PCB DESIGN Cadence

1. PCB DESIGN
FACULTY
DEVELOPMENT
PROGRAMME

8.  J.Balraj
Sr. Hardware Engineer
Day-1
 Orientation, Introduction
to PCB Design

9. Orientation about PCB Design
 Day2: Orcad Schematic Diagram – Adding Symbol, creating new
symbol and converting circuit Diagram to Schematic Diagram.
 Day3 : PCB Editor Layout- Footprint Creation, Netlist Creation,
Single Layer PCB, Component Placement.
 Day4 : Single Layer PCB – Artwork Layer, Routing Traces, Layer
filling, Drill Chart, Gerber file creation and viewing.
 Day5 : Double Layer PCB – Footprint adding, Netlist Creation,
Component Placement, Artwork Layer, Routing Traces, Layer
filling, Drill Chart, Gerber file creation and viewing.
 Day6 : PCB Fabrication – Gerber layer printing, Etching Layers,
Drilling, Solder masking, Silkscreen, Profiling and verifying.

10. Schematic
Diagram
Single Layer PCB
Design
Single Layer PCB
Layout with Gerber
Double Layer PCB
Layout with Gerber
Fabrication of PCB 6
4
1
3
5
Master in PCB Design
2
PCB Footprint

11. Brief about PCB Design
PCB – Printed Circuit Board
PCB is the main key for all the emerging Electronic Smart world.
PCB acts as a bridge between the various components with the help
of tracks, pads and lines incorporated in a laminated copper sheet.
PCB`s are classified majorly by its layers Single, Double and
Multiple.
PCB reduces Time, working Space, Error and cost of the product.

12. PCB Evolution
1925: Charless Ducas, an American inventor, he stencils conductive
materials onto a flat wooden board.
1936: Paul Eisler develops the first printed circuit board to use in a radio set.
1943: Eisler patents a more advanced PCB design, glass-reinforced, non-
conductive substrate.
1948: The United States Army releases PCB technology to the public,
prompting widespread development.
2000s: PCBs have become smaller, lighter, much higher layer counts and
more complex.

13. Types of Boards
Bread Board
General Purpose Board
Printed Circuit Board

14. Types of PCB`s
Single-Layer PCB
Double-Layer PCB
Multilayer PCB
Rigid PCB
Flex PCB
Rigid-Flex PCB

15. Layers or Material in PCB`s
Substrate material – FR4, CEM-1 to 3, Polyimide and Metal core.
Core – Rigid base material laminated with Copper on one or two sides.
Prepreg – Dielectric material Sandwiched between two cores.
Copper foil – defined in ounces per square foot.
Solder Mask – acts as insulation on the Copper layer.
Silkscreen – layer allows the user to use symbols, text, numbers, etc.,

16. Single Layer PCB
Single Layer PCB consist of one copper Layer, one Solder
mask and one substrate material.
Single Layer PCB is a first choice for beginners.
Simple Diagram of Single Layer PCB.
Silkscreen
Copper Layer
Substrate
Soldermask

17. Double Layer PCB
Double Layer PCB consist of two copper Layer(Top &
Bottom), two Solder mask(Top & Bottom) and one substrate
material.
Silkscreen
Copper Layer
Substrate
Soldermask

18. Multi-Layer PCB
Multi-Layer PCB consist of more than two copper Layer, two
Solder mask(Top & Bottom) and more than two substrate
material.
All the layers can be interconnected with copper-plated holes.

19. Rigid PCB
Rigid PCBs are made of solid substrate material that prevents
the board from twisting.
Rigid PCB has single layer, double layer and multilayer
configuration.

20. Flex PCB
Flex PCBs are made of Flexible material such as plastic,
polimide or a similar polymer.
Flex PCB has single layer, double layer and multilayer
configuration.

21. Rigid-Flex PCB
Rigid-Flex PCB is a combination of flexible PCB and Rigid
PCB.
Both Rigid and Flexible substrate are laminated to form a
single circuit.

