The document discusses issues related to lead-free component assembly on printed circuit boards. Higher processing temperatures are required for lead-free assembly, which can damage base materials. This leads to an increase in defects like voids, delamination, and cracking. Proper material selection and finish choice are important to address challenges from the transition to lead-free assembly. Key considerations include moisture absorption, corrosion resistance, and material properties at higher temperatures.
Instrumentation Limited (IL) is an Indian government enterprise established in 1964 to achieve self-reliance in control and automation technology for process industries. IL manufactures and supplies advanced control equipment on a turnkey basis to various industry sectors. It has manufacturing facilities in Kota and Palakkad, India and a network of offices across India to provide installation, commissioning and after-sales services. With over 45 years of experience, IL designs, engineers, manufactures, integrates, installs and commissions complex control systems and has diversified into various related fields to offer a comprehensive range of products and services.
This document discusses printed circuit boards (PCBs). It provides an introduction and overview of what a PCB is, the need for PCBs, types of PCBs including general, trace, single layer and double layer, and the design process for trace PCBs. It also outlines some advantages like lower costs for mass production and reduced wiring, and disadvantages such as difficulty repairing or redesigning a PCB. Finally, it provides some examples of PCB applications.
The document discusses printed circuit boards (PCBs) and their evolution and classifications. It explains that PCBs provide electrical connections between circuit components using conductive tracks on a non-conductive substrate. Early electronic designs used point-to-point wiring but PCBs allowed for more reliable connections. Basic PCB types include single-sided, double-sided, and multilayer boards. More advanced types include rigid-flex boards, which combine rigid and flexible areas to fit devices. Proper PCB design is important to address issues like signal interference at high frequencies.
Creative Hi-Tech would like to share some basics of Printed Circuit Boards which will help you to gain some knowledge before going to any vendor. This power point presentation will clear your basic doubts regarding the PCB.
Introduction to Surface Mount TechnologyABDUL MUNAFF
Surface Mount Technology (SMT) refers to a specific type of electronics assembly where electronic components are attached to the surface of a substrate (typically a printed circuit board).
SMT is a modern alternative to traditional thru-hole technology where components are attached to substrates by leads that passed through holes in the PCB.
Surface Mount components require less space so SMT is helpful in product miniaturization.
SMT Overview
SMT V/S THROUGH HOLE
Basic SMT process flow
Equipments used SMT Assembly
Through Hole Assembly & Soldering
ELECTROSTATIC DISCHARGE
RoHS
Sorry to say but the college spelling is wrong actually "technology" word is missing. Its by mistake.
A presentation on printed circuit board designing. A brief discussion on pcb fabrication. Basic steps involved in it.
This document provides an overview of printed circuit board (PCB) design. It defines a PCB as a board that mechanically supports and electrically connects electronic components using conductive tracks and pads. The document describes the different types of PCBs, including single-sided, double-sided, and multi-layer boards. It outlines the key steps in PCB design, including designing the circuit, placing components, routing wires, and manufacturing. Common PCB design software and features like schematic capture and component placement are also summarized.
Instrumentation Limited (IL) is an Indian government enterprise established in 1964 to achieve self-reliance in control and automation technology for process industries. IL manufactures and supplies advanced control equipment on a turnkey basis to various industry sectors. It has manufacturing facilities in Kota and Palakkad, India and a network of offices across India to provide installation, commissioning and after-sales services. With over 45 years of experience, IL designs, engineers, manufactures, integrates, installs and commissions complex control systems and has diversified into various related fields to offer a comprehensive range of products and services.
This document discusses printed circuit boards (PCBs). It provides an introduction and overview of what a PCB is, the need for PCBs, types of PCBs including general, trace, single layer and double layer, and the design process for trace PCBs. It also outlines some advantages like lower costs for mass production and reduced wiring, and disadvantages such as difficulty repairing or redesigning a PCB. Finally, it provides some examples of PCB applications.
The document discusses printed circuit boards (PCBs) and their evolution and classifications. It explains that PCBs provide electrical connections between circuit components using conductive tracks on a non-conductive substrate. Early electronic designs used point-to-point wiring but PCBs allowed for more reliable connections. Basic PCB types include single-sided, double-sided, and multilayer boards. More advanced types include rigid-flex boards, which combine rigid and flexible areas to fit devices. Proper PCB design is important to address issues like signal interference at high frequencies.
Creative Hi-Tech would like to share some basics of Printed Circuit Boards which will help you to gain some knowledge before going to any vendor. This power point presentation will clear your basic doubts regarding the PCB.
Introduction to Surface Mount TechnologyABDUL MUNAFF
Surface Mount Technology (SMT) refers to a specific type of electronics assembly where electronic components are attached to the surface of a substrate (typically a printed circuit board).
SMT is a modern alternative to traditional thru-hole technology where components are attached to substrates by leads that passed through holes in the PCB.
Surface Mount components require less space so SMT is helpful in product miniaturization.
SMT Overview
SMT V/S THROUGH HOLE
Basic SMT process flow
Equipments used SMT Assembly
Through Hole Assembly & Soldering
ELECTROSTATIC DISCHARGE
RoHS
Sorry to say but the college spelling is wrong actually "technology" word is missing. Its by mistake.
A presentation on printed circuit board designing. A brief discussion on pcb fabrication. Basic steps involved in it.
