This document is a sample report from Yole Développement titled "Advanced RF SiP for Cell Phones 2017" that discusses packaging technologies and market forecasts for 5G radio frequency system-in-package solutions for smartphones. The report covers topics such as the methodology used, an executive summary of key findings, market drivers and trends related to 5G packaging, disruptions and opportunities in the supply chain, and technology roadmaps and forecasts through 2022 for RF SiP wafers, units, and revenue. It also profiles major players and discusses emerging packaging platforms that could be used for 5G solutions.
RF Front End modules and components for cellphones 2017 - Report by Yole Deve...Yole Developpement
A dynamic market with high responsivity to technical innovation, the RF front end industry is set to grow at 14% CAGR to reach $22.7B in 2022.
A market that will more than double in six years!
The radio-frequency (RF) front end and components market for cellphones is highly dynamic. From being worth $10.1B last year, it is expected to reach $22.7B in 2022. Such high growth is definitely something that players in other semiconductor markets would envy. However, the growth is not evenly distributed.
Filters represent the biggest business in the RF front end industry, and the value of this business will more than triple from 2016 to 2022. Most of this growth will derive from additional filtering needs from new antennas as well as the need for more filtering functionality due to multiple carrier aggregation (CA).
Power amplifiers (PAs) and low noise amplifiers (LNAs), the second biggest business, will be almost flat over the same period. High-end LTE PA market growth will be balanced by a shrinking 2G/3G market. The LNA market will grow steadily, especially thanks to the addition of new antennas.
Switches, the third biggest business, will double. This market will mainly be driven by antenna switches.
Lastly, antenna tuners, a small business today with an estimated $36M market value, will expand 7.5-fold to reach $272M in 2022. This growth is mainly due to tuning being added to both the main and the diversity antennas.
For more discussion, please visit our website: http://www.i-micronews.com/reports.html
5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019 by Y...Yole Developpement
The battle for 5G still rages: integration in-module or with discrete parts?
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2019/
Status of the MEMS Industry 2018 Market and technology Report by Yole Dévelop...Yole Developpement
Megatrends are invigorating the MEMS industry.
More information on : https://www.i-micronews.com/category-listing/product/status-of-the-mems-industry-2018.html
MEMS-Application, Functionality, Fabrication process and limitations, MEMS as a switch, MEMS packaging and proposed mems switches for microwave circuit switch.
Technology Manager Andreas Roessler covers 5G basics in this keynote presentation at the RF Lumination 2019 conference in February 2019.
RF Lumination 2019
"Meet 158+ years of RF design & test expertise at one event. If they can't answer your question, it must be a really good question!"
Watch all the presentations here:
https://www.rohde-schwarz-usa.com/RFLuminationContent.html
Andreas Roessler is the Rohde & Schwarz Technology Manager focused on UMTS Long Term Evolution (LTE) and LTE-Advanced. With responsibility for the strategic marketing and product portfolio development for LTE/LTE-Advanced, Andreas follows the standardization process in 3GPP very closely, particularly on core specifications as well as protocol conformance, RRM and RF conformance specifications for device and base stations testing. He graduated from Otto-von-Guericke University in Magdeburg, Germany, and received a Master's Degree in communication engineering.
RF Front End modules and components for cellphones 2017 - Report by Yole Deve...Yole Developpement
A dynamic market with high responsivity to technical innovation, the RF front end industry is set to grow at 14% CAGR to reach $22.7B in 2022.
A market that will more than double in six years!
The radio-frequency (RF) front end and components market for cellphones is highly dynamic. From being worth $10.1B last year, it is expected to reach $22.7B in 2022. Such high growth is definitely something that players in other semiconductor markets would envy. However, the growth is not evenly distributed.
Filters represent the biggest business in the RF front end industry, and the value of this business will more than triple from 2016 to 2022. Most of this growth will derive from additional filtering needs from new antennas as well as the need for more filtering functionality due to multiple carrier aggregation (CA).
Power amplifiers (PAs) and low noise amplifiers (LNAs), the second biggest business, will be almost flat over the same period. High-end LTE PA market growth will be balanced by a shrinking 2G/3G market. The LNA market will grow steadily, especially thanks to the addition of new antennas.
Switches, the third biggest business, will double. This market will mainly be driven by antenna switches.
Lastly, antenna tuners, a small business today with an estimated $36M market value, will expand 7.5-fold to reach $272M in 2022. This growth is mainly due to tuning being added to both the main and the diversity antennas.
For more discussion, please visit our website: http://www.i-micronews.com/reports.html
5G’s Impact on RF Front-End Module and Connectivity for Cell phones 2019 by Y...Yole Developpement
The battle for 5G still rages: integration in-module or with discrete parts?
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2019/
Status of the MEMS Industry 2018 Market and technology Report by Yole Dévelop...Yole Developpement
Megatrends are invigorating the MEMS industry.
More information on : https://www.i-micronews.com/category-listing/product/status-of-the-mems-industry-2018.html
MEMS-Application, Functionality, Fabrication process and limitations, MEMS as a switch, MEMS packaging and proposed mems switches for microwave circuit switch.
Technology Manager Andreas Roessler covers 5G basics in this keynote presentation at the RF Lumination 2019 conference in February 2019.
RF Lumination 2019
"Meet 158+ years of RF design & test expertise at one event. If they can't answer your question, it must be a really good question!"
Watch all the presentations here:
https://www.rohde-schwarz-usa.com/RFLuminationContent.html
Andreas Roessler is the Rohde & Schwarz Technology Manager focused on UMTS Long Term Evolution (LTE) and LTE-Advanced. With responsibility for the strategic marketing and product portfolio development for LTE/LTE-Advanced, Andreas follows the standardization process in 3GPP very closely, particularly on core specifications as well as protocol conformance, RRM and RF conformance specifications for device and base stations testing. He graduated from Otto-von-Guericke University in Magdeburg, Germany, and received a Master's Degree in communication engineering.
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
IR LEDS and VCSELs - Technology, Applications and Industry Trends - 2017 Repo...Yole Developpement
3D imaging, gas sensing and autofocus will fuel the IR light source market to reach US$3.8B in 2027.
