A unique, high-performance MEMS gyroscope z-axis for industrial applications.
Tronics Microsystems, a leader in high-performance MEMS inertial sensors, recently released a new high-performance MEMS gyroscope specially designed for industrial and other demanding applications: the Tronics GYPRO3300. The GYPRO3300 is a next-generation MEMS angular rate sensor that can determine angle changes in three dimensions for applications such as 3D mapping, robotics, AHRS, and navigation systems. Hermetically sealed in a single CLCC 30-pin package, and with a volume under 850 mm3, the GYPRO3300 can be integrated in many advanced systems.
More information on that report at http://www.i-micronews.com/reports.html
The document summarizes a final design presentation for a senior design project team called Mata-Door. It outlines the personnel on the team, the schedule and problem background. It then provides an overview of the system design including optimization details, analysis of individual parts, safety interlocks and testing. Cost analysis and recommendations are also presented before concluding.
1. The document describes the final report for a robotics design project. It summarizes the problem definition, design evolution, robot operation, fabrication methods, design analysis, technical analysis, and results from robot testing competitions.
2. It discusses two robot designs created by a student team to pick up and dump balls, and the operation of these designs. Fabrication methods included building custom parts in Solidworks.
3. The technical analysis identifies elements that worked well and problems encountered, such as the solenoid being too weak. While performance was disappointing, the pickup mechanism was effective and the greatest design strength.
1. The document outlines the design, testing, and analysis of two robots created by a student team to complete the task of picking up and dumping three balls.
2. Both robot designs used the same ball pickup mechanism, with the first storing balls in a carriage and the second using a bent tube to store and roll balls into a collection box.
3. Testing revealed issues with the ball transfer system and solenoid strength, while the initial program and ability to reuse motor brackets between designs were successful aspects.
The document is about a webinar on pipe support field inspection, installation, and maintenance presented by Jerry Godinaer. It provides information on inspecting, installing, and maintaining different types of pipe supports including variable and constant spring hangers, restraint devices, pipe shoes, slide plates, and hardware components. It discusses guidelines for on-site surveys, what to inspect for existing supports, and criteria for adjusting or replacing supports if needed.
Safran Colibrys VS1000 Series - teardown reverse costing report published by ...Yole Developpement
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Safran Colibrys is the leading European supplier of high-performance silicon-based MEMS providing long-term bias stability under harsh environments. In a global market worth around $100M in 2016, high-performance silicon-based MEMS accelerometers address a wide range of applications, from commercial aerospace applications to the defense market. Amongst these, the industrial market remains attractive and the most dynamic. Thanks to performance improvements and reduced size and cost, more opportunities are appearing.
The VS1000 series consists of vibration sensors based on Colibrysâ MEMS accelerometer. They offer the best match for low- to medium-frequency sensing, as well as the best performance stability, with shock resistance and the lowest non-linearity and noise available on the market. The VS1000 is available in various acceleration ranges, from Âą2g to Âą200g.
The VS1000 features an innovative low-noise application specific integrated circuit (ASIC) developed by HMT microelectronic AG and manufactured in a European foundry with a bipolar CMOS-DMOS process using Deep Trench Isolation (DTI). The ASIC is highly integrated in order to use only one die compared to four dies in the previous versions.
The MEMS die uses a capacitive detection principle and is manufactured by Colibrys using its mature 3-stack bulk micromachining process, providing a very stable MEMS device. The ASIC and MEMS dies are hermetically sealed in a ceramic package to ensure robustness and durability.
More information on: http://www.i-micronews.com/reports.html
InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sens...Yole Developpement
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Worldâs first â7-Axisâ motion tracking device targeting drone application
Having supplied Apple for many years, InvenSense (TDK) is a leader in the inertial measurement unit (IMU) market. It has a large market share, competing with Bosch and others. This year, with the acquisition of Sensirionâs barometric pressure sensor division, InvenSense has entered a new market area. It has now released of its first â7-axisâ motion tracking combo, bringing together a 6-axis IMU and a pressure sensor, moving it into drone applications.
The ICM-20789 7-axis combo sensor released by InvenSense features a 6-axis device, incorporating a 3-axis gyroscope and a 3-axis accelerometer, and a barometric pressure sensor previously developed by Sensirion in the same package. Compared with the stand-alone sensor hub, this approach eliminates a package and minimizes board area requirements.
More information on that report at http://www.i-micronews.com/reports.html
Sensirion SGP30 Gas Sensor 2018 - teardown reverse costing report published b...system_plus
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The first monolithic multi-gas sensor from Sensirion, with a unique and innovative design using metal oxide technology.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/sgp30-gas-sensor-from-sensirion/
Sensirion, a leading manufacturer of digital microsensors and systems, recently released a gas sensor designed for consumer and appliance applications: the SGP30 Multi-Pixel. The SGP30 gas sensor is a new kind of sensor which measures different gas types in any environment. With a DFN package volume under 5.5 mm3, this gas sensor can be embedded in a variety of low-power systems, including smartphones, tablets, and laptops.
The 1st generation 1200V SiC MOSFET device from STMicroelectronics has good current density at a very competitive cost
The STC30N120 is the first generation 1200V SiC MOSFET device from STMicroelectronics. The device has a planar structure and a design that allows good electrical performance, such as high current density. Moreover, the supply chain and manufacturing choices lead to a very competitive cost.
The device is suitable for high power applications like motor drives, inverters, DC-DC converters and power supplies.
The STC30N120 integrates first generation high-voltage SiC power MOSFET dies in a dedicated discrete package.
The device is assumed to operate at very high temperature, up to 200°C, and to have an on-resistance of 90mâŚ, with generally standard SiC manufacturing technology.
The report goes into depth in its analysis of the packaging and the components, with images of the complex planar SiC structure.
It also includes production cost analysis and detailed comparison with Rohm and Wolfspeedâs SiC MOSFETs and with 1200V silicon IGBTs. The comparison highlights differences in the electrical parameters, supply chain and production cost.
For more information, please visit our website: http://www.i-micronews.com/reports.html
The document summarizes a final design presentation for a senior design project team called Mata-Door. It outlines the personnel on the team, the schedule and problem background. It then provides an overview of the system design including optimization details, analysis of individual parts, safety interlocks and testing. Cost analysis and recommendations are also presented before concluding.
1. The document describes the final report for a robotics design project. It summarizes the problem definition, design evolution, robot operation, fabrication methods, design analysis, technical analysis, and results from robot testing competitions.
2. It discusses two robot designs created by a student team to pick up and dump balls, and the operation of these designs. Fabrication methods included building custom parts in Solidworks.
3. The technical analysis identifies elements that worked well and problems encountered, such as the solenoid being too weak. While performance was disappointing, the pickup mechanism was effective and the greatest design strength.
1. The document outlines the design, testing, and analysis of two robots created by a student team to complete the task of picking up and dumping three balls.
2. Both robot designs used the same ball pickup mechanism, with the first storing balls in a carriage and the second using a bent tube to store and roll balls into a collection box.
3. Testing revealed issues with the ball transfer system and solenoid strength, while the initial program and ability to reuse motor brackets between designs were successful aspects.
The document is about a webinar on pipe support field inspection, installation, and maintenance presented by Jerry Godinaer. It provides information on inspecting, installing, and maintaining different types of pipe supports including variable and constant spring hangers, restraint devices, pipe shoes, slide plates, and hardware components. It discusses guidelines for on-site surveys, what to inspect for existing supports, and criteria for adjusting or replacing supports if needed.
Safran Colibrys VS1000 Series - teardown reverse costing report published by ...Yole Developpement
Â
Safran Colibrys is the leading European supplier of high-performance silicon-based MEMS providing long-term bias stability under harsh environments. In a global market worth around $100M in 2016, high-performance silicon-based MEMS accelerometers address a wide range of applications, from commercial aerospace applications to the defense market. Amongst these, the industrial market remains attractive and the most dynamic. Thanks to performance improvements and reduced size and cost, more opportunities are appearing.