22. Single Layer PCB
vTOP
vBOTTOM
Double Layer PCB
vTOP
vBOTTOM
Comparison of PCB

23. PCB Characteristics
Through Hole Technology
• In earlier days PCB`s were made using through hole technology.
• Electronics components with leads are inserted in the board holes and soldered on other side of
the board.
• Through hole components has two leads minimum.
Resistor
Transistor
IC Base

24. PCB Characteristics
Surface Mount Technology (SMD)
• It came into process in 1960s and commonly used after 1990s.
• Instead of wire leads components came with small ended caps to solder in to PCB Surfaces.
• With this emerging technology pcb size, production time and price reduced.
• All smart technology use this type of components.
Resistor
Transistor
14 Pin IC

25. IC SMD Packages
SOIC - Small Outline Integrated Circuit.
SOP - Small Outline Package.
TSOP - Thin Small Outline Package
SSOP - Shrink Small Outline Package
TSSOP - Thin Shrink Small Outline Package
QSOP - Quarter-size Small Outline Package
VSOP - Very Small Outline Package
QFP- Quad flat pack
LQFP - Low profile Quad Flat Pack
PQFP - Plastic Quad Flat Pack
CQFP - Ceramic Quad Flat Pack
TQFP - Thin Quad Flat Pack
PLCC - Plastic Leaded Chip Carrier
BGA - Ball Grid Array

26. Thinks to know
Tested Circuit Diagram
Choosing components package such as Through hole or SMD
package
Every components Datasheet with pin details and dimension
Choosing appropriate type of PCB, either single layer, double layer,
multilayer etc.,
Current rating going to be handled by PCB
Pre prediction of components placement
Prediction of size and structure of PCB

27. PCB Design General Steps
Verified Tested Circuit Diagram.
PC with Cadence 17.2 Software.
• Capture CIS
• PCB Editor
Cadence Software cracked link
• https://getintopc.com/softwares/3d-designing/cadence-allegro-orcad-17-20-037-free-download-162258
4/
Cadence software installation video
• https://www.youtube.com/watch?v=M3nTag2HVXM
Gerber Viewer (Viewmate)

28. PCB Design General Steps
Capture CIS
• Schematic diagram as per circuit diagram.
• Symbol creation for new components.
• Verification of symbol Pin numbers as in Component datasheet.
• Annotate the references numbers
• Error checking or design rule checking
• BOM (Bill of materials) creation for schematic
PCB Footprint Creation
• Identifying existing Footprint and Creating new Footprint if necessary
• Adding footprint to the schematic parts
• Design rule checking
• Netlist Creation

29. PCB Design General Steps
PCB Editor
• PCB size fixing
• Importing Netlist
• Placement of components
• Predetermining Gerber layers
• Aligning components
• Routing the track between components
• Refdes alignment
• Pad and drill size verification
• Drill chart customization and generation
• Checking all layers
• Drill file creation
• Gerber file creation for all layers
• Gerber file viewing

30. PCB
SCHEMATIC

31. Schematic Software Image

32. Manual Wired Circuit Images

33. Schematic Diagram

34. Symbol
Footprints

35. Symbol Footprint

36. PCB
LAYOUT

37. PCB Editor Software Image

38. Unrouted PCB Design

39. Routed PCB Design

40. PCB
Manufacturin
g
>>Single Layer

41. PCB Manufacturing Process
Imaging the Gerber layers
Printing Layers on copper
Etching layer
Layer alignment
Drilling
Solder masking the layer
Silk screening
Surface finishing
Electrical testing
Final quality checking
Packing and shipping

42. Silkscreen Layer

43. Bottom Layer

44. Solder Mask – BOTTOM Layer

45. Fab & Drill File

46. PCB Board Layout

47. Assembled PCB Board

48. PCB
Manufacturin
g
>>Double Layer

49. Silkscreen Layer

50. Top Layer

51. Bottom Layer

52. Solder Mask – TOP Layer

53. Solder Mask – BOTTOM Layer

54. Fab & Drill File

55. Assembled PCB Board

56. Online PCB Manufacture
www.pcbpower.com
www.pcbway.com
Cadence PCB Design Recorded videos with Document and
files.
https://lms.pantechelearning.com/s/store/courses/description/
PCB-Design-using-Allegro

57. Thank You