INFRA-RED LIGHT SOURCES: A $1.5B OPPORTUNITY IN 2022 – AND POTENTIALLY $3.8B IN 2027 – DRIVEN BY SEVERAL NEW APPLICATIONS
The market for LED and laser infra-red (IR) light sources is not new, but has evolved rapidly with the recent development of Solid State Lighting (SSL). Initially developed for optical communication applications, these technologies, mostly IR LEDs, started to be integrated into consumer applications like remote controls in the 1980s. Next, the market was driven forward by night vision applications such as surveillance cameras. But it’s only recently, with the development of smartphones, that IR LEDs and lasers have come back to prominence. And now, the market is set for growth for the next 10 years! Today, these technologies are part of a new revolution, still driven by smartphone applications. Integration of breakthrough functionalities such as 3D imaging, autofocus, iris and face recognition is triggering a strong market pull for efficient, miniaturized and complex IR illumination. This trend will also create strong market opportunities for IR lasers, mostly VCSELs, which allow more coherent and directional light than IR LEDs. In this context, we expect the IR light source market to grow from around $450M in 2016 to around $1,550M in 2022 at a compound annual growth rate of 22.7%. In addition, there are also several other applications that are emerging and for which a market boom is likely to happen in the next 10 years. These include gas sensors, LIDARs, driver monitoring systems and remote patient monitoring sensors. We expect this second wave of new applications to propel the IR light source market to around $3,800M in 2027. This report provides an in-depth analysis of all IR light source applications, including: basic principles, technology, trends, key players, and market size. It highlights the global landscape for IR light sources, including classification of applications by wavelength, market segment and function. Detailed market forecasts are given based on these classifications and with complementary analysis by light source for LEDs, edge-emitting lasers and VCSELs. Please note that optical communication applications are not analyzed in this report.
For more information please visit our website: https://www.i-micronews.com/reports.html
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
Orthogonal Frequency Division Multiplexing, OFDM uses a large number of narrow sub-carriers for multi-carrier transmission to overcome the effect of multi path fading problem. LTE uses OFDM for the downlink, from base station to terminal to transmit the data over many narrow band careers of 180 KHz each instead of spreading one signal over the complete 5MHz career bandwidth. OFDM meets the LTE requirement for spectrum flexibility and enables cost-efficient solutions for very wide carriers with high peak rates.
The primary advantage of OFDM over single-carrier schemes is its ability to cope with severe channel conditions. Channel equalization is simplified. The low symbol rate makes the use of a guard interval between symbols affordable, making it possible to eliminate inter symbol interference (ISI).
Smaller package and improved accuracy in a pressure sensor for wearables!
With its wide 300hPa - 1250hPa measurement-covering range and a low power consumption of only 2.0µA, Bosch’s BMP380 pressure sensor is more accurate than the previous BMP280 pressure sensor. Assembled in a 10-pin, metal-lid 2.0mm x 2.0mm x 0.75mm land-grid array package, the BMP380 integrates a digital pressure sensor and a temperature sensor.
It is equipped with only one MEMS die and an amplification application-specific integrated circuit - the same number of dies as the BMP280, but with smaller dimensions.
The pressure sensor is manufactured with Bosch’s “Advanced Porous Silicon Membrane” process, integrating a flexible pressure membrane and temperature diodes on a silicon substrate.
This System-in-Package consists of two sensors in one small package, mixing wire bonding and flip-chip connections. A thorough package analysis is included in this report, which also describes and compares MEMS and ASIC technology evolutions.
Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in P...Yole Developpement
Taiyo Yuden’s Well-Proven Metal Seal Packaging and SAW/BAW technology in LTE Band 7 high isolation duplexer used in Skyworks’ PAMiD
In the last five years, Skyworks has been the largest radio-frequency (RF) component supplier for Huawei. In Huawei’s last flagship, the Mate 9 Pro, and the P10 series, Skyworks supplies entire Long-Term Evolution (LTE) front-end solutions based on its SkyOne® Technology. The solutions comprise Low-, Mid- and High-Band front end modules (FEMs) featuring Surface Acoustic Wave (SAW) and Bulk Acoustic Wave (BAW) filters. Skyworks is known to produce its own SAW filter and to outsource the BAW filter. In its High-Band PA Module integrated Duplexer (PAMiD), Skyworks integrates a duplexer supplied by Taiyo Yuden in metal seal packaging featuring a SAW and a Thin Film Bulk Acoustic Resonator (FBAR)-BAW filter based on Taiyo Yuden Technology.
The filters are located in a System In Package (SiP) with a power amplifier, switch and a RF integrated circuit. The device is a custom version of a Taiyo Yuden commercial device. The duplexer’s SAW filter uses sapphire and lithium tantalate substrates and its BAW filter has an original FBAR design using an air gap cavity on a silicon substrate.
In this report, the complete duplexer is analyzed, from the filters to the packaging developed by Fujitsu Media Limited, which was bought by Taiyo Yuden. The report includes a complete analysis of the package, the SAW filter and the BAW filter, featuring a cost analysis and price estimation for the device. A schematic of the BAW filter is also provided to understand the difference between shunt and series cells.
Finally, the report includes complete performance and technology comparisons with the previous generation of the band 7 duplexer from Taiyo Yuden and a technology comparison with BAW filters and packaging solutions from Qorvo and Broadcom.
More information on that report at http://www.i-micronews.com/reports.html
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
IR LEDS and VCSELs - Technology, Applications and Industry Trends - 2017 Repo...Yole Developpement
3D imaging, gas sensing and autofocus will fuel the IR light source market to reach US$3.8B in 2027.
INFRA-RED LIGHT SOURCES: A $1.5B OPPORTUNITY IN 2022 – AND POTENTIALLY $3.8B IN 2027 – DRIVEN BY SEVERAL NEW APPLICATIONS
The market for LED and laser infra-red (IR) light sources is not new, but has evolved rapidly with the recent development of Solid State Lighting (SSL). Initially developed for optical communication applications, these technologies, mostly IR LEDs, started to be integrated into consumer applications like remote controls in the 1980s. Next, the market was driven forward by night vision applications such as surveillance cameras. But it’s only recently, with the development of smartphones, that IR LEDs and lasers have come back to prominence. And now, the market is set for growth for the next 10 years! Today, these technologies are part of a new revolution, still driven by smartphone applications. Integration of breakthrough functionalities such as 3D imaging, autofocus, iris and face recognition is triggering a strong market pull for efficient, miniaturized and complex IR illumination. This trend will also create strong market opportunities for IR lasers, mostly VCSELs, which allow more coherent and directional light than IR LEDs. In this context, we expect the IR light source market to grow from around $450M in 2016 to around $1,550M in 2022 at a compound annual growth rate of 22.7%. In addition, there are also several other applications that are emerging and for which a market boom is likely to happen in the next 10 years. These include gas sensors, LIDARs, driver monitoring systems and remote patient monitoring sensors. We expect this second wave of new applications to propel the IR light source market to around $3,800M in 2027. This report provides an in-depth analysis of all IR light source applications, including: basic principles, technology, trends, key players, and market size. It highlights the global landscape for IR light sources, including classification of applications by wavelength, market segment and function. Detailed market forecasts are given based on these classifications and with complementary analysis by light source for LEDs, edge-emitting lasers and VCSELs. Please note that optical communication applications are not analyzed in this report.