The VS1000 series consists of vibration sensors based on Colibrysâ MEMS accelerometer. They offer the best match for low- to medium-frequency sensing, as well as the best performance stability, with shock resistance and the lowest non-linearity and noise available on the market. The VS1000 is available in various acceleration ranges, from Âą2g to Âą200g.
The VS1000 features an innovative low-noise application specific integrated circuit (ASIC) developed by HMT microelectronic AG and manufactured in a European foundry with a bipolar CMOS-DMOS process using Deep Trench Isolation (DTI). The ASIC is highly integrated in order to use only one die compared to four dies in the previous versions.
The MEMS die uses a capacitive detection principle and is manufactured by Colibrys using its mature 3-stack bulk micromachining process, providing a very stable MEMS device. The ASIC and MEMS dies are hermetically sealed in a ceramic package to ensure robustness and durability.
More information on: http://www.i-micronews.com/reports.html
InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sens...Yole Developpement
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Worldâs first â7-Axisâ motion tracking device targeting drone application
Having supplied Apple for many years, InvenSense (TDK) is a leader in the inertial measurement unit (IMU) market. It has a large market share, competing with Bosch and others. This year, with the acquisition of Sensirionâs barometric pressure sensor division, InvenSense has entered a new market area. It has now released of its first â7-axisâ motion tracking combo, bringing together a 6-axis IMU and a pressure sensor, moving it into drone applications.
The ICM-20789 7-axis combo sensor released by InvenSense features a 6-axis device, incorporating a 3-axis gyroscope and a 3-axis accelerometer, and a barometric pressure sensor previously developed by Sensirion in the same package. Compared with the stand-alone sensor hub, this approach eliminates a package and minimizes board area requirements.
More information on that report at http://www.i-micronews.com/reports.html
Sensirion SGP30 Gas Sensor 2018 - teardown reverse costing report published b...system_plus
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The first monolithic multi-gas sensor from Sensirion, with a unique and innovative design using metal oxide technology.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/sgp30-gas-sensor-from-sensirion/
Sensirion, a leading manufacturer of digital microsensors and systems, recently released a gas sensor designed for consumer and appliance applications: the SGP30 Multi-Pixel. The SGP30 gas sensor is a new kind of sensor which measures different gas types in any environment. With a DFN package volume under 5.5 mm3, this gas sensor can be embedded in a variety of low-power systems, including smartphones, tablets, and laptops.
The 1st generation 1200V SiC MOSFET device from STMicroelectronics has good current density at a very competitive cost
The STC30N120 is the first generation 1200V SiC MOSFET device from STMicroelectronics. The device has a planar structure and a design that allows good electrical performance, such as high current density. Moreover, the supply chain and manufacturing choices lead to a very competitive cost.
The device is suitable for high power applications like motor drives, inverters, DC-DC converters and power supplies.
The STC30N120 integrates first generation high-voltage SiC power MOSFET dies in a dedicated discrete package.
The device is assumed to operate at very high temperature, up to 200°C, and to have an on-resistance of 90mâŚ, with generally standard SiC manufacturing technology.
The report goes into depth in its analysis of the packaging and the components, with images of the complex planar SiC structure.
It also includes production cost analysis and detailed comparison with Rohm and Wolfspeedâs SiC MOSFETs and with 1200V silicon IGBTs. The comparison highlights differences in the electrical parameters, supply chain and production cost.
For more information, please visit our website: http://www.i-micronews.com/reports.html
This document provides an analysis of Tesla's UBQ01B0 chip used for full self-driving capabilities. It includes a physical analysis of the die and packaging, an overview of the manufacturing process, and a cost analysis. The chip is a system-on-chip designed and produced by Tesla to power its driver-assist and autonomous driving features. It utilizes quad-core ARM processors alongside a GPU and NPU for processing sensor data and neural network operations. The analysis examines the chip's design and architecture at the physical, manufacturing, and cost levels.
This document provides a reverse costing analysis of the Bosch BMP380 pressure sensor. It includes a physical analysis of the package, ASIC die, and MEMS pressure die. Manufacturing process flows and costs are examined for the ASIC front-end, MEMS process, and final packaging. A cost breakdown estimates the component costs based on yield assumptions. Finally, the estimated selling price is presented based on manufacturer margins.
2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...Yole Developpement
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Complete reports and comparison of the latest generation products for smartphones from the leading optical image stabilization gyro players.
2-Axis Gyroscopes for Optical Image Stabilization (OIS) constitute a market where 123 million units were shipped in 2015, according to Yole DĂŠveloppement. This market originates only from high-end smartphones and two players share most of it: InvenSense, with 49%, and STMicroelectronics, with 39%.
The 2-axis gyroscopes are located inside the camera module of high-end smartphones. The main constraints are a small footprint and, more importantly, thinness.
Previously, thickness was the same as standard land grid array (LGA) or quad flat no-leads (QFN) package, close to 1mm. Now the standard is 0.65mm, which products from both InvenSense and STMicroelectronics attain.
InvenSense was first, with the IDG-2030, a 2.3x2.3x0.65mm gyroscope, which is still the smallest on the market. Since its introduction we found it in several smartphones from various manufacturers. The IDG-2030 uses the same Nasiri platform as other InvenSense inertial devices, with wafer-level integration of the MEMS sensor on top of the application specific integrated circuit (ASIC), thus providing only one die in the final LGA package.
Months later, STMicroelectronics released the L2G2IS, which shares the same dimensions. The device is manufactured using the same THELMA process as all STMicroelectronics inertial devices. The THELMA platform involves a two-die approach that is challenging for very thin package integration. However, both players now offer very low-cost gyros thanks to die size reduction and process optimization.
Both gyroscopes analyzed are 2-axis X, Y (Pitch, Roll). The two reports can be purchased separately or together in order to compare the technology and pricing of the main smartphone OIS gyro players, including previous generation products.
More information on that report at http://www.i-micronews.com/reports.html
1200V CoolSiCTM MOSFET Module DF11MR12W1M1_B11, from Infineon 2018 teardown r...system_plus
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The document provides a teardown analysis of Infineon's 1200V 50A CoolSiC MOSFET module, including a profile of Infineon, physical analysis of the module components, a description of the manufacturing processes, a cost analysis, and comparisons to other SiC MOSFET solutions. Through physical analysis, the report reveals Infineon's innovative SiC MOSFET and Schottky diode design assets. Manufacturing process details and a cost analysis estimate the costs to produce the module.
This document provides a reverse costing analysis of the Bosch BMX055 9-Axis MEMS IMU. It includes a physical analysis of the package and dies, manufacturing process flows for the ASIC, MEMS, and magnetometer dies, a cost analysis, and estimated selling price. The package is a 4.5x3.0x0.95mm LGA with 3 dies - a gyro/accel ASIC, MEMS gyro/accel dies, and a magnetometer die fabricated using CMOS and MEMS processes. The analysis estimates manufacturing costs and provides a price within a +/- 10% range given available data and industry expertise.
Rohm SiC MOSFET Gen3 Trench Design Familysystem_plus
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Trench technology in Rohm 650V and 1200V SiC MOSFETs.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/rohm-sic-mosfet-gen3-trench-design-family/
Take a look at the fifth generation of EPCâs low voltage transistor
The low voltage GaN device market is increasingly important, and Efficient Power Conversion Corporation (EPC) is a major player in low voltage GaN-on-silicon high-electron-mobility transistor (HEMT) devices. 100V GaN HEMTs are a very new technology but they already compete with silicon transistors, especially in the field of megahertz high frequency applications.
System Plus Consulting has investigated the companyâs EPC2045 device, its latest driving 100V for applications such as single-stage 48V converters, USB-C data and power connectors, LiDAR sensors, point-of-load converters and loads in open rack server architectures.
With its new transistor and GaN epitaxy design, the EPC2045 achieves a breakdown voltage of 100V for a current of 16A at 25°C, and a very low RdsOn on-resistance of 7m⌠compared to the previous generation.
The chip-scale packaging of EPC products reduces the final device cost and decreases its inductance, bringing advantages not only with respect to competitors in GaN, but also silicon.
