A unique combination of STMicroelectronics’ latest proximity sensor, based on single-photon avalanche diode (SPAD) technology and a VCSEL illuminator, all in Apple’s most advanced handset.
More information on that report at http://www.i-micronews.com/reports.html
STMicroelectronics’ Near Infrared Camera Sensor in the Apple iPhone X - 2017 ...system_plus
The document provides a detailed analysis of the near infrared (NIR) camera sensor used in the Apple iPhone X for facial recognition. It includes a teardown of the true depth camera module containing the NIR sensor from STMicroelectronics. Physical analysis of the module reveals a lens module, filter, and ceramic substrate. Analysis of the ST NIR sensor die shows it has small pixels below 4 μm, a resolution of 2 megapixels, and was manufactured using ST's 140nm process on an Imager-SOI substrate from Soitec. The report also provides a cost analysis of manufacturing the sensor die and module, estimating the manufacturer price to be around $15. The document compares the ST sensor to other NIR sensors
Huawei Mate 20 Pro’s 3D Depth-Sensing Systemsystem_plus
The complete system includes a 3D camera, flood illuminator, and DOT projector featuring a DOE.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/the-huawei-mate-20-pros-3d-depth-sensing-system/
Apple iPhone X – Infrared Dot Projector 2017 teardown reverse costing report ...system_plus
The world’s most advanced dot projector for 3D sensing
with four innovative parts:
Its package; a dedicated VCSEL; a folded optic; and the active DOE.
Apple has made a great technology choice with its 3D facial identification for the iPhone X. The new technology is presented as being 20 times more accurate than the older fingerprint approach with a one-in-a million probability of a random person unlocking your iPhone.
Intel RealSense D435 3D Active IR Stereo Depth Camera 2018 teardown reverse c...system_plus
The 3D camera is using infrared active stereo depth and red/green/blue sensors, and a VCSEL projector.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/intel-realsense-d435-3d-active-ir-stereo-depth-camera/
Advanced packaging technology in the Apple Watch Series 4’s System-in-Packagesystem_plus
Four major packaging technologies: TSMC’s info, ASE’s Double Side Molding/SESUB and SiP, Skyworks’ Double Side BGA.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/advanced-packaging-technology-in-the-apple-watch-series-4s-system-in-package/
SP20569 - IRay T3S Thermal Camera for Smartphonesystem_plus
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/iray-t3s-thermal-camera-for-smartphone/
Melexis Time of Flight Imager for Automotive Applications 2017 teardown rever...Yole Developpement
This document provides a reverse costing analysis of the Melexis MLX75023 3D time-of-flight image sensor. It includes a physical analysis of the glass ball grid array package and die, a comparison to other ToF technologies, a breakdown of the manufacturing process, and a cost analysis. Key findings include that the sensor uses a cutting-edge time-of-flight pixel design licensed from Softkinetic and packaged using a thin glass BGA. The report estimates production costs and sells price based on detailed analysis of materials, fabrication steps, and supply chain.
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...Yole Developpement
A closer look at the impressive, industry-first, tri-layer stacked CIS.
Sony leads the global CMOS Image Sensor (CIS) market, commanding more than a third share of the industry’s total revenue. And over the years, Sony has maintained its leadership by providing innovative CIS products for original equipment manufacturers like Samsung or Apple. In 2017, Sony as a smartphone designer decided to release in its flagship the latest and potentially the greatest innovation in the past decade of CIS manufacturing.
Inside the Sony Xperia™ XZs and the XZ Premium, the latest Motion Eye™ can be found, with the new IMX400 CIS. This three-layer stacked CIS is made with the traditional pixel array and logic circuit on the same die, but also a 1Gb DRAM memory allowing slow motion at almost 960 frames per second.
This innovative CIS is Sony’s next generation technology. The CIS includes a 22 Mpixel array, a 1Gb DRAM die and a digital signal processor (DSP) on the same die footprint. This is the first tri-layer stacked CIS on the market. In this configuration, Sony can provide a fast readout image sensor with no distortion when shooting fast-moving objects thanks to the high capacity DRAM between the pixel array circuit and the DSP circuit.
Using Sony’s Exmor-RS and Xperi’s Zibond technologies, Sony has managed to integrate the three dies in a single thin, small and cost-effective sensor die. Surprisingly, the die sensor uses a unique sort of TSV at different levels to interconnect the dies.
This report includes a complete analysis of the camera module from the Sony Xperia™ XZs, featuring camera module disassembly and die analyses, processes and cross-sections. It also includes a comparison with the Samsung Galaxy S7, Apple iPhone 7 Plus, and Huawei P9 telephoto camera modules. At the CIS level, it compares the IMX400 with the IMX260, the IMX286, and the latest custom CIS for Apple from Sony’s portfolio. Finally, it contains a complete cost analysis and a selling price estimation of the CIS die.
More information on that report at http://www.i-micronews.com/reports.html
STMicroelectronics’ Near Infrared Camera Sensor in the Apple iPhone X - 2017 ...system_plus
The document provides a detailed analysis of the near infrared (NIR) camera sensor used in the Apple iPhone X for facial recognition. It includes a teardown of the true depth camera module containing the NIR sensor from STMicroelectronics. Physical analysis of the module reveals a lens module, filter, and ceramic substrate. Analysis of the ST NIR sensor die shows it has small pixels below 4 μm, a resolution of 2 megapixels, and was manufactured using ST's 140nm process on an Imager-SOI substrate from Soitec. The report also provides a cost analysis of manufacturing the sensor die and module, estimating the manufacturer price to be around $15. The document compares the ST sensor to other NIR sensors
Huawei Mate 20 Pro’s 3D Depth-Sensing Systemsystem_plus
The complete system includes a 3D camera, flood illuminator, and DOT projector featuring a DOE.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/the-huawei-mate-20-pros-3d-depth-sensing-system/
Apple iPhone X – Infrared Dot Projector 2017 teardown reverse costing report ...system_plus
The world’s most advanced dot projector for 3D sensing
with four innovative parts:
Its package; a dedicated VCSEL; a folded optic; and the active DOE.
Apple has made a great technology choice with its 3D facial identification for the iPhone X. The new technology is presented as being 20 times more accurate than the older fingerprint approach with a one-in-a million probability of a random person unlocking your iPhone.
Intel RealSense D435 3D Active IR Stereo Depth Camera 2018 teardown reverse c...system_plus
The 3D camera is using infrared active stereo depth and red/green/blue sensors, and a VCSEL projector.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/intel-realsense-d435-3d-active-ir-stereo-depth-camera/
Advanced packaging technology in the Apple Watch Series 4’s System-in-Packagesystem_plus
Four major packaging technologies: TSMC’s info, ASE’s Double Side Molding/SESUB and SiP, Skyworks’ Double Side BGA.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/advanced-packaging-technology-in-the-apple-watch-series-4s-system-in-package/
SP20569 - IRay T3S Thermal Camera for Smartphonesystem_plus
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/iray-t3s-thermal-camera-for-smartphone/
Melexis Time of Flight Imager for Automotive Applications 2017 teardown rever...Yole Developpement
This document provides a reverse costing analysis of the Melexis MLX75023 3D time-of-flight image sensor. It includes a physical analysis of the glass ball grid array package and die, a comparison to other ToF technologies, a breakdown of the manufacturing process, and a cost analysis. Key findings include that the sensor uses a cutting-edge time-of-flight pixel design licensed from Softkinetic and packaged using a thin glass BGA. The report estimates production costs and sells price based on detailed analysis of materials, fabrication steps, and supply chain.
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...Yole Developpement
A closer look at the impressive, industry-first, tri-layer stacked CIS.
Sony leads the global CMOS Image Sensor (CIS) market, commanding more than a third share of the industry’s total revenue. And over the years, Sony has maintained its leadership by providing innovative CIS products for original equipment manufacturers like Samsung or Apple. In 2017, Sony as a smartphone designer decided to release in its flagship the latest and potentially the greatest innovation in the past decade of CIS manufacturing.
Inside the Sony Xperia™ XZs and the XZ Premium, the latest Motion Eye™ can be found, with the new IMX400 CIS. This three-layer stacked CIS is made with the traditional pixel array and logic circuit on the same die, but also a 1Gb DRAM memory allowing slow motion at almost 960 frames per second.
This innovative CIS is Sony’s next generation technology. The CIS includes a 22 Mpixel array, a 1Gb DRAM die and a digital signal processor (DSP) on the same die footprint. This is the first tri-layer stacked CIS on the market. In this configuration, Sony can provide a fast readout image sensor with no distortion when shooting fast-moving objects thanks to the high capacity DRAM between the pixel array circuit and the DSP circuit.
Using Sony’s Exmor-RS and Xperi’s Zibond technologies, Sony has managed to integrate the three dies in a single thin, small and cost-effective sensor die. Surprisingly, the die sensor uses a unique sort of TSV at different levels to interconnect the dies.
This report includes a complete analysis of the camera module from the Sony Xperia™ XZs, featuring camera module disassembly and die analyses, processes and cross-sections. It also includes a comparison with the Samsung Galaxy S7, Apple iPhone 7 Plus, and Huawei P9 telephoto camera modules. At the CIS level, it compares the IMX400 with the IMX260, the IMX286, and the latest custom CIS for Apple from Sony’s portfolio. Finally, it contains a complete cost analysis and a selling price estimation of the CIS die.
More information on that report at http://www.i-micronews.com/reports.html
Mantis Vision’s 3D Depth Sensing System in the Xiaomi Mi8 Explorer Editionsystem_plus
The first introduction of Mantis Vision’s technology into a mobile application, featuring coded structured light.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/mantis-visions-3d-depth-sensing-system-in-the-xiaomi-mi8-explorer-edition/
ams’ Multi-Spectral Sensor in the Apple iPhone X 2017 teardown reverse costi...system_plus
The most advanced multispectral 6-channel ambient light sensor, supplied and produced by ams for its biggest customer, Apple.
For the semiconductor industry, the smartphone is a gold mine. Each component inside every OEM’s flagship phone holds substantial value for the component supplier, which sometimes gains a significant portion of the phone’s sales revenue too. Apple is one of the major OEMs that every supplier fights to work with, and for many years ams AG has been the world’s leading ambient light sensor (ALS) producer, due to its presence in every Apple iPhone.
Physical analysis and cost comparison of seven leading flagship smartphone cameras: Apple iPhone X/XS/XR, Samsung Galaxy S9, Huawei Mate 20 Pro and P20 Pro, Xiaomi Mi8 Explorer Edition, Oppo Find X and Vivo X21UD.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/mobile-camera-module-comparison-2019/
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...Yole Developpement
Infrared camera and electronic control unit for advanced driver assistance systems based on FLIR night vision imaging technology
Based on a high definition ISC0901 microbolometer from FLIR, the Autoliv night vision infrared camera targets the high-end automotive market using two FLIR cores. Based on the solid first design from 2009, the microbolometer offers better performance in definition and frame rate. The camera also embraces the quality approach with a complex optical system and powers its night vision using sophisticated numerical processing based on an Altera field-programmable gate array (FPGA) and custom algorithm.