For more information please visit our website: https://www.i-micronews.com/reports.html
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
Orthogonal Frequency Division Multiplexing, OFDM uses a large number of narrow sub-carriers for multi-carrier transmission to overcome the effect of multi path fading problem. LTE uses OFDM for the downlink, from base station to terminal to transmit the data over many narrow band careers of 180 KHz each instead of spreading one signal over the complete 5MHz career bandwidth. OFDM meets the LTE requirement for spectrum flexibility and enables cost-efficient solutions for very wide carriers with high peak rates.
The primary advantage of OFDM over single-carrier schemes is its ability to cope with severe channel conditions. Channel equalization is simplified. The low symbol rate makes the use of a guard interval between symbols affordable, making it possible to eliminate inter symbol interference (ISI).
Smaller package and improved accuracy in a pressure sensor for wearables!
With its wide 300hPa - 1250hPa measurement-covering range and a low power consumption of only 2.0µA, Bosch’s BMP380 pressure sensor is more accurate than the previous BMP280 pressure sensor. Assembled in a 10-pin, metal-lid 2.0mm x 2.0mm x 0.75mm land-grid array package, the BMP380 integrates a digital pressure sensor and a temperature sensor.
It is equipped with only one MEMS die and an amplification application-specific integrated circuit - the same number of dies as the BMP280, but with smaller dimensions.
The pressure sensor is manufactured with Bosch’s “Advanced Porous Silicon Membrane” process, integrating a flexible pressure membrane and temperature diodes on a silicon substrate.
This System-in-Package consists of two sensors in one small package, mixing wire bonding and flip-chip connections. A thorough package analysis is included in this report, which also describes and compares MEMS and ASIC technology evolutions.
Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in P...Yole Developpement
Taiyo Yuden’s Well-Proven Metal Seal Packaging and SAW/BAW technology in LTE Band 7 high isolation duplexer used in Skyworks’ PAMiD
In the last five years, Skyworks has been the largest radio-frequency (RF) component supplier for Huawei. In Huawei’s last flagship, the Mate 9 Pro, and the P10 series, Skyworks supplies entire Long-Term Evolution (LTE) front-end solutions based on its SkyOne® Technology. The solutions comprise Low-, Mid- and High-Band front end modules (FEMs) featuring Surface Acoustic Wave (SAW) and Bulk Acoustic Wave (BAW) filters. Skyworks is known to produce its own SAW filter and to outsource the BAW filter. In its High-Band PA Module integrated Duplexer (PAMiD), Skyworks integrates a duplexer supplied by Taiyo Yuden in metal seal packaging featuring a SAW and a Thin Film Bulk Acoustic Resonator (FBAR)-BAW filter based on Taiyo Yuden Technology.
The filters are located in a System In Package (SiP) with a power amplifier, switch and a RF integrated circuit. The device is a custom version of a Taiyo Yuden commercial device. The duplexer’s SAW filter uses sapphire and lithium tantalate substrates and its BAW filter has an original FBAR design using an air gap cavity on a silicon substrate.
In this report, the complete duplexer is analyzed, from the filters to the packaging developed by Fujitsu Media Limited, which was bought by Taiyo Yuden. The report includes a complete analysis of the package, the SAW filter and the BAW filter, featuring a cost analysis and price estimation for the device. A schematic of the BAW filter is also provided to understand the difference between shunt and series cells.
Finally, the report includes complete performance and technology comparisons with the previous generation of the band 7 duplexer from Taiyo Yuden and a technology comparison with BAW filters and packaging solutions from Qorvo and Broadcom.
More information on that report at http://www.i-micronews.com/reports.html
InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sens...Yole Developpement
World’s first ‘7-Axis’ motion tracking device targeting drone application
Having supplied Apple for many years, InvenSense (TDK) is a leader in the inertial measurement unit (IMU) market. It has a large market share, competing with Bosch and others. This year, with the acquisition of Sensirion’s barometric pressure sensor division, InvenSense has entered a new market area. It has now released of its first ‘7-axis’ motion tracking combo, bringing together a 6-axis IMU and a pressure sensor, moving it into drone applications.
The ICM-20789 7-axis combo sensor released by InvenSense features a 6-axis device, incorporating a 3-axis gyroscope and a 3-axis accelerometer, and a barometric pressure sensor previously developed by Sensirion in the same package. Compared with the stand-alone sensor hub, this approach eliminates a package and minimizes board area requirements.
More information on that report at http://www.i-micronews.com/reports.html
UV LEDs - Technology, Manufacturing and Application Trends 2016 Report by Yol...Yole Developpement
After fast adoption of UVA LEDs for curing applications, UVC LEDs for purification/disinfection are now ready
FOLLOWING THE UV CURING BOOM, DISINFECTION AND PURIFICATION APPLICATIONS ARE FINALLY READY TO TAKE OFF
The UVC LED industry is still small but strong growth is expected in the next 18 months due to dramatic price reductions. In 2016 prices are 1/8-1/10 of what they were in 2015. This has been triggered by the industry’s development, its transition to mass production and improved device performance. With most of the industry believing that $1-$4/mW is the price that would trigger mass market adoption we are getting close to a UVC LED market boom. Another positive sign is that most UVC LED manufacturers are now focusing on developing cost-effective solutions rather than improving device power output. In parallel, the UVC LED industry continues to work on increasing lifetime and developing lower wavelength devices, below 280nm.
UVA LEDs continue to progress in the UV curing space. Continuous improvement of device performance coupled with price reduction has allowed the technology to be increasingly adopted in UV curing applications. Penetration of UV LEDs is increasing but we observe differences in adoption rates depending on application. Small size and low speed applications like spot adhesive and digital inkjets have the highest adoption rate, and most new developments use UV LEDs. This is due to the small module size and low irradiance level needed that limits the extra cost of integrating UV LEDs compared to the total price of systems like inkjet printers. On the other hand, applications that need high speed processes and/or high levels of irradiance such as screen printing or coating applications have lower adoption rates. This is because UV LED performance is not yet good enough to fully replace traditional mercury lamps.
