With its choice of a dual camera, Apple’s innovations include new objectives lens assemblies, new bonding processes and a new type of autofocus
In the iPhone 7 Plus, Apple introduced a new rear camera module. Like its competitors LG and Huawei, they have chosen to integrate a dual camera. The module features two sensors, one closed to the sensor in the previous flagship, and another with a totally new structure.
Competition for the best camera phone was revived by Huawei with its flagship, the P9, using a dual camera. Like the other main players except Samsung, Apple has now introduced a dual camera module. This module integrates two 12 megapixel resolution CMOS Image Sensors (CISs) from Sony, using Exmor-RS Technology. The wide-angle objective lens assembly features an aperture of f/1.8 and a pixel size of 1.22 µm. The telephoto has a pixel size of 1 µm but a smaller aperture of f/2.8.
The iPhone 7 Plus dual camera module, with dimensions of 20.6 x 10.0 x 5.9 mm, is equipped with two sub-modules each including a Sony CIS. The wide-angle module is equipped with an optical image stabilization (OIS) voice coil motor (VCM), while the telephoto only comes with a general VCM. The CISs are assembled using a flip-chip process on a ceramic substrate with a gold stud bumping process.
With this new dual camera module and Sony’s Exmor-RS technology, Apple has innovated its offering in areas including phase detection autofocus (PDAF), its objective lens assembly structure, its sensor, and adopts a second generation of through-silicon vias (TSVs). Surprisingly both logic circuit sensors for controlling PDAF are very similar.
The report includes technology and cost analysis of the iPhone 7 Plus dual camera module. Also, comparisons with the Huawei P9, Samsung Galaxy S7 and iPhone 6S rear camera modules are provided. These comparisons highlight differences in structures, technical choices and manufacturing cost.
More information on that report at http://www.i-micronews.com/reports.html
SCiO Molecular Sensor from Consumer Physics: Mobile Spectrometer Dongle - tea...Yole Developpement
The world’s first pocket-sized molecular sensor that can be integrated into consumer smartphones
For a long time, spectral analysis of materials has been limited to academic research. Everyday application of this type of analysis could bring new interactions in areas including food, fitness and medication. Starting with a crowdfunding campaign, and following the path of companies like FLIR, Consumer Physics, which was formerly Verifood Ltd., has created the first dongle molecular sensor, the SCiO Spectrometer. Thanks to big data and cloud technology, the dongle spectrometer claims to take the spectral fingerprint of any substance and quantify or identify any compound.
Consumer Physics is the first to bring spectrometry to consumers. Unlike other spectrometers, Consumer Physics produces a very simple package based on a tiny spectrometer head, with an area of 13 mm x 19 mm.
The SCiO Spectrometer integrates a 1.2 M pixel monochromatic CMOS image sensor from ON Semiconductor, a white LED from OSRAM and a bespoke filter/lens array. The LED is coupled to a reflector in the illumination module, which shines light on the analyzed substance, whose molecules absorb specific wavelengths. The received light in the spectrometer module is filtered and broken up into different wavelengths by the various lenses. Finally, the image sensor gives an instant response from the analyzed substance.
For more information please visit our website: http://www.i-micronews.com/reports.html
2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...Yole Developpement
Complete reports and comparison of the latest generation products for smartphones from the leading optical image stabilization gyro players.
2-Axis Gyroscopes for Optical Image Stabilization (OIS) constitute a market where 123 million units were shipped in 2015, according to Yole Développement. This market originates only from high-end smartphones and two players share most of it: InvenSense, with 49%, and STMicroelectronics, with 39%.
The 2-axis gyroscopes are located inside the camera module of high-end smartphones. The main constraints are a small footprint and, more importantly, thinness.
Previously, thickness was the same as standard land grid array (LGA) or quad flat no-leads (QFN) package, close to 1mm. Now the standard is 0.65mm, which products from both InvenSense and STMicroelectronics attain.
InvenSense was first, with the IDG-2030, a 2.3x2.3x0.65mm gyroscope, which is still the smallest on the market. Since its introduction we found it in several smartphones from various manufacturers. The IDG-2030 uses the same Nasiri platform as other InvenSense inertial devices, with wafer-level integration of the MEMS sensor on top of the application specific integrated circuit (ASIC), thus providing only one die in the final LGA package.
Months later, STMicroelectronics released the L2G2IS, which shares the same dimensions. The device is manufactured using the same THELMA process as all STMicroelectronics inertial devices. The THELMA platform involves a two-die approach that is challenging for very thin package integration. However, both players now offer very low-cost gyros thanks to die size reduction and process optimization.
Both gyroscopes analyzed are 2-axis X, Y (Pitch, Roll). The two reports can be purchased separately or together in order to compare the technology and pricing of the main smartphone OIS gyro players, including previous generation products.
More information on that report at http://www.i-micronews.com/reports.html
Thermal Expert Infrared Camera for Smartphones and I3system I3BOL384_17A Micr...Yole Developpement
The highest resolution thermal camera for smartphones at 384 x 288 pixels, using a microbolometer with 17µm pixels from the South Korea’s I3 System.
Based on a high definition microbolometer from I3system, the Thermal Expert infrared camera is a high-end product for smartphones. A more conservative technological choice, the microbolometer is more expensive but offers better performance. The camera also embraces the quality approach with interchangeable lenses for different uses. I3system targets the professional market and competes more in standard IR cameras than IR cameras for smartphones.
The Thermal Expert camera is very compact and compatible with Android smartphones via its micro-USB-OTG connector. The camera does not use a battery, with power being supplied by the smartphone. The camera is shutterless.
The thermal camera uses a new 17µm pixel design from I3system. The I3BOL384_17A microbolometer features 384 x 288 pixel resolution, 24 times the resolution of the FLIR Lepton. The sensor technology in the I3system component is a titanium oxide microbolometer, technology which is not covered by Honeywell patents. The I3BOL384_17A is the consumer version of a military microbolometer.
This report presents a complete teardown analysis of the Thermal Expert camera and its microbolometer. Based on this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR One, Seek Thermal, Therm-App and Thermal Expert cameras and Lepton, EXC001, PICO384P and I3BOL384_17A microbolometers. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
The new 1200V MOSFET module from Rohm – with the first trench SiC MOSFET on the market – reduces power losses and has a higher performance/cost ratio than the previous generation
The BSM180D12P3C007 is a 1200V 180A SiC MOSFET module from Rohm for high power applications like motor drives, inverters, photovoltaics and induction heating equipment. In comparison with the previous generation of SiC MOSFETs, which have a planar structure, the trench structure halves on-resistance and reduces switching losses by 42%.
The BSM180D12P3C007 integrates the third generation high-voltage SiC power MOSFET dies with a current of 36A and the innovative trench structure. Ten SiC Schottky Barrier diodes are also integrated into the power module.