The Autoliv night vision camera consists of two modules, the camera and a remote processing unit. The system is made very compact and easy to integrate for car makers.
The ISC0901 thermal camera uses FLIR’s 17µm pixel design, optimized for automotive applications. Based on vanadium oxide technology, the ISC0901 microbolometer features a 336x256 resolution wafer level package, achieving an incredibly compact design.
The ISC0901 is the automotive version of a surveillance microbolometer. By using wafer level package technology to encapsulate the microbolometer FLIR offers the best price performance ratio.
This report is divided into two parts, one focused on the microbolometer and the second on the other systems. It is based on a complete teardown analysis of the night vision camera and the associated electronic control unit. Using this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR ISC0901, FLIR Lepton 3 and the PICO384P from ULIS. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
Technical and cost overview of the evolution of radio frequency front-end module technologies integrated in 5G mmWave and Sub-6 GHz Phones.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-2-focus-on-5g-chipset/
An ultrasonic sensor in a compact housing, with 20-450cm detection range.
Ultrasonic transducers are used in vehicles as parking assistance. The ultrasonic transducer sends out short ultrasonic impulses which are reflected by barriers. The echo signals are registered by the sensor and are evaluated by a central control unit.
This ultrasonic parking sensor from Bosch is very compact with its very few components meaning it is manufactured at low cost. The sensor is made with one electronic board, including a Bosch transceiver integrated circuit (IC) that drives the output of the Epcos/TDK transformer and evaluates the reflected signal. The transducer itself is made of a lead zirconate titanate (PZT) membrane and silver electrodes.
More information on that report at http://www.i-micronews.com/reports.html
Technology and cost review of nine RF IPD found on the market from different suppliers: Broadcom, IPDiA, Murata, Qorvo, Skyworks and STMicroelectronics.
With integrated passive devices (IPD) accounting for almost 70 % of the PCB area in smartphones, integration is a challenge that several integrated device manufacturers (IDM) and outsourced semiconductor assembly & test (OSAT) companies have accepted in the last few years. Players active in the RF applications market include IDM companies like Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics, as well as OSATs such as STATS ChipPAC, ASE, Amkor, and TSMC.
Orbbec’s Front 3D Depth Sensing System in the Oppo Find Xsystem_plus
The first introduction of Orbbec’s 3D front depth sensing system in a mobile application featuring a global shutter, a dot projector and a custom system-on-chip.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/orbbecs-front-3d-depth-sensing-system-in-the-oppo-find-x/
Samsung Galaxy S9+ Teardown and Identification of Key Components report publ...Yole Developpement
Discover Samsung’s key devices, advanced packaging technical choices and main suppliers.
More information on that report at https://www.i-micronews.com/report/product/samsung-galaxy-s9-teardown-and-identification-of-key-components.html
SCiO Molecular Sensor from Consumer Physics: Mobile Spectrometer Dongle - tea...Yole Developpement
The world’s first pocket-sized molecular sensor that can be integrated into consumer smartphones
For a long time, spectral analysis of materials has been limited to academic research. Everyday application of this type of analysis could bring new interactions in areas including food, fitness and medication. Starting with a crowdfunding campaign, and following the path of companies like FLIR, Consumer Physics, which was formerly Verifood Ltd., has created the first dongle molecular sensor, the SCiO Spectrometer. Thanks to big data and cloud technology, the dongle spectrometer claims to take the spectral fingerprint of any substance and quantify or identify any compound.
Consumer Physics is the first to bring spectrometry to consumers. Unlike other spectrometers, Consumer Physics produces a very simple package based on a tiny spectrometer head, with an area of 13 mm x 19 mm.
The SCiO Spectrometer integrates a 1.2 M pixel monochromatic CMOS image sensor from ON Semiconductor, a white LED from OSRAM and a bespoke filter/lens array. The LED is coupled to a reflector in the illumination module, which shines light on the analyzed substance, whose molecules absorb specific wavelengths. The received light in the spectrometer module is filtered and broken up into different wavelengths by the various lenses. Finally, the image sensor gives an instant response from the analyzed substance.
For more information please visit our website: http://www.i-micronews.com/reports.html
Deep analysis of the latest generation of under-display optical fingerprint sensors using micro-optics.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/goodixs-ultra-thin-optical-in-display-fingerprint/
Littelfuse and Monolith Semiconductors, in collaboration with X-Fab, have released a 1st-generation, high-reliability MOSFET with the hope of making this silicon carbide product mainstream.
The market outlook for SiC devices is promising, with a compound annual growth rate (CAGR) of 28% from 2016 – 2020. This will increase to 40% from 2020 – 2022 due to growth among automotive and industrial applications. In total, the SiC market will exceed $1B in 2022. In the energy conversion sector, SiC devices have an actual value of $250M, which will increase by around 28% in 2022. The reason for this relates to market forces pushing for loss reduction, not only for the sake of improved efficiency but also for smaller packages.
More information on that report a http://www.systemplus.fr/reverse-costing-reports/littelfuse-silicon-carbide-mosfet-lcis1mo120e0080-1200v-25a-80mohms/
Apple iPhone X Teardown and Identification of Key Components report 2018 pub...system_plus
The document provides an overview and summary of a teardown report for the Apple iPhone X conducted by System Plus Consulting. The report analyzed the iPhone X's key components, printed circuit boards, and identified over 50 integrated circuits. It included teardown photos, detailed component identification and descriptions, as well as summaries of the chipset breakdown by supplier, package type, and footprint. The teardown aimed to help identify manufacturers, packaging, and functions of the iPhone X's main integrated circuits.
Apple iPhone 7 Plus: Rear-Facing Dual Camera Module 2016 teardown reverse cos...Yole Developpement
With its choice of a dual camera, Apple’s innovations include new objectives lens assemblies, new bonding processes and a new type of autofocus
In the iPhone 7 Plus, Apple introduced a new rear camera module. Like its competitors LG and Huawei, they have chosen to integrate a dual camera. The module features two sensors, one closed to the sensor in the previous flagship, and another with a totally new structure.
Competition for the best camera phone was revived by Huawei with its flagship, the P9, using a dual camera. Like the other main players except Samsung, Apple has now introduced a dual camera module. This module integrates two 12 megapixel resolution CMOS Image Sensors (CISs) from Sony, using Exmor-RS Technology. The wide-angle objective lens assembly features an aperture of f/1.8 and a pixel size of 1.22 µm. The telephoto has a pixel size of 1 µm but a smaller aperture of f/2.8.
The iPhone 7 Plus dual camera module, with dimensions of 20.6 x 10.0 x 5.9 mm, is equipped with two sub-modules each including a Sony CIS. The wide-angle module is equipped with an optical image stabilization (OIS) voice coil motor (VCM), while the telephoto only comes with a general VCM. The CISs are assembled using a flip-chip process on a ceramic substrate with a gold stud bumping process.
With this new dual camera module and Sony’s Exmor-RS technology, Apple has innovated its offering in areas including phase detection autofocus (PDAF), its objective lens assembly structure, its sensor, and adopts a second generation of through-silicon vias (TSVs). Surprisingly both logic circuit sensors for controlling PDAF are very similar.
The report includes technology and cost analysis of the iPhone 7 Plus dual camera module. Also, comparisons with the Huawei P9, Samsung Galaxy S7 and iPhone 6S rear camera modules are provided. These comparisons highlight differences in structures, technical choices and manufacturing cost.
More information on that report at http://www.i-micronews.com/reports.html
First plasmonic filter sensor for consumer devices could disrupt optical applications.
The NSP32-V1 from NanoLambda is the world’s smallest optical spectrometer, and the first such device for Internet-of-Things and handheld devices. It could enable everyday analysis of food and water, color measurement, health monitoring and pollution detection. The data measured by the NSP32-V1 is the same output format as conventional optical spectrum analyzers, which facilitates the use of this device without creating a new database.
The NSP32-V1 spectrometer uses a 1024 pixel, 32 x 32, nano-optical filter array to measure the light spectrum, based on a technological breakthrough, the plasmonic filter. This is a metal film perforated with subwavelength hole arrays. It is manufactured within the metal layer of the silicon die, giving a monolithic solution.
The 100μm-high sensor die is assembled in an advanced ball grid array (BGA) package with an optical window for only 500μm height. The other optical parts, the lens and the diffuser, are assembled in a 5.7mm-high module. The module is very small overall, at just 6mm x 6mm x 5.3mm.
Based on a complete teardown analysis of the NSP32-V1 nano-spectrometer, the report provides a complete physical analysis and manufacturing cost estimate of the die and the packaging, including the lens module.
The report also includes a comparison between the characteristics of the NSP32-V1 and the SCIO molecular sensor from Consumer Physics. The comparison highlights differences in technical choices made by the companies and their impacts on the process flow and manufacturing cost.
More information on that report at http://www.i-micronews.com/reports.html
Oppo Find X Teardown and Identification of Key Componentssystem_plus
Discover key devices used by Oppo for its first European smartphone market entry.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/oppo-find-x-teardown-and-identification-of-key-components/
Touch screens displays semiconductor defense and consumer applications sapphi...Yole Developpement
Non substrate applications account for 25% of the US$1 billion sapphire industry. But emerging mobile phone applications could bring this total to more than $3 billion by 2018.
Display cover applications could more than triple the size of the industry within the next 5 years
Established applications could generate US$366 million in 2018. But adoption of sapphire for smartphone display covers could generate an additional $1.3 to $2.6 billion depending on the adoption scenario.
Sapphire is currently used in some exotic, luxury phones. However the sapphire price reduction combined with the massive adoption of touch screen in smartphones have stimulated the interest of cell phone OEMS for this material. Crystal growth equipment manufacturer GTAT is leading the charge and recently created a lot of buzz around this application and on the OEM front. Apple is rumored to have conducted an extended due diligence.
Adoption of sapphire in mobile display covers represents the single largest opportunity discussed in this report. It remains, however, uncertain. We see 4 major challenges: technology, supply chain, cost and market acceptance. Crystal growth and finishing technologies still need to be optimized in order to guarantee stable performance and reduce the price gap with chemically strengthened glass like Corning's Gorilla. We estimate that the current cost of manufacturing a sapphire display cover is around $22 but could drop to $12 and ultimately below $10. It remains to be seen if the Bill Of Material increase vs. the $3 glass display cover will be absorbed by the OEM in exchange for increased market share or if the consumer will value the increased durability brought in by the sapphire cover and accept paying a premium.
It is difficult to predict the success of sapphire in this application. However, we expect that some OEMs will probe the market and introduce some models featuring sapphire by late 2013 - early 2014. Initial customer reaction will have a strong influence on the future of the technology. If successful, strong market traction could ease the funding for the more than $1.5 billion in capex needed to serve this industry and set up the supply chain to serve this application.