In this context, we expect the UVC LED market to strongly grow from $7M in 2015 to $610M by 2021. Despite increased penetration rate in all applications, the UVA LED market will grow more slowly, from $107M in 2015 to $357M by 2021, moderated by price pressure.
The report presents a comprehensive review of all UV light applications including analysis of UV curing, UV purification/disinfection and analytical instruments. It highlights the UV LED working principle, market structure, UV LED market drivers and associated challenges, recent trends, new applications created by UV LEDs, UV LED market size split by application, and much more.
More information on that report at http://www.i-micronews.com/reports.html
Phosphors and Quantum Dots 2017: LED downconverters for Lighting and Displays...Yole Developpement
Volume saturation, price pressure and a shifting intellectual property landscape are forcing the LED phosphor industry into a rationalization period, with innovation key for survival
EXPIRATION OF FUNDAMENTAL INTELLECTUAL PROPERTY CHANGES THE MATERIAL LANDSCAPE
Key patents held by Nichia and Osram have started expiring in 2017 and will continue to do so in 2018. While both companies have since built on those patents and created broad families of intellectual property (IP), it will become much more difficult for them to prevent competitors from using garnet phosphors in their LED packages.
As a result, phosphor families such as silicates and yellow nitrides (LYSN) are expected to lose market share as LED packagers transition to garnets. The switch will especially affect silicates, which are perceived to have lower performance than yttrium aluminum garnet (YAG) and other garnets, However, some of the most recent silicate compositions developed by tier-1 suppliers are now matching YAG performance but come at a premium price. Leading phosphor suppliers with a strong focus on silicate materials must therefore diversify their portfolio. They need to create new silicate compositions with unique features to meet specific demands in various high added value lighting applications.
LYSN might fare better in the long term. Yellow nitrides have exhibited steady and continuous performance improvement since entering the market in 2010. The material is already matching garnet performance in most aspects and, being less mature, still offers significant room for improvement. Attractive features of yellow nitride include a lower infrared tail that could translate to higher efficiency compared to YAG. Leaders in nitride phosphors could therefore find a new growth driver as the red nitride market reaches saturation.
More information on that report at http://www.i-micronews.com/reports.html
Camera Module Industry 2017 Report by Yole Developpement Yole Developpement
New technologies and applications have restructured the Compact Camera Module industry
AT 12.2% CAGR FOR THE NEXT FIVE YEARS, THE COMPACT CAMERA MODULE INDUSTRY (CCM) IS A GROWTH POWERHOUSE WITH NUMEROUS LARGE COMPANIES THRIVING IN A DYNAMIC MARKET
In 2015, Yole Développement published its first report on the camera module industry and mentioned the immaturity of the ecosystem with numerous small players especially for module assembly. Now the dust has settled and giant camera module players have emerged such as LG Innotek, Semco, Foxconn Sharp, O-Film and Sunny Optical. This 2017 edition is giving you the insights into the trajectory of the industry and of more than 30 players serving mobile and other applications such as automotive and security.
Historically one could differentiate the faith of camera module market from the sub parts such as the image sensor, the lens and the autofocus or optical image stabilization system (Voice Coil Motors - VCM). It seems that differentiated growth has now ended and every sub segment is enjoying almost equal benefit from the rising market tide. This convergence is in part due to the end of quasi-monopoly from Sony in the image sensor sub-segment now joined by Samsung and Omnivision. The story is very similar for Largan Precision in the lens set sub-segment which is now facing renewed competition from Sunny Optical, Kantatsu and Genious Optical.
The last sub-domain of our interest in this report is VCMs. The growth of VCM companies has been undercut by dire structuration efforts. We had mentioned the inability of the VCM to serve the demand in the mobile market. Price pressures have changed the face of competition with competitors such as Mitsumi and Shicoh which were forced out and new players such as New Shicoh and Jawha to take center stage.
More information on that report at http://www.i-micronews.com/reports.html
Status of the CMOS Image Sensor Industry 2017 - Report by Yole DeveloppementYole Developpement
New applications are transforming the market and technology playing field for CMOS image sensors
It’s ten years down the line from the initial Apple iPhone that started the smartphone era. Since then, CMOS imaging has benefited from huge market demand and a technology-driven environment, resulting in an $11.6B industry in 2016. Photography and video is the main application, which is totally transformed by new use cases, new devices and new technologies.
The mobile market is key for the CMOS image sensor (CIS) industry. Despite saturation in the number of handsets, the CIS market has been able to maintain a 10.5% compound annual growth rate (CAGR) for the 2016-2022 period due to the introduction of dual and 3D cameras. These additional cameras are changing the industry’s drivers from form factor and image quality to interactivity.
Penetration into higher added value markets such as automotive, security and medical shows that CIS products are transforming use cases across the board. CIS technology adoption allows greater automation levels at low cost, while using newly available computing architectures such as deep learning. The CMOS image sensor industry is currently in a virtuous circle where a new technology is providing true customer value.
Seminar report on Millimeter Wave mobile communications for 5g cellularraghubraghu
The global bandwidth shortage facing wireless communication has motivated the exploration of the unutilized frequencies present in the frequency spectrum; this exploration has lead to the use of millimeter wave (mm-wave) frequency spectrum for future broadband cellular communication networks
Millimeter Wave mobile communications for 5g cellularraghubraghu
The next generation of wireless mobile communication is here know as 5G cellular which will revolutionize the way which see at wireless communication today !!!