The BSM180D12P3C007 offers a higher operating temperature (up to 150°C) in a 45mm x 122mm x 21mm package.
The report goes into depth in its analysis of the packaging and the components, with images of the complex trench SiC structure.
It also includes production cost analysis and overall comparison with the planar SiC MOSFET from Rohm and the Cree CAS120M12BM2 module.
More information on that report at http://www.i-micronews.com/reports.html
First plasmonic filter sensor for consumer devices could disrupt optical applications.
The NSP32-V1 from NanoLambda is the world’s smallest optical spectrometer, and the first such device for Internet-of-Things and handheld devices. It could enable everyday analysis of food and water, color measurement, health monitoring and pollution detection. The data measured by the NSP32-V1 is the same output format as conventional optical spectrum analyzers, which facilitates the use of this device without creating a new database.
The NSP32-V1 spectrometer uses a 1024 pixel, 32 x 32, nano-optical filter array to measure the light spectrum, based on a technological breakthrough, the plasmonic filter. This is a metal film perforated with subwavelength hole arrays. It is manufactured within the metal layer of the silicon die, giving a monolithic solution.
The 100μm-high sensor die is assembled in an advanced ball grid array (BGA) package with an optical window for only 500μm height. The other optical parts, the lens and the diffuser, are assembled in a 5.7mm-high module. The module is very small overall, at just 6mm x 6mm x 5.3mm.
Based on a complete teardown analysis of the NSP32-V1 nano-spectrometer, the report provides a complete physical analysis and manufacturing cost estimate of the die and the packaging, including the lens module.
The report also includes a comparison between the characteristics of the NSP32-V1 and the SCIO molecular sensor from Consumer Physics. The comparison highlights differences in technical choices made by the companies and their impacts on the process flow and manufacturing cost.
More information on that report at http://www.i-micronews.com/reports.html
Delphi Integrated Radar and Camera System (RACam) 2016 teardown reverse costi...Yole Developpement
Delphi is the first to provide a single system combining 76Ghz Radar and Vision Sensing. With a compact design the system can be integrated behind the windshield and enables a broad array of active safety features, as lane tracking, collision avoidance or adaptive cruise control.
The visual detection is performed by a 1/3” CMOS Image Sensor supplied by a leader in the CIS automotive industry. The sensor is surmounted by a specific 7-lens module and the Mobileye EyeQ3 SoC is used for video processing. Concerning the radar function, Receiver and Transmitter chips from Infineon using SiGe HBT technology are assembled by wire bonding on the RF Board. The Antenna board uses a PTFE-based substrate and is equipped with planar antennas for transmission and reception of the RF signals.
Based on a complete teardown analysis of the Delphi RACam, the report provides the bill-of-material (BOM) and the manufacturing cost of the system. The report also includes analysis of the Image Sensor and Lens module. A structural analysis, with a comparison with Bosch MRR1, highlights the technical choices in RF design made by Delphi.
A physical analysis and manufacturing cost estimation of the Infineon RF chips is available in a separate report, which also includes a comparison with MMICs used in the Bosch MRR1 Radar.
More information on that report at http://www.i-micronews.com/reports.html
Apple iphone 6 and 6 plus front camera module teardown reverse costing report...Yole Developpement
For the iPhone 6 FaceTime camera module, Apple integrate an innovative CMOS Image Sensor constituted of an original structure of 4.8 MPixel sub-microlenses array mediated by the color filters to get the final 1.2 Mpixel resolution. This technical choice has a strong impact on the camera performances and on the device manufacturing cost.
The unique technology from Sony (Exmor-RS) consists in a stacking of a pixel array circuit which uses a Back-Side Illuminated (BSI) technology and a logic ISP circuit processed with a 65nm technology node. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process. This allows to raise the pixel array size by 15% and to considerably improve the light sensitivity by integrating an innovative grid and lenses design.
The camera module, with dimensions of 6.2 x 6.0 x 3.8mm, is equipped with a 4-elements lens module and a f/2.2 camera aperture which increase light sensitivity.
The report includes a comparison of Apple’s technical choices between iPhone6 Rear and Front camera.
24 camera modules for consumer and automotive applications, all from the main OEMs - analyzed and compared!
Smartphone manufacturers are increasingly integrating options and powerful components into their products. 3D and dual-camera modules are now available, offering better-image quality and providing more options, i.e. iris scanners and augmented reality.
The automotive camera module market is also rising steadily and is beginning to take significant market share.
Paralleling Yole Développement’s Camera Module Industry 2017 Market Report, this comparative review was conducted to provide insights into the structure and technology of 19 CMOS camera modules (CCM) released in flagship smartphones from the major brands.
In this report, rear and front-facing compact camera modules (including standard (mono), dual, iris scanners, and 3D camera modules) are analyzed and compared in terms of structural overview, module integration, lens number and dimensions, CIS res
olution, and pixel size. Indeed, OIS (Optical Image Stabilization) and dual-cameras are the big new trends for mobile camera modules.
More information on that report at http://www.i-micronews.com/reports.html
SCiO Molecular Sensor from Consumer Physics: Mobile Spectrometer Dongle - tea...Yole Developpement
The world’s first pocket-sized molecular sensor that can be integrated into consumer smartphones
For a long time, spectral analysis of materials has been limited to academic research. Everyday application of this type of analysis could bring new interactions in areas including food, fitness and medication. Starting with a crowdfunding campaign, and following the path of companies like FLIR, Consumer Physics, which was formerly Verifood Ltd., has created the first dongle molecular sensor, the SCiO Spectrometer. Thanks to big data and cloud technology, the dongle spectrometer claims to take the spectral fingerprint of any substance and quantify or identify any compound.
Consumer Physics is the first to bring spectrometry to consumers. Unlike other spectrometers, Consumer Physics produces a very simple package based on a tiny spectrometer head, with an area of 13 mm x 19 mm.
The SCiO Spectrometer integrates a 1.2 M pixel monochromatic CMOS image sensor from ON Semiconductor, a white LED from OSRAM and a bespoke filter/lens array. The LED is coupled to a reflector in the illumination module, which shines light on the analyzed substance, whose molecules absorb specific wavelengths. The received light in the spectrometer module is filtered and broken up into different wavelengths by the various lenses. Finally, the image sensor gives an instant response from the analyzed substance.
For more information please visit our website: http://www.i-micronews.com/reports.html
2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...Yole Developpement
Complete reports and comparison of the latest generation products for smartphones from the leading optical image stabilization gyro players.
2-Axis Gyroscopes for Optical Image Stabilization (OIS) constitute a market where 123 million units were shipped in 2015, according to Yole Développement. This market originates only from high-end smartphones and two players share most of it: InvenSense, with 49%, and STMicroelectronics, with 39%.
The 2-axis gyroscopes are located inside the camera module of high-end smartphones. The main constraints are a small footprint and, more importantly, thinness.
