper tracks etched onto laminated sheets. PCBs can be single-sided, double-sided, or multilayer. They were first developed in the 1930s and are used to build circuit board assemblies that power today's electronic devices.
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The document discusses printed circuit boards (PCBs) and their evolution and classifications. It explains that PCBs provide electrical connections between circuit components using conductive tracks on a non-conductive substrate. Early electronic designs used point-to-point wiring but PCBs allowed for more reliable connections. Basic PCB types include single-sided, double-sided, and multilayer boards. More advanced types include rigid-flex boards, which combine rigid and flexible areas to fit devices. Proper PCB design is important to address issues like signal interference at high frequencies.
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The document discusses three types of printed circuit board (PCB) layers: single sided, double sided, and multiple layers. Single sided PCBs were the original invention and provide a mechanical base for components, though they have limitations with large numbers of connections. Double sided PCBs allow connections on both sides and through holes, addressing complexity issues. Multiple layer PCBs build on double sided by adding internal layers for power and ground, enabling even more complex and compact circuits in a smaller space.
PCB
A printed circuit board (PCB) is used in electronics to build electronic devices. It provides both a place to mount electronic components and the means to electrically connect them. A PCB has conducting copper layers that are typically coated with a green solder mask. Unwanted copper is removed via etching, leaving only the desired copper traces. Components, pads, traces, vias, and metal layers make up the basic structure and function of a PCB.
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This document provides an overview of printed circuit board (PCB) design. It defines a PCB as a board that mechanically supports and electrically connects electronic components using conductive tracks and pads. The document describes the different types of PCBs, including single-sided, double-sided, and multi-layer boards. It outlines the key steps in PCB design, including designing the circuit, placing components, routing wires, and manufacturing. Common PCB design software and features like schematic capture and component placement are also summarized.
Introduction to PCB Design
A printed circuit board (PCB) is a non-conductive board that mechanically supports and electrically connects electronic components using copper tracks etched onto laminated sheets. PCBs can be single-sided, double-sided, or multilayer. They were first developed in the 1930s and are used to build circuit board assemblies, with common types including single-sided, double-sided, and multilayer boards.
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This document discusses printed circuit boards (PCBs). It provides an introduction and overview of what a PCB is, the need for PCBs, types of PCBs including general, trace, single layer and double layer, and the design process for trace PCBs. It also outlines some advantages like lower costs for mass production and reduced wiring, and disadvantages such as difficulty repairing or redesigning a PCB. Finally, it provides some examples of PCB applications.
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Sorry to say but the college spelling is wrong actually "technology" word is missing. Its by mistake.
A presentation on printed circuit board designing. A brief discussion on pcb fabrication. Basic steps involved in it.
Introduction to PCB Designing
A printed circuit board (PCB) is a non-conductive board that mechanically supports and electrically connects electronic components using copper tracks etched onto laminated sheets. PCBs can be single-sided, double-sided, or multilayer. They were first developed in the 1930s and are used to build circuit board assemblies that power today's electronic devices.
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The document discusses printed circuit boards (PCBs) and their evolution and classifications. It explains that PCBs provide electrical connections between circuit components using conductive tracks on a non-conductive substrate. Early electronic designs used point-to-point wiring but PCBs allowed for more reliable connections. Basic PCB types include single-sided, double-sided, and multilayer boards. More advanced types include rigid-flex boards, which combine rigid and flexible areas to fit devices. Proper PCB design is important to address issues like signal interference at high frequencies.
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A printed circuit board (PCB) is a non-conductive laminated substrate that mechanically supports and electrically connects electronic components using copper tracks, pads and other features etched onto copper sheets. PCBs have evolved from early point-to-point wiring to modern surface mount and multilayer board designs. Key aspects of PCBs include the substrate material (often FR-4 fiberglass), copper patterning process (subtractive or additive), drilling of holes, plating, solder mask and the assembly of electronic components. Modern PCB design utilizes computer-aided manufacturing systems to efficiently layout, simulate and produce circuit boards.
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This document discusses printed circuit board (PCB) design. It begins with an introduction to PCBs, describing how they mechanically support and electrically connect electronic components using conductive tracks on insulating substrates. It then discusses the basic materials that make up PCBs like copper foil and plating. The document outlines the main fabrication steps for PCBs which include setting up, imaging, etching, drilling, masking, and electrical testing. It also describes the characteristics of through-hole and surface mount technology. The etching and assembly processes are explained in more detail. Finally, the document provides an overview of PCB design and routing software like EAGLE and includes an example of a power supply board.
