The document proposes a new level shifter circuit that can operate over a wide voltage range from 0.3V to 1.2V. It summarizes existing level shifter techniques and identifies limitations like high power consumption and large transistor sizes. The proposed circuit uses multiplexers in a feedback loop to bias the pull-up transistors for faster switching. Simulations show the new design has lower delay, power and energy compared to other approaches while converting between different voltage domains in smart system-on-chips.
IJRET : International Journal of Research in Engineering and Technology is an international peer reviewed, online journal published by eSAT Publishing House for the enhancement of research in various disciplines of Engineering and Technology. The aim and scope of the journal is to provide an academic medium and an important reference for the advancement and dissemination of research results that support high-level learning, teaching and research in the fields of Engineering and Technology. We bring together Scientists, Academician, Field Engineers, Scholars and Students of related fields of Engineering and Technology.
This document provides an overview of VLSI technology trends over time. It discusses how Moore's Law has been sustained through transistor scaling down to the nanometer level enabled by various techniques like strained silicon, high-k dielectrics, metal gates, SOI, multi-gate transistors like FinFETs. It outlines the evolution from bipolar junction transistors to MOSFETs to integrated circuits. Short channel effects posed challenges to scaling which were addressed through new device architectures in the second generation of scaling.
Power gating is the main power reduction techniques for the static power. As long as technology scaling is taking place, static power becomes paramount important factor to the VLSI designs.Therefore Power gating is the recent power reduction technique that is actively in research areas.
Design of -- Two phase non overlapping low frequency clock generator using Ca...Prashantkumar R
This document describes designing a two-phase non-overlapping clock generator circuit with buffered outputs. The circuit is required to generate clean square wave clock signals from a single-phase input clock between 10-100MHz. The output signals must drive a 0.33pF capacitive load without distortion. The design will be implemented using Cadence tools and modified through simulation to meet the objectives of generating true non-overlapping signals with at least 1ns of underlap that can operate over the specified frequency range and drive the required load.
The document discusses 45nm transistor properties. It describes how 45nm transistors were developed using high-k dielectrics and metal gates to replace silicon dioxide. This allowed for reduced leakage current and increased drive current. 45nm processors from Intel, AMD, and others are discussed. Key advantages of 45nm transistors include higher computational ability, greater power efficiency, and less power leakage.
The document discusses concepts related to static timing analysis (STA) for clocked designs. It defines key timing terms like timing paths, clock skew, slack, and false paths. It explains that STA involves breaking a circuit into timing paths and calculating the delay of each path to check if timing constraints are met. Timing paths connect flip-flops and have startpoints and endpoints. Clock skew is the difference in latency for a clock signal to reach flip-flops. Slack is the difference between a path's required time and arrival time.
Physical design involves taking a synthesized netlist as input and performing floorplanning, placement, and routing to produce a physical layout. Key inputs include the netlist, timing constraints, physical libraries, and technology files. The process involves floor planning to determine block placement and routing areas, power planning to create the power distribution network, and pre-routing of standard cells and power grids. The goal is to meet timing constraints while minimizing area.
IJRET : International Journal of Research in Engineering and Technology is an international peer reviewed, online journal published by eSAT Publishing House for the enhancement of research in various disciplines of Engineering and Technology. The aim and scope of the journal is to provide an academic medium and an important reference for the advancement and dissemination of research results that support high-level learning, teaching and research in the fields of Engineering and Technology. We bring together Scientists, Academician, Field Engineers, Scholars and Students of related fields of Engineering and Technology.
This document provides an overview of VLSI technology trends over time. It discusses how Moore's Law has been sustained through transistor scaling down to the nanometer level enabled by various techniques like strained silicon, high-k dielectrics, metal gates, SOI, multi-gate transistors like FinFETs. It outlines the evolution from bipolar junction transistors to MOSFETs to integrated circuits. Short channel effects posed challenges to scaling which were addressed through new device architectures in the second generation of scaling.
Power gating is the main power reduction techniques for the static power. As long as technology scaling is taking place, static power becomes paramount important factor to the VLSI designs.Therefore Power gating is the recent power reduction technique that is actively in research areas.
Design of -- Two phase non overlapping low frequency clock generator using Ca...Prashantkumar R
This document describes designing a two-phase non-overlapping clock generator circuit with buffered outputs. The circuit is required to generate clean square wave clock signals from a single-phase input clock between 10-100MHz. The output signals must drive a 0.33pF capacitive load without distortion. The design will be implemented using Cadence tools and modified through simulation to meet the objectives of generating true non-overlapping signals with at least 1ns of underlap that can operate over the specified frequency range and drive the required load.
The document discusses 45nm transistor properties. It describes how 45nm transistors were developed using high-k dielectrics and metal gates to replace silicon dioxide. This allowed for reduced leakage current and increased drive current. 45nm processors from Intel, AMD, and others are discussed. Key advantages of 45nm transistors include higher computational ability, greater power efficiency, and less power leakage.
The document discusses concepts related to static timing analysis (STA) for clocked designs. It defines key timing terms like timing paths, clock skew, slack, and false paths. It explains that STA involves breaking a circuit into timing paths and calculating the delay of each path to check if timing constraints are met. Timing paths connect flip-flops and have startpoints and endpoints. Clock skew is the difference in latency for a clock signal to reach flip-flops. Slack is the difference between a path's required time and arrival time.
Physical design involves taking a synthesized netlist as input and performing floorplanning, placement, and routing to produce a physical layout. Key inputs include the netlist, timing constraints, physical libraries, and technology files. The process involves floor planning to determine block placement and routing areas, power planning to create the power distribution network, and pre-routing of standard cells and power grids. The goal is to meet timing constraints while minimizing area.
The document discusses the physical design process for VLSI circuits. It describes the main steps as partitioning, floor planning and placement, routing, layout optimization, and extraction and verification. The goals of physical design are to minimize signal delays, interconnection area, and power usage. Physical design transforms the logical structure of a circuit into its physical layout.