Previously, thickness was the same as standard land grid array (LGA) or quad flat no-leads (QFN) package, close to 1mm. Now the standard is 0.65mm, which products from both InvenSense and STMicroelectronics attain.
InvenSense was first, with the IDG-2030, a 2.3x2.3x0.65mm gyroscope, which is still the smallest on the market. Since its introduction we found it in several smartphones from various manufacturers. The IDG-2030 uses the same Nasiri platform as other InvenSense inertial devices, with wafer-level integration of the MEMS sensor on top of the application specific integrated circuit (ASIC), thus providing only one die in the final LGA package.
Months later, STMicroelectronics released the L2G2IS, which shares the same dimensions. The device is manufactured using the same THELMA process as all STMicroelectronics inertial devices. The THELMA platform involves a two-die approach that is challenging for very thin package integration. However, both players now offer very low-cost gyros thanks to die size reduction and process optimization.
Both gyroscopes analyzed are 2-axis X, Y (Pitch, Roll). The two reports can be purchased separately or together in order to compare the technology and pricing of the main smartphone OIS gyro players, including previous generation products.
More information on that report at http://www.i-micronews.com/reports.html
Thermal Expert Infrared Camera for Smartphones and I3system I3BOL384_17A Micr...Yole Developpement
The highest resolution thermal camera for smartphones at 384 x 288 pixels, using a microbolometer with 17µm pixels from the South Korea’s I3 System.
Based on a high definition microbolometer from I3system, the Thermal Expert infrared camera is a high-end product for smartphones. A more conservative technological choice, the microbolometer is more expensive but offers better performance. The camera also embraces the quality approach with interchangeable lenses for different uses. I3system targets the professional market and competes more in standard IR cameras than IR cameras for smartphones.
The Thermal Expert camera is very compact and compatible with Android smartphones via its micro-USB-OTG connector. The camera does not use a battery, with power being supplied by the smartphone. The camera is shutterless.
The thermal camera uses a new 17µm pixel design from I3system. The I3BOL384_17A microbolometer features 384 x 288 pixel resolution, 24 times the resolution of the FLIR Lepton. The sensor technology in the I3system component is a titanium oxide microbolometer, technology which is not covered by Honeywell patents. The I3BOL384_17A is the consumer version of a military microbolometer.
This report presents a complete teardown analysis of the Thermal Expert camera and its microbolometer. Based on this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR One, Seek Thermal, Therm-App and Thermal Expert cameras and Lepton, EXC001, PICO384P and I3BOL384_17A microbolometers. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
The new 1200V MOSFET module from Rohm – with the first trench SiC MOSFET on the market – reduces power losses and has a higher performance/cost ratio than the previous generation
The BSM180D12P3C007 is a 1200V 180A SiC MOSFET module from Rohm for high power applications like motor drives, inverters, photovoltaics and induction heating equipment. In comparison with the previous generation of SiC MOSFETs, which have a planar structure, the trench structure halves on-resistance and reduces switching losses by 42%.
The BSM180D12P3C007 integrates the third generation high-voltage SiC power MOSFET dies with a current of 36A and the innovative trench structure. Ten SiC Schottky Barrier diodes are also integrated into the power module.
The BSM180D12P3C007 offers a higher operating temperature (up to 150°C) in a 45mm x 122mm x 21mm package.
The report goes into depth in its analysis of the packaging and the components, with images of the complex trench SiC structure.
It also includes production cost analysis and overall comparison with the planar SiC MOSFET from Rohm and the Cree CAS120M12BM2 module.
More information on that report at http://www.i-micronews.com/reports.html
First plasmonic filter sensor for consumer devices could disrupt optical applications.
The NSP32-V1 from NanoLambda is the world’s smallest optical spectrometer, and the first such device for Internet-of-Things and handheld devices. It could enable everyday analysis of food and water, color measurement, health monitoring and pollution detection. The data measured by the NSP32-V1 is the same output format as conventional optical spectrum analyzers, which facilitates the use of this device without creating a new database.
The NSP32-V1 spectrometer uses a 1024 pixel, 32 x 32, nano-optical filter array to measure the light spectrum, based on a technological breakthrough, the plasmonic filter. This is a metal film perforated with subwavelength hole arrays. It is manufactured within the metal layer of the silicon die, giving a monolithic solution.
The 100μm-high sensor die is assembled in an advanced ball grid array (BGA) package with an optical window for only 500μm height. The other optical parts, the lens and the diffuser, are assembled in a 5.7mm-high module. The module is very small overall, at just 6mm x 6mm x 5.3mm.
Based on a complete teardown analysis of the NSP32-V1 nano-spectrometer, the report provides a complete physical analysis and manufacturing cost estimate of the die and the packaging, including the lens module.
The report also includes a comparison between the characteristics of the NSP32-V1 and the SCIO molecular sensor from Consumer Physics. The comparison highlights differences in technical choices made by the companies and their impacts on the process flow and manufacturing cost.
More information on that report at http://www.i-micronews.com/reports.html
Delphi Integrated Radar and Camera System (RACam) 2016 teardown reverse costi...Yole Developpement
Delphi is the first to provide a single system combining 76Ghz Radar and Vision Sensing. With a compact design the system can be integrated behind the windshield and enables a broad array of active safety features, as lane tracking, collision avoidance or adaptive cruise control.
The visual detection is performed by a 1/3” CMOS Image Sensor supplied by a leader in the CIS automotive industry. The sensor is surmounted by a specific 7-lens module and the Mobileye EyeQ3 SoC is used for video processing. Concerning the radar function, Receiver and Transmitter chips from Infineon using SiGe HBT technology are assembled by wire bonding on the RF Board. The Antenna board uses a PTFE-based substrate and is equipped with planar antennas for transmission and reception of the RF signals.
Based on a complete teardown analysis of the Delphi RACam, the report provides the bill-of-material (BOM) and the manufacturing cost of the system. The report also includes analysis of the Image Sensor and Lens module. A structural analysis, with a comparison with Bosch MRR1, highlights the technical choices in RF design made by Delphi.
A physical analysis and manufacturing cost estimation of the Infineon RF chips is available in a separate report, which also includes a comparison with MMICs used in the Bosch MRR1 Radar.
More information on that report at http://www.i-micronews.com/reports.html
Apple iphone 6 and 6 plus front camera module teardown reverse costing report...Yole Developpement
For the iPhone 6 FaceTime camera module, Apple integrate an innovative CMOS Image Sensor constituted of an original structure of 4.8 MPixel sub-microlenses array mediated by the color filters to get the final 1.2 Mpixel resolution. This technical choice has a strong impact on the camera performances and on the device manufacturing cost.
The unique technology from Sony (Exmor-RS) consists in a stacking of a pixel array circuit which uses a Back-Side Illuminated (BSI) technology and a logic ISP circuit processed with a 65nm technology node. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process. This allows to raise the pixel array size by 15% and to considerably improve the light sensitivity by integrating an innovative grid and lenses design.