This document provides an overview of printed circuit board (PCB) design. It defines a PCB as a board that mechanically supports and electrically connects electronic components using conductive tracks and pads. The document describes the different types of PCBs, including single-sided, double-sided, and multi-layer boards. It outlines the key steps in PCB design, including designing the circuit, placing components, routing wires, and manufacturing. Common PCB design software and features like schematic capture and component placement are also summarized.
The document discusses three types of printed circuit board (PCB) layers: single sided, double sided, and multiple layers. Single sided PCBs were the original invention and provide a mechanical base for components, though they have limitations with large numbers of connections. Double sided PCBs allow connections on both sides and through holes, addressing complexity issues. Multiple layer PCBs build on double sided by adding internal layers for power and ground, enabling even more complex and compact circuits in a smaller space.
Surface mount technology involves attaching electronic components directly to the surface of printed circuit boards, as opposed to through-hole technology where components are inserted into holes. There are three main types of surface mount assemblies depending on whether components are mounted on one or both sides of the board. The surface mount process involves designing the board, applying solder paste, placing components, soldering, cleaning, and potential repair. Infrared and hot gas soldering are two common soldering techniques used. Reworking involves removing faulty components and soldering new ones in their place.
The document summarizes key aspects of the Philippine Electrical Code (PEC), which establishes rules and standards for safe electrical installations. It outlines the PEC's objectives of safe electricity use and adequacy. The PEC has mandatory and advisory rules. It is mandated by law and refers to other codes. Government authorities implement and enforce the PEC. The PEC covers electrical installations in various structures and premises. It specifies requirements for permits, inspections, service entrances, service conductors, and service equipment.
Lesson 6 - TERMINATING AND CONNECTING ELECTRICAL WIRING AND ELECTRONICS CIRCU...EdselEscober
This document discusses conductors and insulators in electrical wiring. Conductors such as copper and silver allow electrons to flow, while insulators such as rubber and plastic block electron flow. It also discusses different types of wires and cables, such as solid versus stranded wires, and twisted pair, multi-conductor, coaxial, and fiber optic cables. The document concludes by covering different methods for terminating and connecting wires, including soldering, crimping, and using various connectors.
1. Surface mount technology (SMT) involves mounting electronic components directly onto the surface of printed circuit boards rather than inserting them into holes. This allows for higher circuit densities and smaller components.
2. Key SMT processes include solder paste application, component placement, soldering via reflow or wave soldering methods, cleaning, and potential repair or rework.
3. Reflow soldering is now more common than wave soldering. It involves heating components on the board to melt solder paste using a reflow oven. This bonds components directly to pads on the circuit board surface.
TLE CES NC II Y2 - Module 1 - Using Basic Electronic Hand Tools.docGirlyPedregosa1
TLE CES NC II CBLM
Y2 - Module 1 - Using Basic Electronic Hand Tools
Unit of Competency: USE BASIC ELECTRONIC HAND TOOLS
Module No. 1 Module Title: USING BASIC ELECTRONIC HAND TOOLS
Welcome to the Module “Using Basic Electronic Hand Tools”. This module contains training materials and activities for you to complete.
The unit of competency “Use Basic Electronic Hand Tools” contains the knowledge, skills and desirable attitudes required for a Consumer Electronic Servicing required to obtain the National Certificate (NC) level II.
You are required to go through a series of learning activities in order to complete each of the learning outcomes of the module. In each learning outcome there are Information Sheets, Job Sheets, Assignment Sheets, and Activity Sheets. Follow these activities on your own and answer the Self-Check at the end of each learning activity.
A printed circuit board (PCB) is a non-conductive laminated substrate that mechanically supports and electrically connects electronic components using copper tracks, pads and other features etched onto copper sheets. PCBs have evolved from early point-to-point wiring to modern surface mount and multilayer board designs. Key aspects of PCBs include the substrate material (often FR-4 fiberglass), copper patterning process (subtractive or additive), drilling of holes, plating, solder mask and the assembly of electronic components. Modern PCB design utilizes computer-aided manufacturing systems to efficiently layout, simulate and produce circuit boards.
PCBs are non-conductive boards that hold electronic components and allow electricity to flow through circuitry etched onto their surfaces, and they have been used since the 1940s in devices like radios, computers, and appliances; PCBs can be single sided, double sided, or multilayered and come in rigid, flexible, or rigid-flex styles to suit different applications; They connect components like resistors, capacitors, and ICs through pads and traces on one or more metal layers.
Over the last several years, the technical complexity of printed circuit boards that we fabricate on a day-to-day basis has risen exponentially. Many companies embrace this complexity, but for customers, the overall financial risk increases dramatically.
Printed circuit boards are a complex product that requires many steps to produce, and all customer’s specifications are a little different. This requires a PCB fabricator to have a very clear process and understanding of how these requirements affect production.
In this webinar, we share with you how to better understand what each of the requirements means for you and the fabricator, how to ensure that you are getting exactly what you specified and how to protect your data from falling into the wrong hands.
For more information on our printed circuit board solutions, visit https://www.epectec.com/pcb/.