This document discusses engineering change orders (ECOs) used to fix timing, functional, power, and clock issues after physical design and sign-off. It describes the motivation for ECOs due to tool limitations and differences between implementation and sign-off. Common ECO techniques are listed for timing (driver upsizing, buffer insertion, etc.), power (vt-swapping, downsizing, etc.), and metal-only ECOs. Timing ECO tools from Synopsys, Cadence, and other vendors are also mentioned. Upcoming ECO technologies like dynamic power optimization and automatic legalization are noted.
This document discusses packaging considerations for VLSI devices. It covers package types like through-hole packages, surface-mounted packages, flip chip packages, and chip-scale packages. Key package design considerations include the number of terminals, electrical design to minimize signal degradation, thermal design to dissipate heat, reliability over temperature cycles, and testability to ensure quality. The ideal package is compact with low-inductance connections to transfer heat efficiently while withstanding stresses.
The document discusses various layout optimizations that can be made to standard cells to reduce both internal power and area. These include removing "hammer head" structures to decrease transistor length, moving gate contacts over active areas to reduce transistor height, and reducing source/drain capacitances to decrease dynamic current without impacting speed. Post-layout simulations showed a new D flip-flop design with these optimizations reduced internal power by 20% while maintaining clock-to-Q delay, and improved saturation current by 15-50% while reducing area by 20%.
This document discusses different interconnect timing models used to model delays caused by interconnects in integrated circuits. It describes lumped capacitor, transmission line, lumped RC, Elmore delay, distributed RC, and RLC models. The lumped capacitor and transmission line models treat interconnects as either purely capacitive or propagating waves, while the lumped RC, distributed RC, and RLC models account for resistive and inductive effects at higher frequencies. The Elmore delay model provides a simplified yet accurate way to calculate delays in RC networks. Overall, the choice of timing model depends on factors like the operating frequency and interconnect geometry.
This document discusses junctionless transistors as an alternative to traditional transistors. Junctionless transistors have no p-n junctions and instead use uniformly doped semiconductor material. They offer advantages like simpler fabrication without implantation or annealing steps, reduced short channel effects, higher carrier mobility, and lower leakage current. However, they can have greater threshold voltage variability than conventional transistors. The document provides details on the structure and operation of junctionless transistors, comparing them to traditional transistors and discussing their potential to enable further device miniaturization.
Short channel effects arise when the channel length of a MOSFET becomes comparable to the depletion layer width. This causes unwanted effects such as drain-induced barrier lowering (DIBL), where the drain voltage lowers the channel potential barrier; surface scattering, where carriers collide with the surface increasing; and velocity saturation, where the electric field saturates the carrier drift velocity. Other effects are impact ionization, where high-energy carriers generate electron-hole pairs, and hot carrier injection (HCI). Short channel effects degrade performance and reliability in smaller transistors.
Timing and Design Closure in Physical Design Flows Olivier Coudert
A physical design flow consists of producing a production-worthy layout from a gate-level netlist subject to a set of constraints. We focus on the problems imposed by shrinking process technologies. It exposes the problems of timing closure, signal integrity, design variable dependencies, clock and power/ground routing, and design signoff. It also surveys some physical design flows, and outlines a refinement-based flow.
The physical design flow begins with placement which involves assigning exact locations to modules like gates and standard cells to minimize area and interconnect cost while meeting timing constraints, with the goal of enabling easier routing; placement tools take as input the netlist, floorplan, libraries, and constraints to perform global and detailed placement as well as optimization. The quality of placement significantly impacts the ability to route the design successfully.
This document discusses integrated circuit technology. It begins with an overview of the IC market breakdown by sector. It then discusses advantages of ICs such as smaller size, higher speed, lower power consumption compared to discrete components. The document provides a history of important IC inventions from 1904 to the present. It also discusses transistor scaling that has allowed achieving more complex ICs through reduced dimensions over time. Finally, it covers different IC design styles such as full custom, standard cell, gate array, and FPGA and their tradeoffs in terms of performance, cost, area, and time-to-market.
This is the presentation that was shared by Nilesh Ranpura and Vineeth Mathramkote at CDNLIVE 2015. The session briefs about the implementation challenges and covers the solution approach and how to achieve results
This document discusses low power VLSI design challenges and solutions. It motivates the need for low power design due to increasing power densities in VLSI chips and limited battery capacities. Sources of power dissipation in CMOS VLSI circuits are discussed including dynamic power during switching, static leakage power, and short circuit power. The document outlines various low power design methodologies at circuit, logic, architecture and software levels like reducing switching activity, glitch power reduction, gated clocking, reducing switched capacitance, using variable threshold voltages, and software optimizations.
The document discusses VLSI design methodologies and limitations using CAD tools. It provides an overview of different VLSI design methodologies such as full custom design, semi-custom design, gate array design, standard cell design, FPGA-based design and CPLD-based design. It also discusses the evolution of VLSI design flows from past to present technologies. Furthermore, it describes the complexities in VLSI design and how CAD tools help manage these complexities and automate the design process. Finally, it summarizes different types of VLSI CAD tools and compares various open source and licensed CAD tool vendors.
This document discusses low power VLSI designs. It covers VLSI design flows, RTL modeling using HDLs, synthesis, and power estimation and reduction techniques like clock gating. Clock gating is a major dynamic power reduction technique that gates the clock signal to avoid unnecessary toggling. New trends in clock gating leverage multi-level Boolean logic to derive enables based on stability conditions and observability don't cares. Enable strengthening aims to find a new enable that more efficiently gates the clock than existing enables.
Routing in Integrated circuits is an important task which requires extreme care while placing the modules and circuits and connecting them with each other.
This document discusses FinFET technology. It begins with an introduction to FinFETs, explaining that they are a type of double-gate CMOS that offers advantages over traditional CMOS for scaling to short gate lengths. It then discusses why FinFET technology is needed as traditional CMOS scaling faces challenges from subthreshold and gate leakage. It provides details on double-gate FET structure and operation, including how it controls short-channel effects better than single-gate FETs. It also covers FinFET features, applications, challenges and concludes that FinFETs can help continue CMOS scaling if key issues like fin patterning and gate work functions are addressed.