The camera module, with dimensions of 6.2 x 6.0 x 3.8mm, is equipped with a 4-elements lens module and a f/2.2 camera aperture which increase light sensitivity.
The report includes a comparison of Apple’s technical choices between iPhone6 Rear and Front camera.
24 camera modules for consumer and automotive applications, all from the main OEMs - analyzed and compared!
Smartphone manufacturers are increasingly integrating options and powerful components into their products. 3D and dual-camera modules are now available, offering better-image quality and providing more options, i.e. iris scanners and augmented reality.
The automotive camera module market is also rising steadily and is beginning to take significant market share.
Paralleling Yole Développement’s Camera Module Industry 2017 Market Report, this comparative review was conducted to provide insights into the structure and technology of 19 CMOS camera modules (CCM) released in flagship smartphones from the major brands.
In this report, rear and front-facing compact camera modules (including standard (mono), dual, iris scanners, and 3D camera modules) are analyzed and compared in terms of structural overview, module integration, lens number and dimensions, CIS res
olution, and pixel size. Indeed, OIS (Optical Image Stabilization) and dual-cameras are the big new trends for mobile camera modules.
More information on that report at http://www.i-micronews.com/reports.html
Tiny MEMS digital barometer for smartphones and wearables
The first barometric sensor from Infineon for the consumer market is targeting altitude, GPS, indoor and weather forecasting applications in portable devices. This MEMS sensor positions Infineon to compete with STMicroelectronics and Bosch Sensortec.
Infineon’s DPS310 pressure-sensing device is manufactured using a proprietary MEMS technology developed for and already sold for several years in the automotive market. The sensing element in the DPS310 is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is very small compared to traditional silicon micro-machined membranes. Moreover, Infineon has developed a capacitive sensor to be more accurate and less sensitive to temperature change compared to piezoresistive solutions.
For the DPS310, Infineon has introduced two important innovations. The first is a two-die solution more scalable than the monolithic solution used for some automotive pressure sensors.
The second innovation is a plastic metallized lid to replace the classic metal lid. The device comes in a tiny 2x2.5x0.9mm HLGA molded package.
The report presents a detailed analysis of the sensor’s structure and cost. Comparison with the characteristics of the STMicroelectronics pressure sensor LPS22HB and the Bosch Sensortec BMP280 highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
FLIR One 2nd Generation & FLIR LEPTON 3 IR Camera Core_2016 Report by Yole De...Yole Developpement
Second Generation FLIR ONE for Smartphones Featuring a Completely New LEPTON Core with 160x120 Pixels Resolution and 12µm Pixel Size
After the world’s first consumer thermal camera (FLIR One) in 2014, FLIR just released the second generation of the FLIR One featuring a completely new design and an upgraded Lepton core. The major achievement for FLIR has been to propose, in the same module size, a 4x improved resolution and a better FOV without consuming more power and at a lower cost!
Based on a complete teardown analysis of the new FLIR One for Android and iOS, the report provides a complete physical analysis and manufacturing cost estimation of the infrared camera and the Lepton infrared module as well as the technical choices made for this new generation.
The new Lepton 3 LWIR camera core shares almost the same dimensions than the previous Lepton core but offers a four times improved resolution of 160x120 pixels (versus 80x60 pixel for the Lepton 2). Despite this improvement, it consumes slightly the same power with 160mW versus 150mW. This achievement has been made possible by the reduction of the pixel size, from 17µm to 12µm in the Lepton 3. This new pixel size has been accompanied by new processes for the ROIC, the microbolometer and the wafer-level window with new technology node, new pixel integration with the ROIC and a simplified window which no longer needs an SOI wafer…
On the optical module side, strong efforts have been made to improve lenses resulting in a wider field of view (FOV). The lenses are still wafer-level silicon optics but area has been enhanced thanks to hexagonal shapes compared to square shapes previously.
To finish, a unique comparison between FLIR One 1st and 2nd Generation, Seek Thermal/Raytheon and Opgal Therm-App/Ulis cameras highlights the differences in technical choices and related cost made by each company.
ams’ Multi-Spectral Sensor in the Apple iPhone X 2017 teardown reverse costi...system_plus
The most advanced multispectral 6-channel ambient light sensor, supplied and produced by ams for its biggest customer, Apple.
For the semiconductor industry, the smartphone is a gold mine. Each component inside every OEM’s flagship phone holds substantial value for the component supplier, which sometimes gains a significant portion of the phone’s sales revenue too. Apple is one of the major OEMs that every supplier fights to work with, and for many years ams AG has been the world’s leading ambient light sensor (ALS) producer, due to its presence in every Apple iPhone.
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...Yole Developpement
Infrared camera and electronic control unit for advanced driver assistance systems based on FLIR night vision imaging technology
Based on a high definition ISC0901 microbolometer from FLIR, the Autoliv night vision infrared camera targets the high-end automotive market using two FLIR cores. Based on the solid first design from 2009, the microbolometer offers better performance in definition and frame rate. The camera also embraces the quality approach with a complex optical system and powers its night vision using sophisticated numerical processing based on an Altera field-programmable gate array (FPGA) and custom algorithm.
The Autoliv night vision camera consists of two modules, the camera and a remote processing unit. The system is made very compact and easy to integrate for car makers.
The ISC0901 thermal camera uses FLIR’s 17µm pixel design, optimized for automotive applications. Based on vanadium oxide technology, the ISC0901 microbolometer features a 336x256 resolution wafer level package, achieving an incredibly compact design.
The ISC0901 is the automotive version of a surveillance microbolometer. By using wafer level package technology to encapsulate the microbolometer FLIR offers the best price performance ratio.
This report is divided into two parts, one focused on the microbolometer and the second on the other systems. It is based on a complete teardown analysis of the night vision camera and the associated electronic control unit. Using this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR ISC0901, FLIR Lepton 3 and the PICO384P from ULIS. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing ...Yole Developpement
A look into Texas Instruments’ system-on-chip, including Sony/Softkinetic’s time-of-flight pixel technology, for industrial applications
Today, Time-of-Flight (ToF) systems are among the most innovative technologies offering imaging companies an opportunity to lead the market. Every major player wants to integrate these devices to provide functions such as 3D imaging, proximity sensing, ambient light sensing and gesture recognition.
Sony/Softkinetic has been investigating this technology deeply, providing a unique pixel technology to several image sensor manufacturers in three application areas: consumer, automotive and industrial. For industrial applications, Sony/Softkinetic has licensed its technology to Texas Instruments, which is providing ToF imagers for human detection or robot-human interaction.
The OPT8241 3D ToF imager is packaged using Chip-On-Glass (COG) technology. The device comprises a system-on-chip (SoC) and glass filter in the same component in thin, 0.7 mm-thick, packaging.
