Bosch sensortec bmp380 barometric pressure sensor 2017 teardown reverse costing report published by Yole Developpement

©2017 by System Plus Consulting | Bosch BMP380 Pressure Sensor 1
21 rue la Noue Bras de Fer
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Bosch BMP380
Pressure Sensor
MEMS report by Audrey LAHRACH
November 2017

Table of Contents
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 6
o Bosch Sensortec
o BMP380
Physical Analysis 11
o Synthesis of the Physical Analysis 12
o Package 14
 View & Dimensions
 Opening
 Wire Bonding Process
 Cross-Section
o ASIC Die 24
 ASIC Die View & Dimensions
 ASIC Delayering & Main Blocs
 ASIC Die Process
 ASIC Die Cross-Section
 ASIC Die Process Characteristic
o MEMS Pressure Die 40
 MEMS Die View & Dimensions
 MEMS Die Cross-Section
 MEMS Pressure & Temperature Process
 MEMS Pressure & Temperature Characteristics
o Physical Comparison 57
 Bosch Environmental Sensor Evolution
 Comparison with STMicroelectronics LPS22HB
Sensor Manufacturing Process 66
o ASIC Die Front-End Process & Fabrication Unit
o MEMS Process & Fabrication Unit
o Final Test & Packaging Fabrication unit
Cost Analysis 80
o Synthesis of the cost analysis 81
o Yields Explanation & Hypotheses 83
o ASIC Component 85
 Die Front-End Cost/Probe Test, Thinning & Dicing
 ASIC Component Cost
o MEMS Pressure Die 89
 Die Front-End Cost/Probe Test, Thinning & Dicing
 Sensor Die Cost
o LGA Packaged Component 95
 LGA Packaging Cost
 Back End: Final Test
 Component Cost
Selling Price 100
Company services 105

Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
o Glossary
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price
of the Bosch BMP380 Pressure Sensor.
With its wide 300hPa - 1250hPa measurement-covering range and a low power consumption of only 2.0µA, Bosch’s BMP380
pressure sensor is more accurate than the previous BMP280 pressure sensor.
Assembled in a 10-pin, metal-lid 2.0mm x 2.0mm x 0.75mm land-grid array package, the BMP380 integrates a digital pressure
sensor and a temperature sensor. It is equipped with only one MEMS die and an amplification application-specific integrated
circuit - the same number of dies as the BMP280, but with smaller dimensions.
The pressure sensor is manufactured with Bosch’s “Advanced Porous Silicon Membrane” process, integrating a flexible
pressure membrane and temperature diodes on a silicon substrate.
This System-in-Package consists of two sensors in one small package, mixing wire bonding and flip-chip connections. A
thorough package analysis is included in this report, which also describes and compares MEMS and ASIC technology
evolutions.
This report also offers deep technological and cost analyses of the BMP380, along with a technical and price comparison with
Bosch’s BMP280 pressure sensor, a competing pressure sensor from STMicroelectronics (the LPS22HB), and Bosch’s two
environmental sensors, the BME280 and the BME680.

o Executive Summary
o Reverse Costing
Methodology
o Glossary
Chain
Physical Analysis
Cost Analysis
About System Plus
The reverse costing analysis is conducted in 3 phases:
Teardown
analysis
• Package is analyzed and measured
• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin
out, die marking
• Setup of the manufacturing process.
Costing
analysis
• Setup of the manufacturing environment
• Cost simulation of the process steps
Selling price
analysis
• Supply chain analysis
• Analysis of the selling price
Reverse Costing Methodology

Chain
Physical Analysis
o Synthesis
o Package
o Package Cross-Section
o ASIC
o MEMS Pressure/
Temperature
o Bosch Evolution
o STMicroelectronics
LPS22HB Comparison
Cost Analysis
About System Plus
Package Views & Dimensions
Package:
o Type: Metal lid LGA 10-pads
o Dimensions: 2 x 2 x 0.75mm
o Pitch: 0.5mm
2 mm
2mm0.75mm
o Marking: C2
PE
350 µm
Package Top View
©2017 by System Plus Consulting
Package Side View
Package Bottom View

Chain
Physical Analysis
o Synthesis
o Package
o ASIC
o MEMS Pressure/
Temperature
o Bosch Evolution
LPS22HB Comparison
Cost Analysis
About System Plus
Package Cross-Section - Overview
Cross-Section Plane
Package Cross-Section Overview – SEM View
Package total thickness: xxx mm
o ASIC thickness: xxx mm
o MEMS Pressure thickness: xxx mm
o Metal Lid thickness: xxx mm

