The document discusses the process of printed circuit board (PCB) design, fabrication, and installation. It covers: - The key components of a PCB including pads, traces, vias, and layers - The PCB fabrication process including film generation, drilling, electroplating, imaging, etching, solder mask application, and silkscreening - How components are attached to the board through surface mount or through-hole methods and the importance of carefully soldering to avoid shorts

1. Presentation on - PCB Design,
fabrication,Installation
SUNEEL KUMAR
By-

2.  PCB
 FABRICATION
 PCB DESIGNING
 INSTALLATION

3.  Printed Circuit Board
 Electronic Board that connects circuit
components
 PCB populated with electronic components
is a printed circuit assembly (PCA)
 PCBs are rugged, inexpensive, and can be
highly reliable
 Mass manufacturing
 Professional

4.  Conducting layers are typically made of
thin copper foil.
 The board is typically coated with a solder
mask that is green in color. Other colors
that are normally available are blue and
red.
 Unwanted copper is removed from the
substrate after etching leaving only the
desired copper traces or pathways

5.  Components
 Pads
 Traces
 Vias
 Top Metal Layer
 Bottom Metal Layer

6.  Components are the actual devices
used in the circuit.
 This includes input/output connections.
 I/O ports, including power supply
connections, are also important in the
PCB design.

7.  Location that components connect to.
 You will solder components to the pads
on the PCB.
 Pads will connect to traces.
 Pads have an inner diameter and outer
diameter.

8.  Traces connect pads together.
 Traces are essentially the wiring of the
PCB.
 Equivalent to wire for conducting signals
 Traces sometimes connect to vias.
 High current traces should be wide.
 Signal traces usually narrower than
power or ground traces

9.  Pad with a plated hole connecting
traces from one layer of board to other
layers.
 Attempt to minimize via use in your
PCBs.
 Some component leads can be used as
vias.

10.  Most of the components
reside on the top layer
 Fewer traces on the top
layer
 Components are soldered
to the pads on the top
layer of PCB
 Higher circuit densities

11.  Few components on this layer.
 Many traces on this layer.
 Most soldering done on this layer.

12.  Protect copper traces on outer layers from
corrosion
 Areas that shouldn't be soldered may be
covered with polymer resist solder mask
coating
 Designed to keep solder only in certain
areas
 Prevents solder form binding between
conductors and thereby creating short
circuits

13. 1. Film Generation 2. Shear Raw Material
3. Drill Holes Industry standard
0.059" thick, copper
clad, two sides

14. 4. Electrolus copper
Apply copper in hole barrels
5. Apply Image
Apply Photosensitive Material to
develop selected areas from
panel

15. 6. Strip and Etch
•Remove dryfilm, then
etch exposed copper
•Tin protects the copper
circuitry from being
etched
7. Solder Mask
Apply solder mask area to
entire board with the exception
of solder pads

16. 8. Solder Coat 9. Silkscreen
Apply white letter marking
using screen printing
process
Apply solder to pads

18. • The film is generated from the design files (Gerber files). which
are sent to the manufacturing house. One film is generated per
layer.

19. Industry standard 0.059” thick, copper clad
panel.

20. Using NC machines and carbide drills to drill holes according to the
drill spec sent to the manufacturing house.

21. • Apply copper in hole barrels.

22. • Apply Photosensitive Material to develop selected areas
from panel.

23. First Look At
PCB DESIGNING

29. •CAD tools provide auto-router
and board wizard functionality.
•In reality, PCB designers
don’t
use an auto-router.
•The technology behind an auto-
router has a science of its own,
drawing from disciplines such asartificial intelligence,
algorithms, and
heuristic
ultimatelyattempting to solve the traveling
salesman problem.
•The irony is, only a very
experienced PCB designer can
take advantage of an auto-router,
and even then, it is only used for a
fraction of the board.

31. •The
Check
Design
(DRC)
Rule
checksthe board you designed
against a set of rules to
determine if you made
any errors.
•The Design Rules of
a board can be
through themodified
Design Rules dialog,
appears ifwhich
DRC
selected
the
command
is
without
a
terminating.

33. These components can be attached to the board in
various ways. In general, an engineer will choose to use
either the surface mount method or the through-hole
method to attach the components. Following a
schematic pattern and using the numbers on the
silkscreen, the engineer uses solder to attach the
components to the board. The engineer must be very
careful when soldering. As solder is a metal that an
engineer melts so that they can manipulate it. Any stray
blobs that are out of place and touch other metal
components could cause the circuit to short. This can be
dangerous, causing fires or even small explosions. When
the components are installed correctly, the PCB is ready to
be used in a device.