The document provides information about designing a printed circuit board (PCB) using the KiCAD software. It begins with an overview of KiCAD, an open source electronic design automation software suite for schematic capture and PCB layout. It then describes the four main steps to designing a PCB in KiCAD: 1) creating schematic diagrams using the Eeschema editor, 2) associating components using Cvpcb, 3) laying out the PCB using Pcbnew, and 4) generating output files using Gerbview. The document concludes with an example of using KiCAD to design an astable multivibrator circuit using a 555 timer integrated circuit.
This document provides information about basic hand tools used in consumer electronics servicing. It lists and describes various types of screwdrivers, soldering tools, splicing tools, boring tools, cutting tools, and auxiliary tools. It also discusses how to properly classify these tools and gives assignments for students to identify common faults in using hand tools like pliers, screwdrivers, and utility knives.
Wave soldering is a widely used process in electronics manufacturing that involves 5 key steps: 1) melting solder in a tank heated to the proper temperature, 2) cleaning components to remove oxides using fluxing, 3) placing the printed circuit board on the melted solder, 4) applying the molten solder to flow into the joints, and 5) final cleaning of any flux residues using deionized water and solvents.
Terminating and Connecting Electrical Wiring and Electronic Circuits (TCEC) ....DannyverFullo1
1) The document discusses electrical wiring and circuit diagrams. It defines key terms like load, source, and switch symbols.
2) It explains the basic steps for single pole and 3-way switch wiring installations, including connecting the source lines and load lines.
3) Examples of schematic and actual wiring diagrams are provided for single pole and 3-way switch connections to illustrate the concepts.
Basic tools and instruments in electronicsStephanieDaque
This document lists and describes basic tools and instruments used in electronics, including Allen wrenches, artist's cutters, desoldering tools, magnifying glasses, mini drills, needle files, paint brushes, pliers, reamers, screwdrivers, soldering guns, soldering irons, soldering iron stands, solid-state VOMs, and transistor testers. Each tool is briefly defined and its intended electronic use is stated.
This document provides an overview of printed circuit board (PCB) manufacturing. It discusses various stages of the PCB manufacturing process including laminate fabrication, copper deposition, photolithography, etching, drilling, surface finishing techniques like solder masking and hot air leveling. It also covers different types of PCBs like single sided, double sided, multilayer and flexible PCBs. Various material options for PCB substrates and their properties are described. Manufacturing processes for different PCB components are outlined.
CSS L15 - CRIMPING ETHERNET CABLE AND RJ45Marvin Bronoso
CSS L15 - CRIMPING ETHERNET CABLE AND RJ45
At the end of this learning module the student are able to:
○Crimp Ethernet wire and RJ-45 to establish computer network connection.
○Understand the differences straight through and crossover type of network cabling.
○Learn the T568A and T568B pin out of twisted pair wiring.
The document describes the manufacturing process for printed circuit boards. It involves several steps: 1) Pre-production engineering like file inspection and drill data generation. 2) CNC cutting and drilling of copper clad laminate. 3) Wet processing like direct plating system and electroplating to deposit copper. 4) Photo imaging and developing to transfer circuit images. 5) Etching and inspection to remove unwanted copper.
This document contains diagrams and specifications for a PLC control panel for a tobacco filling station. It includes diagrams of the main incoming power, power monitoring circuits, and safety circuits of the control panel. Component details are provided, such as the makes and models of circuit breakers, contactors, sensors and other devices. Dimensions and layout of the overall control panel and internal components are shown. Pneumatic and electrical control circuits are illustrated.
1) Henry Ford developed the assembly line at his Highland Park plant in Michigan in 1913, which was the culmination of decades of technological developments.
2) Key developments included interchangeable parts, portable electric motors that allowed for flexible factory layouts, and the concept of a moving assembly line where parts were brought to stationary workers.
3) These innovations enabled Ford to realize his goal of mass production and producing affordable cars for the masses using the most efficient methods possible.
The document discusses three types of printed circuit board (PCB) layers: single sided, double sided, and multiple layers. Single sided PCBs were the original invention and provide a mechanical base for components, though they have limitations with large numbers of connections. Double sided PCBs allow connections on both sides and through holes, addressing complexity issues. Multiple layer PCBs build on double sided by adding internal layers for power and ground, enabling even more complex and compact circuits in a smaller space.
Surface mount technology involves attaching electronic components directly to the surface of printed circuit boards, as opposed to through-hole technology where components are inserted into holes. There are three main types of surface mount assemblies depending on whether components are mounted on one or both sides of the board. The surface mount process involves designing the board, applying solder paste, placing components, soldering, cleaning, and potential repair. Infrared and hot gas soldering are two common soldering techniques used. Reworking involves removing faulty components and soldering new ones in their place.
The document summarizes key aspects of the Philippine Electrical Code (PEC), which establishes rules and standards for safe electrical installations. It outlines the PEC's objectives of safe electricity use and adequacy. The PEC has mandatory and advisory rules. It is mandated by law and refers to other codes. Government authorities implement and enforce the PEC. The PEC covers electrical installations in various structures and premises. It specifies requirements for permits, inspections, service entrances, service conductors, and service equipment.
Lesson 6 - TERMINATING AND CONNECTING ELECTRICAL WIRING AND ELECTRONICS CIRCU...EdselEscober
This document discusses conductors and insulators in electrical wiring. Conductors such as copper and silver allow electrons to flow, while insulators such as rubber and plastic block electron flow. It also discusses different types of wires and cables, such as solid versus stranded wires, and twisted pair, multi-conductor, coaxial, and fiber optic cables. The document concludes by covering different methods for terminating and connecting wires, including soldering, crimping, and using various connectors.