This document is a tutorial on circuit design using FinFETs presented at the 2013 IEEE International Solid-State Circuits Conference by Bing Sheu from TSMC. The tutorial covers technology considerations of FinFETs including their electrostatics benefits, SPICE modeling using the BSIM-CMG model, digital and memory circuit design methodology, and applications to analog/mixed-signal circuits. The document provides details on FinFET device structures, parasitic capacitances, scaling techniques, and performance comparisons to planar MOSFETs.
Optimized Local I/O ESD Protection for SerDes In Advanced SOI, BiCMOS and Fin...Sofics
Sofics presentation (B2.2) at the 1st International EOS/ESD Symposium on Design and System (IEDS). IEDS is dedicated to the fundamental understanding of issues related to electrostatic discharge on design and system and the application of this knowledge to the solution of problems.
Semiconductor companies are developing ever faster interfaces to satisfy the need for higher data throughputs. However, the parasitic capacitance of the traditional ESD solutions limits the signal frequency. This paper demonstrates low-cap Analog I/Os for high speed SerDes (28Gbps to 112Gbps) circuits created in advanced BiCMOS, SOI and FinFET nodes.
This document discusses low power high performance baud rate generators using MTCMOS voltage interface circuits. It compares feedback based and multi-VTH based voltage level converters that are used in baud rate generators to interface between circuits operating at different voltage levels. The multi-VTH level converters are found to offer significant power savings compared to feedback based converters. A baud rate generator is designed and simulated using different level converters in 90nm CMOS technology. The multi-VTH level converter LC5 provides the lowest power when used in the baud rate generator.
IRJET - A Zero Voltage Switching Pulse Width Modulated Multilevel Buck ConverterIRJET Journal
This document presents a new five-level zero voltage switching pulse width modulated multilevel buck converter. The proposed converter uses a multilevel topology to reduce voltage stresses on switches without adding extra voltage. It achieves zero voltage switching for all switches by utilizing active clamping and circulating reactive energy throughout the converter. Simulations in MATLAB were used to verify the performance of the proposed converter. The converter design and operating principles are explained, including modes of operation, component sizing equations, and simulation details.
The document discusses the physical design process for VLSI circuits. It describes the main steps as partitioning, floor planning and placement, routing, layout optimization, and extraction and verification. The goals of physical design are to minimize signal delays, interconnection area, and power usage. Physical design transforms the logical structure of a circuit into its physical layout.
This document discusses engineering change orders (ECOs) used to fix timing, functional, power, and clock issues after physical design and sign-off. It describes the motivation for ECOs due to tool limitations and differences between implementation and sign-off. Common ECO techniques are listed for timing (driver upsizing, buffer insertion, etc.), power (vt-swapping, downsizing, etc.), and metal-only ECOs. Timing ECO tools from Synopsys, Cadence, and other vendors are also mentioned. Upcoming ECO technologies like dynamic power optimization and automatic legalization are noted.
This document discusses packaging considerations for VLSI devices. It covers package types like through-hole packages, surface-mounted packages, flip chip packages, and chip-scale packages. Key package design considerations include the number of terminals, electrical design to minimize signal degradation, thermal design to dissipate heat, reliability over temperature cycles, and testability to ensure quality. The ideal package is compact with low-inductance connections to transfer heat efficiently while withstanding stresses.
The document discusses various layout optimizations that can be made to standard cells to reduce both internal power and area. These include removing "hammer head" structures to decrease transistor length, moving gate contacts over active areas to reduce transistor height, and reducing source/drain capacitances to decrease dynamic current without impacting speed. Post-layout simulations showed a new D flip-flop design with these optimizations reduced internal power by 20% while maintaining clock-to-Q delay, and improved saturation current by 15-50% while reducing area by 20%.
This document discusses different interconnect timing models used to model delays caused by interconnects in integrated circuits. It describes lumped capacitor, transmission line, lumped RC, Elmore delay, distributed RC, and RLC models. The lumped capacitor and transmission line models treat interconnects as either purely capacitive or propagating waves, while the lumped RC, distributed RC, and RLC models account for resistive and inductive effects at higher frequencies. The Elmore delay model provides a simplified yet accurate way to calculate delays in RC networks. Overall, the choice of timing model depends on factors like the operating frequency and interconnect geometry.
This document discusses junctionless transistors as an alternative to traditional transistors. Junctionless transistors have no p-n junctions and instead use uniformly doped semiconductor material. They offer advantages like simpler fabrication without implantation or annealing steps, reduced short channel effects, higher carrier mobility, and lower leakage current. However, they can have greater threshold voltage variability than conventional transistors. The document provides details on the structure and operation of junctionless transistors, comparing them to traditional transistors and discussing their potential to enable further device miniaturization.
Short channel effects arise when the channel length of a MOSFET becomes comparable to the depletion layer width. This causes unwanted effects such as drain-induced barrier lowering (DIBL), where the drain voltage lowers the channel potential barrier; surface scattering, where carriers collide with the surface increasing; and velocity saturation, where the electric field saturates the carrier drift velocity. Other effects are impact ionization, where high-energy carriers generate electron-hole pairs, and hot carrier injection (HCI). Short channel effects degrade performance and reliability in smaller transistors.
Timing and Design Closure in Physical Design Flows Olivier Coudert
A physical design flow consists of producing a production-worthy layout from a gate-level netlist subject to a set of constraints. We focus on the problems imposed by shrinking process technologies. It exposes the problems of timing closure, signal integrity, design variable dependencies, clock and power/ground routing, and design signoff. It also surveys some physical design flows, and outlines a refinement-based flow.
The physical design flow begins with placement which involves assigning exact locations to modules like gates and standard cells to minimize area and interconnect cost while meeting timing constraints, with the goal of enabling easier routing; placement tools take as input the netlist, floorplan, libraries, and constraints to perform global and detailed placement as well as optimization. The quality of placement significantly impacts the ability to route the design successfully.
This document discusses integrated circuit technology. It begins with an overview of the IC market breakdown by sector. It then discusses advantages of ICs such as smaller size, higher speed, lower power consumption compared to discrete components. The document provides a history of important IC inventions from 1904 to the present. It also discusses transistor scaling that has allowed achieving more complex ICs through reduced dimensions over time. Finally, it covers different IC design styles such as full custom, standard cell, gate array, and FPGA and their tradeoffs in terms of performance, cost, area, and time-to-market.