This report analyzes the complete component, from the glass near-infrared band-pass filter to the collector based on ToF pixel licenses developed by Sony/Softkinetic and adapted by Texas Instruments. The report includes a complete cost analysis and price estimation of the device based on a detailed description of the package, and the ToF imager.
It also features a complete ToF pixel technology comparison with the Infineon/pmd, STMicroelectronics and Melexis automotive ToF imagers, which are all also based on Sony/Softkinetic technology, with details on the companies’ design choices.
More information on that report at http://www.i-micronews.com/reports.html
FLIR Systems FLIR ONE & LEPTON Consumer Thermal Imager with Microbolometer te...Yole Developpement
Initially focused on the Military market, uncooled thermal camera sales have grown significantly due to the substantial cost reduction of microbolometers and growing adoption in commercial markets. With a vertically-integrated business model and a fabless structure, FLIR drive the commercial market’s price war.
Plugged into the back of an IPhone 5 or 5S, the FLIR ONE is the first consumer thermal camera featuring Long Wave Infrared (LWIR) technology. It contains a visible VGA (640x480) camera and a thermal camera which provide images blended using FLIR MSX Technology.
The thermal camera uses a new core, LEPTON, featuring a 80x60 pixels resolution with pixel size of 17µm. The sensor technology in the LEPTON core is an uncooled VOx microbolometer. Thanks to its strong integration at the core level with innovative wafer-level optics (WLO), wafer-level packaging (WLP) and custom ASIC use, this is the world's smallest microbolometer-based thermal imaging camera core.
Based on complete teardown analyses of the FLIR ONE and the LEPTON core, the reports provide the bill-of-material (BOM) and the manufacturing cost of the infrared camera as well as a complete physical analysis and manufacturing cost estimation of the infrared module.
The report also includes a comparison with FLIR i7 infrared camera and sensor, highlighting the technical choices made by FLIR to decrease by more than three the manufacturing cost at the camera level and the sensor level to made a consumer product.
Fingerprint Cards’ FPC1268 in the Huawei Mate 9 Pro & P10 series 2017 teardow...Yole Developpement
The world’s first capacitive fingerprint successfully integrated under glass, in collaboration with TPK
Fingerprint Cards AB (FPC), a leader in capacitive fingerprint technology, has over the last year equipped a large number of smartphones worldwide. One of its biggest clients, Huawei, traditionally integrates the latest technology in its flagship model every year. With the integration of the FPC1268 in the Huawei Mate 9 Pro and the Huawei P10 series, FPC has introduced a new kind of capacitive fingerprint integration: one that can be successfully integrated under glass. This technology, developed in collaboration with TPK, aims to be the new low-cost solution for fingerprint scanner integration.
Following the Mate 9 Pro, the Huawei P10 is the latest smartphone to feature the capacitive fingerprint completely hidden behind the cover glass. The sensor is located under the home button in the device’s front, under a unique TPK-developed glass cover that allows for new, highly attractive designs like the ultrasonic fingerprint.
Using the same process as FPC’s previous flagship product, the 1025, the integration no longer requires wire bonding but instead a specific TSV designed by an identified OSAT and based on Tessera’s WLCSP solution. While previously used for CIS integration, this is the first time it has been used for fingerprint. Along with the ASIC, the fingerprint is integrated into an LGA package which is soldered on a flex PCB and covered by TPK’s specially-designed glass.
Thanks to conductive layers, TPK’s solution allows for the precise detection and identification of the fingerprint under glass. Everything is packaged in a metal ring that forms part of the home button.
This report provides a complete analysis of chip fabrication and package processes, along with a cost estimate. Also included is a comparison with FPC’s previous capacitive fingerprint generation, the FPC1025, and Qualcomm’s new ultrasonic fingerprint, the Sense ID.
More information on that report at http://www.i-micronews.com/reports.html
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...Yole Developpement
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technology’s low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providers’ investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
SP20569 - IRay T3S Thermal Camera for Smartphonesystem_plus
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/iray-t3s-thermal-camera-for-smartphone/
Acoustic MEMS and Audio Solutions 2017 - Report by Yole DeveloppementYole Developpement
The audio business is about to experience profound changes
Audio is becoming a key function of multiple existing and new products that increasingly has to be analyzed as a complete landscape compared to independent devices. From mobile phones to cars, from home assistants to drones, audio products like microphones, speakers and audio integrated circuits (ICs) are essential for all the new systems driving consumer electronic markets. The total audio business was worth more than $15B in 2016. With a compound annual growth rate (CAGR) close to 6%, in 2022, the audio device market will be worth $20B and become a key feature in all the applications it is involved in. And there’s clearly room for more added value in the audio supply and value chain, as well as other significant changes.
In 2016, Yole estimates that the MEMS microphone market has almost reached the $1B milestone, with a value of $993M. Combined with the $700M electret condenser microphone (ECM) market, now the acquisition of sound is almost a $2B value market. The µspeaker market is estimated to be worth $8.7B, (meaning speakers less than two inches in diameter). In addition to these two visible elements of the audio chain, the audio IC market, which includes codecs, digital signal processors (DSPs) and amplifiers, is estimated to be worth $4.3B in 2016.
This new Yole report describes the evolution of the three audio functions, microphones, speakers and audio ICs, technical trends, as well as the evolution of the strategies of the main players to capture a larger part of this fast-growing field.
For more information about our report, please visit our website: https://www.i-micronews.com/reports.html
Samsung Galaxy S9+ Teardown and Identification of Key Components report publ...Yole Developpement
Discover Samsung’s key devices, advanced packaging technical choices and main suppliers.
More information on that report at https://www.i-micronews.com/report/product/samsung-galaxy-s9-teardown-and-identification-of-key-components.html
MEMS Microphone: Market, Applications and Business Trends 2014 2014 Report by...Yole Developpement
New opportunities and emerging applications continue to boost the MEMS microphone market with strong new players
MEMS MICROPHONE MARKET GROWTH WILL CONTINUE TO SOAR OVER THE NEXT SEVERAL YEARS
MEMS microphone market has been growing since its first appearance. The huge worldwide adoption of smartphones, each using more than one MEMS microphone, creates the wide integration and rocketing growth of the MEMS microphone market. Some smartphones are now using three microphones: one for voice capture, one or two for noise cancellation and one for voice recognition improvement.
The Internet of Things (IoT) and wearable electronics applications are emerging markets for MEMS microphones: new opportunities will create new momentum in this fast growing business. Smart watch, smart glasses, smart home & building, and vehicle voice control will be promising applications in the next few years.
Yole Développement believes that the MEMS microphone will remain one of the fastest growing MEMS components due to existing and new opportunities. The market will grow from $785M in 2013 to $1.65B by 2019. Shipments are expected to grow from 2.4B in 2013 to 6.6B units in 2019 which points to a market filled with opportunities for existing and new players.