Compared to silicon transistors, GaN process developments have significantly lowered capacitance. This translates into lower gate drive losses and lower device switching losses at higher frequencies for the same on-resistance and voltage rating.
More information on that report at http://www.i-micronews.com/reports.html
Discover the first MEMS device using TSV in ASIC and WLCSP to reach the smallest size (only 1.4mm3!)
After being integrated in the latest Appleâs iPhone in 2013, Bosch is now the top MEMS supplier according to Yoleâs Top 30 MEMS Ranking 2014. This strong growth is both due to the consumer and automotive businesses of Bosch.
With a size of only 1.4mm3 (1.2x1.5x0.8mm), the BMA355 is the smallest MEMS accelerometer on the market and features 60% volume reduction compared to state of the art 2x2x0.9mm MEMS accelerometers. This size reduction has been made possible by the use of Through-Silicon Vias (TSVs) in the ASIC, enabling a WLCSP package. All the manufacturing steps are realized at the wafer-level. This is the first introduction of a MEMS component with TSV Via-Middle process.
The BMA355 is a 12-bit digital resolution accelerometer well suited for applications requiring extremely small form factors.
The report is including a detailed technical and cost comparison with state of the art MEMS accelerometers from STMicroelectronics and mCube.
Discover all the details in the report: http://www.i-micronews.com/reports/Bosch-Sensortec-BMA355-3-Axis-MEMS-Accelerometer/1/452/
Advanced packaging technology in the Apple Watch Series 4âs System-in-Packagesystem_plus
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Four major packaging technologies: TSMCâs info, ASEâs Double Side Molding/SESUB and SiP, Skyworksâ Double Side BGA.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/advanced-packaging-technology-in-the-apple-watch-series-4s-system-in-package/
Everspinâs Spin Transfer Torque MRAM with perpendicular magnetic tunnel junction.
More information: https://www.systemplus.fr/reverse-costing-reports/everspin-emd3d256m-sttmram-memory/
In its new series of SiC MOSFETs, Rohm uses trench structures for 650V and 1200V products, while 1700V products use planar structures
After more than five years since SiC MOSFETs were first released, they are gradually penetrating different industries for power conversion applications. The market outlook is promising with a compound annual growth rate of 42% from 2015 to 2021. The forecast for 2017 is expected to be even better than previous years with increasingly positive signals from the industry.
Against this backdrop, Rohm offers a series of new SiC products at different voltages. It appears that it uses trench structures for 650V and 1200V products, while 1700V products use planar structures.
The SCT2H12NZGC11 is a 1700V SiC MOSFET from Rohm for industrial and commercial power application such as power supplies. The device offers a quite low on-resistance but very high current density and integrates the second generation high-voltage SiC power MOSFET dies, which now achieve 3.7A current.
Thanks to the die design the deviceâs cost is very competitive. The gate structure is very simple and the packaging is optimized to save costs.
The report presents a deep technology analysis of the packaging and components with images of the planar SiC structure.
More information on that report at http://www.i-micronews.com/reports.html
The first MEMS Gyroscope from Maxim Integrated in the industry smallest 3x3mm package
Following the purchase of MEMS manufacturer SensorDynamics in 2011, Maxim releases its first MEMS Gyroscope reference with a very accurate and cost effective component.
The MAX21000 continues to use the PSM-X2 process jointly developed by SensorDynamics and the Fraunhofer Institute for Silicon Technology. This technology platform includes a proprietary surface micromachining process to build the mechanical structures and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation of the gyro sensor.
Assembled in a LGA 3.0x3.0x0.9mm package, the MAX21000 is a low power consumption (5.4mA) and high accuracy 3-axis gyroscope targeted for mobile applications.
The report is including a detailed technical and cost comparison with state of the art 3x3mm MEMS gyros from STMicroelectronics, Bosch Sensortec and InvenSense. Surprisingly, Maxim is able to provide a very competitive component due to an important silicon are a reduction.
Discover all the details in the report: http://www.i-micronews.com/reports/Maxim-Integrated-MAX21000-3-Axis-MEMS-Gyroscope/1/449/
Comparison of main players AP: Apple A10 with inFO vs. Qualcomm Snapdragon 820 with MCeP packaging technology vs. HiSilicon Kirin 955 & Samsung Exynos 8 with standard Package-on-Package
Five major players are sharing the smartphone application processors (AP) market. Among them, Qualcomm, Apple, Samsung and HiSilicon propose the most powerful AP. They use almost the same technology node for the die, and the innovation is now at the packaging level. During this year, we observed different technologies inside the four main smartphone flagships: classic Package-on-Package (PoP) developed by Amkor for the Kirin 955 and for the Exynos 8, Molded Core Embedded Package (MCeP) technology developed by Shinko for the Snapdragon 820 and integrated Fan-Out packaging (inFO) developed by TSMC for the A10.
Located under the DRAM chip on the main board, the AP are packaged using PoP technology. The Apple A10 can be found in the iPhone 7 series. The HiSilicon Kirin 955 can be found in the Huawei P9 and the Samsung Exynos 8 as the Qualcomm Snapdragon 820 can be found in the Samsung Galaxy S7 series depending on the world version (US and Asia for the Snapdragon and International for the Exynos).
In this report, we highlight the differences and the innovations of the packages chosen by the end-user OEMs. Whereas some AP providers like for HiSilicon or Samsung choose to consider conventional PoP with embedded land-side capacitor (LSC), others like Apple or Qualcomm use innovative technologies like Fan-Out PoP and silicon based Deep Trench LSC or embedded die packaging with advanced PCB substrate. The detailed comparison between the four players will give the pros and the cons of the packaging technologies.
This report also compares the costs of the different approaches and includes a detailed technical comparison between the packaging structure of the Qualcomm Snapdragon 820, the Samsung Exynos 8, the HiSilicon Kirin 955 and the Apple A10.
More information on: http://www.i-micronews.com/reports.html
Safran Colibrys MS1010 and MEMSIC MXA2500M High-End Accelerometerssystem_plus
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Detailed technology and cost analysis of the high-end single-axis and dual-axis accelerometers integrated in the STIM318 IMU.
More information: https://www.systemplus.fr/reverse-costing-reports/safran-colibrys-ms1010-and-memsic-mxa2500m-high-end-accelerometers/
Texas Instrumentsâ LMG5200 GaN Power Stage - 2018 teardown reverse costing re...system_plus
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The first 80V half-bridge GaN power stage from TI, with innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/texas-instruments-lmg5200-gan-power-stage/
Littelfuse and Monolith Semiconductors, in collaboration with X-Fab, have released a 1st-generation, high-reliability MOSFET with the hope of making this silicon carbide product mainstream.
The market outlook for SiC devices is promising, with a compound annual growth rate (CAGR) of 28% from 2016 â 2020. This will increase to 40% from 2020 â 2022 due to growth among automotive and industrial applications. In total, the SiC market will exceed $1B in 2022. In the energy conversion sector, SiC devices have an actual value of $250M, which will increase by around 28% in 2022. The reason for this relates to market forces pushing for loss reduction, not only for the sake of improved efficiency but also for smaller packages.
More information on that report a http://www.systemplus.fr/reverse-costing-reports/littelfuse-silicon-carbide-mosfet-lcis1mo120e0080-1200v-25a-80mohms/
Autolivâs 3rd Generation Automotive Night Vision Camera with FLIRâs ISC0901 M...Yole Developpement
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Infrared camera and electronic control unit for advanced driver assistance systems based on FLIR night vision imaging technology
Based on a high definition ISC0901 microbolometer from FLIR, the Autoliv night vision infrared camera targets the high-end automotive market using two FLIR cores. Based on the solid first design from 2009, the microbolometer offers better performance in definition and frame rate. The camera also embraces the quality approach with a complex optical system and powers its night vision using sophisticated numerical processing based on an Altera field-programmable gate array (FPGA) and custom algorithm.
The Autoliv night vision camera consists of two modules, the camera and a remote processing unit. The system is made very compact and easy to integrate for car makers.