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- Auto-routing is an automated design process where components are automatically routed after placement. Software programs like ISIS and ARES are used for auto-routing.
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The document provides information about printed circuit board design, including requirements specification, computer-aided design procedures, general design principles, and guidelines. It discusses establishing requirements, schematic entry, component placement, routing connections, design rule checks, and plotting. It also covers determining design standards, component outlines, placement techniques, wiring orientation, and considerations for board size and conductor widths/spacings.
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A printed circuit board (PCB) is used in electronics to build electronic devices. It provides a place to mount components and electrical connections between them. PCBs are made of copper foil conducting layers typically coated with a green solder mask. They contain components, pads, traces, and top/bottom metal layers. PCBs must be mounted to a chassis or other PCB/socket and may attach to heat sinks. Their design involves generating films, shearing raw materials, drilling holes, applying copper, photosensitive materials, stripping, etching, solder mask, solder coat, and silkscreening.
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The document discusses printed circuit board (PCB) design. It begins by introducing PCBs and their history. It then describes the main types of PCBs and basic PCB terminology. The document outlines the general PCB design process from schematic design to routing to generating output files for fabrication. It provides guidelines for component placement and introduces PCB design rules to ensure sufficient spacing and avoid electrical issues. Finally, it briefly summarizes the key topics covered in the document.
GabunaMary-Joy-D.Procedures-in-making-PCB.pptx
A printed circuit board mechanically supports and electrically connects electronic components using conductive copper tracks etched onto a non-conductive substrate. PCBs have pre-designed copper tracks that reduce wiring and faults from loose connections. Designing a PCB requires considering the size, shape, and position of components as well as space for heat dissipation, accessibility, and grouping different circuit types. PCB layout is performed manually or using CAD software, though manual routing allows better organization and repair access compared to autorouting. Excess copper is removed through etching using chemicals like ferric chloride, then holes are drilled and components are mounted and soldered to complete the circuit board.
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PCBs are non-conductive boards that hold electronic components and allow electricity to flow through circuitry etched onto their surfaces, and they have been used since the 1940s in devices like radios, computers, and appliances; PCBs can be single sided, double sided, or multilayered and come in rigid, flexible, or rigid-flex styles to suit different applications; They connect components like resistors, capacitors, and ICs through pads and traces on one or more metal layers.
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This document discusses the different types of layers used in a printed circuit board (PCB) layout. It describes 11 layers: the global layer defines component boundaries; the top and bottom layers are where components are mounted; inner layers separate top and bottom layers in multilayer PCBs; solder mask layers protect copper traces; solder paste layers define solder areas; silk screen layers contain text and markings; assembly layers define component shapes; and drill layers specify hole diameters. Each layer serves a distinct purpose in the PCB design and manufacturing process.
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This document summarizes the process of designing and fabricating a small printed circuit board (PCB). It begins with defining a PCB and providing a brief history. It then discusses types of PCBs, common materials used, and the key steps to fabricating a PCB which include: 1) Simulating a circuit design using software, 2) Designing the PCB layout, 3) Printing the design onto the PCB board using iron and acid, and 4) Placing components and soldering them into place. The document uses a simple circuit as an example to demonstrate the full PCB fabrication process from start to finish.
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This document provides guidelines for PCB design, including key principles of current flow, coupling, and stackup goals. It discusses protection devices, power generation, routing traces, vias, copper pours, grounding, decoupling capacitors, component selection, circuit mounting, and layout programs. Manufacturers for PCB ordering are also listed.
Pcb designing
This document discusses printed circuit board (PCB) design. It begins with an introduction to PCBs, describing how they mechanically support and electrically connect electronic components using conductive tracks on insulating substrates. It then discusses the basic materials that make up PCBs like copper foil and plating. The document outlines the main fabrication steps for PCBs which include setting up, imaging, etching, drilling, masking, and electrical testing. It also describes the characteristics of through-hole and surface mount technology. The etching and assembly processes are explained in more detail. Finally, the document provides an overview of PCB design and routing software like EAGLE and includes an example of a power supply board.
Introduction to PCB Design (Eagle)
A class to introduce students to designing Printed Circuit Boards (PCBs) using the Eagle software. Reflow soldering with stencil and solder paste will also be covered. This class was originally held by me at One Maker Group.
The lesson should take approximately 6 hours to complete.