Glass cover lens manufacturers might seize the opportunity. Because of their vast existing glass finishing capacity that could be converted to process sapphire and their privileged access to leading smartphone OEMs, those companies could beat established sapphire finishing companies into this market. However, another scenario would see collaborations between some leading sapphire and cover lens makers in order to pool technical knowledge, capacity and customer access under the push of some smartphone OEMs.
In any case, if this opportunity materializes, it will transform the sapphire industry with new players emerging...
More information at http://www.i-micronews.com/reports/Sapphire-Applications-Touch-screens-displays-semiconductor/3/372/
Status of the Power Electronics Industry 2017 Report by Yole Developpement Yole Developpement
Power devices fuel and enable industry mega trends reaching almost US$35B in 2022.
SOLAR AND ELECTRIC VEHICLE POWER CONVERTER MARKETS GREW SPECTACULARLY – BY MORE THAN 20% – LAST YEAR, DRIVING GROWTH IN THE EXPANDING IGBT MARKET
The power electronics sectors continue to expand their presence almost everywhere. Renewable energies and e-mobility, including electric and hybrid vehicles (EV/HEVs), are especially boosting this market. Both the solar and EV/HEV converter markets grew by over 20% between 2015 and 2016. At the semiconductor level, the power semiconductor market grew by 3.8% compared to 2015. This year, Yole Développement has enlarged its power semiconductor market analysis to all types of power integrated circuits (ICs) including power management ICs, linear regulators and switching regulators, representing a total market of $28B. Among all the different types of power devices including thyristors, MOSFETs, IGBTs and power ICs, IGBTs made the greatest progress, with around 8% growth.
Yole Développement’s decision to start analyzing the power IC market evolution closely is part of an effort to cover the whole power spectrum of this market. We now encompass the complete range from low power, low voltage, highly integrated power management ICs in mobile phones to more robust, high power IGCT modules used in trains.
The report also covers the fast-emerging wide band gap (WBG) semiconductor market, identifying today and tomorrow’s leading silicon carbide (SiC) and gallium nitride (GaN) players and the key technological details. ‘Status of Power Electronics Industry 2017 (SPEI 2017)’ describes the evolution and forecasts the future of the power inverter, power device and silicon wafer markets.
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
Comparison of main players AP: Apple A10 with inFO vs. Qualcomm Snapdragon 820 with MCeP packaging technology vs. HiSilicon Kirin 955 & Samsung Exynos 8 with standard Package-on-Package
Five major players are sharing the smartphone application processors (AP) market. Among them, Qualcomm, Apple, Samsung and HiSilicon propose the most powerful AP. They use almost the same technology node for the die, and the innovation is now at the packaging level. During this year, we observed different technologies inside the four main smartphone flagships: classic Package-on-Package (PoP) developed by Amkor for the Kirin 955 and for the Exynos 8, Molded Core Embedded Package (MCeP) technology developed by Shinko for the Snapdragon 820 and integrated Fan-Out packaging (inFO) developed by TSMC for the A10.
Located under the DRAM chip on the main board, the AP are packaged using PoP technology. The Apple A10 can be found in the iPhone 7 series. The HiSilicon Kirin 955 can be found in the Huawei P9 and the Samsung Exynos 8 as the Qualcomm Snapdragon 820 can be found in the Samsung Galaxy S7 series depending on the world version (US and Asia for the Snapdragon and International for the Exynos).
In this report, we highlight the differences and the innovations of the packages chosen by the end-user OEMs. Whereas some AP providers like for HiSilicon or Samsung choose to consider conventional PoP with embedded land-side capacitor (LSC), others like Apple or Qualcomm use innovative technologies like Fan-Out PoP and silicon based Deep Trench LSC or embedded die packaging with advanced PCB substrate. The detailed comparison between the four players will give the pros and the cons of the packaging technologies.
This report also compares the costs of the different approaches and includes a detailed technical comparison between the packaging structure of the Qualcomm Snapdragon 820, the Samsung Exynos 8, the HiSilicon Kirin 955 and the Apple A10.
More information on: http://www.i-micronews.com/reports.html
Fingerprint Cards’ FPC1268 in the Huawei Mate 9 Pro & P10 series 2017 teardow...Yole Developpement
This report analyzes FPC's FPC1268 fingerprint sensor used in the Huawei Mate 9 Pro and P10 smartphones. It provides a teardown of the sensor package, including photos of the sensor and ASIC dies. The report details the manufacturing processes for the sensor and ASIC, from wafer fabrication to packaging. It estimates the costs for materials and manufacturing steps. Comparisons are made to FPC's previous FPC1025 sensor and Qualcomm's ultrasonic fingerprint sensor. This is the first capacitive fingerprint sensor successfully integrated under a glass cover, in a collaboration between FPC and TPK.
Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing ...Yole Developpement
A look into Texas Instruments’ system-on-chip, including Sony/Softkinetic’s time-of-flight pixel technology, for industrial applications
Today, Time-of-Flight (ToF) systems are among the most innovative technologies offering imaging companies an opportunity to lead the market. Every major player wants to integrate these devices to provide functions such as 3D imaging, proximity sensing, ambient light sensing and gesture recognition.
Sony/Softkinetic has been investigating this technology deeply, providing a unique pixel technology to several image sensor manufacturers in three application areas: consumer, automotive and industrial. For industrial applications, Sony/Softkinetic has licensed its technology to Texas Instruments, which is providing ToF imagers for human detection or robot-human interaction.
The OPT8241 3D ToF imager is packaged using Chip-On-Glass (COG) technology. The device comprises a system-on-chip (SoC) and glass filter in the same component in thin, 0.7 mm-thick, packaging.
This report analyzes the complete component, from the glass near-infrared band-pass filter to the collector based on ToF pixel licenses developed by Sony/Softkinetic and adapted by Texas Instruments. The report includes a complete cost analysis and price estimation of the device based on a detailed description of the package, and the ToF imager.
It also features a complete ToF pixel technology comparison with the Infineon/pmd, STMicroelectronics and Melexis automotive ToF imagers, which are all also based on Sony/Softkinetic technology, with details on the companies’ design choices.
More information on that report at http://www.i-micronews.com/reports.html
Mantis Vision’s 3D Depth Sensing System in the Xiaomi Mi8 Explorer Editionsystem_plus
The first introduction of Mantis Vision’s technology into a mobile application, featuring coded structured light.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/mantis-visions-3d-depth-sensing-system-in-the-xiaomi-mi8-explorer-edition/
ams’ Multi-Spectral Sensor in the Apple iPhone X 2017 teardown reverse costi...system_plus
The most advanced multispectral 6-channel ambient light sensor, supplied and produced by ams for its biggest customer, Apple.
For the semiconductor industry, the smartphone is a gold mine. Each component inside every OEM’s flagship phone holds substantial value for the component supplier, which sometimes gains a significant portion of the phone’s sales revenue too. Apple is one of the major OEMs that every supplier fights to work with, and for many years ams AG has been the world’s leading ambient light sensor (ALS) producer, due to its presence in every Apple iPhone.
Physical analysis and cost comparison of seven leading flagship smartphone cameras: Apple iPhone X/XS/XR, Samsung Galaxy S9, Huawei Mate 20 Pro and P20 Pro, Xiaomi Mi8 Explorer Edition, Oppo Find X and Vivo X21UD.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/mobile-camera-module-comparison-2019/
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...Yole Developpement
Infrared camera and electronic control unit for advanced driver assistance systems based on FLIR night vision imaging technology
Based on a high definition ISC0901 microbolometer from FLIR, the Autoliv night vision infrared camera targets the high-end automotive market using two FLIR cores. Based on the solid first design from 2009, the microbolometer offers better performance in definition and frame rate. The camera also embraces the quality approach with a complex optical system and powers its night vision using sophisticated numerical processing based on an Altera field-programmable gate array (FPGA) and custom algorithm.
The Autoliv night vision camera consists of two modules, the camera and a remote processing unit. The system is made very compact and easy to integrate for car makers.
The ISC0901 thermal camera uses FLIR’s 17µm pixel design, optimized for automotive applications. Based on vanadium oxide technology, the ISC0901 microbolometer features a 336x256 resolution wafer level package, achieving an incredibly compact design.
The ISC0901 is the automotive version of a surveillance microbolometer. By using wafer level package technology to encapsulate the microbolometer FLIR offers the best price performance ratio.
This report is divided into two parts, one focused on the microbolometer and the second on the other systems. It is based on a complete teardown analysis of the night vision camera and the associated electronic control unit. Using this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR ISC0901, FLIR Lepton 3 and the PICO384P from ULIS. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
Technical and cost overview of the evolution of radio frequency front-end module technologies integrated in 5G mmWave and Sub-6 GHz Phones.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-2-focus-on-5g-chipset/
An ultrasonic sensor in a compact housing, with 20-450cm detection range.
Ultrasonic transducers are used in vehicles as parking assistance. The ultrasonic transducer sends out short ultrasonic impulses which are reflected by barriers. The echo signals are registered by the sensor and are evaluated by a central control unit.
This ultrasonic parking sensor from Bosch is very compact with its very few components meaning it is manufactured at low cost. The sensor is made with one electronic board, including a Bosch transceiver integrated circuit (IC) that drives the output of the Epcos/TDK transformer and evaluates the reflected signal. The transducer itself is made of a lead zirconate titanate (PZT) membrane and silver electrodes.
More information on that report at http://www.i-micronews.com/reports.html
Technology and cost review of nine RF IPD found on the market from different suppliers: Broadcom, IPDiA, Murata, Qorvo, Skyworks and STMicroelectronics.
With integrated passive devices (IPD) accounting for almost 70 % of the PCB area in smartphones, integration is a challenge that several integrated device manufacturers (IDM) and outsourced semiconductor assembly & test (OSAT) companies have accepted in the last few years. Players active in the RF applications market include IDM companies like Qorvo, Skyworks, Murata, Broadcom, and STMicroelectronics, as well as OSATs such as STATS ChipPAC, ASE, Amkor, and TSMC.
Orbbec’s Front 3D Depth Sensing System in the Oppo Find Xsystem_plus
The first introduction of Orbbec’s 3D front depth sensing system in a mobile application featuring a global shutter, a dot projector and a custom system-on-chip.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/orbbecs-front-3d-depth-sensing-system-in-the-oppo-find-x/
Samsung Galaxy S9+ Teardown and Identification of Key Components report publ...Yole Developpement
Discover Samsung’s key devices, advanced packaging technical choices and main suppliers.
More information on that report at https://www.i-micronews.com/report/product/samsung-galaxy-s9-teardown-and-identification-of-key-components.html
SCiO Molecular Sensor from Consumer Physics: Mobile Spectrometer Dongle - tea...Yole Developpement
The world’s first pocket-sized molecular sensor that can be integrated into consumer smartphones
For a long time, spectral analysis of materials has been limited to academic research. Everyday application of this type of analysis could bring new interactions in areas including food, fitness and medication. Starting with a crowdfunding campaign, and following the path of companies like FLIR, Consumer Physics, which was formerly Verifood Ltd., has created the first dongle molecular sensor, the SCiO Spectrometer. Thanks to big data and cloud technology, the dongle spectrometer claims to take the spectral fingerprint of any substance and quantify or identify any compound.