The ISC0901 thermal camera uses FLIRâs 17Âľm pixel design, optimized for automotive applications. Based on vanadium oxide technology, the ISC0901 microbolometer features a 336x256 resolution wafer level package, achieving an incredibly compact design.
The ISC0901 is the automotive version of a surveillance microbolometer. By using wafer level package technology to encapsulate the microbolometer FLIR offers the best price performance ratio.
This report is divided into two parts, one focused on the microbolometer and the second on the other systems. It is based on a complete teardown analysis of the night vision camera and the associated electronic control unit. Using this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The reportâs final component is a comparison between the characteristics of the FLIR ISC0901, FLIR Lepton 3 and the PICO384P from ULIS. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
SPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE Invertersystem_plus
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Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/vitesco-technologies-power-module-in-jaguar-i-pace-inverter/
The document discusses new ideas for repairing gearboxes and generators used in wind turbines. It begins with an agenda that includes discussing why gearboxes are failing prematurely and new specifications for gearbox material quality and operating assumptions. It then discusses remanufacturing techniques for gearboxes including regrounding gears and load testing. For generators, it discusses failure types, root causes, and innovations in remanufacturing insulation systems.
SP20569 - IRay T3S Thermal Camera for Smartphonesystem_plus
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Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/iray-t3s-thermal-camera-for-smartphone/
Technical and cost overview of the evolution of radio frequency front-end module technologies integrated in 5G mmWave and Sub-6 GHz Phones.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-2-focus-on-5g-chipset/
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This document provides an analysis of Tesla's UBQ01B0 chip used for full self-driving capabilities. It includes a physical analysis of the die and packaging, an overview of the manufacturing process, and a cost analysis. The chip is a system-on-chip designed and produced by Tesla to power its driver-assist and autonomous driving features. It utilizes quad-core ARM processors alongside a GPU and NPU for processing sensor data and neural network operations. The analysis examines the chip's design and architecture at the physical, manufacturing, and cost levels.
This document provides a reverse costing analysis of the Bosch BMP380 pressure sensor. It includes a physical analysis of the package, ASIC die, and MEMS pressure die. Manufacturing process flows and costs are examined for the ASIC front-end, MEMS process, and final packaging. A cost breakdown estimates the component costs based on yield assumptions. Finally, the estimated selling price is presented based on manufacturer margins.
2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...Yole Developpement
Â
Complete reports and comparison of the latest generation products for smartphones from the leading optical image stabilization gyro players.
2-Axis Gyroscopes for Optical Image Stabilization (OIS) constitute a market where 123 million units were shipped in 2015, according to Yole DĂŠveloppement. This market originates only from high-end smartphones and two players share most of it: InvenSense, with 49%, and STMicroelectronics, with 39%.
The 2-axis gyroscopes are located inside the camera module of high-end smartphones. The main constraints are a small footprint and, more importantly, thinness.
Previously, thickness was the same as standard land grid array (LGA) or quad flat no-leads (QFN) package, close to 1mm. Now the standard is 0.65mm, which products from both InvenSense and STMicroelectronics attain.
InvenSense was first, with the IDG-2030, a 2.3x2.3x0.65mm gyroscope, which is still the smallest on the market. Since its introduction we found it in several smartphones from various manufacturers. The IDG-2030 uses the same Nasiri platform as other InvenSense inertial devices, with wafer-level integration of the MEMS sensor on top of the application specific integrated circuit (ASIC), thus providing only one die in the final LGA package.
Months later, STMicroelectronics released the L2G2IS, which shares the same dimensions. The device is manufactured using the same THELMA process as all STMicroelectronics inertial devices. The THELMA platform involves a two-die approach that is challenging for very thin package integration. However, both players now offer very low-cost gyros thanks to die size reduction and process optimization.
Both gyroscopes analyzed are 2-axis X, Y (Pitch, Roll). The two reports can be purchased separately or together in order to compare the technology and pricing of the main smartphone OIS gyro players, including previous generation products.
More information on that report at http://www.i-micronews.com/reports.html
1200V CoolSiCTM MOSFET Module DF11MR12W1M1_B11, from Infineon 2018 teardown r...system_plus
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The document provides a teardown analysis of Infineon's 1200V 50A CoolSiC MOSFET module, including a profile of Infineon, physical analysis of the module components, a description of the manufacturing processes, a cost analysis, and comparisons to other SiC MOSFET solutions. Through physical analysis, the report reveals Infineon's innovative SiC MOSFET and Schottky diode design assets. Manufacturing process details and a cost analysis estimate the costs to produce the module.
This document provides a reverse costing analysis of the Bosch BMX055 9-Axis MEMS IMU. It includes a physical analysis of the package and dies, manufacturing process flows for the ASIC, MEMS, and magnetometer dies, a cost analysis, and estimated selling price. The package is a 4.5x3.0x0.95mm LGA with 3 dies - a gyro/accel ASIC, MEMS gyro/accel dies, and a magnetometer die fabricated using CMOS and MEMS processes. The analysis estimates manufacturing costs and provides a price within a +/- 10% range given available data and industry expertise.
Rohm SiC MOSFET Gen3 Trench Design Familysystem_plus
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Trench technology in Rohm 650V and 1200V SiC MOSFETs.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/rohm-sic-mosfet-gen3-trench-design-family/
Take a look at the fifth generation of EPCâs low voltage transistor
The low voltage GaN device market is increasingly important, and Efficient Power Conversion Corporation (EPC) is a major player in low voltage GaN-on-silicon high-electron-mobility transistor (HEMT) devices. 100V GaN HEMTs are a very new technology but they already compete with silicon transistors, especially in the field of megahertz high frequency applications.
System Plus Consulting has investigated the companyâs EPC2045 device, its latest driving 100V for applications such as single-stage 48V converters, USB-C data and power connectors, LiDAR sensors, point-of-load converters and loads in open rack server architectures.
With its new transistor and GaN epitaxy design, the EPC2045 achieves a breakdown voltage of 100V for a current of 16A at 25°C, and a very low RdsOn on-resistance of 7m⌠compared to the previous generation.
The chip-scale packaging of EPC products reduces the final device cost and decreases its inductance, bringing advantages not only with respect to competitors in GaN, but also silicon.
Compared to silicon transistors, GaN process developments have significantly lowered capacitance. This translates into lower gate drive losses and lower device switching losses at higher frequencies for the same on-resistance and voltage rating.
More information on that report at http://www.i-micronews.com/reports.html
Discover the first MEMS device using TSV in ASIC and WLCSP to reach the smallest size (only 1.4mm3!)
After being integrated in the latest Appleâs iPhone in 2013, Bosch is now the top MEMS supplier according to Yoleâs Top 30 MEMS Ranking 2014. This strong growth is both due to the consumer and automotive businesses of Bosch.
With a size of only 1.4mm3 (1.2x1.5x0.8mm), the BMA355 is the smallest MEMS accelerometer on the market and features 60% volume reduction compared to state of the art 2x2x0.9mm MEMS accelerometers. This size reduction has been made possible by the use of Through-Silicon Vias (TSVs) in the ASIC, enabling a WLCSP package. All the manufacturing steps are realized at the wafer-level. This is the first introduction of a MEMS component with TSV Via-Middle process.
The BMA355 is a 12-bit digital resolution accelerometer well suited for applications requiring extremely small form factors.
The report is including a detailed technical and cost comparison with state of the art MEMS accelerometers from STMicroelectronics and mCube.
Discover all the details in the report: http://www.i-micronews.com/reports/Bosch-Sensortec-BMA355-3-Axis-MEMS-Accelerometer/1/452/
Advanced packaging technology in the Apple Watch Series 4âs System-in-Packagesystem_plus
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Four major packaging technologies: TSMCâs info, ASEâs Double Side Molding/SESUB and SiP, Skyworksâ Double Side BGA.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/advanced-packaging-technology-in-the-apple-watch-series-4s-system-in-package/
Everspinâs Spin Transfer Torque MRAM with perpendicular magnetic tunnel junction.