Millimeter wave mobile communication for 5G cellular.Apurv Modi
Introducing the Fifth generation(5G) cellular technology that is use "millimeter wave" technology,as research is going on this approach and by 2020 5G mobile cellular will work on to the millimeter wave with great spectrum bandwidth and very less cost with serving of 100 billion wireless connection across the world
Key points
•
From mobile voice to mobile everywhere7
1. LTE global success
•
LTE subscriptionsdistribution (Q4 2017 –Q4 2021)9
•
Breakdown of mobile customers by country and technology, end-20169
•
China Mobile LTE capexand LTE coverage10
•
Outdoor LTE coverage10
•
≥ 500 Mbps LTE-Advanced networks launched11
•
MNOs ranking by subscriber numbers, end-June 201712
•
Subscriber numbers in leading countries12
•
5G usage scenarios13
•
5G Performance Objectives14
2. 5G
•
5G timeline16
•
5G subscribers by region in 202517
•
5G subscribers forecasts17
•
5G widespread technology enablers18
•
Three scenarions for 5G monetisation, MNO’s view19
3. More spectrum for LTE upgrades and 5G
•
IMT bands, below 6 GHz22
•
IMT bands, above 6 GHz23
•
Potential5G bands worldwidein the 20-45 GHz range24
•
Price of premium licences/spectrum per MHz per pop., for 10 years25
•
Price of 700 MHz licences/spectrum per MHz per pop., for 10 years25
5G Impact on RF Front-end Module and Connectivity for Cell Phones Report by Y...Yole Developpement
How is 5G enabling new business opportunities despite flat mobile growth?
More information on : https://www.i-micronews.com/category-listing/product/p5g%E2%80%99s-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2018.html
Status of the Advanced Packaging Industry 2018 Report by Yole Developpement Yole Developpement
In the era of a slowing Moore’s Law, advanced packaging has emerged as the savior of future semiconductor development.
More information on that report at https://www.i-micronews.com/report/product/status-of-the-advanced-packaging-industry-2018.html
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
Presentations given at the
Workshop 6: European and Taiwanese Cooperation on 5G
Wednesday, 19 June 2019, at EUCNC 2019 in Valencia, Spain.
All presentations atre available.
Introducing our 5G Platform for the first movers in 5G, the first completely end-to-end solution that combines core and radio solutions in 5G to enable new opportunities and use cases
Recent research and the current scenario as well as future market potential of "The 5G Wireless Ecosystem: 2015 - 2025 - Technologies, Applications, Verticals, Strategies & Forecasts" globally.
5G’s Impact on Telecom Infrastructure 2019 report by Yole DéveloppementYole Developpement
Network evolution and 5G implementation are driving massive structural changes.
More information on: https://www.i-micronews.com/products/5gs-impact-on-telecom-infrastructure-2019/
5G: The Nervous System of the Digital Society, Digital Economy and Silver Eco...Dr. David Soldani
Interview to David Soldani, Nokia, by Roberta Chiti, Cor.Com, Italy on May 12, 2017
http://www.corrierecomunicazioni.it/digital/47243_soldani-nokia-5g-sistema-nervoso-della-societa-digitale.htm
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
The one million robotic vehicle milestone will be reached by end of the decade: The industrial phase has been launched.
More information on: https://www.i-micronews.com/products/sensors-for-robotic-mobility-2020/
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...Yole Developpement
High-end inertial sensors are the backbone of systems that will enable autonomous transportation and the new space industry.
More information on: https://www.i-micronews.com/products/high-end-inertial-sensors-for-defense-aerospace-and-industrial-applications-2020/
Transcript: Selling digital books in 2024: Insights from industry leaders - T...BookNet Canada
The publishing industry has been selling digital audiobooks and ebooks for over a decade and has found its groove. What’s changed? What has stayed the same? Where do we go from here? Join a group of leading sales peers from across the industry for a conversation about the lessons learned since the popularization of digital books, best practices, digital book supply chain management, and more.
Link to video recording: https://bnctechforum.ca/sessions/selling-digital-books-in-2024-insights-from-industry-leaders/
Presented by BookNet Canada on May 28, 2024, with support from the Department of Canadian Heritage.
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
GraphRAG is All You need? LLM & Knowledge GraphGuy Korland
Guy Korland, CEO and Co-founder of FalkorDB, will review two articles on the integration of language models with knowledge graphs.
1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/
Key Trends Shaping the Future of Infrastructure.pdfCheryl Hung
Keynote at DIGIT West Expo, Glasgow on 29 May 2024.
Cheryl Hung, ochery.com
Sr Director, Infrastructure Ecosystem, Arm.
The key trends across hardware, cloud and open-source; exploring how these areas are likely to mature and develop over the short and long-term, and then considering how organisations can position themselves to adapt and thrive.
Essentials of Automations: Optimizing FME Workflows with ParametersSafe Software
Are you looking to streamline your workflows and boost your projects’ efficiency? Do you find yourself searching for ways to add flexibility and control over your FME workflows? If so, you’re in the right place.
Join us for an insightful dive into the world of FME parameters, a critical element in optimizing workflow efficiency. This webinar marks the beginning of our three-part “Essentials of Automation” series. This first webinar is designed to equip you with the knowledge and skills to utilize parameters effectively: enhancing the flexibility, maintainability, and user control of your FME projects.
Here’s what you’ll gain:
- Essentials of FME Parameters: Understand the pivotal role of parameters, including Reader/Writer, Transformer, User, and FME Flow categories. Discover how they are the key to unlocking automation and optimization within your workflows.
- Practical Applications in FME Form: Delve into key user parameter types including choice, connections, and file URLs. Allow users to control how a workflow runs, making your workflows more reusable. Learn to import values and deliver the best user experience for your workflows while enhancing accuracy.
- Optimization Strategies in FME Flow: Explore the creation and strategic deployment of parameters in FME Flow, including the use of deployment and geometry parameters, to maximize workflow efficiency.
- Pro Tips for Success: Gain insights on parameterizing connections and leveraging new features like Conditional Visibility for clarity and simplicity.
We’ll wrap up with a glimpse into future webinars, followed by a Q&A session to address your specific questions surrounding this topic.
Don’t miss this opportunity to elevate your FME expertise and drive your projects to new heights of efficiency.
The Art of the Pitch: WordPress Relationships and SalesLaura Byrne
Clients don’t know what they don’t know. What web solutions are right for them? How does WordPress come into the picture? How do you make sure you understand scope and timeline? What do you do if sometime changes?
All these questions and more will be explored as we talk about matching clients’ needs with what your agency offers without pulling teeth or pulling your hair out. Practical tips, and strategies for successful relationship building that leads to closing the deal.
Connector Corner: Automate dynamic content and events by pushing a buttonDianaGray10
Here is something new! In our next Connector Corner webinar, we will demonstrate how you can use a single workflow to:
Create a campaign using Mailchimp with merge tags/fields
Send an interactive Slack channel message (using buttons)
Have the message received by managers and peers along with a test email for review
But there’s more:
In a second workflow supporting the same use case, you’ll see:
Your campaign sent to target colleagues for approval
If the “Approve” button is clicked, a Jira/Zendesk ticket is created for the marketing design team
But—if the “Reject” button is pushed, colleagues will be alerted via Slack message
Join us to learn more about this new, human-in-the-loop capability, brought to you by Integration Service connectors.