Consumer Physics is the first to bring spectrometry to consumers. Unlike other spectrometers, Consumer Physics produces a very simple package based on a tiny spectrometer head, with an area of 13 mm x 19 mm.
The SCiO Spectrometer integrates a 1.2 M pixel monochromatic CMOS image sensor from ON Semiconductor, a white LED from OSRAM and a bespoke filter/lens array. The LED is coupled to a reflector in the illumination module, which shines light on the analyzed substance, whose molecules absorb specific wavelengths. The received light in the spectrometer module is filtered and broken up into different wavelengths by the various lenses. Finally, the image sensor gives an instant response from the analyzed substance.
For more information please visit our website: http://www.i-micronews.com/reports.html
Deep analysis of the latest generation of under-display optical fingerprint sensors using micro-optics.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/goodixs-ultra-thin-optical-in-display-fingerprint/
Littelfuse and Monolith Semiconductors, in collaboration with X-Fab, have released a 1st-generation, high-reliability MOSFET with the hope of making this silicon carbide product mainstream.
The market outlook for SiC devices is promising, with a compound annual growth rate (CAGR) of 28% from 2016 – 2020. This will increase to 40% from 2020 – 2022 due to growth among automotive and industrial applications. In total, the SiC market will exceed $1B in 2022. In the energy conversion sector, SiC devices have an actual value of $250M, which will increase by around 28% in 2022. The reason for this relates to market forces pushing for loss reduction, not only for the sake of improved efficiency but also for smaller packages.
More information on that report a http://www.systemplus.fr/reverse-costing-reports/littelfuse-silicon-carbide-mosfet-lcis1mo120e0080-1200v-25a-80mohms/
Apple iPhone X Teardown and Identification of Key Components report 2018 pub...system_plus
The document provides an overview and summary of a teardown report for the Apple iPhone X conducted by System Plus Consulting. The report analyzed the iPhone X's key components, printed circuit boards, and identified over 50 integrated circuits. It included teardown photos, detailed component identification and descriptions, as well as summaries of the chipset breakdown by supplier, package type, and footprint. The teardown aimed to help identify manufacturers, packaging, and functions of the iPhone X's main integrated circuits.
Apple iPhone 7 Plus: Rear-Facing Dual Camera Module 2016 teardown reverse cos...Yole Developpement
With its choice of a dual camera, Apple’s innovations include new objectives lens assemblies, new bonding processes and a new type of autofocus
In the iPhone 7 Plus, Apple introduced a new rear camera module. Like its competitors LG and Huawei, they have chosen to integrate a dual camera. The module features two sensors, one closed to the sensor in the previous flagship, and another with a totally new structure.
Competition for the best camera phone was revived by Huawei with its flagship, the P9, using a dual camera. Like the other main players except Samsung, Apple has now introduced a dual camera module. This module integrates two 12 megapixel resolution CMOS Image Sensors (CISs) from Sony, using Exmor-RS Technology. The wide-angle objective lens assembly features an aperture of f/1.8 and a pixel size of 1.22 µm. The telephoto has a pixel size of 1 µm but a smaller aperture of f/2.8.
The iPhone 7 Plus dual camera module, with dimensions of 20.6 x 10.0 x 5.9 mm, is equipped with two sub-modules each including a Sony CIS. The wide-angle module is equipped with an optical image stabilization (OIS) voice coil motor (VCM), while the telephoto only comes with a general VCM. The CISs are assembled using a flip-chip process on a ceramic substrate with a gold stud bumping process.
With this new dual camera module and Sony’s Exmor-RS technology, Apple has innovated its offering in areas including phase detection autofocus (PDAF), its objective lens assembly structure, its sensor, and adopts a second generation of through-silicon vias (TSVs). Surprisingly both logic circuit sensors for controlling PDAF are very similar.
The report includes technology and cost analysis of the iPhone 7 Plus dual camera module. Also, comparisons with the Huawei P9, Samsung Galaxy S7 and iPhone 6S rear camera modules are provided. These comparisons highlight differences in structures, technical choices and manufacturing cost.
More information on that report at http://www.i-micronews.com/reports.html
First plasmonic filter sensor for consumer devices could disrupt optical applications.
The NSP32-V1 from NanoLambda is the world’s smallest optical spectrometer, and the first such device for Internet-of-Things and handheld devices. It could enable everyday analysis of food and water, color measurement, health monitoring and pollution detection. The data measured by the NSP32-V1 is the same output format as conventional optical spectrum analyzers, which facilitates the use of this device without creating a new database.
The NSP32-V1 spectrometer uses a 1024 pixel, 32 x 32, nano-optical filter array to measure the light spectrum, based on a technological breakthrough, the plasmonic filter. This is a metal film perforated with subwavelength hole arrays. It is manufactured within the metal layer of the silicon die, giving a monolithic solution.
The 100μm-high sensor die is assembled in an advanced ball grid array (BGA) package with an optical window for only 500μm height. The other optical parts, the lens and the diffuser, are assembled in a 5.7mm-high module. The module is very small overall, at just 6mm x 6mm x 5.3mm.
Based on a complete teardown analysis of the NSP32-V1 nano-spectrometer, the report provides a complete physical analysis and manufacturing cost estimate of the die and the packaging, including the lens module.
The report also includes a comparison between the characteristics of the NSP32-V1 and the SCIO molecular sensor from Consumer Physics. The comparison highlights differences in technical choices made by the companies and their impacts on the process flow and manufacturing cost.
More information on that report at http://www.i-micronews.com/reports.html
Oppo Find X Teardown and Identification of Key Componentssystem_plus
Discover key devices used by Oppo for its first European smartphone market entry.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/oppo-find-x-teardown-and-identification-of-key-components/
Touch screens displays semiconductor defense and consumer applications sapphi...Yole Developpement
Non substrate applications account for 25% of the US$1 billion sapphire industry. But emerging mobile phone applications could bring this total to more than $3 billion by 2018.
Display cover applications could more than triple the size of the industry within the next 5 years
Established applications could generate US$366 million in 2018. But adoption of sapphire for smartphone display covers could generate an additional $1.3 to $2.6 billion depending on the adoption scenario.
Sapphire is currently used in some exotic, luxury phones. However the sapphire price reduction combined with the massive adoption of touch screen in smartphones have stimulated the interest of cell phone OEMS for this material. Crystal growth equipment manufacturer GTAT is leading the charge and recently created a lot of buzz around this application and on the OEM front. Apple is rumored to have conducted an extended due diligence.
Adoption of sapphire in mobile display covers represents the single largest opportunity discussed in this report. It remains, however, uncertain. We see 4 major challenges: technology, supply chain, cost and market acceptance. Crystal growth and finishing technologies still need to be optimized in order to guarantee stable performance and reduce the price gap with chemically strengthened glass like Corning's Gorilla. We estimate that the current cost of manufacturing a sapphire display cover is around $22 but could drop to $12 and ultimately below $10. It remains to be seen if the Bill Of Material increase vs. the $3 glass display cover will be absorbed by the OEM in exchange for increased market share or if the consumer will value the increased durability brought in by the sapphire cover and accept paying a premium.
It is difficult to predict the success of sapphire in this application. However, we expect that some OEMs will probe the market and introduce some models featuring sapphire by late 2013 - early 2014. Initial customer reaction will have a strong influence on the future of the technology. If successful, strong market traction could ease the funding for the more than $1.5 billion in capex needed to serve this industry and set up the supply chain to serve this application.
Glass cover lens manufacturers might seize the opportunity. Because of their vast existing glass finishing capacity that could be converted to process sapphire and their privileged access to leading smartphone OEMs, those companies could beat established sapphire finishing companies into this market. However, another scenario would see collaborations between some leading sapphire and cover lens makers in order to pool technical knowledge, capacity and customer access under the push of some smartphone OEMs.
In any case, if this opportunity materializes, it will transform the sapphire industry with new players emerging...
More information at http://www.i-micronews.com/reports/Sapphire-Applications-Touch-screens-displays-semiconductor/3/372/
Status of the Power Electronics Industry 2017 Report by Yole Developpement Yole Developpement
Power devices fuel and enable industry mega trends reaching almost US$35B in 2022.
SOLAR AND ELECTRIC VEHICLE POWER CONVERTER MARKETS GREW SPECTACULARLY – BY MORE THAN 20% – LAST YEAR, DRIVING GROWTH IN THE EXPANDING IGBT MARKET
The power electronics sectors continue to expand their presence almost everywhere. Renewable energies and e-mobility, including electric and hybrid vehicles (EV/HEVs), are especially boosting this market. Both the solar and EV/HEV converter markets grew by over 20% between 2015 and 2016. At the semiconductor level, the power semiconductor market grew by 3.8% compared to 2015. This year, Yole Développement has enlarged its power semiconductor market analysis to all types of power integrated circuits (ICs) including power management ICs, linear regulators and switching regulators, representing a total market of $28B. Among all the different types of power devices including thyristors, MOSFETs, IGBTs and power ICs, IGBTs made the greatest progress, with around 8% growth.
Yole Développement’s decision to start analyzing the power IC market evolution closely is part of an effort to cover the whole power spectrum of this market. We now encompass the complete range from low power, low voltage, highly integrated power management ICs in mobile phones to more robust, high power IGCT modules used in trains.
The report also covers the fast-emerging wide band gap (WBG) semiconductor market, identifying today and tomorrow’s leading silicon carbide (SiC) and gallium nitride (GaN) players and the key technological details. ‘Status of Power Electronics Industry 2017 (SPEI 2017)’ describes the evolution and forecasts the future of the power inverter, power device and silicon wafer markets.
3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update -...Yole Developpement
3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.
TSVs have been adopted for MEMS, Sensors, and Memory devices. What will the next technology driver be?
Through-silicon vias (TSVs) have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CMOS image sensors (CIS), MEMS, sensors, and radio frequency (RF) filters. In the near future they will also enable photonics and LED function integration. The market for 3D TSV and 2.5D interconnect is expected to reach around two million wafers in 2020, expanding at a 22% compound annual growth rate (CAGR). The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.
CIS still commanded more than 70% % share of TSV market wafer volume in 2015, although this will decrease to around 60% by 2020. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors (FPS). However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 30% of CIS production by 2020. The TSV markets for RF filters and FPS are expected to reach around $1.6B and $0.5B by 2020 respectively. The report will explain the market’s dynamics and give an overview of all segments and key markets. It will also provide market data in terms of revenues, units and wafer starts for all the different segments, including market share.