More information: https://www.systemplus.fr/reverse-costing-reports/everspin-emd3d256m-sttmram-memory/
In its new series of SiC MOSFETs, Rohm uses trench structures for 650V and 1200V products, while 1700V products use planar structures
After more than five years since SiC MOSFETs were first released, they are gradually penetrating different industries for power conversion applications. The market outlook is promising with a compound annual growth rate of 42% from 2015 to 2021. The forecast for 2017 is expected to be even better than previous years with increasingly positive signals from the industry.
Against this backdrop, Rohm offers a series of new SiC products at different voltages. It appears that it uses trench structures for 650V and 1200V products, while 1700V products use planar structures.
The SCT2H12NZGC11 is a 1700V SiC MOSFET from Rohm for industrial and commercial power application such as power supplies. The device offers a quite low on-resistance but very high current density and integrates the second generation high-voltage SiC power MOSFET dies, which now achieve 3.7A current.
Thanks to the die design the deviceâs cost is very competitive. The gate structure is very simple and the packaging is optimized to save costs.
The report presents a deep technology analysis of the packaging and components with images of the planar SiC structure.
More information on that report at http://www.i-micronews.com/reports.html
The first MEMS Gyroscope from Maxim Integrated in the industry smallest 3x3mm package
Following the purchase of MEMS manufacturer SensorDynamics in 2011, Maxim releases its first MEMS Gyroscope reference with a very accurate and cost effective component.
The MAX21000 continues to use the PSM-X2 process jointly developed by SensorDynamics and the Fraunhofer Institute for Silicon Technology. This technology platform includes a proprietary surface micromachining process to build the mechanical structures and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation of the gyro sensor.
Assembled in a LGA 3.0x3.0x0.9mm package, the MAX21000 is a low power consumption (5.4mA) and high accuracy 3-axis gyroscope targeted for mobile applications.
The report is including a detailed technical and cost comparison with state of the art 3x3mm MEMS gyros from STMicroelectronics, Bosch Sensortec and InvenSense. Surprisingly, Maxim is able to provide a very competitive component due to an important silicon are a reduction.
Discover all the details in the report: http://www.i-micronews.com/reports/Maxim-Integrated-MAX21000-3-Axis-MEMS-Gyroscope/1/449/
Comparison of main players AP: Apple A10 with inFO vs. Qualcomm Snapdragon 820 with MCeP packaging technology vs. HiSilicon Kirin 955 & Samsung Exynos 8 with standard Package-on-Package
Five major players are sharing the smartphone application processors (AP) market. Among them, Qualcomm, Apple, Samsung and HiSilicon propose the most powerful AP. They use almost the same technology node for the die, and the innovation is now at the packaging level. During this year, we observed different technologies inside the four main smartphone flagships: classic Package-on-Package (PoP) developed by Amkor for the Kirin 955 and for the Exynos 8, Molded Core Embedded Package (MCeP) technology developed by Shinko for the Snapdragon 820 and integrated Fan-Out packaging (inFO) developed by TSMC for the A10.
Located under the DRAM chip on the main board, the AP are packaged using PoP technology. The Apple A10 can be found in the iPhone 7 series. The HiSilicon Kirin 955 can be found in the Huawei P9 and the Samsung Exynos 8 as the Qualcomm Snapdragon 820 can be found in the Samsung Galaxy S7 series depending on the world version (US and Asia for the Snapdragon and International for the Exynos).
In this report, we highlight the differences and the innovations of the packages chosen by the end-user OEMs. Whereas some AP providers like for HiSilicon or Samsung choose to consider conventional PoP with embedded land-side capacitor (LSC), others like Apple or Qualcomm use innovative technologies like Fan-Out PoP and silicon based Deep Trench LSC or embedded die packaging with advanced PCB substrate. The detailed comparison between the four players will give the pros and the cons of the packaging technologies.
This report also compares the costs of the different approaches and includes a detailed technical comparison between the packaging structure of the Qualcomm Snapdragon 820, the Samsung Exynos 8, the HiSilicon Kirin 955 and the Apple A10.
More information on: http://www.i-micronews.com/reports.html
Safran Colibrys MS1010 and MEMSIC MXA2500M High-End Accelerometerssystem_plus
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Detailed technology and cost analysis of the high-end single-axis and dual-axis accelerometers integrated in the STIM318 IMU.
More information: https://www.systemplus.fr/reverse-costing-reports/safran-colibrys-ms1010-and-memsic-mxa2500m-high-end-accelerometers/
Texas Instrumentsâ LMG5200 GaN Power Stage - 2018 teardown reverse costing re...system_plus
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The first 80V half-bridge GaN power stage from TI, with innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/texas-instruments-lmg5200-gan-power-stage/
Littelfuse and Monolith Semiconductors, in collaboration with X-Fab, have released a 1st-generation, high-reliability MOSFET with the hope of making this silicon carbide product mainstream.
The market outlook for SiC devices is promising, with a compound annual growth rate (CAGR) of 28% from 2016 â 2020. This will increase to 40% from 2020 â 2022 due to growth among automotive and industrial applications. In total, the SiC market will exceed $1B in 2022. In the energy conversion sector, SiC devices have an actual value of $250M, which will increase by around 28% in 2022. The reason for this relates to market forces pushing for loss reduction, not only for the sake of improved efficiency but also for smaller packages.
More information on that report a http://www.systemplus.fr/reverse-costing-reports/littelfuse-silicon-carbide-mosfet-lcis1mo120e0080-1200v-25a-80mohms/
Autolivâs 3rd Generation Automotive Night Vision Camera with FLIRâs ISC0901 M...Yole Developpement
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Infrared camera and electronic control unit for advanced driver assistance systems based on FLIR night vision imaging technology
Based on a high definition ISC0901 microbolometer from FLIR, the Autoliv night vision infrared camera targets the high-end automotive market using two FLIR cores. Based on the solid first design from 2009, the microbolometer offers better performance in definition and frame rate. The camera also embraces the quality approach with a complex optical system and powers its night vision using sophisticated numerical processing based on an Altera field-programmable gate array (FPGA) and custom algorithm.
The Autoliv night vision camera consists of two modules, the camera and a remote processing unit. The system is made very compact and easy to integrate for car makers.
The ISC0901 thermal camera uses FLIRâs 17Âľm pixel design, optimized for automotive applications. Based on vanadium oxide technology, the ISC0901 microbolometer features a 336x256 resolution wafer level package, achieving an incredibly compact design.
The ISC0901 is the automotive version of a surveillance microbolometer. By using wafer level package technology to encapsulate the microbolometer FLIR offers the best price performance ratio.
This report is divided into two parts, one focused on the microbolometer and the second on the other systems. It is based on a complete teardown analysis of the night vision camera and the associated electronic control unit. Using this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The reportâs final component is a comparison between the characteristics of the FLIR ISC0901, FLIR Lepton 3 and the PICO384P from ULIS. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
SPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE Invertersystem_plus
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Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/vitesco-technologies-power-module-in-jaguar-i-pace-inverter/
The document discusses new ideas for repairing gearboxes and generators used in wind turbines. It begins with an agenda that includes discussing why gearboxes are failing prematurely and new specifications for gearbox material quality and operating assumptions. It then discusses remanufacturing techniques for gearboxes including regrounding gears and load testing. For generators, it discusses failure types, root causes, and innovations in remanufacturing insulation systems.
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SP20569 - IRay T3S Thermal Camera for Smartphonesystem_plus
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Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/iray-t3s-thermal-camera-for-smartphone/
Technical and cost overview of the evolution of radio frequency front-end module technologies integrated in 5G mmWave and Sub-6 GHz Phones.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-2-focus-on-5g-chipset/
Technical and cost overview of the evolution of the radio frequency front-end module technologies integrated in the Apple iPhone series from 2016 - 2020.
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Deep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.
More information : https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8200-pamid-in-the-apple-iphone-12-series/
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A study of the complete first generation of the 5G millimeter-wave chipset for Appleâs phones including custom antenna, front-end module and antenna-on-package.
More information : https://www.systemplus.fr/reverse-costing-reports/apple-iphone-12-series-mmwave-5g-chipset-and-antenna/
This document provides an overview of NVIDIA's new A100 Ampere GPU. Some key points:
- It uses TSMC's 7nm process and CoWoS packaging to integrate over 6,000mm2 of silicon onto a single 55mm x 55mm package.