The example designs used in this class can be found in the repo here. https://github.com/yeokm1/intro-to-pcb-design-eagle
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This PPT Gives information about:
1. PCB computer aided manufacturing,
2. Panelization,
3. Copper patterning,
4. Subtractive, additive and semi-additive processes Patterning 5. method by volume,
6. Large volume,
7. Small volume,
8. Hobbyist,
9. Chemical etching
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The document provides information about designing a printed circuit board (PCB) using the KiCAD software. It begins with an overview of KiCAD, an open source electronic design automation software suite for schematic capture and PCB layout. It then describes the four main steps to designing a PCB in KiCAD: 1) creating schematic diagrams using the Eeschema editor, 2) associating components using Cvpcb, 3) laying out the PCB using Pcbnew, and 4) generating output files using Gerbview. The document concludes with an example of using KiCAD to design an astable multivibrator circuit using a 555 timer integrated circuit.
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This document provides an overview of printed circuit board (PCB) manufacturing. It discusses various stages of the PCB manufacturing process including laminate fabrication, copper deposition, photolithography, etching, drilling, surface finishing techniques like solder masking and hot air leveling. It also covers different types of PCBs like single sided, double sided, multilayer and flexible PCBs. Various material options for PCB substrates and their properties are described. Manufacturing processes for different PCB components are outlined.
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- PCBs mechanically support and electrically connect electronic components using conductive tracks etched onto a non-conductive substrate. PCBs can be single layer, double layer, or multi-layer.
- Auto-routing is an automated design process where components are automatically routed after placement. Software programs like ISIS and ARES are used for auto-routing.
- There are different methods for PCB fabrication including hand/home made, small factories using screen printing processes, and large automated industrial facilities. Basic design considerations include tracks, drills, clearances, and component packages.
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The document discusses the process of electronics assembly, which involves attaching component leads to circuit boards through soldering. It describes the key steps of the assembly process, including component placement using surface mount technology (SMT), solder paste application, reflow soldering, and inspection techniques. Examples are provided of different component types, printed wiring boards, and potential defects from improper soldering.
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A printed circuit board (PCB) is used in electronics to build electronic devices. It provides a place to mount components and electrical connections between them. PCBs are made of copper foil conducting layers typically coated with a green solder mask. They contain components, pads, traces, and top/bottom metal layers. PCBs must be mounted to a chassis or other PCB/socket and may attach to heat sinks. Their design involves generating films, shearing raw materials, drilling holes, applying copper, photosensitive materials, stripping, etching, solder mask, solder coat, and silkscreening.
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The document discusses printed circuit board (PCB) design. It begins by introducing PCBs and their history. It then describes the main types of PCBs and basic PCB terminology. The document outlines the general PCB design process from schematic design to routing to generating output files for fabrication. It provides guidelines for component placement and introduces PCB design rules to ensure sufficient spacing and avoid electrical issues. Finally, it briefly summarizes the key topics covered in the document.
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A printed circuit board mechanically supports and electrically connects electronic components using conductive copper tracks etched onto a non-conductive substrate. PCBs have pre-designed copper tracks that reduce wiring and faults from loose connections. Designing a PCB requires considering the size, shape, and position of components as well as space for heat dissipation, accessibility, and grouping different circuit types. PCB layout is performed manually or using CAD software, though manual routing allows better organization and repair access compared to autorouting. Excess copper is removed through etching using chemicals like ferric chloride, then holes are drilled and components are mounted and soldered to complete the circuit board.
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PCB assembly is crucial across industries for integrating electronic components into functional systems. In consumer electronics, it enables compact designs and mass production of devices like smartphones. In automotive, it powers vital systems like ECUs and infotainment. In aerospace and defense, it ensures reliability in avionics and radar systems. Healthcare relies on it for precise medical devices, and industrial automation benefits from efficient control systems. Overall, PCB assembly drives innovation, reliability, and efficiency across diverse sectors
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1. Surface mount technology (SMT) involves mounting electronic components directly onto the surface of printed circuit boards, without leads inserted into holes. This allows for higher circuit densities and smaller components compared to traditional through-hole technology.
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2. Key SMT processes include solder paste application, component placement, soldering via reflow or wave soldering methods, cleaning, and potential repair or rework.
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Take a look at Altium's resources for electrical engineers and PCB designers here.
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Paul Eisle was the first man to create the printed circuit board in the year 1936. However, it was in the 1950s that the US Defense Industry started integrating PCBs in the bomb detonator mechanisms. This made way for the wide application of PCBs throughout the world. These days, PCBs are widely used in almost all finished products like automobiles, personal computers and cellular telephones.