Comparison of main players AP: Apple A10 with inFO vs. Qualcomm Snapdragon 820 with MCeP packaging technology vs. HiSilicon Kirin 955 & Samsung Exynos 8 with standard Package-on-Package
Five major players are sharing the smartphone application processors (AP) market. Among them, Qualcomm, Apple, Samsung and HiSilicon propose the most powerful AP. They use almost the same technology node for the die, and the innovation is now at the packaging level. During this year, we observed different technologies inside the four main smartphone flagships: classic Package-on-Package (PoP) developed by Amkor for the Kirin 955 and for the Exynos 8, Molded Core Embedded Package (MCeP) technology developed by Shinko for the Snapdragon 820 and integrated Fan-Out packaging (inFO) developed by TSMC for the A10.
Located under the DRAM chip on the main board, the AP are packaged using PoP technology. The Apple A10 can be found in the iPhone 7 series. The HiSilicon Kirin 955 can be found in the Huawei P9 and the Samsung Exynos 8 as the Qualcomm Snapdragon 820 can be found in the Samsung Galaxy S7 series depending on the world version (US and Asia for the Snapdragon and International for the Exynos).
In this report, we highlight the differences and the innovations of the packages chosen by the end-user OEMs. Whereas some AP providers like for HiSilicon or Samsung choose to consider conventional PoP with embedded land-side capacitor (LSC), others like Apple or Qualcomm use innovative technologies like Fan-Out PoP and silicon based Deep Trench LSC or embedded die packaging with advanced PCB substrate. The detailed comparison between the four players will give the pros and the cons of the packaging technologies.
This report also compares the costs of the different approaches and includes a detailed technical comparison between the packaging structure of the Qualcomm Snapdragon 820, the Samsung Exynos 8, the HiSilicon Kirin 955 and the Apple A10.
More information on: http://www.i-micronews.com/reports.html
Fingerprint Cards’ FPC1268 in the Huawei Mate 9 Pro & P10 series 2017 teardow...Yole Developpement
This report analyzes FPC's FPC1268 fingerprint sensor used in the Huawei Mate 9 Pro and P10 smartphones. It provides a teardown of the sensor package, including photos of the sensor and ASIC dies. The report details the manufacturing processes for the sensor and ASIC, from wafer fabrication to packaging. It estimates the costs for materials and manufacturing steps. Comparisons are made to FPC's previous FPC1025 sensor and Qualcomm's ultrasonic fingerprint sensor. This is the first capacitive fingerprint sensor successfully integrated under a glass cover, in a collaboration between FPC and TPK.
Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing ...Yole Developpement
A look into Texas Instruments’ system-on-chip, including Sony/Softkinetic’s time-of-flight pixel technology, for industrial applications
Today, Time-of-Flight (ToF) systems are among the most innovative technologies offering imaging companies an opportunity to lead the market. Every major player wants to integrate these devices to provide functions such as 3D imaging, proximity sensing, ambient light sensing and gesture recognition.
Sony/Softkinetic has been investigating this technology deeply, providing a unique pixel technology to several image sensor manufacturers in three application areas: consumer, automotive and industrial. For industrial applications, Sony/Softkinetic has licensed its technology to Texas Instruments, which is providing ToF imagers for human detection or robot-human interaction.
The OPT8241 3D ToF imager is packaged using Chip-On-Glass (COG) technology. The device comprises a system-on-chip (SoC) and glass filter in the same component in thin, 0.7 mm-thick, packaging.
This report analyzes the complete component, from the glass near-infrared band-pass filter to the collector based on ToF pixel licenses developed by Sony/Softkinetic and adapted by Texas Instruments. The report includes a complete cost analysis and price estimation of the device based on a detailed description of the package, and the ToF imager.
It also features a complete ToF pixel technology comparison with the Infineon/pmd, STMicroelectronics and Melexis automotive ToF imagers, which are all also based on Sony/Softkinetic technology, with details on the companies’ design choices.
More information on that report at http://www.i-micronews.com/reports.html
SiGe based millimeter-wave chipset commercially available for
backhaul applications with beamforming capability.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/peraso-x710-chipset-60ghz-outdoor-wireless-broadband-solution/
FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...Yole Developpement
An infrared camera with a powerful vision processor in a small package, using a new 12μm microbolometer.
Based on a high definition ISC1406L micro-bolometer, the FLIR Boson thermal camera aims at a wide range of markets: military, drones, automotive, security and firefighting. Thanks to sound technological and economic choices, the microbolometer offers very good performance in definition and frame rate at low cost. The camera core’s economical approach involves new lens technology and sophisticated vision processing from Intel/Movidius to power its infrared vision.
The FLIR Boson camera core occupies only 4.9cm3 without its lens, including a 320x256 pixel microbolometer and an advanced processor. The system is made very compact and easy for integrators to handle. It includes a new chalcogenide glass for the lens and a powerful Vision Processing Unit for the first time.
More information on that report at http://www.i-micronews.com/reports.html
Broadcom AFEM-8072 – Mid and High Band LTE RF Front-End Module (FEM) - teardo...system_plus
The first mid/high band Long Term Evolution (LTE) Radio Frequency (RF) FEM in the Apple iPhone X integrates the latest generation of Film Bulk Acoustic Resonator (FBAR) technology with advanced and innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8072-mid-and-high-band-lte-rf-front-end-module-fem/
2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...Yole Developpement
Complete reports and comparison of the latest generation products for smartphones from the leading optical image stabilization gyro players.
2-Axis Gyroscopes for Optical Image Stabilization (OIS) constitute a market where 123 million units were shipped in 2015, according to Yole Développement. This market originates only from high-end smartphones and two players share most of it: InvenSense, with 49%, and STMicroelectronics, with 39%.
The 2-axis gyroscopes are located inside the camera module of high-end smartphones. The main constraints are a small footprint and, more importantly, thinness.
Previously, thickness was the same as standard land grid array (LGA) or quad flat no-leads (QFN) package, close to 1mm. Now the standard is 0.65mm, which products from both InvenSense and STMicroelectronics attain.
InvenSense was first, with the IDG-2030, a 2.3x2.3x0.65mm gyroscope, which is still the smallest on the market. Since its introduction we found it in several smartphones from various manufacturers. The IDG-2030 uses the same Nasiri platform as other InvenSense inertial devices, with wafer-level integration of the MEMS sensor on top of the application specific integrated circuit (ASIC), thus providing only one die in the final LGA package.
Months later, STMicroelectronics released the L2G2IS, which shares the same dimensions. The device is manufactured using the same THELMA process as all STMicroelectronics inertial devices. The THELMA platform involves a two-die approach that is challenging for very thin package integration. However, both players now offer very low-cost gyros thanks to die size reduction and process optimization.
Both gyroscopes analyzed are 2-axis X, Y (Pitch, Roll). The two reports can be purchased separately or together in order to compare the technology and pricing of the main smartphone OIS gyro players, including previous generation products.
More information on that report at http://www.i-micronews.com/reports.html
World’s first 76-81 GHz automotive single-chip radar in a System-on-Chip device with integrated Antenna-in-Package using Fan-Out packaging technology.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/mediatek-autus-r10-mt2706-77-79-ghz-ewlbaip-radar-chipset/
MEMS Fabry-Perot interferometer in a very tiny NIR spectrometer.
More information: https://www.systemplus.fr/reverse-costing-reports/spectral-engines-nirone-sensor-x/
Deep analysis of the 400Gb optical transceiver from a leading Chinese company.
More information: https://www.systemplus.fr/reverse-costing-reports/innolights-400g-qsfp-dd-optical-transceiver/
Sensirion SGP30 Gas Sensor 2018 - teardown reverse costing report published b...system_plus
The first monolithic multi-gas sensor from Sensirion, with a unique and innovative design using metal oxide technology.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/sgp30-gas-sensor-from-sensirion/
Sensirion, a leading manufacturer of digital microsensors and systems, recently released a gas sensor designed for consumer and appliance applications: the SGP30 Multi-Pixel. The SGP30 gas sensor is a new kind of sensor which measures different gas types in any environment. With a DFN package volume under 5.5 mm3, this gas sensor can be embedded in a variety of low-power systems, including smartphones, tablets, and laptops.
The document provides a full reverse costing analysis of the Hamamatsu C12880MA microspectrometer. It includes a physical analysis of the package, reflective grating, image sensor, and die cross-section. The manufacturing process flow is examined, covering the front-end IC process, wafer fabrication, sensor layers process, grating process, and packaging. A cost analysis is presented for the front-end, image sensor die, grating, packaging, and total component cost. The report also provides a selling price analysis and compares the C12880MA to other spectrometer technologies.
The first UVA/UVB light sensor using innovative resin and very compact package from Capella, Samsung’s top light sensor supplier.
Historically known for its technological capabilities in optoelectronics and recently acquired by Vishay Intertechnology ($205M), Capella releases its integrated UV Sensor based on Filtron™ technology to provide accurate UVA/UVB light sensing.
Apple and Samsung are the first customer of this type of device.
The CM3512 is an UV sensor equipped with photodiode, amplifiers, and analog/digital circuits into a single chip. It is designed by CMOS process and has I2C protocol interface. The use of PCB substrate enables a very compact package.
Compared with state of the art UV Sensors supplied by Rohm Semiconductor and Silicon Labs, the new design developed by Capella is based on patented Filtron™ Technology resin which offers reliable light-filtering capabilities into a variety of polymeric substrates.
Assembled in a OPLGA 2.35 x 1.8 x 1.0mm package, the CM3512 is an advanced sensitivity UV sensor targeted for consumers applications.
More information on that report athttp://www.i-micronews.com/reports/Capella-Microsystems-CM3512-Ultraviolet-Light-Sensor/1/453/
Tiny MEMS digital barometer for smartphones and wearables
The first barometric sensor from Infineon for the consumer market is targeting altitude, GPS, indoor and weather forecasting applications in portable devices. This MEMS sensor positions Infineon to compete with STMicroelectronics and Bosch Sensortec.
Infineon’s DPS310 pressure-sensing device is manufactured using a proprietary MEMS technology developed for and already sold for several years in the automotive market. The sensing element in the DPS310 is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is very small compared to traditional silicon micro-machined membranes. Moreover, Infineon has developed a capacitive sensor to be more accurate and less sensitive to temperature change compared to piezoresistive solutions.
For the DPS310, Infineon has introduced two important innovations. The first is a two-die solution more scalable than the monolithic solution used for some automotive pressure sensors.
The second innovation is a plastic metallized lid to replace the classic metal lid. The device comes in a tiny 2x2.5x0.9mm HLGA molded package.
The report presents a detailed analysis of the sensor’s structure and cost. Comparison with the characteristics of the STMicroelectronics pressure sensor LPS22HB and the Bosch Sensortec BMP280 highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Editionsystem_plus
This document provides an analysis of Qualcomm's WiGig 60 GHz chipset for smartphones. It includes a physical analysis of the module and its two System-in-Package (SiP) components - a baseband SiP integrated on the main board and an antenna SiP featuring integrated antennae on an organic PCB. Both SiPs use a non-conventional double-sided molded packaging. The physical analysis examines the SiP and antenna board structures in detail. The document also provides a manufacturing process flow, cost analysis, and estimated selling price for the WiGig chipset solution.