- It features a 7nm GPU die with 54 billion transistors and 40/80GB of HBM2 memory in a 3D stacked configuration connected via microbumps and TSVs.
- The report includes a physical analysis of the package, dies, and assembly, as well as a cost analysis and estimated price. It finds the A100 provides significantly higher performance than previous generations like the V100.
Deep analysis of the 400Gb optical transceiver from a leading Chinese company.
More information: https://www.systemplus.fr/reverse-costing-reports/innolights-400g-qsfp-dd-optical-transceiver/
EPCâs 70 V ePower stage with separate and independent high and low side control inputs.
More information: https://www.systemplus.fr/reverse-costing-reports/epc2152-half-bridge-monolithic-gan-ic/
Microsoft - Holographic Lens from Hololens 2system_plus
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See-through holographic display for mixed reality smartglasses.
More on : https://www.systemplus.fr/reverse-costing-reports/microsoft-holographic-lens-from-hololens-2/
Cost-effective 1 mm2 miniature camera with customizable wafer-level optics for endoscopy and novel medical imaging devices.
More information : https://www.systemplus.fr/reverse-costing-reports/ams-naneye-mini-camera/
Discover Axisâs high-end product integrating its latest ARTPEC-7 in-house system-on-chip dedicated to network video and machine learning capabilities.
More information : https://www.systemplus.fr/reverse-costing-reports/axis-p1375-e-network-camera/
Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1)system_plus
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Dig deep into Hikvisionâs AI-powered thermal network camera for security applications.
More information: https://www.systemplus.fr/reverse-costing-reports/hikvision-intelligent-thermal-network-camera-ds-2td2166-15-v1/
The first 600V system-in-package half-bridge driver from STMicroelectronics integrating two GaN-based HEMTs.
More information: https://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-mastergan1-half-bridge-driver/
Physical and cost analysis of Micronâs fifth-generation low-power DRAM memory.
More information: https://www.systemplus.fr/reverse-costing-reports/micron-lpddr5-12gb-mobile-memory/
This report analyzes Samsung's 12GB LPDDR5 mobile memory. It includes a full physical analysis of the memory package and die. High resolution images show the die, DRAM cells, and cross-sections. The manufacturing process flow and cost analysis are used to estimate production costs. The component cost includes die manufacturing, packaging, and testing. A comparison is made between LPDDR4 and LPDDR5 physical characteristics and manufacturing processes. This report provides a comprehensive technical and cost analysis of Samsung's latest low power DRAM technology.
Sensonor STIM318 Inertial Measurement Unit (IMU)system_plus
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Newest IMU with 9-axis detection and gyro bias instability of 0.3°/h from Sensonor.
More information: https://www.systemplus.fr/reverse-costing-reports/sensonor-stim318-inertial-measurement-unit-imu/
Hamamatsu Photodiode and Laser in Livoxâs Horizon LiDARsystem_plus
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Analysis of the six channels and 905nm pulsed laser and photodiode from Hamamatsu, in Livoxâs LiDAR for automotive ADAS.
More information: https://www.systemplus.fr/reverse-costing-reports/hamamatsu-photodiode-and-laser-in-livox-horizon-lidar/
MEMS Fabry-Perot interferometer in a very tiny NIR spectrometer.
More information: https://www.systemplus.fr/reverse-costing-reports/spectral-engines-nirone-sensor-x/
Worldâs first 76-81 GHz automotive single-chip radar in a System-on-Chip device with integrated Antenna-in-Package using Fan-Out packaging technology.
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Deep analysis of the latest generation of under-display optical fingerprint sensors using micro-optics.
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How to Interpret Trends in the Kalyan Rajdhani Mix Chart.pdfChart Kalyan
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Which one is cheapest? Which one is fastest? Which one will scale to meet our needs?
Join me in this session as we dive into each AWS hosting service to determine which one is best for your scenario and explain why!
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Guest Speaker Segment with Hannah Barrington: Dive into the world of dynamic real estate marketing with Hannah, the Marketing Manager at Workspace Group. Hear firsthand how their team generates engaging descriptions for thousands of office units by integrating diverse data sourcesâfrom PDF floorplans to web pagesâusing FME transformers, like OpenAIVisionConnector and AnthropicVisionConnector. This use case will show you how GenAI can streamline content creation for marketing across the board.
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Introduction of Cybersecurity with OSS at Code Europe 2024
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Tronics GYPRO3300 Angular Rate Sensor - reverse costing report published by System Plus
1. 21 rue la Noue Bras de Fer
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Tronics GYPRO3300
MEMS Angular Rate Sensor
MEMS report by ClĂŠment Le Bleis
January 2018 â version 1
2. Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
o Glossary
Company Profile 8
o Tronics Microsystems
Physical Analysis 16
o Summary of the Physical Analysis 14
o Sensor Package 16
ďź Package Opening
ďź Wire Bonding
ďź Sensor Package Cross-Section
o MEMS Die 31
ďź MEMS Cap : View & Dimensions
ďź MEMS Sensing area
ďź MEMS Die Cross-Section
ďź MEMS Die Process Characteristics
o ASIC Die 61
ďź ASIC Die View & Dimensions
ďź ASIC Delayering & main Blocs
ďź ASIC Die Process
ďź ASIC Die Cross-Section
Physical Comparison 78
o Comparison with ADIS16136 & STIM210
Manufacturing Process Flow 86
o Global Overview
o ASIC Process Characteristics
o ASIC Wafer Fabrication Unit
o MEMS Front-End Process
o MEMS Wafer Fabrication Unit
Cost Analysis 104
o Summary of the cost analysis 105
o Yields Explanation & Hypotheses 106
o MEMS/ASIC Die 109
ďź ASIC Front-End Cost
ďź ASIC Back-End 0 : Probe Test & Dicing
ďź ASIC Wafer & Die Cost
ďź MEMS Front End Cost
ďź MEMS Front-End Cost per process steps
ďź MEMS Back-End 0 : Probe Test & Dicing
ďź MEMS Wafer & Die Cost
o Component 126
ďź Back-End : Packaging Cost
ďź Back-End : Final Test Cost
ďź Component Cost
Selling Price 128
Feedback 131
Company services 133
3. Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
o Glossary
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Executive Summary
4. Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
o Glossary
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
The reverse costing analysis is conducted in 3 phases:
Teardown
analysis
⢠Package is analyzed and measured
⢠The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin
out, die marking
⢠Setup of the manufacturing process.