And...
Speakers:
Akshay Agnihotri, Product Manager
Charlie Greenberg, Host
Elevating Tactical DDD Patterns Through Object CalisthenicsDorra BARTAGUIZ
After immersing yourself in the blue book and its red counterpart, attending DDD-focused conferences, and applying tactical patterns, you're left with a crucial question: How do I ensure my design is effective? Tactical patterns within Domain-Driven Design (DDD) serve as guiding principles for creating clear and manageable domain models. However, achieving success with these patterns requires additional guidance. Interestingly, we've observed that a set of constraints initially designed for training purposes remarkably aligns with effective pattern implementation, offering a more ‘mechanical’ approach. Let's explore together how Object Calisthenics can elevate the design of your tactical DDD patterns, offering concrete help for those venturing into DDD for the first time!
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...Jeffrey Haguewood
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on the notifications, alerts, and approval requests using Slack for Bonterra Impact Management. The solutions covered in this webinar can also be deployed for Microsoft Teams.
Interested in deploying notification automations for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
Accelerate your Kubernetes clusters with Varnish CachingThijs Feryn
A presentation about the usage and availability of Varnish on Kubernetes. This talk explores the capabilities of Varnish caching and shows how to use the Varnish Helm chart to deploy it to Kubernetes.
This presentation was delivered at K8SUG Singapore. See https://feryn.eu/presentations/accelerate-your-kubernetes-clusters-with-varnish-caching-k8sug-singapore-28-2024 for more details.
6. 21 rue la Noue Bras de Fer
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Advanced RF SiP for Cellphones
Reverse Costing Review: Physical Analyses & Cost Estimations
RF report by Stéphane ELISABETH
October 2017
THIS REPORT IS ACCOMPANIED
BY A PHYSICAL TEARDOWN AND
REVERSE COSTING REPORT!
18. The 5th
generation of cellular networks is
anticipated to arrive in the timeframe of the
next 2-5 years, enabling Gbps datarates and
a plethora of new applications and services.
One of the key drivers for developing such
speed is high resolution video demand (4K, 8K
etc.) over mobile devices. Furthermore, future
applications such as mobile driven augmented
and virtual reality would benefit greatly from
such technical capabilities. In addition, certain
amounts of data generated by the Internet of
Things end devices will need to be transmitted
over the cellular network as well. Global mobile
data traffic is growing at an astonishing rate,
with >40% CAGR predicted from 2017-2022.
While some parts of 5G might be available
as soon as 2019, in reality, there are many
uncertainties which keep the global community
in discussion:
• Accuracy of future projected data
demands and market growth
• Growth of applications and services which
would require 5G networks
• Justification of financial investment in
infrastructure required
• Allocation of appropriate frequency bands
• Technology readiness
• Competition from advanced WiFi (i.e.
WiGiG)
• Capabilities of ongoing 4G innovation
The fundamental motivation for developing 5G
networks is the assumption that much higher
datarates will be needed, than current 4G
allows. The speed of 5G adoption will highly
depend on market demand and status of RF
semiconductor technology quality. While the
step from 3G to 4G was more incremental,
5G is considered a disruptive step, both from
financial and technology viewpoint. 5G has 3
aspects: mmWave, sub 6GHz and sub 1 GHz
(5G Internet-of-Thing - IoT). Highest frequency
5G targets mmWave frequency bands, in the
range from 28 GHz to 60 GHz and even in some
cases up to 80 GHz. This requires significant
technology overhaul and installation of a large
number of smaller local cells to assure signal
quality. Meanwhile, significant efforts are being
allocated to improve current 4G technology
in the sub 6 GHz bands, towards 100 Mbit/s
and beyond. The semiconductor industry, from
front end to assembly and test is under heavy
pressure to innovate at a very fast pace while
maintaining desired quality and reliability.
RF front end modules today are utilizing complex
System-in-Package (SiP) architectures with 10-
15 dies (switches, filters, power amplifiers)
included and several types of interconnects
(wire bond, flip chip, Cu pillars) in a single
package. Future smartphone connectivity relies
on SiP innovation with SiP packaging revenue
expected to grow 10% CAGR 2017 to 2022,
more than the overall fast growing advanced
packaging sector with CAGR 2017-2022 of 7%.
Overall RF front end component market for
smartphones is expected to grow from 12.3
$B in 2017 to 22.8 $B in 2022, with a CAGR
of 13%. Advanced multi die SiP packaging holds
a large set of key technologies to address all
flavors of 5G requirements with the ability to
enable or slow down the 5G market!
ADVANCED RF SYSTEM-IN-PACKAGE FOR CELL PHONES 2017
Market Technology report - October 2017
5G – THE DISRUPTION IS AROUND THE CORNER!
The transition from 4G to 5G requires disruptive packaging innovation. 5G mmWave, 5G sub 6
GHz - which packaging architectures can rise to the occasion?
KEY FEATURES OF THE REPORT
Get the sample of the report
on www.i-Micronews.com
Market overview
• Drivers and dynamics for 5G
flavors: 5G mmWave and 5G sub
6 GHz
• Disruptions and opportunities
thereof
• Focus on FEM and PAM
architectures in RF front-end of
cellphones
• RF front end SiP forecast
(revenue, wafers, units)
Technology trends and forecasts
• RF front-end multi-die System-in-
Package challenges and technology
requirements for 5G sub 6 GHz
and 5G mmWave (24 GHz) bands
• 5G SiP packaging roadmaps for
smartphone front-end
• RF SiP revenue, wafer and unit
forecasts
Supply chain analysis
• Supply chain changes in the new
5G era
• Strategies and outlook of current
RF SiP manufacturers
• New entries and supply chain
disruptions for mmWave packaging
(Yole Développement, October 2017)
All flavors of 5G are developing in parallel!