This is the presentation that was shared by Nilesh Ranpura and Vineeth Mathramkote at CDNLIVE 2015. The session briefs about the implementation challenges and covers the solution approach and how to achieve results
This document discusses low power VLSI design challenges and solutions. It motivates the need for low power design due to increasing power densities in VLSI chips and limited battery capacities. Sources of power dissipation in CMOS VLSI circuits are discussed including dynamic power during switching, static leakage power, and short circuit power. The document outlines various low power design methodologies at circuit, logic, architecture and software levels like reducing switching activity, glitch power reduction, gated clocking, reducing switched capacitance, using variable threshold voltages, and software optimizations.
The document discusses VLSI design methodologies and limitations using CAD tools. It provides an overview of different VLSI design methodologies such as full custom design, semi-custom design, gate array design, standard cell design, FPGA-based design and CPLD-based design. It also discusses the evolution of VLSI design flows from past to present technologies. Furthermore, it describes the complexities in VLSI design and how CAD tools help manage these complexities and automate the design process. Finally, it summarizes different types of VLSI CAD tools and compares various open source and licensed CAD tool vendors.
This document discusses low power VLSI designs. It covers VLSI design flows, RTL modeling using HDLs, synthesis, and power estimation and reduction techniques like clock gating. Clock gating is a major dynamic power reduction technique that gates the clock signal to avoid unnecessary toggling. New trends in clock gating leverage multi-level Boolean logic to derive enables based on stability conditions and observability don't cares. Enable strengthening aims to find a new enable that more efficiently gates the clock than existing enables.
Routing in Integrated circuits is an important task which requires extreme care while placing the modules and circuits and connecting them with each other.
This document discusses FinFET technology. It begins with an introduction to FinFETs, explaining that they are a type of double-gate CMOS that offers advantages over traditional CMOS for scaling to short gate lengths. It then discusses why FinFET technology is needed as traditional CMOS scaling faces challenges from subthreshold and gate leakage. It provides details on double-gate FET structure and operation, including how it controls short-channel effects better than single-gate FETs. It also covers FinFET features, applications, challenges and concludes that FinFETs can help continue CMOS scaling if key issues like fin patterning and gate work functions are addressed.
This document is a tutorial on circuit design using FinFETs presented at the 2013 IEEE International Solid-State Circuits Conference by Bing Sheu from TSMC. The tutorial covers technology considerations of FinFETs including their electrostatics benefits, SPICE modeling using the BSIM-CMG model, digital and memory circuit design methodology, and applications to analog/mixed-signal circuits. The document provides details on FinFET device structures, parasitic capacitances, scaling techniques, and performance comparisons to planar MOSFETs.
Optimized Local I/O ESD Protection for SerDes In Advanced SOI, BiCMOS and Fin...Sofics
Sofics presentation (B2.2) at the 1st International EOS/ESD Symposium on Design and System (IEDS). IEDS is dedicated to the fundamental understanding of issues related to electrostatic discharge on design and system and the application of this knowledge to the solution of problems.
Semiconductor companies are developing ever faster interfaces to satisfy the need for higher data throughputs. However, the parasitic capacitance of the traditional ESD solutions limits the signal frequency. This paper demonstrates low-cap Analog I/Os for high speed SerDes (28Gbps to 112Gbps) circuits created in advanced BiCMOS, SOI and FinFET nodes.
This document discusses low power high performance baud rate generators using MTCMOS voltage interface circuits. It compares feedback based and multi-VTH based voltage level converters that are used in baud rate generators to interface between circuits operating at different voltage levels. The multi-VTH level converters are found to offer significant power savings compared to feedback based converters. A baud rate generator is designed and simulated using different level converters in 90nm CMOS technology. The multi-VTH level converter LC5 provides the lowest power when used in the baud rate generator.
IRJET - A Zero Voltage Switching Pulse Width Modulated Multilevel Buck ConverterIRJET Journal
This document presents a new five-level zero voltage switching pulse width modulated multilevel buck converter. The proposed converter uses a multilevel topology to reduce voltage stresses on switches without adding extra voltage. It achieves zero voltage switching for all switches by utilizing active clamping and circulating reactive energy throughout the converter. Simulations in MATLAB were used to verify the performance of the proposed converter. The converter design and operating principles are explained, including modes of operation, component sizing equations, and simulation details.
Low Power Design Techniques for ASIC / SOC DesignRajesh_navandar
1. Low power techniques aim to reduce both dynamic and static/leakage power in integrated circuits. Dynamic power is reduced through techniques like lowering supply voltage and clock frequency, while leakage power is reduced by increasing transistor threshold voltage.
2. Power gating is a widely used technique that temporarily turns off unused circuit blocks to drastically reduce leakage power. It requires additional power switches and isolation cells to safely turn blocks on and off.
3. Multi-threshold CMOS uses both low and high threshold voltage transistors optimized for performance and leakage respectively. Further scaling presents new challenges as leakage power becomes dominant.
This document describes novel multi-threshold voltage level converters that minimize power consumption without compromising speed. Conventional feedback-based level converters rely on feedback circuits that cause slow response times and short circuit currents. The novel converters proposed use multiple transistor threshold voltages to directly drive high voltage gates from low voltage signals without static currents. When used in an integrated circuit, the multi-threshold converters decrease power by 47% and optimize delay by 50% compared to feedback converters in a 0.18-μm technology.
Smart metering and conditional access control of electrical energykannansenthilkumar
This project proposes an energy meter monitoring system using a microcontroller, GSM modem, and other components. The system measures energy usage through the meter, displays readings on an LCD, and allows utility authorities to remotely control power on/off via GSM. It also accepts customer complaints through a button and sends alerts about power issues or bills via GSM. The system aims to reduce manual errors and increase accuracy in energy monitoring and billing.