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This document provides definitions for many common terms related to printed circuit boards (PCBs). It begins with an introduction to PCB terminology and includes a glossary defining terms like active components, analog circuits, arrays, back drilling, board types, buried vias, CAD, CAM files, coatings, components, connectors, copper weight, cutouts, daughter boards, decals, digital circuits, and more. The glossary offers concise explanations of over 50 important PCB and electronics manufacturing terms.
Surface mount technology(smt)
The document discusses Surface Mount Technology (SMT) used in electronic circuit board production. SMT involves mounting electronic components directly onto the surface of printed circuit boards rather than inserting them into holes. The key steps of SMT include receiving printed circuit boards, applying glue, placing chips and integrated circuits using specialized machines, curing the boards in a reflow oven, conducting visual and automated inspections, and any needed repairs. The document outlines the advantages of SMT, such as higher component density, improved mechanical and electrical performance, and faster automated assembly.
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Importance of PCB assembly in Various Industries | Suntronic Inc |
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Complete overview of the circuit board fabrication procedure
Complete overview of the circuit board fabrication procedure
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Transistor s06
This document summarizes different types of transistors, including Bipolar Junction Transistors (BJT), Unijunction Transistors (UJT), Field Effect Transistors (FET), Metal-Oxide-Semiconductor Field Effect Transistors (MOSFET), FinFETs, and Dualgate transistors. It describes the basic structure and functioning of BJTs, including PNP and NPN types, and provides information on UJTs, FETs including n-channel and p-channel types, MOSFETs, FinFETs which use a 3D "fin" design, and Dualgate transistors which incorporate more than one gate.
Transformer
The document provides information about transformers, including:
1. Transformers are AC devices that change high voltage low current into low voltage high current and vice versa without changing frequency through electromagnetic induction between two electric circuits.
2. Transformers operate on the principle of mutual induction, where an emf is induced in one coil by a change in current in a neighboring coil.
3. The main components of a transformer are the laminated core and two windings - the primary and secondary windings. High voltage coils have smaller cross sections than low voltage coils.
Solar energy presentation 0220
1. Solar panels absorb sunlight to generate electricity through the photovoltaic effect using crystalline silicon cells or thin-film cells arranged in modules.
2. The efficiency of solar panels determines the area needed, with more efficient panels requiring less space to produce the same output.
3. Solar panels convert sunlight into electricity, which is then converted by solar inverters from DC to AC power through maximum power point tracking to extract the maximum available power.
Semiconductors
This document discusses semiconductors and diodes. It defines P-type and N-type semiconductors, where P-type materials have holes as majority carriers and are positively charged, and N-type materials have electrons as majority carriers and are negatively charged. Diodes are electronic devices created by joining a P-type and N-type semiconductor, and are used for rectification and other applications. The document goes on to explain forward and reverse bias of diodes, their I-V characteristics including the Shockley equation, and applications of diodes such as rectification.
NDT and DT
This presentation discusses non-destructive testing (NDT) and destructive testing (DT). NDT techniques like ultrasonic testing, radiography, and eddy current testing are used to evaluate materials and components without damaging them. This allows for safety, reliability, and cost-effective testing over the lifetime of a product. Destructive testing involves testing samples until failure to understand material properties and identify weaknesses. While more informative, destructive testing is not practical for mass-produced items. Both techniques have important applications in manufacturing for process and quality control.
Quality presentation
The document presents concepts related to quality including quality, quality control, quality assurance, quality management, and total quality management. It defines quality as the totality of features and characteristics that allow a product to meet stated or implied needs. Quality control is the process of reviewing all production factors to fulfill quality requirements, with an emphasis on controls, processes, competence, and soft elements. Quality assurance aims to prevent defects and problems when delivering solutions, focusing on providing confidence that requirements will be met. Quality management is a systematic set of documented and maintained operating procedures ensuring consistent business growth through quality planning, assurance, control, and improvement. Total quality management is defined as a process aimed at increasing stakeholder satisfaction through individual and organizational development.
Intro to maintenance
The document discusses the importance of maintenance for productivity, quality, safety and profitability. It outlines different types of maintenance including corrective, preventive and predictive maintenance. Corrective maintenance involves repairs after equipment fails, while preventive maintenance aims to reduce breakdowns through scheduled inspections and minor repairs. The benefits of preventive maintenance include reduced downtime, lower repair costs, improved safety and quality, and extended equipment lifespan. The document emphasizes that the costs of equipment failure, including lost production and delayed shipments, can outweigh the costs of proper maintenance.