• Upgrade of 4G technology - incremental
innovation
• Will stay at frequencies 6 GHz
• Modification of current RF packaging architectures
• Minimal change in BOM
• mmWave 5G technology - disruptive
innovation
• Introduction of mmWave frequencies 24 GHz
• Adoption of new packaging architectures and
platforms
• Major design changes and new materials
required
• Used frequencies 1GHz
• To address transfer of data generated by many
IoT end devices (mainly sensors)
• Still undefined standards/protocols
• Little to no innovation regarding semiconductor
packaging
5G
mm
Wave
5G
sub 6
GHz
5G
IoT
4G2G 3G
All tracks include higher integration
and further RF SiP development
19. Supply chain to get more complex with Qualcomm 5G push and
potential new entries
(Yole Développement, October 2017)
ADVANCED RF SYSTEM-IN-PACKAGE FOR CELL PHONES 2017
5G BRINGS BOTH COMPLEXITY AND NEW BUSINESS OPPORTUNITIES
NEW DESIGNS FOR CHALLENGING 5G REQUIREMENTS
The SiP supply chain in the smartphone RF
front end (FEM/PAM) in today’s 4G technology
is clearly led by 5 IDMs: Qorvo, Broadcom
(Avago), Skyworks, Murata and TDK Epcos.
Part of their production is outsourced to top
OSATs: ASE, Amkor, JCET Group and SPIL.
The future brings diversified strategies on
which markets to target first. Today’s IDMs are
more focusing on 5G sub 6 GHz solutions while
Qualcomm is attempting to skip a step directly
focusing on promoting and developing mmWave
5G technologies while working on establishing
a 5G mmWave supply chain in order to ensure
early leadership. Various packaging technology
options and market uncertainties leave OSATs
to make difficult choices on targeted customers,
markets and packaging architectures to qualify
and offer, in order to motivate IDMs for further
outsourcing.
With 5G mmWave, 5G sub 6 GHz and 5G IoT
developing in parallel, what are the strategies of
each RF SiP manufacturer and their long term
Accomplishing Gbps wireless datarates on the
cellular network requires operation of devices at
GHz frequencies. While allocation of frequency
bands is still in discussion, mmWave bands around
28 GHz, 39 GHz and 60 GHz come most into
discussion. Meanwhile 5G below 6GHz is targeting
expansion to 3.5 GHz and 4.5 GHz. Although
5G below 6 GHz also requires semiconductor
packaging innovation, it can be considered mostly
incremental. However, the 5G mmWave domain is
opening completely new sets of requirements that
requires considerable technology disruptions. At
mmWave frequencies signal path length becomes
particularly critical and any design imperfection is
transformed into considerable signal losses and
deteriorated device performance. Today, RF SiPs,
namely FEMiD and PAMiD are rather complex
and contain 10-15 heterogeneous dies (Si based,
III/V, MEMS etc.) with mixed wirebonding, flip
chip ball or Cu pillar interconnects attaching to
organic package substrates with up to 7 metal
layers. Future 5G sub 6 GHz and especially 5G
mmWave will require even denser integration of
dies in order to minimize signal paths and keep
losses under control.
Finding new innovative substrate/RDL solutions
will directly impact the performance and success
of a product. On top of that, integration of the
antenna within the SiP is more a need than an
option, bringing a set of additional challenges
from placement options, processing, shielding etc.
Future RF packaging innovation in cellphones is
being performed on several levels and in parallel
for 5G sub 6GHz and 5G mmWave, however the
real packaging disruption is expected on mmWave
frequencies 24 GHz. Some of the future RF
packaging quests are search for low loss materials,
antenna integration, possible integration of dies
in front end, overhaul in packaging architectures
and exploration of shielding options – all in
order to develop new generations of 5G RF SiPs.
Investigated packaging platforms for 5G so far
include advanced Flip Chip substrate solutions,
Fan-Out WLP and glass interposers.
What are the requirements and challenges in
5G packaging? How does that reflect on RF
packaging architectures and materials? What are
the advantages and limitations of developing RF
packaging architectures? How will the dies and
interconnects change at higher frequencies? Is
there a better fit for lower and higher mmWave
5G bands? Which RF packaging architectures will
win? Take a look into the full report for an in depth
analysis providing answers to these questions.
More and disruptive SiP architectures expected in 5G mmWave
(Yole Développement, October 2017)
Tomorrow, 5G sub 6 GHz and mmWave 5G (2019)
Sub 2.7 GHz
FC substrate SiP
Today (4G in 2017)
• 10-15 dies in Flip Chip SiP
• Mix of Si and III/V Front End
(i.e. PA)
• Flip Chip balls or Cu pillars
• Power amplifiers still
wirebonded
Improvements in sub 6 GHz and mmWave bands (28, 39, 60 GHz)
Glass substrate
Fan-Out WLP
Enhanced
Flip Chip substrate
SiP
Which package
architecture
will win?
OSAT services
OSAT services
Key RF FEM/PAM
SiP suppliers in 4G
5G sub 6GHz
mmWave
5G
Potential new
semiconductor entries
?
Technology
strategy and
competition
ongoing
Working on
incremental
advancements
Directly to disruptive
mmWave 5G
Key OEM mobile drivers
More OEM
involvement
+ others
20. MARKET TECHNOLOGY REPORT
outlook? Can Qualcomm outpace the competitors by being first to develop 5G mmWave
technologies or are the timelines premature? How are OSATs responding and is outsourcing
expected to increase or decrease at mmWave frequencies? With specific technology changes
at 5G mmWave, doors are open for other fabless and IDM to enter the competition at RF
front end. Why are they considered as potential new entries and how can the supply chain?
This report aims to provide answers to these diverse and challenging questions.