1. Surface mount technology (SMT) involves mounting electronic components directly onto the surface of printed circuit boards rather than inserting them into holes. This allows for higher circuit densities and smaller components.
2. Key SMT processes include solder paste application, component placement, soldering via reflow or wave soldering methods, cleaning, and potential repair or rework.
3. Reflow soldering is now more common than wave soldering. It involves heating components on the board to melt solder paste using a reflow oven. This bonds components directly to pads on the circuit board surface.
TLE CES NC II Y2 - Module 1 - Using Basic Electronic Hand Tools.docGirlyPedregosa1
TLE CES NC II CBLM
Y2 - Module 1 - Using Basic Electronic Hand Tools
Unit of Competency: USE BASIC ELECTRONIC HAND TOOLS
Module No. 1 Module Title: USING BASIC ELECTRONIC HAND TOOLS
Welcome to the Module “Using Basic Electronic Hand Tools”. This module contains training materials and activities for you to complete.
The unit of competency “Use Basic Electronic Hand Tools” contains the knowledge, skills and desirable attitudes required for a Consumer Electronic Servicing required to obtain the National Certificate (NC) level II.
You are required to go through a series of learning activities in order to complete each of the learning outcomes of the module. In each learning outcome there are Information Sheets, Job Sheets, Assignment Sheets, and Activity Sheets. Follow these activities on your own and answer the Self-Check at the end of each learning activity.
A printed circuit board (PCB) is a non-conductive laminated substrate that mechanically supports and electrically connects electronic components using copper tracks, pads and other features etched onto copper sheets. PCBs have evolved from early point-to-point wiring to modern surface mount and multilayer board designs. Key aspects of PCBs include the substrate material (often FR-4 fiberglass), copper patterning process (subtractive or additive), drilling of holes, plating, solder mask and the assembly of electronic components. Modern PCB design utilizes computer-aided manufacturing systems to efficiently layout, simulate and produce circuit boards.
PCBs are non-conductive boards that hold electronic components and allow electricity to flow through circuitry etched onto their surfaces, and they have been used since the 1940s in devices like radios, computers, and appliances; PCBs can be single sided, double sided, or multilayered and come in rigid, flexible, or rigid-flex styles to suit different applications; They connect components like resistors, capacitors, and ICs through pads and traces on one or more metal layers.
Over the last several years, the technical complexity of printed circuit boards that we fabricate on a day-to-day basis has risen exponentially. Many companies embrace this complexity, but for customers, the overall financial risk increases dramatically.
Printed circuit boards are a complex product that requires many steps to produce, and all customer’s specifications are a little different. This requires a PCB fabricator to have a very clear process and understanding of how these requirements affect production.
In this webinar, we share with you how to better understand what each of the requirements means for you and the fabricator, how to ensure that you are getting exactly what you specified and how to protect your data from falling into the wrong hands.
For more information on our printed circuit board solutions, visit https://www.epectec.com/pcb/.
The document provides information about designing a printed circuit board (PCB) using the KiCAD software. It begins with an overview of KiCAD, an open source electronic design automation software suite for schematic capture and PCB layout. It then describes the four main steps to designing a PCB in KiCAD: 1) creating schematic diagrams using the Eeschema editor, 2) associating components using Cvpcb, 3) laying out the PCB using Pcbnew, and 4) generating output files using Gerbview. The document concludes with an example of using KiCAD to design an astable multivibrator circuit using a 555 timer integrated circuit.
This document provides information about basic hand tools used in consumer electronics servicing. It lists and describes various types of screwdrivers, soldering tools, splicing tools, boring tools, cutting tools, and auxiliary tools. It also discusses how to properly classify these tools and gives assignments for students to identify common faults in using hand tools like pliers, screwdrivers, and utility knives.
Wave soldering is a widely used process in electronics manufacturing that involves 5 key steps: 1) melting solder in a tank heated to the proper temperature, 2) cleaning components to remove oxides using fluxing, 3) placing the printed circuit board on the melted solder, 4) applying the molten solder to flow into the joints, and 5) final cleaning of any flux residues using deionized water and solvents.
Terminating and Connecting Electrical Wiring and Electronic Circuits (TCEC) ....DannyverFullo1
1) The document discusses electrical wiring and circuit diagrams. It defines key terms like load, source, and switch symbols.
2) It explains the basic steps for single pole and 3-way switch wiring installations, including connecting the source lines and load lines.
3) Examples of schematic and actual wiring diagrams are provided for single pole and 3-way switch connections to illustrate the concepts.
Basic tools and instruments in electronicsStephanieDaque
This document lists and describes basic tools and instruments used in electronics, including Allen wrenches, artist's cutters, desoldering tools, magnifying glasses, mini drills, needle files, paint brushes, pliers, reamers, screwdrivers, soldering guns, soldering irons, soldering iron stands, solid-state VOMs, and transistor testers. Each tool is briefly defined and its intended electronic use is stated.