Simulation and analysis of multilevel inverter with reduced number of switchesIAEME Publication
This document summarizes a research paper that proposes a new multilevel inverter topology with reduced number of switches compared to conventional cascaded H-bridge multilevel inverters. The proposed topology is a five-level inverter that requires only six switches compared to eight switches in a conventional design. Simulation results show the performance of the new topology is validated using MATLAB/Simulink software. The paper also describes the operating modes and switching techniques used in the new multilevel inverter design, including phase disposition, alternative phase opposition disposition, and phase opposition disposition pulse width modulation strategies.
Automated load shedding using microcontrollerRajVerma175
In this proposed model automated load shedding can be using microcontroller and relay module. this model is applicable only based on voltage sagging but it can be made based on current only replacing transformer to current transformer.
The power electronics device which converts DC power to AC power at required output voltage and frequency level is known as inverter. Multilevel inverter is to synthesize a near sinusoidal voltage from several levels of dc voltages. In order to maintain the different voltage levels at appropriate intervals, the conduction time intervals of MOSFETS have been maintained by controlling the pulse width of gating pulses. In this paper single phase to three phase power conversion using PWM technique. The simulation is carried out in MATLAB/Simulink environment which demonstrate the feasibility of proposed scheme.
This document provides an overview of multilevel inverters. It discusses the drawbacks of two-level voltage source inverters for medium voltage drives, including high dv/dt and motor harmonic losses. It then introduces multilevel inverters as a solution, showing their stepped waveform that approaches sinusoidal. The document describes the main topologies of multilevel inverters - diode-clamped, flying capacitor, and cascaded H-bridge - and compares their component requirements. It highlights advantages like lower harmonics and higher voltage/power capabilities without increasing device ratings.
This document describes the design and performance study of a two-quadrant chopper drive. It begins with an introduction to choppers and their classification. It then discusses the different types of choppers - first quadrant, second quadrant, two-quadrant types A and B. It outlines the operations carried out by choppers and the components used in the model. Observations from the test circuit are presented along with graphs. Advantages include the ability for forward motoring and braking. Applications include electric vehicles and traction motor control. The conclusion is that regenerative braking is possible using a two-quadrant chopper.
This project aims to simulate and analyze DC motor speed control using a transistor. A transistor is used to switch the motor current in response to a control signal from a potentiometer, varying the motor's average voltage and thus controlling speed. The transistor switches the motor current at a constant frequency while varying the duty cycle to control speed. Components include a transistor, battery, resistors, potentiometer, DC motor, and PCB. Rotating the potentiometer creates a varying voltage across the transistor's gate, which then adjusts the motor voltage accordingly. This allows for smooth, low-cost speed control of the DC motor.
High-Power Bidirectional Dual Active Bridge and Double Dual Active Bridge DC-...IRJET Journal
The document summarizes a high-power bidirectional dual active bridge DC-DC converter. It discusses how dual active bridge converters use two full-bridge circuits connected by a transformer and inductor to enable bidirectional power flow and control power transfer between two DC sources by phase shifting square wave voltages generated by each bridge. Zero-voltage switching is enabled through resonance of the inductor and snubber capacitor, improving efficiency. The dual active bridge converter is well-suited for applications requiring high power density and bidirectional power flow such as balancing energy storage systems in aircraft.
- A new voltage-mode control scheme for buck converters improves performance at high frequencies by starting the ramp signal earlier, producing minimal jitter even at narrow duty cycles.
- Test results show the new scheme achieves jitter as low as 1.3ns at 1.5MHz switching frequency, compared to over 30ns for traditional control.
- The new scheme also enables monotonic start-up and allows higher bandwidth operation using fewer output capacitors.
The document describes a 20mA LED driver demo board that operates from 10-400V DC or 10-265V AC input and can power a single 20mA LED or string of LEDs up to 9V. The circuit uses an HV9821 control IC to operate in three modes - clamped buck converter, buck converter, or resistive ballast - depending on the line and load conditions. The board is designed to meet EMI standards and provides LED current regulation within 3% over the input voltage range while consuming less than 1W of power.
High Voltage Direct Current Transmission Systems 2Mark MaterialsSanthosh Kumar
The document provides information about HVDC transmission, including:
1. It lists two merits of AC transmission (power can be generated at high voltages, maintenance of AC substations is easy and cheaper) and two merits of DC transmission (it requires only two conductors, there is no skin effect).
2. It discusses types of DC link including monopolar, bipolar, and homopolar links.
3. It lists types of power devices used for HVDC transmission including thyristor, IGBT, GTO, LTT, and MCT.
4. It provides advantages and disadvantages of HVDC transmission such as full control over power, reduced transmission lines, and inability to change voltage
IGBT Based Single-Phase Quasi Z-Source Inverter for PV.pptxSureshJK
1) The document discusses a quasi Z-source inverter (qZSI) topology for photovoltaic systems. qZSI can operate as a buck or boost inverter with continuous input current and no need for dead time between switchings.
2) It describes the operating states and simple boost control technique of qZSI using shoot-through pulses to boost the input voltage. Simulation and hardware results validate the voltage boosting and output voltage regulation abilities of qZSI.
3) The experiment aims to understand qZSI operation, simulate and prototype a qZSI circuit, and evaluate performance for applications in photovoltaic energy conversion.
Original High Performance Off-Line Controller IC ACT30 CT30 30 New Active-SemiAUTHELECTRONIC
The document describes the ACT30, a high performance off-line power supply controller IC. It has features like low standby power of 0.15W, overcurrent protection, and hiccup mode short circuit protection. It uses current mode control and can drive external NPN or MOSFET switches. It is suitable for use in battery chargers, adapters, and other power supplies.
Novel High Voltage Buck Boost ConverterIRJET Journal
This document presents a novel high voltage buck boost converter using a PI controller. The proposed converter can boost a low voltage DC input such as that from a renewable energy source to a higher required output voltage. It utilizes a snubber circuit and MOSFET switches to achieve soft switching and high efficiency compared to conventional buck boost converters. Simulation results show the converter can boost a 100V DC input to 500V DC output with very low power losses. The converter design and operation are described, along with conclusions that it achieves high efficiency through soft switching and energy recovery in the snubber circuit.