Costing
analysis
⢠Setup of the manufacturing environment
⢠Cost simulation of the process steps
Selling price
analysis
⢠Supply chain analysis
⢠Analysis of the selling price
Reverse Costing Methodology
5. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Physical analysis
o Package Views & Dimensions
o Package Opening
o Package Cross-Section
o MEMS Cap
o MEMS Sensing Area
o MEMS Die Cross-Section
o ASIC Die : View & Dimensions
o ASIC Die : Marking
o ASIC Die : Description
o ASIC Die : Delayering
o ASIC Die Process
o ASIC Die Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Summary of the Physical Analysis
6. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Physical analysis
o Package Views & Dimensions
o Package Opening
o Package Cross-Section
o MEMS Cap
o MEMS Sensing Area
o MEMS Die Cross-Section
o ASIC Die : View & Dimensions
o ASIC Die : Marking
o ASIC Die : Description
o ASIC Die : Delayering
o ASIC Die Process
o ASIC Die Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Package Views & Dimensions
GYPRO3300 Gyroscope - Side View
Š2018 by System Plus Consulting
GYPRO3300 Gyroscope - Top View
Š2018 by System Plus Consulting
19.6 mm11.5mm
3.7mm
⢠Package : CLCC 30
⢠Dimensions : 19.6 x 11.5 x 3.7 mm
⢠Weight : 8 grams
⢠Pin Pitch : 1.27 mm
⢠Marking:
Logo Tronics
Q09
16320803
3300 471
GYPRO3300 Gyroscope - Back View
Š2018 by System Plus Consulting
Arrow indicates
rotation axis
7. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Physical analysis
o Package Views & Dimensions
o Package Opening
o Package Cross-Section
o MEMS Cap
o MEMS Sensing Area
o MEMS Die Cross-Section
o ASIC Die : View & Dimensions
o ASIC Die : Marking
o ASIC Die : Description
o ASIC Die : Delayering
o ASIC Die Process
o ASIC Die Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Package Opening
8. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Physical analysis
o Package Views & Dimensions
o Package Opening
o Package Cross-Section
o MEMS Cap
o MEMS Sensing Area
o MEMS Die Cross-Section
o ASIC Die : View & Dimensions
o ASIC Die : Marking
o ASIC Die : Description
o ASIC Die : Delayering
o ASIC Die Process
o ASIC Die Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
MEMS Cap
9. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Physical analysis
o Package Views & Dimensions
o Package Opening
o Package Cross-Section
o MEMS Cap
o MEMS Sensing Area
o MEMS Die Cross-Section
o ASIC Die : View & Dimensions
o ASIC Die : Marking
o ASIC Die : Description
o ASIC Die : Delayering
o ASIC Die Process
o ASIC Die Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
MEMS Sensing Area : Die dimensions
10. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Physical analysis
o Package Views & Dimensions
o Package Opening
o Package Cross-Section
o MEMS Cap
o MEMS Sensing Area
o MEMS Die Cross-Section
o ASIC Die : View & Dimensions
o ASIC Die : Marking
o ASIC Die : Description
o ASIC Die : Delayering
o ASIC Die Process
o ASIC Die Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
MEMS Sensing Area â Principles of work
11. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Physical analysis
o Package Views & Dimensions
o Package Opening
o Package Cross-Section
o MEMS Cap
o MEMS Sensing Area
o MEMS Die Cross-Section
o ASIC Die : View & Dimensions
o ASIC Die : Marking
o ASIC Die : Description
o ASIC Die : Delayering
o ASIC Die Process
o ASIC Die Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
MEMS Die Cross-Section : MEMS
12. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Physical analysis
o Package Views & Dimensions
o Package Opening
o Package Cross-Section
o MEMS Cap
o MEMS Sensing Area
o MEMS Die Cross-Section
o ASIC Die : View & Dimensions
o ASIC Die : Marking
o ASIC Die : Description
o ASIC Die : Delayering
o ASIC Die Process
o ASIC Die Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
ASIC Die : View & Dimensions
13. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Physical analysis
o Package Views & Dimensions
o Package Opening
o Package Cross-Section
o MEMS Cap
o MEMS Sensing Area
o MEMS Die Cross-Section
o ASIC Die : View & Dimensions
o ASIC Die : Marking
o ASIC Die : Description
o ASIC Die : Delayering
o ASIC Die Process
o ASIC Die Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
ASIC Die Cross-Section â Metal Layer
14. Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
o Glossary
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Comparison with GYPRO3300, ADIS16136 & STIM210
15. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
o Global Overview
o ASIC Process Characteristics
o ASIC Wafer Fabrication Unit
o MEMS Front-End Process
o MEMS Wafer Fabrication
Unit
o MEMS Sensor Process Flow
o Package Assembly Unit
o Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Global Overview
16. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
o Global Overview
o ASIC Process Characteristics
o ASIC Wafer Fabrication Unit
o MEMS Front-End Process
o MEMS Wafer Fabrication
Unit
o MEMS Sensor Process Flow
o Package Assembly Unit
o Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
MEMS Front-End Process
17. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
o Global Overview
o ASIC Process Characteristics
o ASIC Wafer Fabrication Unit
o MEMS Front-End Process
o MEMS Wafer Fabrication
Unit
o MEMS Sensor Process Flow
o Package Assembly Unit
o Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
MEMS Sensor Process Flow
18. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
o Global Overview
o ASIC Process Characteristics
o ASIC Wafer Fabrication Unit
o MEMS Front-End Process
o MEMS Wafer Fabrication
Unit
o MEMS Sensor Process Flow
o Package Assembly Unit
o Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Packaging Process Flow
19. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
o Summary
o Economic Analysis
o Yields
o ASIC & Wafer Die Cost
o MEMS Wafer & Die Cost
o Packaging Cost
o Back-End Cost
o Component Cost
Selling Price Analysis
Feedbacks
About System Plus
ASIC Wafer & Die Cost
20. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
o Summary
o Economic Analysis
o Yields
o ASIC & Wafer Die Cost
o MEMS Wafer & Die Cost
o Packaging Cost
o Back-End Cost
o Component Cost
Selling Price Analysis
Feedbacks
About System Plus
MEMS Front-End Cost
21. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
o Summary
o Economic Analysis
o Yields
o ASIC & Wafer Die Cost
o MEMS Wafer & Die Cost
o Packaging Cost
o Back-End Cost
o Component Cost
Selling Price Analysis
Feedbacks
About System Plus
Component Cost
22. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
o Company services
o Related reports
o Contact
o Legal
Related Reports
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
MEMS
⢠Sensonor STIM210 â High-precision MEMS Gyro Module
⢠Analog Devices ADIS16136 Precision Angular Rate Sensor
MARKET AND TECHNOLOGY REPORTS - YOLE DĂVELOPPEMENT
MEMS & SENSORS
⢠High End Inertial Systems Market and Technology report 2017
23. COMPLETE TEARDOWN
WITH:
⢠Detailed photos
⢠Precise
measurements
⢠Materials analysis
⢠Manufacturing
process flow
⢠Supply chain
evaluation
⢠Manufacturing cost
analysis
⢠Estimated sales price
Tronics GYPRO3300 Angular Rate Sensor
Title: Tronics
GYPRO3300B
Gyroscope
Pages: 141
Date: January 2018
Format: PDF & Excel
file
Price: EUR 3,490
Bundle offer: with the
reports Sensonor
STIM210 High-
precision MEMS Gyro
Module and Analog
Devices ADIS16136
Precision Angular Rate
Sensor - Contact us
A unique, high-performance MEMS gyroscope z-axis
for industrial applications
sealed in a single CLCC 30-pin package, and with a volume under 850 mm3, the
GYPRO3300 can be integrated in many advanced systems.
The GYPRO3300 gyroscope is a unique, high-performance z-axis with a sleek structure
that includes MEMS and ASIC in a ceramic package, using Tronics vacuum wafer-level
packaging (WLP) technology based on micro-machined, thick single-crystal silicon.
Resistant to moisture, dust, and dirt, the GYPRO3300 was designed for high-stress
conditions. The MEMS structure is based on a tuning-fork design working in anti-phase
mode to reject external vibration. This structure is coupled with an ASIC specifically
designed by Si-Ware for MEMS gyroscopes.
The GYPRO3300 offers a new level of performance, with a bias instability below 1°/h and
a vibration rectification of 0.002°/s/g², which is qualified for industrial applications. Si-
Wareâs ASIC embeds OTP memory, a temperature sensor, and a phase-locked loop to
manage, compensate, and process data issued from the MEMS. Moreover, the system
works in a close-loop architecture that brings key advantages.
This report analyzes the complete component, including the package, MEMS, and ASIC
dies developed by Tronics Microsystems-TDK. Moreover, this report provides a full
description of the ASIC and MEMS functionalities, and details the manufacturing
processes used.
Also included is a complete cost analysis and selling price estimate for the GYPRO3300 z-
axis gyroscope, as well as a comparison with two other high-end MEMS gyroscopes:
Sensonorâs STIM210 Multi-Axis and Analog Devicesâ ADIS16136.