Integrated circuits
This document provides an overview of integrated circuits and operational amplifiers. It begins with an introduction to amplifiers and their use to boost electrical signals. It then defines an operational amplifier as a type of high-gain DC amplifier with two inputs and one output. The document discusses the symbol and pin configuration of an op-amp, and describes inverting and non-inverting modes and how to calculate gain. It also provides examples of different types of amplifiers such as audio frequency, intermediate frequency, radio frequency, ultrasonic, and wide band amplifiers.
Embeded system
This document provides an overview of embedded systems and microcontrollers including the 8051 and 8086. It discusses key aspects of embedded systems such as they combine both hardware and software to perform a specific task. Examples are given of microcontrollers that control functions like engine control. The document then focuses on details of the 8051 microcontroller including its features, pins, and ports. It also provides details on the architecture and components of the 8086 microprocessor such as its execution unit, registers, bus interface unit, and segment registers.
Diodes
The presentation discusses diodes, rectifiers, and filters. It introduces diodes and how they allow current to pass in only one direction. It describes two types of rectifiers - half wave and full wave - that convert alternating current to direct current. Finally, it discusses two types of filters - passive filters using resistors, inductors and capacitors, and active filters that also incorporate amplifying components like operational amplifiers.
Capacitors
This document discusses energy storage devices known as capacitors. It describes the basic construction of a capacitor using two conductive plates separated by an insulating material. The capacitance of a capacitor depends on the plate area, distance between plates, and the dielectric material. Several types of capacitors are introduced, including fixed, electrolytic, variable, and electric double layer capacitors. The key electrical properties of capacitors are explained, such as how charge is stored, the relationship between charge, voltage, and capacitance, and equations for charging, discharging, power, and equivalent capacitance.
Active and passive
The document discusses active and passive components in electronics. It defines passive components as circuit elements that receive and store energy in electric or magnetic fields, but cannot continuously deliver power. Passive components mentioned include capacitors, inductors, and transformers. Active components are defined as having gain or ability to control voltage/current, and include transistors and integrated circuits. The document provides examples of capacitors, inductors, and transformers as passive elements, and contrasts them with transistors as active elements.
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一比一原版(YU毕业证)约克大学毕业证如何办理
YU毕业证文凭证书【微信95270640】（约克大学毕业证高仿学位证书((+《Q微信95270640》))）购买YU毕业证修改YU成绩单购买约克大学毕业证办YU文凭办高仿毕业证约克大学毕业证购买修改成绩单挂科退学如何进行学历认证留学退学办毕业证书/ 出国留学无法毕业买毕业证留学被劝退买毕业证（非正常毕业教育部认证咨询） York University
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十年年留学服务公司,拥有海外样板无数能完美1:1还原海外各国大学等毕业材料。
海外大学毕业材料都有哪些工艺呢？凭借多年的制作经验本公司制作1:1原版高度还原约克大学约克大学毕业证学历书工艺由：《激光》《水印》《钢印》《烫金》《底纹》《防伪光标》《热敏防伪》《紫外线》凹凸版uv版等防伪技术一流高精仿度几乎跟学校100%相同！让您绝对满意。而且我们每天都在更新海外文凭的样板以求所有同学都能享受到完美的品质服务。
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国外毕业证学位证成绩单办理流程：
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5 Common Mistakes to Avoid During the Job Application Process.pdf
The journey toward landing your dream job can be both exhilarating and nerve-wracking. As you navigate through the intricate web of job applications, interviews, and follow-ups, it’s crucial to steer clear of common pitfalls that could hinder your chances. Let’s delve into some of the most frequent mistakes applicants make during the job application process and explore how you can sidestep them. Plus, we’ll highlight how Alliance Job Search can enhance your local job hunt.
一比一原版(UVic毕业证)维多利亚大学毕业证如何办理
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Resumes, Cover Letters, and Applying Online
This webinar showcases resume styles and the elements that go into building your resume. Every job application requires unique skills, and this session will show you how to improve your resume to match the jobs to which you are applying. Additionally, we will discuss cover letters and learn about ideas to include. Every job application requires unique skills so learn ways to give you the best chance of success when applying for a new position. Learn how to take advantage of all the features when uploading a job application to a company’s applicant tracking system.