Similar to A Multi VDD Wide Voltage Range Up Level Shifter For Smart SoC Applications (20)
Tools & Techniques for Commissioning and Maintaining PV Systems W-Animations ...Transcat
Join us for this solutions-based webinar on the tools and techniques for commissioning and maintaining PV Systems. In this session, we'll review the process of building and maintaining a solar array, starting with installation and commissioning, then reviewing operations and maintenance of the system. This course will review insulation resistance testing, I-V curve testing, earth-bond continuity, ground resistance testing, performance tests, visual inspections, ground and arc fault testing procedures, and power quality analysis.
Fluke Solar Application Specialist Will White is presenting on this engaging topic:
Will has worked in the renewable energy industry since 2005, first as an installer for a small east coast solar integrator before adding sales, design, and project management to his skillset. In 2022, Will joined Fluke as a solar application specialist, where he supports their renewable energy testing equipment like IV-curve tracers, electrical meters, and thermal imaging cameras. Experienced in wind power, solar thermal, energy storage, and all scales of PV, Will has primarily focused on residential and small commercial systems. He is passionate about implementing high-quality, code-compliant installation techniques.
Null Bangalore | Pentesters Approach to AWS IAMDivyanshu
#Abstract:
- Learn more about the real-world methods for auditing AWS IAM (Identity and Access Management) as a pentester. So let us proceed with a brief discussion of IAM as well as some typical misconfigurations and their potential exploits in order to reinforce the understanding of IAM security best practices.
- Gain actionable insights into AWS IAM policies and roles, using hands on approach.
#Prerequisites:
- Basic understanding of AWS services and architecture
- Familiarity with cloud security concepts
- Experience using the AWS Management Console or AWS CLI.
- For hands on lab create account on [killercoda.com](https://killercoda.com/cloudsecurity-scenario/)
# Scenario Covered:
- Basics of IAM in AWS
- Implementing IAM Policies with Least Privilege to Manage S3 Bucket
- Objective: Create an S3 bucket with least privilege IAM policy and validate access.
- Steps:
- Create S3 bucket.
- Attach least privilege policy to IAM user.
- Validate access.
- Exploiting IAM PassRole Misconfiguration
-Allows a user to pass a specific IAM role to an AWS service (ec2), typically used for service access delegation. Then exploit PassRole Misconfiguration granting unauthorized access to sensitive resources.
- Objective: Demonstrate how a PassRole misconfiguration can grant unauthorized access.
- Steps:
- Allow user to pass IAM role to EC2.
- Exploit misconfiguration for unauthorized access.
- Access sensitive resources.
- Exploiting IAM AssumeRole Misconfiguration with Overly Permissive Role
- An overly permissive IAM role configuration can lead to privilege escalation by creating a role with administrative privileges and allow a user to assume this role.
- Objective: Show how overly permissive IAM roles can lead to privilege escalation.
- Steps:
- Create role with administrative privileges.
- Allow user to assume the role.
- Perform administrative actions.
- Differentiation between PassRole vs AssumeRole
Try at [killercoda.com](https://killercoda.com/cloudsecurity-scenario/)
Accident detection system project report.pdfKamal Acharya
The Rapid growth of technology and infrastructure has made our lives easier. The
advent of technology has also increased the traffic hazards and the road accidents take place
frequently which causes huge loss of life and property because of the poor emergency facilities.
Many lives could have been saved if emergency service could get accident information and
reach in time. Our project will provide an optimum solution to this draw back. A piezo electric
sensor can be used as a crash or rollover detector of the vehicle during and after a crash. With
signals from a piezo electric sensor, a severe accident can be recognized. According to this
project when a vehicle meets with an accident immediately piezo electric sensor will detect the
signal or if a car rolls over. Then with the help of GSM module and GPS module, the location
will be sent to the emergency contact. Then after conforming the location necessary action will
be taken. If the person meets with a small accident or if there is no serious threat to anyone’s
life, then the alert message can be terminated by the driver by a switch provided in order to
avoid wasting the valuable time of the medical rescue team.
Supermarket Management System Project Report.pdfKamal Acharya
Supermarket management is a stand-alone J2EE using Eclipse Juno program.
This project contains all the necessary required information about maintaining
the supermarket billing system.
The core idea of this project to minimize the paper work and centralize the
data. Here all the communication is taken in secure manner. That is, in this
application the information will be stored in client itself. For further security the
data base is stored in the back-end oracle and so no intruders can access it.
Prediction of Electrical Energy Efficiency Using Information on Consumer's Ac...PriyankaKilaniya
Energy efficiency has been important since the latter part of the last century. The main object of this survey is to determine the energy efficiency knowledge among consumers. Two separate districts in Bangladesh are selected to conduct the survey on households and showrooms about the energy and seller also. The survey uses the data to find some regression equations from which it is easy to predict energy efficiency knowledge. The data is analyzed and calculated based on five important criteria. The initial target was to find some factors that help predict a person's energy efficiency knowledge. From the survey, it is found that the energy efficiency awareness among the people of our country is very low. Relationships between household energy use behaviors are estimated using a unique dataset of about 40 households and 20 showrooms in Bangladesh's Chapainawabganj and Bagerhat districts. Knowledge of energy consumption and energy efficiency technology options is found to be associated with household use of energy conservation practices. Household characteristics also influence household energy use behavior. Younger household cohorts are more likely to adopt energy-efficient technologies and energy conservation practices and place primary importance on energy saving for environmental reasons. Education also influences attitudes toward energy conservation in Bangladesh. Low-education households indicate they primarily save electricity for the environment while high-education households indicate they are motivated by environmental concerns.
Software Engineering and Project Management - Introduction, Modeling Concepts...Prakhyath Rai
Introduction, Modeling Concepts and Class Modeling: What is Object orientation? What is OO development? OO Themes; Evidence for usefulness of OO development; OO modeling history. Modeling
as Design technique: Modeling, abstraction, The Three models. Class Modeling: Object and Class Concept, Link and associations concepts, Generalization and Inheritance, A sample class model, Navigation of class models, and UML diagrams
Building the Analysis Models: Requirement Analysis, Analysis Model Approaches, Data modeling Concepts, Object Oriented Analysis, Scenario-Based Modeling, Flow-Oriented Modeling, class Based Modeling, Creating a Behavioral Model.