In this report, Yole Développement has completely re-examined and updated the MEMS microphone market data to provide you with a clear 2013 to 2019 market forecast.
Medical and automotive MEMS microphone markets will grow, but the current markets are still small. The Internet of Things will definitely result in new opportunities for the automotive market. MEMS microphones facilitate man-machine communication and enable voice detection and control to make devices more effective. Increased device effectiveness will lead to greater opportunity.
In this report, we will provide a complete overview of traditional applications – mobile phone, notebook, camera and tablet, other consumer electronics, medical applications, and automotive applications – as well as identify emerging applications.
KNOWLES IS STILL ALIVE AND KICKING, BUT COMPETITION IS INCREASING!
The MEMS microphone market is huge and has many opportunities. Big players compete with different approaches and new comers keep entering the market.
The market is changing: Knowles’ domination is weakening; it has about 61% of the market now down from the 83% it had in 2010. However, total market expansion has increased Knowles’ MEMS microphone revenue from $173.5M in 2010 to $477M in 2013.
Even though Knowles is still the market leader, other players are competing to take its market share. However compared to 2012, Knowles managed to regain some market share in 2013: iPhone 5S and 5C are using two microphones from Knowles and one from AAC Technologies (AAC). Other players still have a long way to go if they want to take market share from Knowles...
New Receiver & Transmitter components with a SiGe:C HBT technology from Infineon
The new integrated Radar and Camera (RACam) 76GHz automotive radar from Delphi integrates receiver and transmitter components from Infineon. These components use the latest SiGe:C HBT technology.
The two bare dies RF component are developed and manufactured by Infineon. The two chips are integrated in the RF board with specific thermal management. The dies have wire bonding and are directly connected to microstrip line transmission which lead the signal to antenna via a specific way through the PCB.
The RF transistors are the newest generation SiGe:C HBT dies from Infineon. The circuits use advanced insulation structure and modern copper metal layers.
The report includes a complete physical analysis of the dies, with details on technical choices regarding the design and the manufacturing process. The SiGe HBT are equally analyzed.
Technical and cost overview of the evolution of radio frequency front-end module technologies integrated in 5G mmWave and Sub-6 GHz Phones.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-2-focus-on-5g-chipset/
Heart-Rate Monitor and Pulse Oximeter Sensor in LED Reflective Solution in the Samsung Galaxy S7
Maxim Integrated is a respected supplier for Samsung’s mobile phone flagships. From the 5th generation Galaxy S5 to the latest Galaxy S7, Maxim’s heart-rate sensor has always been found in the back of the smartphone. The Galaxy S7 uses the latest version of the heart-rate sensor, designed for both smartphone and wearables but very different to previous versions: the MAX30102.
The Samsung Galaxy S7 heart-rate sensor is located on the main board of the smartphone under the camera. The sensor is an optical heart-rate module and a pulse oximeter sensor in an LED reflective solution.
The main die features a photodiode area and an analysis part, with an integrated ambient light cancellation system comprising a photodetector and a wavelength cut-off filter based on Maxim’s proprietary technology. The component features two LEDs: one infra-red (IR) and one red. The LEDs are bonded on silicon substrates, the IR led is manufactured from AlInGaP material and the red LED from GaAs material.
The component is assembled with multiple devices in the package. Compared to the previous generation the design footprint and packaging are totally different. This has made the component more reliable.
Thanks to all these innovations, the MAX30102 is very cost effective, enforcing Maxim’s leadership in this domain.
Complete chip fabrication processes and cost estimation are presented in the report. It also includes comparison with the previous generation of the sensor that can be found in the Samsung Galaxy S6, highlighting and measuring all the differences.
More information on that report at http://www.i-micronews.com/reports.html
igh performance Vertical Thin Film with Vias (VTFV) dies in a new and more efficient packaging for harsh environment.
The LE UW U1A4, that belongs to OSTAR Headlamp Pro family, shows a breakdown voltage of 13.3V for a current of 1A (at 85°C) and delivers up to 1000 lumens at 5600K in a “20mm x 20mm” package. These performance are obtained due to a complex packaging and assembly process, completely described in this report.
Compared with the first generation of Osram’s packaged LED for exterior automotive headlamps, the new OSTAR Headlamp Pro comes with an enhanced design to increase the corrosion robustness and, for the first time, with a remote ceramic phosphor to increase efficiency.
This reverse costing report provides an estimation of the production cost of the LE UW U1A4. It describes the overall manufacturing process and highlights key points of innovation developed by OSRAM.
More information on that report at http://www.i-micronews.com/reports/OSRAM-OSTAR-Automotive-Headlamp-Pro/14/451/
Comparative packaging analysis of over 100 inertial, environmental, acoustic, optical and radio-frequency MEMS components from major manufacturers
MEMS device manufacturers have to choose between shrinking their products, or and adding functionality. This leads to certain categories of components slowing down packaging integration and evolution.
To complement Yole Développe-ment’s MEMS Packaging 2017 Market report, System Plus Consulting has conducted a comparative technology review to provide insights into the packaging structure and technology of around 80 consumer and 20 automotive MEMS products from leading suppliers, including Bosch, Texas Instruments, Broadcom, STMicroelectronics, Knowles…
Several types of device are compared: Environmental sensors, including pressure, humidity, gas and combo sensors; Inertial devices including accelerometers, gyroscopes, magnetometers and sensor hubs; Optical MEMS including microbolometers and micromirrors; Microphones; and Radio frequency (RF) MEMS including antenna tuners, RF filters and oscillators.
More information on that report at http://www.i-micronews.com/reports.html
Physical analysis and cost comparison of seven leading flagship smartphone cameras: Apple iPhone X/XS/XR, Samsung Galaxy S9, Huawei Mate 20 Pro and P20 Pro, Xiaomi Mi8 Explorer Edition, Oppo Find X and Vivo X21UD.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/mobile-camera-module-comparison-2019/
RF Front End modules and components for cellphones 2017 - Report by Yole Deve...Yole Developpement
A dynamic market with high responsivity to technical innovation, the RF front end industry is set to grow at 14% CAGR to reach $22.7B in 2022.
A market that will more than double in six years!
The radio-frequency (RF) front end and components market for cellphones is highly dynamic. From being worth $10.1B last year, it is expected to reach $22.7B in 2022. Such high growth is definitely something that players in other semiconductor markets would envy. However, the growth is not evenly distributed.
Filters represent the biggest business in the RF front end industry, and the value of this business will more than triple from 2016 to 2022. Most of this growth will derive from additional filtering needs from new antennas as well as the need for more filtering functionality due to multiple carrier aggregation (CA).
Power amplifiers (PAs) and low noise amplifiers (LNAs), the second biggest business, will be almost flat over the same period. High-end LTE PA market growth will be balanced by a shrinking 2G/3G market. The LNA market will grow steadily, especially thanks to the addition of new antennas.