Chain
Physical Analysis
o Synthesis
o Package
o ASIC
o MEMS Pressure/
Temperature
o Bosch Evolution
LPS22HB Comparison
Cost Analysis
About System Plus
ASIC Cross-Section – Metal Layers
Metal Layers Cross-Section - SEM View

Chain
Physical Analysis
o Synthesis
o Package
o ASIC
o MEMS Pressure/
Temperature
o Bosch Evolution
LPS22HB Comparison
Cost Analysis
About System Plus
MEMS Pressure Overview
MEMS Die Overview – SEM View
ASIC
HUMIDITY & PRESSURE SENSOR

Chain
Physical Analysis
o Synthesis
o Package
o ASIC
o MEMS Pressure/
Temperature
o Bosch Evolution
LPS22HB Comparison
Cost Analysis
About System Plus
Mfr. Ref. Die Size Die Marking Year
Marking
Metal Layer Epitaxy
Thickness
Number of Temperature
Diode
Bosch
BMP280 Xx x xxmm xx xx xx xxµm x
BME280 xx x xxmm xx xx xx xxµm x
BME680 Xx x xxmm xx xx xx xxµm x
BMP380 Xx x xxmm xx xx xx xxµm x
BMxxxx Pressure Sensor Die
BMxxxx Pressure xxx Sensor Die
Bosch Environmental Sensor Evolution - Pressure Sensor Die

Chain
Physical Analysis
o Synthesis
o Package
o ASIC
o MEMS Pressure/
Temperature
o Bosch Evolution
LPS22HB Comparison
Cost Analysis
About System Plus
Package Comparison
BMP380 Pressure Sensor
STMicroelectronics – LPS22HB
Mfr. Ref. Package Type Package size
(mm)
Pin
Number
Pitch Dies Number Wire Bonding
Number
Bosch BMP380 Metal Lid LGA 2x2x0.75 10 0.5 xx xx
STMicroelectronics LPS22HB HLGA 2x2x0.76 10 0.4 xx xx

Chain
Physical Analysis
Cost Analysis
o Summary
o Supply Chain
o Yields
o ASIC Die Cost
o MEMS Pressure/
Temperature Die Cost
o Packaging Cost
o Back-end Cost
o Component Cost
About System Plus
ASIC Front-End Cost
• The unprobed wafer cost is estimated at $xxx for medium
yield hypothesis.
• The main part of the wafer cost is due to the xxxxxx with xx%.

Chain
Physical Analysis
Cost Analysis
o Summary
o Supply Chain
o Yields
o ASIC Die Cost
o MEMS Pressure/
o Packaging Cost
o Back-end Cost
o Component Cost
About System Plus
ASIC Die Cost
Cost Breakdown Cost Breakdown Cost Breakdown
Low Yield Medium Yield High Yield
• The number of good dies per wafer is estimated to
ranges from xxx to xxx according to yield variations,
which results in a die cost of $xxxx for medium yield.

Chain
Physical Analysis
Cost Analysis
o Summary
o Supply Chain
o Yields
o ASIC Die Cost
o MEMS Pressure/
o Packaging Cost
o Back-end Cost
o Component Cost
About System Plus
BMP380 Component Cost
The component cost ranges from $xxx to $xxx according to yield
variations.
The ASIC die manufacturing represents xx% of the module cost.
The MEMS Temp./Pressure die represents xx% of the module cost.
The package assembly represent xx% of the module cost.
Final test and yield losses account for xx% of the module cost.

Chain
Physical Analysis
Cost Analysis
o Definitions of Price
o Manufacturer Financial
Ratios
o Manufacturer Price
About System Plus
BMP380 Estimated Selling Price Evolution
• We estimate that xxxxx realizes a gross
margin of xx% on the component,
which results in a final component
price ranging from $xxx to $xxx.
• This corresponds to the selling price for
large volume to OEMs.

Chain
Physical Analysis
Cost Analysis
About System Plus
o Company services
o Related reports
o Feedbacks
o Contact
o Legal
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
MEMS & SENSORS
• Status of the MEMS Industry 2017
• MEMS Packaging 2017
MEMS & SENSORS
• MEMS Packaging: Reverse Technology Review
• STMicroelectronics LPS22HB Nano Pressure Sensor
• Bosch BME680 Environmental Sensor with Integrated Gas Sensor

COMPANY
SERVICES

Chain
Physical Analysis
Cost Analysis
About System Plus
o Company services
o Related reports
o Feedbacks
o Contact
o Legal
Business Models Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>40 reports per year)
Costing Tools
Trainings

Chain
Physical Analysis
Cost Analysis
About System Plus
o Company services
o Related reports
o Feedbacks
o Contact
o Legal
Contact
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FRANCE
+33 2 40 18 09 16
sales@systemplus.fr
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