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2开始安排制作毕业证成绩单电子图；
3毕业证成绩单电子版做好以后发送给您确认；
4毕业证成绩单电子版您确认信息无误之后安排制作成品；
5成品做好拍照或者视频给您确认；
6快递给客户（国内顺丰国外DHLUPS等快读邮寄）
真实网上可查的证明材料
1教育部学历学位认证留服官网真实存档可查永久存档。
2留学回国人员证明（使馆认证）使馆网站真实存档可查。
我们对海外大学及学院的毕业证成绩单所使用的材料尺寸大小防伪结构（包括：多伦多都会大学多伦多都会大学毕业证学位证隐形水印阴影底纹钢印LOGO烫金烫银LOGO烫金烫银复合重叠。文字图案浮雕激光镭射紫外荧光温感复印防伪）都有原版本文凭对照。质量得到了广大海外客户群体的认可同时和海外学校留学中介做到与时俱进及时掌握各大院校的（毕业证成绩单资格证结业证录取通知书在读证明等相关材料）的版本更新信息能够在第一时间掌握最新的海外学历文凭的样版尺寸大小纸张材质防伪技术等等并在第一时间收集到原版实物以求达到客户的需求。
本公司还可以按照客户原版印刷制作且能够达到客户理想的要求。有需要办理证件的客户请联系我们在线客服中心微信：95270640 或咨询在线高楼最底屋最下面很矮很黑是很不显眼的地下室父亲的家安在别人脚底下须绕过高楼旁边的垃圾堆下八个台阶才到父亲的家很狭小除了一张单人床和一张小方桌几乎没有多余的空间山娃一下子就联想起学校的男小便处山娃很想笑却怎么也笑不出来山娃很迷惑父亲的家除了一扇小铁门连窗户也没有墓穴一般阴森森有些骇人父亲的城也便成了山娃的城父亲的家也便成了山娃的家父亲让山娃呆在屋里做作业看电视最多只能在门口透透气不能跟陌生人搭腔更家
官方认证美国旧金山州立大学毕业证学位证书案例原版一模一样
原版一模一样【微信：741003700 】【美国旧金山州立大学毕业证学位证书】【微信：741003700 】学位证，留信认证（真实可查，永久存档）offer、雅思、外壳等材料/诚信可靠,可直接看成品样本，帮您解决无法毕业带来的各种难题！外壳，原版制作，诚信可靠，可直接看成品样本。行业标杆！精益求精，诚心合作，真诚制作！多年品质 ,按需精细制作，24小时接单,全套进口原装设备。十五年致力于帮助留学生解决难题，包您满意。
本公司拥有海外各大学样板无数，能完美还原海外各大学 Bachelor Diploma degree, Master Degree Diploma
1:1完美还原海外各大学毕业材料上的工艺：水印，阴影底纹，钢印LOGO烫金烫银，LOGO烫金烫银复合重叠。文字图案浮雕、激光镭射、紫外荧光、温感、复印防伪等防伪工艺。材料咨询办理、认证咨询办理请加学历顾问Q/微741003700
留信网认证的作用:
1:该专业认证可证明留学生真实身份
2:同时对留学生所学专业登记给予评定
3:国家专业人才认证中心颁发入库证书
4:这个认证书并且可以归档倒地方
5:凡事获得留信网入网的信息将会逐步更新到个人身份内，将在公安局网内查询个人身份证信息后，同步读取人才网入库信息
6:个人职称评审加20分
7:个人信誉贷款加10分
8:在国家人才网主办的国家网络招聘大会中纳入资料，供国家高端企业选择人才
A Guide to a Winning Interview June 2024
This webinar is an in-depth review of the interview process. Preparation is a key element to acing an interview. Learn the best approaches from the initial phone screen to the face-to-face meeting with the hiring manager. You will hear great answers to several standard questions, including the dreaded “Tell Me About Yourself”.