Find more
details about
this report here:
COMPANIES CITED IN THE REPORT (non exhaustive list)
Amkor (J-Devices, Nanium), Apple, ASE Group, Broadcom Ltd. (Avago Technologies, Javelin
Semiconductor),CavendishKinetics,Cisco,DecaTechnologies,Ericsson,Fujitsu,GLOBALFOUNDRIES,
Google, Huawei (Hisilicon), Infineon, Intel, JCET/STATS ChipPAC, Kyocera, Lenovo, LG, Marvell,
Mediatek, Nepes, NXP Semiconductors (Freescale), Microsoft, Murata Manufacturing Company,
NTT Docomo, ON Semiconductor, OPPO, Panasonic, Peregrine Semiconductor/Murata, Powertech
Technology, Qorvo (RFMD, Triquint), Qualcomm (RF360), Samsung, Skyworks Solutions, Soitec,
Spreadtrum, SPIL, STMicroelectronics, TDK-EPC (EPCOS), Texas Instruments, TSMC, UMC, Vivo,
Xiaomi, ZTE and more…
Introduction3
Methodology
Report synergies
Objectives, scope, glossary
Advanced packaging platforms
Executive summary 15
Market drivers and dynamics 35
Advanced packaging drivers
RF packaging environment
Disruptions and opportunities
Technology56
Challenges and requirements for 5G
packaging
Analysis on RF SiP packaging platforms in
development
RF SiP packaging roadmaps
Players and supply chain 87
Player landscape and positioning
Company strategies
Business model shifts
Market forecasts 102
RF SiP forecasts
Unit count
Wafer count
Revenue
Conclusions117
Yole Développement presentation 121
TABLE OF CONTENTS (complete content on i-Micronews.com)
• Smartphone RF Front-End Module Review
• Status of the Advanced Packaging Industry
2017
• Glass Substrate Manufacturing in the
semiconductor field 2017
• 5G’s Impact on the
RF Front-End Industry
RELATED REPORTS
Benefit from our Bundle Annual Subscription offers and access our analyses at the best available
price and with great advantages
AUTHORS
Andrej Ivankovic is a Technolo-
gy Market Analyst, in the Advanced
Packaging and Semiconductor Manu-
facturing team, at Yole Développement
the «More than Moore» market re-
search and strategy consulting company.
He holds a master’s degree in Electri-
cal Engineering, with specialization in
Industrial Electronics from the Univer-
sity of Zagreb, Croatia and a PhD in
Mechanical Engineering from KU Leuven,
Belgium. He started as an intern at ON
Semiconductor performing reliability
tests, failure analysis and characteriza-
tion of power electronics and packages.
The following 4 years he worked as a
RD engineer at IMEC Belgium on the
development of 3D IC technology, focu-
sing on electrical and thermo-mechani-
cal issues of 3D stacking and packaging.
Part of this time he also worked at GLO-
BALFOUNDRIES as an external resear-
cher. He has regularly presented at in-
ternational conferences authoring and
co-authoring 18 papers and 1 patent.
Claire Troadec is leading the RF
activity at Yole Développement. She
has been a member of the MEMS
manufacturing team from 2013. She
graduated from INSA Rennes in
France with an engineering degree in
microelectronics and material sciences.
She then joined NXP Semiconductors,
and worked for 7 years as a CMOS
process integration engineer at the
IMEC RD facility. During this time, she
oversaw the isolation and performance
boost of CMOS technology node
devices from 90 nm down to 45 nm.
She has authored or co-authored
seven US patents and nine international
publications in the semiconductor field
and before joining Yole Développement
managed her own distribution company.
Find all our reports on www.i-micronews.com
OBJECTIVES OF THE REPORT
• Translate 5G market drivers to semiconductor packaging dynamics
• Summarize multi die packaging (SiP) technology challenges and requirements for RF Front-End
in smartphones
• Analyze various developing RF SiP architectures for sub 6 GHz and mmWave frequencies,
advantages and suitability thereof
• Analyze supply chain changes and opportunities for 5G in smartphones
21. ORDER FORM
Advanced RF System-in-Package for Cell Phones 2017
SHIPPING CONTACT
First Name:
Email:
Last Name:
Phone:
PAYMENT
BY CREDIT CARD
Visa Mastercard Amex
Name of the Card Holder:
Credit Card Number:
Card Verification
Value (3 digits except AMEX: 4 digits):
Expiration date:
BY BANK TRANSFER
BANK INFO: HSBC, 1 place de la Bourse,
F-69002 Lyon, France,
Bank code: 30056, Branch code: 00170
Account No: 0170 200 1565 87,
SWIFT or BIC code: CCFRFRPP,
IBAN: FR76 3005 6001 7001 7020 0156 587
RETURN ORDER BY
• FAX: +33 (0)472 83 01 83
• MAIL: YOLE DÉVELOPPEMENT, Le Quartz,
75 Cours Emile Zola, 69100 Villeurbanne/Lyon - France
SALES CONTACTS
• North America - Steve Laferriere: +13106 008 267
laferriere@yole.fr
• Europe RoW - Lizzie Levenez: + 49 15 123 544 182
levenez@yole.fr
• Japan Rest of Asia - Takashi Onozawa: +81 3 6869 6970
onozawa@yole.fr
• Greater China - Mavis Wang: +886 979 336 809
wang@yole.fr
• Specific inquiries: +33 472 830 180 – info@yole.fr
(1)
Our Terms and Conditions of Sale are available at
www.yole.fr/Terms_and_Conditions_of_Sale.aspx
The present document is valid 24 months after its publishing date:
October 11, 2017
/
ABOUT YOLE DEVELOPPEMENT
BILL TO
Name (Mr/Ms/Dr/Pr):
Job Title:
Company:
Address:
City:
State:
Postcode/Zip:
Country*:
*VAT ID Number for EU members:
Tel:
Email:
Date:
PRODUCT ORDER - REF.YDAP17041
Please enter my order for above named report:
One user license*: Euro 5,490
Multi user license: Euro 6,490
- The report will be ready for delivery from November 6, 2017
- For price in dollars, please use the day’s exchange rate. All reports are
delivered electronically at payment reception. For French customers,
add 20% for VAT
I hereby accept Yole Développement’s Terms and Conditions of Sale(1)
Signature:
*One user license means only one person at the company can use the report.
Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and
corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications
using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and
image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, software, Optoelectronics, Microfluidics Medical, Advanced
Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries Energy Management.
The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting,
PISEO and KnowMade, support industrial companies, investors and RD organizations worldwide to help them understand markets and follow technology
trends to grow their business.
MEDIA EVENTS
• i-Micronews.com website and related @Micronews e-newsletter
• Communication webcast services
• Events: TechDays, forums,…
More information on www.i-micronews.com
CONTACTS
For more information about :
• Consulting Financial Services: Jean-Christophe Eloy (eloy@yole.fr)
• Reports: David Jourdan (jourdan@yole.fr) Yole Group of Companies
• Press Relations Corporate Communication: Sandrine Leroy (leroy@yole.fr)
CONSULTING AND ANALYSIS
• Market data research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering costing
• Patent analysis
• Design and characterization of innovative optical systems
• Financial services (due diligence, MA with our partner)
More information on www.yole.fr
REPORTS
• Market technology reports
• Patent investigation and patent infringement risk analysis
• Teardowns reverse costing analysis
• Cost simulation tool
More information on www.i-micronews.com/reports