This document provides an overview of printed circuit board (PCB) manufacturing. It discusses various stages of the PCB manufacturing process including laminate fabrication, copper deposition, photolithography, etching, drilling, surface finishing techniques like solder masking and hot air leveling. It also covers different types of PCBs like single sided, double sided, multilayer and flexible PCBs. Various material options for PCB substrates and their properties are described. Manufacturing processes for different PCB components are outlined.
CSS L15 - CRIMPING ETHERNET CABLE AND RJ45Marvin Bronoso
CSS L15 - CRIMPING ETHERNET CABLE AND RJ45
At the end of this learning module the student are able to:
○Crimp Ethernet wire and RJ-45 to establish computer network connection.
○Understand the differences straight through and crossover type of network cabling.
○Learn the T568A and T568B pin out of twisted pair wiring.
The document describes the manufacturing process for printed circuit boards. It involves several steps: 1) Pre-production engineering like file inspection and drill data generation. 2) CNC cutting and drilling of copper clad laminate. 3) Wet processing like direct plating system and electroplating to deposit copper. 4) Photo imaging and developing to transfer circuit images. 5) Etching and inspection to remove unwanted copper.
This document contains diagrams and specifications for a PLC control panel for a tobacco filling station. It includes diagrams of the main incoming power, power monitoring circuits, and safety circuits of the control panel. Component details are provided, such as the makes and models of circuit breakers, contactors, sensors and other devices. Dimensions and layout of the overall control panel and internal components are shown. Pneumatic and electrical control circuits are illustrated.
1) Henry Ford developed the assembly line at his Highland Park plant in Michigan in 1913, which was the culmination of decades of technological developments.
2) Key developments included interchangeable parts, portable electric motors that allowed for flexible factory layouts, and the concept of a moving assembly line where parts were brought to stationary workers.
3) These innovations enabled Ford to realize his goal of mass production and producing affordable cars for the masses using the most efficient methods possible.
Earthing, or grounding, is connecting the electrical system to earth to discharge accumulated charges and prevent hazards. It stabilizes voltages and allows protective devices to operate during faults. There are different earthing systems like TN-S, TN-C, and TT that use separate earth and neutral conductors or combine them. Proper earthing is important for safety and performance of the electrical network.
This document contains drawings for an electrical cabinet including a single line diagram, component details, general arrangements, and bill of quantities. Key details include:
- Panel name is Panel No. 1, type is Motor Control Center, with 500A incomer and 415V power/240V control voltage.
- Drawings include details for 6 feeders ranging from 5KW to 63A, using DOL and star-delta motor connections.
- Components shown include contactors, overload relays, push buttons, indicating lights and current transformers.
The Control Panel document provides an overview of the Control Panel in Windows and describes its various applets. The Control Panel is a centralized location for system management utilities. It contains applets divided into categories for tasks like hardware/sound configuration, user account management, network settings, security options, and more. Each applet allows adjusting specific settings related to its category area.
An electrical panel is an enclosure containing electrical components like switches, circuit breakers, and fuses to control and protect electrical systems. There are different types of panels for various applications like motor control, power control, low/medium/high voltage distribution. Key components within panels include switchgears for switching and protecting circuits, fuses that melt under excessive current, and circuit breakers that can safely interrupt faults. Panels also include bus bars to conduct electricity and current transformers to reduce current for measurement. Cables distribute power from panels and come in various core configurations depending on the application.
The document discusses various types of additive manufacturing (3D printing) technologies. It describes extrusion deposit techniques like fused deposition modeling (FDM), powder bed fusion methods including selective laser sintering (SLS), and vat photopolymerization techniques like stereolithography (SLA). It also covers areas like binder jetting, 3D model file formats, applications in advanced manufacturing and medicine, and challenges with additively manufacturing metal matrix composites.
Industrial training in Hi-Tech Castings & ANSYS Software TrainingJASTINDER PAL SINGH
The document summarizes two projects undertaken by a student at Guru Nanak Dev Engineering College to improve processes at Hi-Tech Castings. The first project implemented the 5S methodology to organize the workplace and increase productivity. The second project aimed to improve mild steel casting by researching common defects, proposing prevention methods, and suggesting process changes. The student also received ANSYS software training to perform finite element analysis.
This document provides an overview of a study conducted on the casting methodology and defects at Peekay Steels Pvt. Ltd. It discusses the following key points:
1. The objectives of the study were to study Peekay's industrial casting process in depth and examine casting defects using radiography testing to minimize defects.
2. The methodology involved 5 phases: background research, studying Peekay's process, examining their gate valve production, making prototypes, and testing defects.
3. Peekay's casting process involves several departments coordinating complex patterns, molds, melting, heat treatment and quality control. Their no-bake molding process uses chemical binders for strength and dimensional tolerances.
The document discusses different design choices for applying soldermask to microwave PCBs fabricated with PTFE-based laminates. Plating copper traces with a thin layer of gold before etching avoids the need for post-etch cleaning and allows soldermask to reliably adhere. While gold plating increases costs, it eliminates multiple cleaning and plasma treatment steps. This can improve manufacturing yield and reduce costs for production quantities by preventing boards from being reworked or scrapped due to soldermask adhesion issues.
Rapid tooling uses rapid prototyping techniques to quickly produce tools for limited production runs. There are several indirect rapid tooling methods that use a rapid prototyping pattern to create a tool. These include spraying metal onto the pattern to create a shell, electroforming nickel onto the pattern, and depositing nickel vapor. Epoxy and ceramic materials can also be cast around a pattern to create a tool. These indirect rapid tooling methods allow production of a functional tool in a fraction of the time and cost of conventional tooling.