Switches, the third biggest business, will double. This market will mainly be driven by antenna switches.
Lastly, antenna tuners, a small business today with an estimated $36M market value, will expand 7.5-fold to reach $272M in 2022. This growth is mainly due to tuning being added to both the main and the diversity antennas.
For more discussion, please visit our website: http://www.i-micronews.com/reports.html
Global Advanced Driver Assistance Systems (ADAS) Market: Trends and Opportuni...Daedal Research
The report titled “Global Advanced Driver Assistance Systems (ADAS) Market: Trends and Opportunities (2013-2018)” provides an in-depth analysis of global advanced driver assistance system market. For more mail me: info@daedal-research.com
A compact, cost-effective and high-performance driving assistance system.
The Mid Range Radar Sensor, with its three Transmitter and four Receiver channels, operates in the 76-77 GHz frequency band that is standard for automotive radar applications. The front version works with an aperture angle of up to +/- 45 degrees and can detect objects up to 160 meters away. With a compact design (using fan-out RF components from Infineon), the system is easy to integrate into a vehicle’s body.
The system integrates two electronic boards including Bosch, Freescale and STMicroelectronics circuits. The RF board is manufactured with an asymmetric structure using Hybrid PTFE/FR4 substrate and is equipped with planar antennas.
Infineon 77GHZ SiGe Monolithic Microwave Integrated Circuits (MMIC) are used as High-Freqency transmitter and receiver.. The two RF dies are packaged is the last version of the eWLB, the Fan-Out Wafer level Package developed and manufactured by Infineon.
Tiny MEMS digital barometer for smartphones and wearables
The first barometric sensor from Infineon for the consumer market is targeting altitude, GPS, indoor and weather forecasting applications in portable devices. This MEMS sensor positions Infineon to compete with STMicroelectronics and Bosch Sensortec.
Infineon’s DPS310 pressure-sensing device is manufactured using a proprietary MEMS technology developed for and already sold for several years in the automotive market. The sensing element in the DPS310 is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is very small compared to traditional silicon micro-machined membranes. Moreover, Infineon has developed a capacitive sensor to be more accurate and less sensitive to temperature change compared to piezoresistive solutions.
For the DPS310, Infineon has introduced two important innovations. The first is a two-die solution more scalable than the monolithic solution used for some automotive pressure sensors.
The second innovation is a plastic metallized lid to replace the classic metal lid. The device comes in a tiny 2x2.5x0.9mm HLGA molded package.
The report presents a detailed analysis of the sensor’s structure and cost. Comparison with the characteristics of the STMicroelectronics pressure sensor LPS22HB and the Bosch Sensortec BMP280 highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
FLIR One 2nd Generation & FLIR LEPTON 3 IR Camera Core_2016 Report by Yole De...Yole Developpement
Second Generation FLIR ONE for Smartphones Featuring a Completely New LEPTON Core with 160x120 Pixels Resolution and 12µm Pixel Size
After the world’s first consumer thermal camera (FLIR One) in 2014, FLIR just released the second generation of the FLIR One featuring a completely new design and an upgraded Lepton core. The major achievement for FLIR has been to propose, in the same module size, a 4x improved resolution and a better FOV without consuming more power and at a lower cost!
Based on a complete teardown analysis of the new FLIR One for Android and iOS, the report provides a complete physical analysis and manufacturing cost estimation of the infrared camera and the Lepton infrared module as well as the technical choices made for this new generation.
The new Lepton 3 LWIR camera core shares almost the same dimensions than the previous Lepton core but offers a four times improved resolution of 160x120 pixels (versus 80x60 pixel for the Lepton 2). Despite this improvement, it consumes slightly the same power with 160mW versus 150mW. This achievement has been made possible by the reduction of the pixel size, from 17µm to 12µm in the Lepton 3. This new pixel size has been accompanied by new processes for the ROIC, the microbolometer and the wafer-level window with new technology node, new pixel integration with the ROIC and a simplified window which no longer needs an SOI wafer…
On the optical module side, strong efforts have been made to improve lenses resulting in a wider field of view (FOV). The lenses are still wafer-level silicon optics but area has been enhanced thanks to hexagonal shapes compared to square shapes previously.
To finish, a unique comparison between FLIR One 1st and 2nd Generation, Seek Thermal/Raytheon and Opgal Therm-App/Ulis cameras highlights the differences in technical choices and related cost made by each company.
ams’ Multi-Spectral Sensor in the Apple iPhone X 2017 teardown reverse costi...system_plus
The most advanced multispectral 6-channel ambient light sensor, supplied and produced by ams for its biggest customer, Apple.
For the semiconductor industry, the smartphone is a gold mine. Each component inside every OEM’s flagship phone holds substantial value for the component supplier, which sometimes gains a significant portion of the phone’s sales revenue too. Apple is one of the major OEMs that every supplier fights to work with, and for many years ams AG has been the world’s leading ambient light sensor (ALS) producer, due to its presence in every Apple iPhone.
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...Yole Developpement
Infrared camera and electronic control unit for advanced driver assistance systems based on FLIR night vision imaging technology
Based on a high definition ISC0901 microbolometer from FLIR, the Autoliv night vision infrared camera targets the high-end automotive market using two FLIR cores. Based on the solid first design from 2009, the microbolometer offers better performance in definition and frame rate. The camera also embraces the quality approach with a complex optical system and powers its night vision using sophisticated numerical processing based on an Altera field-programmable gate array (FPGA) and custom algorithm.
The Autoliv night vision camera consists of two modules, the camera and a remote processing unit. The system is made very compact and easy to integrate for car makers.
The ISC0901 thermal camera uses FLIR’s 17µm pixel design, optimized for automotive applications. Based on vanadium oxide technology, the ISC0901 microbolometer features a 336x256 resolution wafer level package, achieving an incredibly compact design.
The ISC0901 is the automotive version of a surveillance microbolometer. By using wafer level package technology to encapsulate the microbolometer FLIR offers the best price performance ratio.
This report is divided into two parts, one focused on the microbolometer and the second on the other systems. It is based on a complete teardown analysis of the night vision camera and the associated electronic control unit. Using this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR ISC0901, FLIR Lepton 3 and the PICO384P from ULIS. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing ...Yole Developpement
A look into Texas Instruments’ system-on-chip, including Sony/Softkinetic’s time-of-flight pixel technology, for industrial applications
Today, Time-of-Flight (ToF) systems are among the most innovative technologies offering imaging companies an opportunity to lead the market. Every major player wants to integrate these devices to provide functions such as 3D imaging, proximity sensing, ambient light sensing and gesture recognition.
Sony/Softkinetic has been investigating this technology deeply, providing a unique pixel technology to several image sensor manufacturers in three application areas: consumer, automotive and industrial. For industrial applications, Sony/Softkinetic has licensed its technology to Texas Instruments, which is providing ToF imagers for human detection or robot-human interaction.