Analog Devices ADIS16460 6-axis MEMS Inertial Sensorsystem_plus
High precision 6-Axis Inertial Measurement Unit for industrial and harsh environments.
More information on that report at: http://www.systemplus.fr/fr/reverse-costing-reports/analog-devices-adis16460-6-axis-mems-inertial-sensor/
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Seriessystem_plus
This document provides a reverse costing analysis of the Broadcom AFEM-8100 SiP used in the Apple iPhone 11 series. It includes a physical analysis of the module and its dies, as well as a manufacturing process flow and cost analysis. Broadcom remains the sole supplier of the multi-die module, which features power amplifier, switch, filter and other dies. The analysis finds innovations that reduce the package size and cost, including a new EMI shielding integration method.
The first high reliability and highly rugged 9-axis IMU for industrial applications from Honeywell.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/honeywell-hg1120ca50-9-axis-mems-inertial-sensor/
ams’s Color Sensor in the Apple iPhone 8 2018 teardown reverse costing report...Yole Developpement
A next-generation sensor with organic color filters, more photodiodes, and infrared detection.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/amss-color-sensor-in-the-apple-iphone-8/
Discover Axis’s high-end product integrating its latest ARTPEC-7 in-house system-on-chip dedicated to network video and machine learning capabilities.
More information : https://www.systemplus.fr/reverse-costing-reports/axis-p1375-e-network-camera/
Thermo Fisher Ion 520 DNA Sequencing Chip 2017 teardown reverse costing repor...Yole Developpement
Next generation of silicon/polymer microfluidic technology for fast throughput DNA sequencing from Thermo Fisher Ion Torrent®
Today a main challenge in life science research is to reduce the price of genomic analysis, and the time taken to do it. Back in 2003, the cost of sequencing the human genome was almost $3B. That decreased to $10,000 in 2011, and is headed towards $1,000 in the next few years.
Thermo Fisher, with 8% of the microfluidic product market, is one of the companies most involved in sequencing applications, along with its rival Illumina. However, the two companies have different objectives.
Thermo Fisher intends to reduce analysis time with fast throughput and short single-end reads. Illumina has high throughput with short paired reads. To deliver fast reading, Thermo Fisher uses Ion Torrent® technology, which relies on technology similar to an image sensor.
The innovative Ion 520 DNA sequencing chip uses this Ion Torrent technology. It includes a multiwell array, which captures the sphere particles that have DNA attached. The particles react with a solution of nucleotides, which changes the charge in the wells, which in turn is detected by the circuit and allows the DNA sequencing.
More information on that report at http://www.i-micronews.com/reports.html
Similar to STMicroelectronics Proximity & Flood Illuminator in the Apple iPhone X - reverse costing report published by System Plus (20)
This document provides an analysis of Tesla's UBQ01B0 chip used for full self-driving capabilities. It includes a physical analysis of the die and packaging, an overview of the manufacturing process, and a cost analysis. The chip is a system-on-chip designed and produced by Tesla to power its driver-assist and autonomous driving features. It utilizes quad-core ARM processors alongside a GPU and NPU for processing sensor data and neural network operations. The analysis examines the chip's design and architecture at the physical, manufacturing, and cost levels.
SPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE Invertersystem_plus
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/vitesco-technologies-power-module-in-jaguar-i-pace-inverter/
Technical and cost overview of the evolution of the radio frequency front-end module technologies integrated in the Apple iPhone series from 2016 - 2020.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-1-focus-on-apple/
Deep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.
More information : https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8200-pamid-in-the-apple-iphone-12-series/
Apple iPhone 12 series mmWave 5G Chipset and Antennasystem_plus
A study of the complete first generation of the 5G millimeter-wave chipset for Apple’s phones including custom antenna, front-end module and antenna-on-package.
More information : https://www.systemplus.fr/reverse-costing-reports/apple-iphone-12-series-mmwave-5g-chipset-and-antenna/
This document provides an overview of NVIDIA's new A100 Ampere GPU. Some key points:
- It uses TSMC's 7nm process and CoWoS packaging to integrate over 6,000mm2 of silicon onto a single 55mm x 55mm package.
- It features a 7nm GPU die with 54 billion transistors and 40/80GB of HBM2 memory in a 3D stacked configuration connected via microbumps and TSVs.
- The report includes a physical analysis of the package, dies, and assembly, as well as a cost analysis and estimated price. It finds the A100 provides significantly higher performance than previous generations like the V100.
EPC’s 70 V ePower stage with separate and independent high and low side control inputs.
More information: https://www.systemplus.fr/reverse-costing-reports/epc2152-half-bridge-monolithic-gan-ic/
Microsoft - Holographic Lens from Hololens 2system_plus
See-through holographic display for mixed reality smartglasses.
More on : https://www.systemplus.fr/reverse-costing-reports/microsoft-holographic-lens-from-hololens-2/
Cost-effective 1 mm2 miniature camera with customizable wafer-level optics for endoscopy and novel medical imaging devices.
More information : https://www.systemplus.fr/reverse-costing-reports/ams-naneye-mini-camera/
Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1)system_plus
Dig deep into Hikvision’s AI-powered thermal network camera for security applications.
More information: https://www.systemplus.fr/reverse-costing-reports/hikvision-intelligent-thermal-network-camera-ds-2td2166-15-v1/
The first 600V system-in-package half-bridge driver from STMicroelectronics integrating two GaN-based HEMTs.
More information: https://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-mastergan1-half-bridge-driver/
Physical and cost analysis of Micron’s fifth-generation low-power DRAM memory.
More information: https://www.systemplus.fr/reverse-costing-reports/micron-lpddr5-12gb-mobile-memory/
This report analyzes Samsung's 12GB LPDDR5 mobile memory. It includes a full physical analysis of the memory package and die. High resolution images show the die, DRAM cells, and cross-sections. The manufacturing process flow and cost analysis are used to estimate production costs. The component cost includes die manufacturing, packaging, and testing. A comparison is made between LPDDR4 and LPDDR5 physical characteristics and manufacturing processes. This report provides a comprehensive technical and cost analysis of Samsung's latest low power DRAM technology.
Safran Colibrys MS1010 and MEMSIC MXA2500M High-End Accelerometerssystem_plus
Detailed technology and cost analysis of the high-end single-axis and dual-axis accelerometers integrated in the STIM318 IMU.
More information: https://www.systemplus.fr/reverse-costing-reports/safran-colibrys-ms1010-and-memsic-mxa2500m-high-end-accelerometers/
Sensonor STIM318 Inertial Measurement Unit (IMU)system_plus
Newest IMU with 9-axis detection and gyro bias instability of 0.3°/h from Sensonor.
More information: https://www.systemplus.fr/reverse-costing-reports/sensonor-stim318-inertial-measurement-unit-imu/
Hamamatsu Photodiode and Laser in Livox’s Horizon LiDARsystem_plus
Analysis of the six channels and 905nm pulsed laser and photodiode from Hamamatsu, in Livox’s LiDAR for automotive ADAS.
More information: https://www.systemplus.fr/reverse-costing-reports/hamamatsu-photodiode-and-laser-in-livox-horizon-lidar/
Everspin’s Spin Transfer Torque MRAM with perpendicular magnetic tunnel junction.
More information: https://www.systemplus.fr/reverse-costing-reports/everspin-emd3d256m-sttmram-memory/
Advanced System-in-Package Technology in Apple’s AirPods Prosystem_plus
Analysis of Apple’s first SiP found in the latest AirPods, featuring a fully integrated SiP for audio codec and Bluetooth connectivity.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/advanced-system-in-package-technology-in-apples-airpods-pro/
Compare the technology and cost of 19 microphones from Knowles, Goertek, AAC Technologies, STMicroelectronics, TDK-InvenSense, TDK-Epcos, Cirrus Logic and Vesper.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/consumer-mems-microphones-comparison-2020/
Latest Audi Q3 instrument cluster with immobilizer: Structural and cost analysis
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/audi-bosch-fpk-generation-2-instrument-cluster/
Threats to mobile devices are more prevalent and increasing in scope and complexity. Users of mobile devices desire to take full advantage of the features
available on those devices, but many of the features provide convenience and capability but sacrifice security. This best practices guide outlines steps the users can take to better protect personal devices and information.
Essentials of Automations: The Art of Triggers and Actions in FMESafe Software
In this second installment of our Essentials of Automations webinar series, we’ll explore the landscape of triggers and actions, guiding you through the nuances of authoring and adapting workspaces for seamless automations. Gain an understanding of the full spectrum of triggers and actions available in FME, empowering you to enhance your workspaces for efficient automation.
We’ll kick things off by showcasing the most commonly used event-based triggers, introducing you to various automation workflows like manual triggers, schedules, directory watchers, and more. Plus, see how these elements play out in real scenarios.
Whether you’re tweaking your current setup or building from the ground up, this session will arm you with the tools and insights needed to transform your FME usage into a powerhouse of productivity. Join us to discover effective strategies that simplify complex processes, enhancing your productivity and transforming your data management practices with FME. Let’s turn complexity into clarity and make your workspaces work wonders!
UiPath Test Automation using UiPath Test Suite series, part 5DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 5. In this session, we will cover CI/CD with devops.
Topics covered:
CI/CD with in UiPath
End-to-end overview of CI/CD pipeline with Azure devops
Speaker:
Lyndsey Byblow, Test Suite Sales Engineer @ UiPath, Inc.
Building Production Ready Search Pipelines with Spark and MilvusZilliz
Spark is the widely used ETL tool for processing, indexing and ingesting data to serving stack for search. Milvus is the production-ready open-source vector database. In this talk we will show how to use Spark to process unstructured data to extract vector representations, and push the vectors to Milvus vector database for search serving.
Observability Concepts EVERY Developer Should Know -- DeveloperWeek Europe.pdfPaige Cruz
Monitoring and observability aren’t traditionally found in software curriculums and many of us cobble this knowledge together from whatever vendor or ecosystem we were first introduced to and whatever is a part of your current company’s observability stack.
While the dev and ops silo continues to crumble….many organizations still relegate monitoring & observability as the purview of ops, infra and SRE teams. This is a mistake - achieving a highly observable system requires collaboration up and down the stack.
I, a former op, would like to extend an invitation to all application developers to join the observability party will share these foundational concepts to build on:
Pushing the limits of ePRTC: 100ns holdover for 100 daysAdtran
At WSTS 2024, Alon Stern explored the topic of parametric holdover and explained how recent research findings can be implemented in real-world PNT networks to achieve 100 nanoseconds of accuracy for up to 100 days.
AI 101: An Introduction to the Basics and Impact of Artificial IntelligenceIndexBug
Imagine a world where machines not only perform tasks but also learn, adapt, and make decisions. This is the promise of Artificial Intelligence (AI), a technology that's not just enhancing our lives but revolutionizing entire industries.