This document provides information on conducting a sand casting demonstration or lab. Sand casting is an inexpensive way to make metal parts and is commonly used in industries like automotive and aerospace. In sand casting, molten metal is poured into a mold cavity formed in sand. While inexpensive, sand casting often results in flaws that can affect material properties. The demonstration aims to introduce students to sand casting and show how processing can influence defect formation and properties. It outlines objectives, procedures, equipment needed and safety considerations for an instructor to replicate the sand casting process in the classroom.
As the oil and gas market moves towards new corrosion-resistant materials and alloys, specifying products has become increasingly complex.
When no single material performs well in every application, how can specifiers determine the best fit for a project? And what can be done to predict the expected service life of a component?
This technical seminar, run by Parker on its stand at the major oil and gas event Offshore Europe 2017, looks at:
• Common types of corrosion and their triggers
• Key factors to consider when selecting materials for a project
• Different manufacturer perspectives and the science behind their arguments
• Risks associated with mixing dissimilar materials.
About Clara Moyanno: As an innovation engineer and expert metallurgist working across the globe, Ms. Moyanno, innovation engineer with Parker Hannifin, deals with all sorts of challenges. She is often involved in discussions on materials selection, including advice to oil and gas producers working on new platforms around the world.
Clara specializes in areas such as tackling corrosion, and materials selection for design specifications. She also advises on quality certifications and regulations around the manufacturing of metals.
Learn more http://parker.com/ipd
The document discusses various manufacturing processes. It provides details about metal casting processes like sand casting and special casting processes such as shell mold casting and investment casting. Sand casting involves pouring molten metal into a sand mold cavity to form the desired shape. The mold is formed using sand, which acts as the expendable refractory material. The document also describes the various steps involved in sand casting and types of patterns used. Special casting processes provide advantages like better surface finish and dimensional accuracy compared to sand casting.
The document describes the manufacturing process for a 6-layer printed circuit board (PCB). It involves laminating copper layers and prepreg dielectric layers to build up the stack, then drilling holes and depositing copper on inner layers through electroless plating. External layers are imaged and electroplated to add copper traces. The PCB is then etched, tinned, and has solder mask and finishes applied before testing and assembly. Close collaboration between designers and fabricators is important to optimize the process for impedance and yields.
A review on advanced ceramic processing techniquesAlokjyoti Dash
This Presentation enlists and describes most ceramic process and most parameters which affect these ceramic processing. A reader shall understand the basic of these presented process to fabricate unique ceramic materials
The document discusses casting manufacturing processes and patterns. It provides an overview of casting, including definitions and key terms. The main steps in the casting process are described as well as common applications. Pattern materials and types are also outlined. Patterns are replicas used to form mold cavities and can be single-piece, split, loose-piece, or other types depending on the part geometry and needed access. Wood, metal, plastic and other materials can be used for patterns.
Priciples of manufacturing processes.casting,forging,forming,Extrusionbilalhussain203
This document provides an overview of major manufacturing processes including casting, forming and shaping, machining, joining, and finishing. It focuses on describing various metal casting processes such as sand casting, shell molding, vacuum molding, expanded polystyrene casting, investment casting, plaster mold casting, and ceramic mold casting. It also discusses permanent mold casting processes and die casting. Finally, it covers metal forming processes such as rolling, extrusion, forging, and thread rolling.
This document discusses primary and secondary manufacturing processes and distinguishes between them. It focuses on sand casting as a primary manufacturing process. Sand casting involves pouring molten metal into a sand mold cavity. The mold is formed by packing sand around a pattern and then removing the pattern, leaving a cavity in the shape of the desired part. The document describes the key elements of sand casting, including the pattern, cores, sand, gating and riser systems. It also discusses common casting defects and the steps in the sand casting process.
Powder metallurgy is a process that involves producing metal powder and compacting and sintering it to form objects. It has three main steps - powder production, compacting, and sintering. Powder metallurgy allows for near-net shape production with few secondary operations and can be used to make complex parts from various alloys. Some examples where it is used include auto transmission sprockets and main bearing caps for automobile engines. The process offers advantages like net-shape production, ability to use high-melting metals, and high production rates. However, it also has disadvantages such as high powder production costs and limited part geometries.
1) Shell mold casting is a metal casting process where a mold is made from a thin-walled shell created by applying a sand-resin mixture around a pattern. This allows for higher production rates and more complex geometries compared to sand casting.
2) The process involves creating a reusable metal pattern, heating it, and applying a sand-resin mixture to form a shell mold around the pattern. The shells are then cured, filled with molten metal, and broken to remove the casting.
3) Shell mold casting provides advantages like high dimensional accuracy, automation potential, fewer gas defects, and lower labor costs compared to sand casting. It is often used for small to medium parts requiring precision.
This document provides an overview of various manufacturing processes, with a focus on casting processes and defects. It defines common casting defects such as cold shuts, shrinkage cavities, sand blows, and pin holes. It also discusses additional steps after solidification like trimming, removing cores, cleaning, inspection, and heat treatment. Various casting processes are introduced like sand casting, shell molding, and use of chills. Causes of casting defects include issues with casting design, mold design, gating system design, sand choice, melting temperature, and composition. Quality inspection methods for castings include visual inspection, dimensional measurement, and metallurgical/chemical testing.