Tronics Microsystems, a leader in high-
performance MEMS inertial sensors,
recently released a new high-
performance MEMS gyroscope specially
designed for industrial and other
demanding applications: the Tronics
GYPRO3300. The GYPRO3300 is a next-
generation MEMS angular rate sensor
that can determine angle changes in
three dimensions for applications such
as 3D mapping, robotics, AHRS, and
navigation systems. Hermetically
24. TABLE OF CONTENTS
Overview /Introduction
Tronics Microsystems -
Company Profile
Physical Analysis
⢠Physical Analysis
Methodology
⢠Sensor Package
ďź View and dimensions
ďź Package opening
ďź Sensor package cross-section
⢠MEMS Die
ďź MEMS cap : View and
dimensions
ďź MEMS sensing area
ďź MEMS die cross-section
⢠ASIC Die
ďź ASIC die view and
dimensions
ďź ASIC delayering and main
blocs
ďź ASIC die cross-section
Performed byPerformed by
AUTHORS:
graduated with a bachelor in
radioprotection and electronics,
completed with a master degree
in electronic components in
Nantes in 2017. He is in charge
of costing of MEMS and
Integrated Circuits.
ClĂŠment Le Bleis
ClĂŠment Le Bleis has
joined System Plus
Consulting in Nov-
ember. ClĂŠment is
ratory. He previously worked
for 25 years at Atmel Nantes
Technological Analysis Labo-
ratory as fab support in physical
analysis, and for three years at
Hirex Engineering in Toulouse,
in a destructive physical analysis
lab.
Yvon Le Goff(Lab)
Yvon has joined
S y s t e m P l u s
Consulting in 2011
to setup its labo-
ANALYSIS PERFORMED WITH OUR COSTING TOOLS MEMS COSIM+ AND IC PRICE+
System Plus Consulting offers
powerful costing tools to
evaluate the production cost
and selling price from single
chip to complex structures.
MEMS CoSim+
Cost simulation tool to
evaluate the cost of any MEMS
process or device: From single
chip to complex structures.
IC Price+
The tool performs the
necessary cost simulation of
any Integrated Circuit: ASICs,
microcontrollers, DSP,
memories, smartpowerâŚ
MEMS CoSim+
IC Price+
Manufacturing Process
Flow
⢠ASIC Process Characteristics
⢠ASIC Wafer Fabrication Unit
⢠MEMS Front-End Process
⢠MEMS Wafer Fabrication
Unit
Cost Analysis
⢠Cost Analysis Overview
⢠Main Steps Used in the
Economic Analysis
⢠Yield Hypotheses
⢠MEMS/ASIC Die Cost
ďź Front-end (FE) cost
ďź Back-end - tests and dicing
ďź Wafer and die cost
⢠Component
ďź Packaging cost
ďź Component cost
Estimated Price Analysis
Distributed by
25. RELATED REPORTS
ANNUAL SUBSCRIPTION OFFER
You can choose to buy over 12
months a set of 3, 4, 5, 7, 10 or
15 Reverse CostingÂŽ reports.
Up to 47% discount!
⢠MEMS & Sensors:
Accelerometer - Environment - Fingerprint -
Gas - Gyroscope - IMU/Combo -
Microphone - Optics - Oscillator - Pressure
⢠Power:
GaN - IGBT - MOSFET - Si Diode - SiC
⢠Imaging: Camera - Spectrometer
⢠LED & Laser:
UV LED - VCSEL - White/blue LED
Each year System Plus Consulting releases a comprehensive collection of new reverse engineering &
costing analyses in various domains.
⢠Packaging:
3D Packaging - Embedded - SIP - WLP
⢠Integrated Circuits :
IPD - Memories - PMIC - SoC
⢠RF:
FEM - Duplexer
⢠Systems:
Automotive - Consumer - Energy -
Telecom
Performed by
More than 60 reports released each year on the following topics (considered for 2018):
Sensonor STIM210
High-precision MEMS
Gyro Module
Analog Devices ADIS16136
Precision Angular Rate Sensor
High End Inertial Systems Market
and Technology report 2017
World highest performance silicon
MEMS gyro available without
export control. Tactical grade with
bias instability of 0.5°/h in a
miniature 33cm3 package.
Tactical grade gyro module with in-
run bias stability of 4°/hour.
Fueled by geopolitical risks rising
defense investments, commercial
aerospace and fast-growing appli-
cations, this new prosperous cycle of
the high end inertial business will
bring the market to new heights.
Pages: 195
Date: March 2014
Full report: EUR 4,490*
Bundle offer existing: contact us
for more information
Pages: 81
Date: September 2014
Full report: EUR 2,990*
Bundle offer existing: contact us
for more information
Pages: Over 350
Date: November 2017
Full report: EUR 6,490*
Bundle offer existing: contact us for
more information
Distributed by
26. ORDER FORM
Please process my order for âTronics GYPRO3300B Gyroscopeâ Reverse Costing Report
ďą Full Reverse Costing report: EUR 3,490*
Ref.: SP18381
*For price in dollars please use the dayâs exchange rate. All reports are delivered electronically in pdf format. For French customer, add 20 % for VAT.
Performed by
DELIVERY on receipt of payment:
By credit card:
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By bank transfer:
BANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France,
Bank code : 30056, Branch code : 00170
Account No : 0170 200 1565 87,
SWIFT or BIC code : CCFRFRPP,
IBAN : FR76 3005 6001 7001 7020 0156 587
Return order by:
⢠FAX: +33 (0)472 83 01 83
⢠MAIL: YOLE DEVELOPPEMENT,
75 Cours Emile Zola, F - 69100 Lyon - Villeurbanne
Contact:
⢠Japan: Miho - Ohtake@yole.fr
⢠Greater China: Mavis - Wang@yole.fr
⢠Asia: Takashi - Onozawa@yole.fr
⢠EMEA: Lizzie - Levenez@yole.fr
⢠North America: Steve â laferriere@yole.fr
⢠General: info@yole.fr
The present document is valid till January, 2019
SHIP TO PAYMENT
BILLING CONTACT
ABOUT YOLE DEVELOPPEMENT
Name (Mr/Ms/Dr/Pr):
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Job Title:
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Company:
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Address:
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Distributed by
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Founded in 1998, Yole DĂŠveloppement has grown to become a group of companies providing marketing, technology
and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using
silicon and/or micro manufacturing, the Yole DĂŠveloppement group has expanded to include more than 50
collaborators worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics,
Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy
Management.
The âMore than Mooreâ company Yole, along with its partners System Plus Consulting, Blumorpho and KnowMade,
support industrial companies, investors and R&D organizations worldwide to help them understand markets and
follow technology trends to grow their business.
CUSTOM STUDIES
⢠Market data & research, marketing
analysis
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services
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More information on www.yole.fr
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⢠i-Micronews.com, online disruptive
technologies website and its weekly e-
newsletter, @Micronews
⢠Communication & webcasts services
⢠Events: Yole Seminars, Market Briefings
More information on
http://www.i-micronews.com/media-kit.html
TECHNOLOGY & MARKET REPORTS
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reports
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costing analysis
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More information on
http://www.i-
micronews.com/reports.html
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- Posting any Product to any other online service (including bulletin boards or the Internet);
- Licensing, leasing, selling, offering for sale or assigning the Product.
6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall
personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the
copyrights and will guaranty that the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a
maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company,
the joint venture done with a third party etc..cannot access the report and should pay a full license price.
7. Termination
7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such
delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without
solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due
time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which
shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
Distributed by
29. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
o Company services
o Related reports
o Contact
o Legal
Business Models Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>40 reports per year)
Costing Tools
Trainings
30. Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
o Company services
o Related reports
o Contact
o Legal
Contact
Headquarters
21 rue La Noue Bras de Fer
44200 Nantes
FRANCE
+33 2 40 18 09 16
sales@systemplus.fr
Europe Sales Office
Lizzie LEVENEZ
Frankfurt am Main
GERMANY
+49 151 23 54 41 82
llevenez@systemplus.fr
America Sales Office
Steve LAFERRIERE
Phoenix
USA
(310) 600-8267
laferriere@yole.fr
www.systemplus.fr
Asia Sales Office
Takashi ONOZAWA
Tokyo
JAPAN
onozawa@yole.fr
Mavis WANG
GREATER CHINA
wang@yole.fr
NANTES
Headquarter
FRANKFURT/MAIN
Europa Sales Office
LYON
YOLE HQ
TOKYO
YOLE KK
GREATER CHINA
YOLE
PHOENIX
YOLE Inc.
KOREA
YOLE