一比一原版(UBC毕业证)不列颠哥伦比亚大学毕业证如何办理
UBC硕士学位证成绩单【微信95270640】办理UBC毕业证【Q微信95270640】不列颠哥伦比亚大学毕业证书原版↑制作不列颠哥伦比亚大学学历认证文凭办理不列颠哥伦比亚大学留信网认证,留学回国办理毕业证成绩单文凭学历认证【Q微信95270640】专业为海外学子办理毕业证成绩单、文凭制作，学历仿制，回国人员证明、做文凭，研究生、本科、硕士学历认证、留信认证、结业证、学位证书样本、美国教育部认证百分百真实存档可查】
【实体公司】办不列颠哥伦比亚大学不列颠哥伦比亚大学毕业证成绩单学历认证学位证文凭认证办留信网认证办留服认证办教育部认证（网上可查实体公司专业可靠）
— — — 留学归国服务中心 — — -
【主营项目】
一.不列颠哥伦比亚大学毕业证成绩单使馆认证教育部认证成绩单等！
二.真实使馆公证(即留学回国人员证明,不成功不收费)
三.真实教育部学历学位认证（教育部存档！教育部留服网站永久可查）
四.办理各国各大学文凭(一对一专业服务,可全程监控跟踪进度)
国外毕业证学位证成绩单办理流程：
1客户提供不列颠哥伦比亚大学不列颠哥伦比亚大学毕业证成绩单办理信息：姓名生日专业学位毕业时间等（如信息不确定可以咨询顾问：我们有专业老师帮你查询）；
2开始安排制作毕业证成绩单电子图；
3毕业证成绩单电子版做好以后发送给您确认；
4毕业证成绩单电子版您确认信息无误之后安排制作成品；
5成品做好拍照或者视频给您确认；
6快递给客户（国内顺丰国外DHLUPS等快读邮寄）。
专业服务请勿犹豫联系我！本公司是留学创业和海归创业者们的桥梁。一次办理终生受用一步到位高效服务。详情请在线咨询办理,欢迎有诚意办理的客户咨询!洽谈。
招聘代理：本公司诚聘英国加拿大澳洲新西兰美国法国德国新加坡各地代理人员如果你有业余时间有兴趣就请联系我们咨询顾问：+微信:95270640伟大了居然能单匹马地跑到这么远这么大这么美的地方赚大钱高楼大厦鳞次栉比大街小巷人潮涌动山娃一路张望一路惊叹他发现城里的桥居然层层叠叠扭来扭去桥下没水却有着水一般的车水马龙山娃惊诧于城里的公交车那么大那么美不用买票乖乖地掷下二枚硬币空调享受还能坐着看电视呢屡经辗转山娃终于跟着父亲到家了山娃没想到父亲城里的家会如此寒碜更没料到父亲的城里竟有如此简陋的鬼地方父亲的家在高楼最底屋最下面很矮很黑是很不显各
Leadership Ambassador club Adventist module
Aims to equip people who aspire to become leaders with good qualities,and with Christian values and morals as per Biblical teachings.The you who aspire to be leaders should first read and understand what the ambassador module for leadership says about leadership and marry that to what the bible says.Christians sh
原版制作(RMIT毕业证书)墨尔本皇家理工大学毕业证在读证明一模一样
学校原件一模一样【微信：741003700 】《(RMIT毕业证书)墨尔本皇家理工大学毕业证在读证明》【微信：741003700 】学位证，留信认证（真实可查，永久存档）原件一模一样纸张工艺/offer、雅思、外壳等材料/诚信可靠,可直接看成品样本，帮您解决无法毕业带来的各种难题！外壳，原版制作，诚信可靠，可直接看成品样本。行业标杆！精益求精，诚心合作，真诚制作！多年品质 ,按需精细制作，24小时接单,全套进口原装设备。十五年致力于帮助留学生解决难题，包您满意。
本公司拥有海外各大学样板无数，能完美还原。
1:1完美还原海外各大学毕业材料上的工艺：水印，阴影底纹，钢印LOGO烫金烫银，LOGO烫金烫银复合重叠。文字图案浮雕、激光镭射、紫外荧光、温感、复印防伪等防伪工艺。材料咨询办理、认证咨询办理请加学历顾问Q/微741003700
【主营项目】
一.毕业证【q微741003700】成绩单、使馆认证、教育部认证、雅思托福成绩单、学生卡等！
二.真实使馆公证(即留学回国人员证明,不成功不收费)
三.真实教育部学历学位认证（教育部存档！教育部留服网站永久可查）
四.办理各国各大学文凭(一对一专业服务,可全程监控跟踪进度)
如果您处于以下几种情况：
◇在校期间，因各种原因未能顺利毕业……拿不到官方毕业证【q/微741003700】
◇面对父母的压力，希望尽快拿到；
◇不清楚认证流程以及材料该如何准备；
◇回国时间很长，忘记办理；
◇回国马上就要找工作，办给用人单位看；
◇企事业单位必须要求办理的
◇需要报考公务员、购买免税车、落转户口
◇申请留学生创业基金
留信网认证的作用:
1:该专业认证可证明留学生真实身份
2:同时对留学生所学专业登记给予评定
3:国家专业人才认证中心颁发入库证书
4:这个认证书并且可以归档倒地方
5:凡事获得留信网入网的信息将会逐步更新到个人身份内，将在公安局网内查询个人身份证信息后，同步读取人才网入库信息
6:个人职称评审加20分
7:个人信誉贷款加10分
8:在国家人才网主办的国家网络招聘大会中纳入资料，供国家高端企业选择人才
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PCB
- 1. Presentation on - PCB Design, fabrication,Installation SUNEEL KUMAR By-
- 2. PCB FABRICATION PCB DESIGNING INSTALLATION
- 3. Printed Circuit Board Electronic Board that connects circuit components PCB populated with electronic components is a printed circuit assembly (PCA) PCBs are rugged, inexpensive, and can be highly reliable Mass manufacturing Professional
- 4. Conducting layers are typically made of thin copper foil. The board is typically coated with a solder mask that is green in color. Other colors that are normally available are blue and red. Unwanted copper is removed from the substrate after etching leaving only the desired copper traces or pathways
- 5. Components Pads Traces Vias Top Metal Layer Bottom Metal Layer
- 6. Components are the actual devices used in the circuit. This includes input/output connections. I/O ports, including power supply connections, are also important in the PCB design.
- 7. Location that components connect to. You will solder components to the pads on the PCB. Pads will connect to traces. Pads have an inner diameter and outer diameter.