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Deeper understanding of process
Virtual variation of operation parameters
Assists in
–Identifying critical process parameters
–Optimizing production process
–Improve productivity
Metal casting involves pouring molten metal into a mold cavity to solidify into the desired shape, with common mold materials including sand. The main steps are making patterns and molds, melting metal, pouring into the mold, solidification, and finishing. Key casting methods include green sand molding, shell molding, and die casting which offer advantages like complexity of parts and better dimensional accuracy and surface finish compared to sand casting.
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تتميز هذهِ الملزمة بعِدة مُميزات :
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Jemison, MacLaughlin, and Majumder "Broadening Pathways for Editors and Authors"
Component & assembly issues in PCB design
1. Review on component & assembly issues
VSD 534
M.Sc. [Engg.] in VLSI System Design
Module Title: High speed board design
Date: 30 April 2012
M. S. Ramaiah School of Advanced Studies 1
2. Contents
• Introduction
• Major issues
• Lead free PCB
• Lead free issues
• Voids
• Lead free materials
• Conclusion
• References
M. S. Ramaiah School of Advanced Studies 2
3. Introduction
• As the industry has moved to lead-free assembly processing, the performance
demands on the lead free compatible PCBs have significantly increased
• This new lead-free arena brings different PCB materials and surface finishes to
the table as well as specific changes required in the PCB manufacturing
process to support lead-free compatibility
• It’s important to understand the effects these different materials will have on
PCB fabrication, as well as the need to respond to these changes
• When exposing laminates to higher temperatures, glass transition temperature
(Tg), coefficient of thermal expansion (CTE) and decomposition temperature
are data points to consider
M. S. Ramaiah School of Advanced Studies 3
4. Major issues
• Component packages are getting smaller
• Assembly design density is increasing
• Assembly process margins are tighter
• Use of lead free materials
• Solderable finish selection
• PCB material selection
• Reliability factors
M. S. Ramaiah School of Advanced Studies 4
5. Lead free assembly
• Higher processing temperatures are required (20 C to 40 C higher)
• Narrower reflow process window. Between liquidus and peak (was 400C,
now 200C)
• There are many lead-free patents. Alloy patent issues are now resolved by
cross-licensing between major suppliers
• The right finish choice for lead-free…OSP?...HASL?… ENIG?... Ag?…
Sn…?
• Formation of tin whiskers…
Figure 1. ENIG finish [3]
M. S. Ramaiah School of Advanced Studies 5
6. Lead free design challenges
• For lead-free assembly, peak temperatures have increased a minimum of 20ºC
up to and sometimes greater than 65ºC which can damage and reduce the
reliability of base materials
• Increase in the frequency of blistering and delamination during lead-free
assembly
• Increase in the frequency of assembly related defects such as, voids,
tombstoning, copper dissolution, out gassing, pad cratering, poor wet out, etc.
• Transitioning to Pb-free soldering the industry faces significant risks of solder
joint fragility associated with all the commonly used solder pad surface
finishes.
M. S. Ramaiah School of Advanced Studies 6
7. Uncontrolled environment
• All materials will absorb some level of moisture
• Water vapor increases internal stresses significantly
• The amount of water absorbed, depends on the type of package, material & the
conditions under which the part is stored
Figure 2. Moisture pick for different base materials
M. S. Ramaiah School of Advanced Studies 7
8. Popcorn effect
• Delamination and failure of packaging due to
expansion of trapped moisture
• Moisture can be present as liquid in voids
• Absorbed moisture turns to steam when heat is
applied, building up a pressure of several
atmospheres in the interior of the component,
which causes the housing to ‘balloon’ and crack
Figure 3. Illustration of popcorn effect & cracking [3]
M. S. Ramaiah School of Advanced Studies 8
9. Lead free issues (1/2)
Figure 4. Lead free issues [4]
M. S. Ramaiah School of Advanced Studies 9
10. Lead free issues (2/2)
Figure 5. Lead free issues [4]
M. S. Ramaiah School of Advanced Studies 10
11. Voids
• Found with all lead-free solders
• Occurs at the interface between
solder & pad
• Flux design & process control are
critical
• Not a reliability issue until 0.5 mm
pitch
• Voids are caused due to surface
tension being higher than Sn-Pb, also
flux residues can not escape Figure 6. Formation of voids [2]
M. S. Ramaiah School of Advanced Studies 11
13. FR-4 vs. FR-370HR base material
Figure 7. Traditional FR-4 & high performance FR-370HR [1]
M. S. Ramaiah School of Advanced Studies 13
14. Field failure due to corrosion
• PCB’s are often required to operate in extreme cycles
of temperature and humidity
• Corrosion areas between IC contacts are found to
contain a complex mixture of tin, lead and copper
oxides.
• Copper chloride residue (in red) has formed in the gap
between the IC contacts.