Let's Integrate MuleSoft RPA, COMPOSER, APM with AWS IDP along with Slackshyamraj55
Discover the seamless integration of RPA (Robotic Process Automation), COMPOSER, and APM with AWS IDP enhanced with Slack notifications. Explore how these technologies converge to streamline workflows, optimize performance, and ensure secure access, all while leveraging the power of AWS IDP and real-time communication via Slack notifications.
Climate Impact of Software Testing at Nordic Testing DaysKari Kakkonen
My slides at Nordic Testing Days 6.6.2024
Climate impact / sustainability of software testing discussed on the talk. ICT and testing must carry their part of global responsibility to help with the climat warming. We can minimize the carbon footprint but we can also have a carbon handprint, a positive impact on the climate. Quality characteristics can be added with sustainability, and then measured continuously. Test environments can be used less, and in smaller scale and on demand. Test techniques can be used in optimizing or minimizing number of tests. Test automation can be used to speed up testing.
Communications Mining Series - Zero to Hero - Session 1DianaGray10
This session provides introduction to UiPath Communication Mining, importance and platform overview. You will acquire a good understand of the phases in Communication Mining as we go over the platform with you. Topics covered:
• Communication Mining Overview
• Why is it important?
• How can it help today’s business and the benefits
• Phases in Communication Mining
• Demo on Platform overview
• Q/A
Cosa hanno in comune un mattoncino Lego e la backdoor XZ?Speck&Tech
ABSTRACT: A prima vista, un mattoncino Lego e la backdoor XZ potrebbero avere in comune il fatto di essere entrambi blocchi di costruzione, o dipendenze di progetti creativi e software. La realtà è che un mattoncino Lego e il caso della backdoor XZ hanno molto di più di tutto ciò in comune.
Partecipate alla presentazione per immergervi in una storia di interoperabilità, standard e formati aperti, per poi discutere del ruolo importante che i contributori hanno in una comunità open source sostenibile.
BIO: Sostenitrice del software libero e dei formati standard e aperti. È stata un membro attivo dei progetti Fedora e openSUSE e ha co-fondato l'Associazione LibreItalia dove è stata coinvolta in diversi eventi, migrazioni e formazione relativi a LibreOffice. In precedenza ha lavorato a migrazioni e corsi di formazione su LibreOffice per diverse amministrazioni pubbliche e privati. Da gennaio 2020 lavora in SUSE come Software Release Engineer per Uyuni e SUSE Manager e quando non segue la sua passione per i computer e per Geeko coltiva la sua curiosità per l'astronomia (da cui deriva il suo nickname deneb_alpha).
Full-RAG: A modern architecture for hyper-personalizationZilliz
Mike Del Balso, CEO & Co-Founder at Tecton, presents "Full RAG," a novel approach to AI recommendation systems, aiming to push beyond the limitations of traditional models through a deep integration of contextual insights and real-time data, leveraging the Retrieval-Augmented Generation architecture. This talk will outline Full RAG's potential to significantly enhance personalization, address engineering challenges such as data management and model training, and introduce data enrichment with reranking as a key solution. Attendees will gain crucial insights into the importance of hyperpersonalization in AI, the capabilities of Full RAG for advanced personalization, and strategies for managing complex data integrations for deploying cutting-edge AI solutions.
“An Outlook of the Ongoing and Future Relationship between Blockchain Technologies and Process-aware Information Systems.” Invited talk at the joint workshop on Blockchain for Information Systems (BC4IS) and Blockchain for Trusted Data Sharing (B4TDS), co-located with with the 36th International Conference on Advanced Information Systems Engineering (CAiSE), 3 June 2024, Limassol, Cyprus.
TrustArc Webinar - 2024 Global Privacy SurveyTrustArc
How does your privacy program stack up against your peers? What challenges are privacy teams tackling and prioritizing in 2024?
In the fifth annual Global Privacy Benchmarks Survey, we asked over 1,800 global privacy professionals and business executives to share their perspectives on the current state of privacy inside and outside of their organizations. This year’s report focused on emerging areas of importance for privacy and compliance professionals, including considerations and implications of Artificial Intelligence (AI) technologies, building brand trust, and different approaches for achieving higher privacy competence scores.
See how organizational priorities and strategic approaches to data security and privacy are evolving around the globe.
This webinar will review:
- The top 10 privacy insights from the fifth annual Global Privacy Benchmarks Survey
- The top challenges for privacy leaders, practitioners, and organizations in 2024
- Key themes to consider in developing and maintaining your privacy program
HCL Notes and Domino License Cost Reduction in the World of DLAUpanagenda
Webinar Recording: https://www.panagenda.com/webinars/hcl-notes-and-domino-license-cost-reduction-in-the-world-of-dlau/
The introduction of DLAU and the CCB & CCX licensing model caused quite a stir in the HCL community. As a Notes and Domino customer, you may have faced challenges with unexpected user counts and license costs. You probably have questions on how this new licensing approach works and how to benefit from it. Most importantly, you likely have budget constraints and want to save money where possible. Don’t worry, we can help with all of this!
We’ll show you how to fix common misconfigurations that cause higher-than-expected user counts, and how to identify accounts which you can deactivate to save money. There are also frequent patterns that can cause unnecessary cost, like using a person document instead of a mail-in for shared mailboxes. We’ll provide examples and solutions for those as well. And naturally we’ll explain the new licensing model.
Join HCL Ambassador Marc Thomas in this webinar with a special guest appearance from Franz Walder. It will give you the tools and know-how to stay on top of what is going on with Domino licensing. You will be able lower your cost through an optimized configuration and keep it low going forward.
These topics will be covered
- Reducing license cost by finding and fixing misconfigurations and superfluous accounts
- How do CCB and CCX licenses really work?
- Understanding the DLAU tool and how to best utilize it
- Tips for common problem areas, like team mailboxes, functional/test users, etc
- Practical examples and best practices to implement right away
Unlocking Productivity: Leveraging the Potential of Copilot in Microsoft 365, a presentation by Christoforos Vlachos, Senior Solutions Manager – Modern Workplace, Uni Systems
HCL Notes und Domino Lizenzkostenreduzierung in der Welt von DLAUpanagenda
Webinar Recording: https://www.panagenda.com/webinars/hcl-notes-und-domino-lizenzkostenreduzierung-in-der-welt-von-dlau/
DLAU und die Lizenzen nach dem CCB- und CCX-Modell sind für viele in der HCL-Community seit letztem Jahr ein heißes Thema. Als Notes- oder Domino-Kunde haben Sie vielleicht mit unerwartet hohen Benutzerzahlen und Lizenzgebühren zu kämpfen. Sie fragen sich vielleicht, wie diese neue Art der Lizenzierung funktioniert und welchen Nutzen sie Ihnen bringt. Vor allem wollen Sie sicherlich Ihr Budget einhalten und Kosten sparen, wo immer möglich. Das verstehen wir und wir möchten Ihnen dabei helfen!
Wir erklären Ihnen, wie Sie häufige Konfigurationsprobleme lösen können, die dazu führen können, dass mehr Benutzer gezählt werden als nötig, und wie Sie überflüssige oder ungenutzte Konten identifizieren und entfernen können, um Geld zu sparen. Es gibt auch einige Ansätze, die zu unnötigen Ausgaben führen können, z. B. wenn ein Personendokument anstelle eines Mail-Ins für geteilte Mailboxen verwendet wird. Wir zeigen Ihnen solche Fälle und deren Lösungen. Und natürlich erklären wir Ihnen das neue Lizenzmodell.
Nehmen Sie an diesem Webinar teil, bei dem HCL-Ambassador Marc Thomas und Gastredner Franz Walder Ihnen diese neue Welt näherbringen. Es vermittelt Ihnen die Tools und das Know-how, um den Überblick zu bewahren. Sie werden in der Lage sein, Ihre Kosten durch eine optimierte Domino-Konfiguration zu reduzieren und auch in Zukunft gering zu halten.
Diese Themen werden behandelt
- Reduzierung der Lizenzkosten durch Auffinden und Beheben von Fehlkonfigurationen und überflüssigen Konten
- Wie funktionieren CCB- und CCX-Lizenzen wirklich?
- Verstehen des DLAU-Tools und wie man es am besten nutzt
- Tipps für häufige Problembereiche, wie z. B. Team-Postfächer, Funktions-/Testbenutzer usw.
- Praxisbeispiele und Best Practices zum sofortigen Umsetzen
26. COMPLETE TEARDOWN
WITH:
• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process
flow
• Supply chain evaluation
• Manufacturing cost
analysis
• Estimated sales price
• Comparison with
STMicroelectronics’ ToF
portfolio: Previous
generation VL6180X,
actual VL53L0X, and
last custom product in
Apple’s iPhone 8,
Evolution, from
function to SPADs
STMicroelectronics’ Time of Flight Proximity Sensor &
Flood Illuminator in the Apple iPhone X
Title: STMicroelectronics’
ToF Proximity Sensor &
Flood Illuminator
Pages: 172
Date: January 2018
Format: PDF & Excel file
Price: Full report:
EUR 3,490
A unique combination of STMicroelectronics’ latest proximity sensor, based on single-photon
avalanche diode (SPAD) technology and a VCSEL illuminator, all in Apple’s most advanced handset
custom proximity sensor, one which represents the smallest FlightSenseTM device
in its ToF portfolio. And with the Apple X, STMicroelectronics has gained
significant market share by integrating several of its components (from the NIR
camera to the 3D touch controller), including a new custom version of the
proximity sensor featuring a flood illuminator.
Located in the front above the main speaker, the proximity sensor/flood illuminator
is packaged using optical LGA. The device is unique to Apple. In the past,
STMicroelectronics released a custom proximity sensor two times smaller (2.80 x
2.40 mm) than the devices in its portfolio, based on FlightSenseTM technology. This
new version comes with a flood illuminator used in the True Depth system. The flood
illuminator is an NIR VCSEL with a wide beam that illuminates the face and allows for
nighttime user recognition with the NIR camera. The packaging is specially designed
for the flood illuminator’s heat management.
In this report the complete microsystem is analyzed, from the two illumination
devices (which are vertical-cavity surface-emitting lasers (VCSEL)) to the collector
(based on the SPAD developed by STMicroelectronics). Moreover, a complete cost
analysis and price estimate is presented for the device, based on a detailed
description of the package, the ToF detector, the VCSEL, and the second VCSEL for
flood illumination.
Also featured is a complete technology comparison with STMicroelectronics’ ToF
portfolio since its first generation: the VL53L0X, the VL6180X, and the most recent
custom proximity sensor in the Apple iPhone 8.
Ahead of its competitors, Apple has begun
using 3D sensing. For the iPhone’s 10th
anniversary, Apple integrated this new function
under the name “True Depth sensing”. The
system features a near-infrared (NIR) camera, a
dot projector, and a flood illuminator, along
with a proximity sensor. All modules work
together to form a high-end security solution:
facial recognition. Since the Apple 7,
STMicroelectronics has supplied Apple with a
27. TABLE OF CONTENTS
Performed by
AUTHORS:
MEMS CoSim+
ANALYSIS PERFORMED WITH OUR COSTING TOOLS MEMS COSIM+ AND IC PRICE+
System Plus Consulting offers
powerful costing tools to
evaluate the production cost
and selling price from single chip
to complex structures.
