SlideShare a Scribd company logo
Paul Eisle was the first man to create the
printed circuit board in the year 1936.
However, it was in the 1950s that the US
Defence Industry started integrating
PCBs in the bomb detonator
mechanisms. This made way for the
wide application of PCBs throughout the
world. These days, PCBs are widely
used in almost all finished products like
automobiles, personal computers and
cellular telephones.
Complete Overview of the Circuit Board
Fabrication Procedure
408.452.1500
800.814.3680
What is the Circuit Board
Fabrication Procedure?
Circuit board fabrication:-
Is a procedure that is generally carried out
using two software varieties and they are
CAM or Computer Aided Manufacturing
software and CAD or Computer Aided
Design software. The CAD software is
used for designing the electronic schematic
of the circuit that needs to be
manufactured. Post designing the
schematic, engineers use the CAM
software for producing the PCB prototype.
Post completing the design of the PCB
prototype, the very first step of the fabrication
procedure is selecting the material for making
the PCB. A huge variety of PCB materials are
available. However, the ones popularly used
depend on the requirements and the
application of the customers. These include
FR4, CEM5, Arlon, Alumina, Bakelite, FR1,
CEM1, Ge Tek, Ceramic, FR4 High
Temperature, Rogers and Polyimide. The
PCB dimensions are dictated by the design
requirements of the users.
Selecting the PCB Material
Once the PCB material is selected, the
first thing that is to be done is applying the
copper coating to the PCB. The
photosensitive procedure is then used for
printing the layout of the circuit on the
board. The photoengraving procedure is
then used for removing or etching out the
copper that is not a part of the circuit
layout. Copper left out on the board
creates tracks or traces of PCB circuit.
Applying the Copper Coating
There are two procedures used for
connecting the circuit traces and they are
the mechanical milling procedure and the
silk-screen, etch-resistant printing
procedure. The mechanical milling
procedure used CNC machines for
removing unwanted copper from the
circuit board. The silk-screen, etch-
resistant printing procedure is used for
covering the areas where traces should
Connecting the Circuit Traces
Holes need to be drilled at points where
electronic and electrical parts are positioned
on the circuit board in order to mount the
circuit components. Special varieties of drill
bits or lasers are used for drilling these holes.
Once the drilling procedure is completed,
hollow rivets are packed into the holes for
creating electrical connection between
different layers of the circuit board. This can
also be done by coating the holes by way of
electroplating procedure.
Mounting the Circuit
Components
Holes need to be drilled at points where electronic
and electrical parts are positioned on the circuit
board in order to mount the circuit components.
Special varieties of drill bits or lasers are used for
drilling these holes. Once the drilling procedure is
completed, hollow rivets are packed into the holes
for creating electrical connection between different
layers of the circuit board. This can also be done by
coating the holes by way of electroplating
procedure.
http://www.shax-eng.com/

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Complete overview of the circuit board fabrication procedure

  • 1. Paul Eisle was the first man to create the printed circuit board in the year 1936. However, it was in the 1950s that the US Defence Industry started integrating PCBs in the bomb detonator mechanisms. This made way for the wide application of PCBs throughout the world. These days, PCBs are widely used in almost all finished products like automobiles, personal computers and cellular telephones. Complete Overview of the Circuit Board Fabrication Procedure 408.452.1500 800.814.3680
  • 2. What is the Circuit Board Fabrication Procedure? Circuit board fabrication:- Is a procedure that is generally carried out using two software varieties and they are CAM or Computer Aided Manufacturing software and CAD or Computer Aided Design software. The CAD software is used for designing the electronic schematic of the circuit that needs to be manufactured. Post designing the schematic, engineers use the CAM software for producing the PCB prototype.
  • 3. Post completing the design of the PCB prototype, the very first step of the fabrication procedure is selecting the material for making the PCB. A huge variety of PCB materials are available. However, the ones popularly used depend on the requirements and the application of the customers. These include FR4, CEM5, Arlon, Alumina, Bakelite, FR1, CEM1, Ge Tek, Ceramic, FR4 High Temperature, Rogers and Polyimide. The PCB dimensions are dictated by the design requirements of the users. Selecting the PCB Material
  • 4. Once the PCB material is selected, the first thing that is to be done is applying the copper coating to the PCB. The photosensitive procedure is then used for printing the layout of the circuit on the board. The photoengraving procedure is then used for removing or etching out the copper that is not a part of the circuit layout. Copper left out on the board creates tracks or traces of PCB circuit. Applying the Copper Coating
  • 5. There are two procedures used for connecting the circuit traces and they are the mechanical milling procedure and the silk-screen, etch-resistant printing procedure. The mechanical milling procedure used CNC machines for removing unwanted copper from the circuit board. The silk-screen, etch- resistant printing procedure is used for covering the areas where traces should Connecting the Circuit Traces
  • 6. Holes need to be drilled at points where electronic and electrical parts are positioned on the circuit board in order to mount the circuit components. Special varieties of drill bits or lasers are used for drilling these holes. Once the drilling procedure is completed, hollow rivets are packed into the holes for creating electrical connection between different layers of the circuit board. This can also be done by coating the holes by way of electroplating procedure. Mounting the Circuit Components
  • 7. Holes need to be drilled at points where electronic and electrical parts are positioned on the circuit board in order to mount the circuit components. Special varieties of drill bits or lasers are used for drilling these holes. Once the drilling procedure is completed, hollow rivets are packed into the holes for creating electrical connection between different layers of the circuit board. This can also be done by coating the holes by way of electroplating procedure. http://www.shax-eng.com/