• Tin from the solder process (in blue) has also
accumulated on contacts and on all areas of the PCB
Figure 8. Image overlay from a
corroded area between IC legs [3]
M. S. Ramaiah School of Advanced Studies 14
15. Summary
• The need for lead-free solder assembly has led to many investigations
into PCB materials and finishes
• Substitutes for tin/lead alloy in the electronic industry are tin-copper
for wave soldering and tin-copper-silver for re-flow soldering
• Most design issues are tied to material choice and finish
• Most likely, every market will need to go lead-free because device
manufacturers are not likely to support two component finishes – one
with lead and one without
M. S. Ramaiah School of Advanced Studies 15
16. References
1. Bob McGrath (2005) The Effects of Lead-Free on PCB Fabrication, [White
paper] PCB East, Joseph Fjelstad SiliconPipe Inc., San Jose, CA
2. Clyde F. Coombs (2008) Printed Circuit Handbook. New York: Mc-Graw
Hill
3. Dale lee (2011) Root Cause Failure Analysis of PCB Assemblies [online]
available at <http://www.smta.org/chapters/files/Wisconsin_DFX-Root_
Cause_Failure_Analysis_Final.pdf> Retrieved on 29th April 2012
4. NASA Workmanship Standards (2002) Through Hole Soldering General
Requirements [online] available at <http://workmanship.nasa.gov/lib/insp/2
%20books/links/sections/601%20General%20Requirements.html> Retrieved
on 29th April 2012
M. S. Ramaiah School of Advanced Studies 16
18. Remarks
Sl. No. Topic Max. marks Marks
obtained
1 Quality of slides 5
2 Clarity of subject 5
3 Presentation 5
4 Effort and question handling 5
Total 20
M. S. Ramaiah School of Advanced Studies 18
Editor's Notes
The glass transition temperature (TG) of the resin system is the temperature at which the material transitions from a rigid state to a softened stateCTE is a measure of the material expansion both below and above the Tg expressed in parts per million (PPM).Decomposition temperature (Td) is a value derived by measuring the weight loss of the sample vs. temperature.
• Component Packages Are Getting Smaller • 0603 > 0402 > 0201>01005 • BGA > CSP > WL-CSP > ?• Assembly Design Density Is Increasing • Tighter Component to Component Spacing (Spacing Smaller Than 0.020” Common) • Smaller Copper (Pad) Interconnections• Assembly Process Margins Are Tighter • Thermal Balance @ Pad Level Is Critical (Trace/Via Connection Size to Pads) • Component Placement Accuracy
Lead has good electrical & thermal conductivities. The use of lead in electronics assembly operations has come under scrutiny due to health and environmental concerns associated with lead exposure. HASL-Hot Air Solder Level, OSP-Organic SolderabilityProctectants, ENIG-Electroless nickel immersion gold, Ag-Silver,Sn-Tin
Storage of PCBs prior to assembly is much more important. Drying may be required! Release of moisture may be more important than absorption.
If plastic packaged parts have been manufactured or stored under humid conditions, they can develop cracks on soldering, by whatever method this is carried out. Absorbed moisture turns to steam when heat is applied, building up a pressure of several atmospheres in the interior of the component, which causes the housing to ‘balloon’ and crack. The stages of this so-called ‘popcorn effect’ are shown in Figure 1. Ultrasonic microscope photographs confirm that delamination has occurred, providing an easy path to the chip and bond pads both for moisture and external sources of ionic contaminationDelamination and failure of packaging due to expansion of trapped moisture
Measling: Whitish, discrete spots or crosses below the laminate surface - usually induced by thermal shock / stress. Measling that bridges uncommon conductors is unacceptable.A whisker is a slender needle-shaped metallic growth between a conductor and a land. Typically the result of mechanical stresses in high tin compounds, it is a reliability concernPoor wetting is an indicator of poor solderability, improper flux, or contamination. Nonwettingresults in the solder forming a ball or beading on the termination surface. The fillet is convex; no feathered edge is apparentVoids are an indication of improper process control, and are typically caused by insufficient solder, solder wicking / thieving, or contamination.
Flux residue indicates improper / incomplete cleaning.Bridging is an indicator of poor process controls (i.e.: excess solder, smeared paste, improper lacement, incorrect heat)Excess solder / Solder flooding / is an indicator of improper / incorrect process controls, and is typically seen in wave solderingPinholes are typically small holes in the solder surface, leading to a void of indeterminate size within the solder terminationPorous solder exhibits an uneven surface and a spongy appearance that may contain a concentration of small pinholes and voids Voids are caused due to Surface tension is higher than Sn-Pb, flux residues can not escape
The glass transition temperature (TG) of the resin system is the temperature at which the material transitions from a rigid state to a softened state. Tg is the material property typically used by industry to compare thermal robustness of laminates; however, it is not a good indicator of lead free compatibility.Decomposition temperature (Td) is a value derived by measuring the weight loss of the sample vs. temperature. Td is an important material property used to assess thermal survivability.
Most design issues are tied to material choice and finish. Most likely, every market will need to go lead-free because device manufacturers are not likely to support two component finishes – one with lead and one without.
The presence of significant levels of solder residues, tin and lead, along with ionic material on all PCB areas after production is a latent defect. These residues are the essential feedstock for corrosion processes which require heat, humidity and applied EMF in order to proceed by several possible routes including redox reactions, galvanic processes, electrolysis, atmospheric oxidation, ion transport and ionic salt formation. The long term consequences of these processes are well known including metal filament and dendrite growth, potentially leading to contact resistance changes, arcing and complete circuit failure.