- 8. Traces connect pads together. Traces are essentially the wiring of the PCB. Equivalent to wire for conducting signals Traces sometimes connect to vias. High current traces should be wide. Signal traces usually narrower than power or ground traces
- 9. Pad with a plated hole connecting traces from one layer of board to other layers. Attempt to minimize via use in your PCBs. Some component leads can be used as vias.
- 10. Most of the components reside on the top layer Fewer traces on the top layer Components are soldered to the pads on the top layer of PCB Higher circuit densities
- 11. Few components on this layer. Many traces on this layer. Most soldering done on this layer.
- 12. Protect copper traces on outer layers from corrosion Areas that shouldn't be soldered may be covered with polymer resist solder mask coating Designed to keep solder only in certain areas Prevents solder form binding between conductors and thereby creating short circuits
- 13. 1. Film Generation 2. Shear Raw Material 3. Drill Holes Industry standard 0.059" thick, copper clad, two sides
- 14. 4. Electrolus copper Apply copper in hole barrels 5. Apply Image Apply Photosensitive Material to develop selected areas from panel
- 15. 6. Strip and Etch •Remove dryfilm, then etch exposed copper •Tin protects the copper circuitry from being etched 7. Solder Mask Apply solder mask area to entire board with the exception of solder pads
- 16. 8. Solder Coat 9. Silkscreen Apply white letter marking using screen printing process Apply solder to pads
- 18. • The film is generated from the design files (Gerber files). which are sent to the manufacturing house. One film is generated per layer.
- 19. Industry standard 0.059” thick, copper clad panel.
- 20. Using NC machines and carbide drills to drill holes according to the drill spec sent to the manufacturing house.
- 21. • Apply copper in hole barrels.
- 22. • Apply Photosensitive Material to develop selected areas from panel.
- 23. First Look At PCB DESIGNING
- 29. •CAD tools provide auto-router and board wizard functionality. •In reality, PCB designers don’t use an auto-router. •The technology behind an auto- router has a science of its own, drawing from disciplines such asartificial intelligence, algorithms, and heuristic ultimatelyattempting to solve the traveling salesman problem. •The irony is, only a very experienced PCB designer can take advantage of an auto-router, and even then, it is only used for a fraction of the board.
- 31. •The Check Design (DRC) Rule checksthe board you designed against a set of rules to determine if you made any errors. •The Design Rules of a board can be through themodified Design Rules dialog, appears ifwhich DRC selected the command is without a terminating.
- 33. These components can be attached to the board in various ways. In general, an engineer will choose to use either the surface mount method or the through-hole method to attach the components. Following a schematic pattern and using the numbers on the silkscreen, the engineer uses solder to attach the components to the board. The engineer must be very careful when soldering. As solder is a metal that an engineer melts so that they can manipulate it. Any stray blobs that are out of place and touch other metal components could cause the circuit to short. This can be dangerous, causing fires or even small explosions. When the components are installed correctly, the PCB is ready to be used in a device.