MEMS CoSim+
Cost simulation tool to evaluate
the cost of any MEMS process or
device.
IC Price+
The tool performs the necessary
cost simulation of any Integrated
Circuit: ASICs, microcontrollers,
DSP, memories, smartpower,
and more.
Overview / Introduction
STMicroelectronics - Company
Profile & Time of Flight (ToF)
Technology
Apple iPhone X Plus - Teardown
Physical Analysis
• Physical Analysis Methodology
• Package
View and dimensions
Package opening and wire bonding
process
Package cross-section: adhesives,
PCB, filters, FOV, diffuser, ceramic
• VCSEL Die
View and dimensions
Wire bonding, cavity
Cross-section
Process characteristics
• ASIC Die
View, dimensions and marking
Die overview - active area, SPADs
technology
Die delayering, main blocks’ ID and
process
Cross-section - metal layers, SPADs
Process characteristics
Dr. Stéphane
Elisabeth
Stéphane has a deep
k n o w l e d g e o f
materials characte-
r i z a t i o n s a n d
electronics systems.
He holds an Engineering Degree in
Electronics and Numerical
Technology, and a PhD in Materials
for Microelectronics.
Physical Comparison with Apple’s
iPhone 8, the VL53L0X, and the
VL6180X
• Package, Functions, FOV, Optical
Blocking Package, ASIC & VCSEL,
SPADs
Manufacturing Process Flow
• Overview
• ASIC and VCSELs Front-End Process
• ASIC and VCSELs Wafer Fabrication
Unit
• Packaging Process Flow
• Final Assembly Unit
Cost Analysis
• Cost Analysis Synthesis
• Economic Analysis - Main Steps Used
• Yield Hypotheses
• ASIC & VCSEL Die Cost
Front-end cost
Back-end - tests and dicing
Wafer and die cost
• Component
Packaging cost
Packaging cost per process steps
Component cost
Estimated Price Analysis
IC Price+
Sylvain Hallereau
Sylvain is in charge of
costing analyses for IC,
power and MEMS. He
has more than 10
years of experience in
power device manufacturing cost
analysis.
He previously worked for 25
years at Atmel Nantes
Technological Analysis Laboratory
and for three years at Hirex
Engineering in Toulouse.
Yvon Le Goff
(Lab)
Yvon has joined
System Plus
Consulting in 2011 to
setup its laboratory.
Distributed by
28. RELATED REPORTS
ANNUAL SUBSCRIPTION OFFER
Performed by
Apple iPhone X
Infrared Dot Projector
STMicroelectronics’ Near
Infrared Camera Sensor in
the Apple iPhone X
STMicroelectronics Time
of Flight Proximity Sensor
in the Apple iPhone 7 Plus
The world’s most advanced dot
projector for 3D sensing with four
innovative parts: Its package; a
dedicated VCSEL; a folded optic; and
the active DOE.
The first NIR camera sensor with
multiple innovations based on
imager-silicon-on-insulator sub-
strate from SOITEC, supplied and
produced by STMicroelectronics for
the Apple True Depth Module.
A look inside the Single Photon
Avalanche Diode (SPAD) from
STMicroelectronics entering the
high-end Apple handset.
Pages: Over 150
Date: December 2017
Full report: EUR 3,990*
Pages: 97
Date: December 2017
Full report: EUR 3,490*
Pages: 113
Date: March 2017
Full report: EUR 3,490*
Bundle: Apple iPhone X Special offer, contact us for more details.
You can choose to buy over 12
months a set of 3, 4, 5, 7, 10 or
15 Reverse Costing® reports.
Up to 47% discount!
Each year System Plus Consulting releases a comprehensive collection of new reverse engineering &
costing analyses in various domains.
• Packaging:
3D Packaging - Embedded - SIP - WLP
• Integrated Circuits :
IPD - Memories - PMIC - SoC
• RF:
FEM - Duplexer
• Systems:
Automotive - Consumer - Energy -
Telecom
More than 60 reports released each year on the following topics (considered for 2018):
• MEMS & Sensors:
Accelerometer - Environment - Fingerprint -
Gas - Gyroscope - IMU/Combo -
Microphone - Optics - Oscillator - Pressure
• Power:
GaN - IGBT - MOSFET - Si Diode - SiC
• Imaging: Camera - Spectrometer
• LED & Laser:
UV LED - VCSEL - White/blue LED
Distributed by
29. ORDER FORM
STMicroelectronics’ ToF Proximity Sensor & Flood Illuminator : EUR 3,490*
*For price in dollars please use the day’s exchange rate. All reports are delivered electronically in pdf format. For French customer, add 20 % for VAT.
Performed by
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology
and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using
silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50
collaborators worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics,
Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy
Management.
The “More than Moore” company Yole, along with its partners System Plus Consulting, Blumorpho and KnowMade,
support industrial companies, investors and R&D organizations worldwide to help them understand markets and
follow technology trends to grow their business.
CUSTOM STUDIES
• Market data & research, marketing
analysis
• Technology analysis
• Reverse engineering & costing
services
• Strategy consulting
• Patent analysis
More information on www.yole.fr
MEDIA
• i-Micronews.com, online disruptive
technologies website and its weekly e-
newsletter, @Micronews
• Communication & webcasts services
• Events: Yole Seminars, Market Briefings
More information on
http://www.i-micronews.com/media-kit.html
TECHNOLOGY & MARKET REPORTS
• Collection of technology & market
reports
• Manufacturing cost simulation tools
• Component reverse engineering &
costing analysis
• Patent investigation
More information on
http://www.i-
micronews.com/reports.html
Ref.: SP18383
Please process my order for “STMicroelectronics’ ToF Proximity Sensor & Flood Illuminator” Reverse Costing Report
30. Performed by
TERMS AND CONDITIONS OF SALES
. Definitions: “Acceptance”: Action by which the Buyer accepts the terms and conditions of sale in their entirety. It is done by signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of
Sale”.
“Buyer”: Any business user (i.e. any person acting in the course of its business activities, for its business needs) entering into the following general conditions to the exclusion of consumers acting in their personal
interests.
“Contracting Parties” or “Parties”: The Seller on the one hand and the Buyer on the other hand.
“Intellectual Property Rights” (“IPR”) means any rights held by the Seller in its Products, including any patents, trademarks, registered models, designs, copyrights, inventions, commercial secrets and know-how, technical
information, company or trading names and any other intellectual property rights or similar in any part of the world, notwithstanding the fact that they have been registered or not and including any pending registration of
one of the above mentioned rights.
“License”: For the reports and databases, 3 different licenses are proposed. The buyer has to choose one license:
• One user license: one person at the company can use the report.
• Multi-user license: the report can be used by unlimited users within the company. Subsidiaries and Joint-Ventures are not included.
• Corporate license: purchased under “Annual Subscription” program, the report can be used by unlimited users within the company. Joint-Ventures are not included.
“Products”: Depending on the purchase order, reports or database on MEMS, CSC, Optics/MOEMS, Nano, bio… to be bought either on a unit basis or as an annual subscription. (i.e. subscription for a period of 12
calendar months). The annual subscription to a package (i.e. a global discount based on the number of reports that the Buyer orders or accesses via the service, a global search service on line on I-micronews and a
consulting approach), is defined in the order. Reports are established in PowerPoint and delivered on a PDF format and the database may include Excel files.
“Seller”: Based in Lyon (France headquarters), Yole Développement is a market research and business development consultancy company, facilitating market access for advanced technology industrial projects. With
more than 20 market analysts, Yole works worldwide with the key industrial companies, R&D institutes and investors to help them understand the markets and technology trends.
1. Scope
1.1 The Contracting Parties undertake to observe the following general conditions when agreed by the Buyer and the Seller. ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS AND CONDITIONS IN ANY
OTHER DOCUMENTS ISSUED BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE MADE HEREUNDER AND SHALL NOT BE
BINDING IN ANY WAY ON THE SELLER.
1.2 This agreement becomes valid and enforceable between the Contracting Parties after clear and non-equivocal consent by any duly authorized person representing the Buyer. For these purposes, the Buyer accepts
these conditions of sales when signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. This results in acceptance by the Buyer.
1.3 Orders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from the date of order, to be sent either by email or to the Buyer’s address. In the absence of any
confirmation in writing, orders shall be deemed to have been accepted.
2. Mailing of the Products
2.1 Products are sent by email to the Buyer:
- within [1] month from the order for Products already released; or
- within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavours to inform the Buyer of an indicative release date and the evolution of the work in
progress.
2.2 Some weeks prior to the release date the Seller can propose a pre-release discount to the Buyer
The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including incases where a new event or access to new contradictory information would require for the analyst extra time to
compute or compare the data in order to enable the Seller to deliver a high quality Products.
2.3 The mailing of the Product will occur only upon payment by the Buyer, in accordance with the conditions contained in article 3.
2.4. The mailing is operated through electronic means either by email via the sales department or automatically online via an email/password. If the Product’s electronic delivery format is defective, the Seller undertakes to
replace it at no charge to the Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product.
2.5 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity shall be sent in
writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. .
2.6 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providing prior information to the Seller as required under
article 2.5 shall remain at the Buyer’s risk.
3. Price, invoicing and payment
3.1 Prices are given in the orders corresponding to each Product sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated from time
to time. The effective price is deemed to be the one applicable at the time of the order.
3.2 Yole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange
to this uncertainty, the company will get a discount that can vary from 15% to 10%.
3.3 Payments due by the Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account:
HSBC, 1 place de la Bourse 69002 Lyon France
Bank code: 30056
Branch code: 00170
Account n°: 0170 200 1565 87
BIC or SWIFT code: CCFRFRPP
IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order.
3.4 Payment is due by the Buyer to the Seller within 30 days from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be
entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441-6 of the French Commercial Code. Our publications (report, database, tool...) are delivered
only after reception of the payment.
3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages.
4. Liabilities
4.1 The Buyer or any other individual or legal person acting on its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and
interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of
the use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof.
4.4All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot
be guaranteed to be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the
liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of
any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in
article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the
orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down
payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take
reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that
any Product will be free from infection.
5. Force majeure
The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties,
equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.
6. Protection of the Seller’s IPR
6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the
Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as:
- Information storage and retrieval systems;
- Recordings and re-transmittals over any network (including any local area network);
- Use in any timesharing, service bureau, bulletin board or similar arrangement or public display;
- Posting any Product to any other online service (including bulletin boards or the Internet);
- Licensing, leasing, selling, offering for sale or assigning the Product.
6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall
personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the
copyrights and will guaranty that the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a
maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company,
the joint venture done with a third party etc..cannot access the report and should pay a full license price.
7. Termination
7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such
delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without
solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due
time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which
shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
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