A Multi VDD Wide Voltage Range Up Level Shifter For Smart SoC Applications
1. A Multi VDD Wide Voltage Range Up Level
Shifter for Smart SoC Applications
Presented by
D Baba Fayaz,
Department of Electronics and Communication Engineering,
National Institute of Technology Warangal.10-09-2020 1
2. Outline
• Motivation
• Introduction
• Existing Techniques of Level Shifters
• Proposed Level Shifter
• Simulation Results
• Comparison Table
• Conclusion
• References
10-09-2020 A Multi VDD Wide Voltage Range Up Level Shifter for Smart SOC Applications 2
3. Motivation
• In scale down technology nodes power
consumption is one of the major drawback in
todays SOC designs.
• Scaling of device features not only increases the
performance of the circuit but also increases the
leakage power.
• Scaling the power supply (VDD) causes the
degrading in performance of the circuit.
• Multiple supply voltage domain(MSVD)
technique is emerging as an efficient method to
reduce both dynamic and static power in today
SOCs.
10-09-2020
A Multi VDD Wide Voltage Range Up Level Shifter for Smart
SOC Applications
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4. Introduction to Level Shifter
Level shifter cell is used to convert from one
voltage to another voltage level.
It is required when the chip is operating at multiple
voltage domains.
The situation where dynamic voltage scaling is
used and the voltage relation between the source
and destination might change and that leads to
unreliable functioning. In that case we need this
level shifter.
Applications : Interconnecting two logic families like
CMOS and TTL
10-09-2020
A Multi VDD Wide Voltage Range Up Level Shifter for Smart
SOC Applications
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5. Existing Techniques of Level Shifters
• Level shifter circuits are typically based on one of these approaches
1. Differential cascade voltage switch (DCVS) level shifter.
2. Current mirror based level shifter.
3. Single ended input level shifter.
10-09-2020
A Multi VDD Wide Voltage Range Up Level Shifter for Smart
SOC Applications
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6. DCVS (or) STANDARD LEVEL SHIFTER
• In this configuration, Input of NMOS transistors are controlled by
a low voltage input signal, which is shifted to high voltage at the
output of the level shifter.
• The gate of PL and PR transistors is connected to high voltage
supply due to that NL and NR struggle to sink more current than
the PMOS pull-up transistors source.
Drawbacks
• This configuration needs larger NMOS transistors with widths
typically ten times larger than PMOS transistors by this both delay
and power consumption also increases.
• Very weak pull down network even if the NMOS transistors are
significantly larger than the PMOS transistors.
10-09-2020
A Multi VDD Wide Voltage Range Up Level Shifter for Smart
SOC Applications
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7. CURRENT MIRROR BASED LEVEL SHIFTER
• A semi static current mirror is used to limit the current and
therefore the strength of the pull up device is weakened when
the pull down device is pulling down the output node.
• This circuit overcomes the contention problem which is in
DCVS circuit.
• However, this structure suffers from the static current flowing
through NL and PL during the “High” logic levels of input
signal.
Drawbacks
• This method leads to large standby current.
• Power consumption increases significantly due to static current
path.
10-09-2020
A Multi VDD Wide Voltage Range Up Level Shifter for Smart
SOC Applications
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8. SINGLE ENDED LEVEL SHIFTER
• A single ended level shifter is to mitigate the drawbacks of
Standard and Current mirror level LS.
• Low power applications can be easily carried out by using
this single ended level shifter using zero steady state
current and only one supply is required at which shift of
input logic signal is to be done.
Drawbacks
• A high resistive path is required through N2 as compared
to N1 to minimize charge leakage at OUT while OUT_bar
is transitioning to logic low.
• It suffers from higher leakage current and operation is
restricted with high range of input and output supplies.
10-09-2020 A Multi VDD Wide Voltage Range Up Level Shifter for Smart SOC Applications 8
9. PARAMETER VALUE
Technology 90nm
VDDH 1.2
VDDL=VIN 0.3
Output voltage 1.2
Temperature -25 to 125
Cout (Load) 1fF – 100fF
Frequency 1MHz
Tools used: Cadence virtuoso IC617
Design Specifications of proposed level shifter
10-09-2020 A Multi VDD Wide Voltage Range Up Level Shifter for Smart SOC Applications 9
10. PROPOSED LEVEL SHIFTER CIRCUIT TOPOLOGY
10-09-2020
A Multi VDD Wide Voltage Range Up Level Shifter for Smart
SOC Applications
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11. D
VDDL
SELECT
Gate
of PL
MUX_L
D_B
VDDL
SELECTGate
of PR
MUX_R
INTERNAL BLOCKS OF MULTIPLEXER
• The operation of multiplexer is mainly depends on the select input. For MUXL, when the select is HIGH,
nmos transistor will ON and we get output as D and when input is LOW, pmos transistor will ON and we get
output as VDDL and that will fed to transistor PL.
• Similarly for MUXR when select input is HIGH nmos transistor will ON and we get output as VDDL and
when input is LOW pmos transistor will ON and we get DB as output that output will be given to transistor
PR.
10-09-2020 A Multi VDD Wide Voltage Range Up Level Shifter for Smart SOC Applications 11
12. Structure of the Proposed Level Shifter
• The proposed level shifter is based on standard level shifter and it mitigates the drawbacks of
existing level shifters and exhibits symmetric operation between the input and output.
• The main advantage of Proposed topology is feedback loop it consists of two multiplexers i.e.,
MUXL and MUXR. Multiplexers are based on pass transistor logic, each multiplexer has two
transistors and the output of MUXs are connected to the gate of the PMOS pull up transistors.
• The output node D_B is connected as select line input of this multiplexers and based upon this
select input multiplexer chooses one of its input as output.
• The proposed configuration eliminates the need of large size NMOS pull down transistors i.e., NL
and NR because the driving voltage of PMOS pull up network is very low (i.e., VDDL).
10-09-2020
A Multi VDD Wide Voltage Range Up Level Shifter for Smart
SOC Applications
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13. Operation of the Proposed Level Shifter
Two possible transition states exists for this LS, when output is High and the next
transition is falling, or when the output is Low and the next transition is rising.
In First case, when the output is high, upcoming transition is falling. For this, the gate
of PL is connected to node D and the gate of PR is connected to node low supply voltage
“VDDL”, this connection biases PR into cutoff region, which degrades the strength of PR.
Without any contention from PR node D discharges through the pull down transistor NR
and node D_B is charged to full voltage by pull up transistor PL.
In Second case, when the output is Low, upcoming transition is Rising. For this, the gate
of PR is connected to node low supply voltage “VDDL” and gate of PL is connected to
node D_B, this connection biases PL into cutoff region and degrades the strength of PL.
Without any contention from PL node D_B discharges through the transistor NL and
node D will charges to full voltage by the transistor PR.
10-09-2020
A Multi VDD Wide Voltage Range Up Level Shifter for Smart
SOC Applications
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15. • The proposed level shifter exhibits higher performance and speed improvement is due to the feedback loop
that sets up the circuit for next transition as compared with the other level shifters.
• This configuration eliminates the need for the large NMOS pull down transistors NL and NR, because the
relevant PMOS pull up transistor is maintained at a low voltage bias for the upcoming transition.
• Symmetric rise and fall transition times of the proposed level shifter is preserved over the maximum
operating range.
• The delay, power and energy of the proposed level shifter has reduced and significant improvement in
performance is achieved.
Advantages
10-09-2020 A Multi VDD Wide Voltage Range Up Level Shifter for Smart SOC Applications 15
17. Input and Output response
10-09-2020 A Multi VDD Wide Voltage Range Up Level Shifter for Smart SOC Applications 17
18. Simulations
10-09-2020 A Multi VDD Wide Voltage Range Up Level Shifter for Smart SOC Applications 18
Fig: Delay vs VDDL across different process corners Fig: Power vs VDDL across different process corners
19. Simulations
10-09-2020 A Multi VDD Wide Voltage Range Up Level Shifter for Smart SOC Applications 19
Fig: Delay across different Load conditions Fig: Power across different Load conditions
20. Simulations
10-09-2020 A Multi VDD Wide Voltage Range Up Level Shifter for Smart SOC Applications 20
Fig: Delay vs Temp across different process corners Fig: Power vs Temp across different process corners
21. Simulations
10-09-2020 A Multi VDD Wide Voltage Range Up Level Shifter for Smart SOC Applications 21
Fig: Histogram of the output response across 1000 samplesFig: Output response across different load conditions
22. Simulations
10-09-2020 A Multi VDD Wide Voltage Range Up Level Shifter for Smart SOC Applications 22
Fig: Histogram of the Delay response across 1000 samples Fig: Histogram of the power response across 1000 samples
23. Simulations
10-09-2020 A Multi VDD Wide Voltage Range Up Level Shifter for Smart SOC Applications 23
Fig: Total Power Consumed by the circuit
24. Layout of the Proposed circuit
10-09-2020 A Multi VDD Wide Voltage Range Up Level Shifter for Smart SOC Applications 24
25. Design
(90nm)
Voltage
conversion
range (V)
Delay
(nS)
Static
Power
(nw)
Average
power
(uW)
Energy/
transition
(fJ)
(EDP)
(fJ nS)
f = 1MHz
Area
(transistor
count)
Results
DCVS
Level shifter
0.5 V to 1.2 V 23.60 112.2 8.242 8.24 194.51 8 simulated
Current
mirror Level
shifter
0.4 V to 1.2 V 13.05 413.2 3.058 3.05 39.90 8
simulated
Wilson
current
mirror Level
shifter
0.4 V to 1.2 V 10.31 413.8 1.812 1.81 18.68 9 simulated
Advanced
Level shifter
[Ref 1]
0.6 V to 1.2 V 6.09 2959 16.63 16.6 101.27 29 simulated
Proposed
Level shifter
0.3 V to 1.2 V 3.65 960 1.43 1.43 5.24 12 simulated
Comparison Table
10-09-2020
A Multi VDD Wide Voltage Range Up Level Shifter for Smart SOC Applications
25
26. Conclusion
The proposed Level Shifter was compared to the existing state-of-the-art LS
circuits using various simulation setups and the better results were obtained for
the proposed level shifter.
The circuits were designed and simulated in 90nm CMOS technology the
proposed level shifter shifts the input voltage of 0.3 V to 1.2 V. Moreover,
while converting it exhibits an average delay of 3.65 ns and power
consumption of 1.43 µW.
This level shifter could be used and can produce low power consumption
in spite of the overhead, based on the data obtained from the simulation
as discussed in this work.
10-09-2020
A Multi VDD Wide Voltage Range Up Level Shifter for Smart
SOC Applications
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27. References
1. A. shapiro and E. G. Friedman, “power efficient level shifter for 16nm FinFET
near threshold circuits”, IEEE Trans. Very large scale Integr. (VLSI) Syst., vol. 24,
no. 2, pp. 774-778, Feb. 2016.
2. S. Lütkemeier and U. Ruckert, “A subthreshold to above-threshold level shifter
comprising a Wilson current mirror,” IEEE Trans. CircuitsSyst. II, Exp. Briefs, vol.
57, no. 9, pp. 721–724, Sep. 2010.
3. B. H. Calhoun and D. Brooks, “Can subthreshold and near-threshold circuits go
mainstream?” IEEE Micro, vol. 30, no. 4, pp. 80–85, Jul./Aug. 2010.
4. S.-C. Luo, C.-J. Huang, and Y.-H. Chu, “A wide-range level shifter using a modified
Wilson current mirror hybrid buffer,” IEEE Trans Circuits Syst. I, Reg. Papers, vol.
61, no. 6, pp. 1656–1665,Jun. 2014.
5. M. Lanuzza, P. Corsonello, and S. Perri, “Fast and wide range voltage conversion
in multisupply voltage designs,” IEEE Trans. Very Large Scale Integr. (VLSI) Syst.,
vol. 59, no. 12, pp. 922–926, Mar. 2014.
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A Multi VDD Wide Voltage Range Up Level Shifter for Smart
SOC Applications
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