The OPT8241 3D ToF imager is packaged using Chip-On-Glass (COG) technology. The device comprises a system-on-chip (SoC) and glass filter in the same component in thin, 0.7 mm-thick, packaging.
This report analyzes the complete component, from the glass near-infrared band-pass filter to the collector based on ToF pixel licenses developed by Sony/Softkinetic and adapted by Texas Instruments. The report includes a complete cost analysis and price estimation of the device based on a detailed description of the package, and the ToF imager.
It also features a complete ToF pixel technology comparison with the Infineon/pmd, STMicroelectronics and Melexis automotive ToF imagers, which are all also based on Sony/Softkinetic technology, with details on the companies’ design choices.
More information on that report at http://www.i-micronews.com/reports.html
FLIR Systems FLIR ONE & LEPTON Consumer Thermal Imager with Microbolometer te...Yole Developpement
Initially focused on the Military market, uncooled thermal camera sales have grown significantly due to the substantial cost reduction of microbolometers and growing adoption in commercial markets. With a vertically-integrated business model and a fabless structure, FLIR drive the commercial market’s price war.
Plugged into the back of an IPhone 5 or 5S, the FLIR ONE is the first consumer thermal camera featuring Long Wave Infrared (LWIR) technology. It contains a visible VGA (640x480) camera and a thermal camera which provide images blended using FLIR MSX Technology.
The thermal camera uses a new core, LEPTON, featuring a 80x60 pixels resolution with pixel size of 17µm. The sensor technology in the LEPTON core is an uncooled VOx microbolometer. Thanks to its strong integration at the core level with innovative wafer-level optics (WLO), wafer-level packaging (WLP) and custom ASIC use, this is the world's smallest microbolometer-based thermal imaging camera core.
Based on complete teardown analyses of the FLIR ONE and the LEPTON core, the reports provide the bill-of-material (BOM) and the manufacturing cost of the infrared camera as well as a complete physical analysis and manufacturing cost estimation of the infrared module.
The report also includes a comparison with FLIR i7 infrared camera and sensor, highlighting the technical choices made by FLIR to decrease by more than three the manufacturing cost at the camera level and the sensor level to made a consumer product.
Fingerprint Cards’ FPC1268 in the Huawei Mate 9 Pro & P10 series 2017 teardow...Yole Developpement
The world’s first capacitive fingerprint successfully integrated under glass, in collaboration with TPK
Fingerprint Cards AB (FPC), a leader in capacitive fingerprint technology, has over the last year equipped a large number of smartphones worldwide. One of its biggest clients, Huawei, traditionally integrates the latest technology in its flagship model every year. With the integration of the FPC1268 in the Huawei Mate 9 Pro and the Huawei P10 series, FPC has introduced a new kind of capacitive fingerprint integration: one that can be successfully integrated under glass. This technology, developed in collaboration with TPK, aims to be the new low-cost solution for fingerprint scanner integration.
Following the Mate 9 Pro, the Huawei P10 is the latest smartphone to feature the capacitive fingerprint completely hidden behind the cover glass. The sensor is located under the home button in the device’s front, under a unique TPK-developed glass cover that allows for new, highly attractive designs like the ultrasonic fingerprint.
Using the same process as FPC’s previous flagship product, the 1025, the integration no longer requires wire bonding but instead a specific TSV designed by an identified OSAT and based on Tessera’s WLCSP solution. While previously used for CIS integration, this is the first time it has been used for fingerprint. Along with the ASIC, the fingerprint is integrated into an LGA package which is soldered on a flex PCB and covered by TPK’s specially-designed glass.
Thanks to conductive layers, TPK’s solution allows for the precise detection and identification of the fingerprint under glass. Everything is packaged in a metal ring that forms part of the home button.
This report provides a complete analysis of chip fabrication and package processes, along with a cost estimate. Also included is a comparison with FPC’s previous capacitive fingerprint generation, the FPC1025, and Qualcomm’s new ultrasonic fingerprint, the Sense ID.
More information on that report at http://www.i-micronews.com/reports.html
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...Yole Developpement
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technology’s low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providers’ investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
SP20569 - IRay T3S Thermal Camera for Smartphonesystem_plus
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/iray-t3s-thermal-camera-for-smartphone/
Acoustic MEMS and Audio Solutions 2017 - Report by Yole DeveloppementYole Developpement
The audio business is about to experience profound changes
Audio is becoming a key function of multiple existing and new products that increasingly has to be analyzed as a complete landscape compared to independent devices. From mobile phones to cars, from home assistants to drones, audio products like microphones, speakers and audio integrated circuits (ICs) are essential for all the new systems driving consumer electronic markets. The total audio business was worth more than $15B in 2016. With a compound annual growth rate (CAGR) close to 6%, in 2022, the audio device market will be worth $20B and become a key feature in all the applications it is involved in. And there’s clearly room for more added value in the audio supply and value chain, as well as other significant changes.
In 2016, Yole estimates that the MEMS microphone market has almost reached the $1B milestone, with a value of $993M. Combined with the $700M electret condenser microphone (ECM) market, now the acquisition of sound is almost a $2B value market. The µspeaker market is estimated to be worth $8.7B, (meaning speakers less than two inches in diameter). In addition to these two visible elements of the audio chain, the audio IC market, which includes codecs, digital signal processors (DSPs) and amplifiers, is estimated to be worth $4.3B in 2016.
This new Yole report describes the evolution of the three audio functions, microphones, speakers and audio ICs, technical trends, as well as the evolution of the strategies of the main players to capture a larger part of this fast-growing field.
For more information about our report, please visit our website: https://www.i-micronews.com/reports.html
Samsung Galaxy S9+ Teardown and Identification of Key Components report publ...Yole Developpement
Discover Samsung’s key devices, advanced packaging technical choices and main suppliers.
More information on that report at https://www.i-micronews.com/report/product/samsung-galaxy-s9-teardown-and-identification-of-key-components.html
MEMS Microphone: Market, Applications and Business Trends 2014 2014 Report by...Yole Developpement
New opportunities and emerging applications continue to boost the MEMS microphone market with strong new players
MEMS MICROPHONE MARKET GROWTH WILL CONTINUE TO SOAR OVER THE NEXT SEVERAL YEARS
MEMS microphone market has been growing since its first appearance. The huge worldwide adoption of smartphones, each using more than one MEMS microphone, creates the wide integration and rocketing growth of the MEMS microphone market. Some smartphones are now using three microphones: one for voice capture, one or two for noise cancellation and one for voice recognition improvement.
The Internet of Things (IoT) and wearable electronics applications are emerging markets for MEMS microphones: new opportunities will create new momentum in this fast growing business. Smart watch, smart glasses, smart home & building, and vehicle voice control will be promising applications in the next few years.
Yole Développement believes that the MEMS microphone will remain one of the fastest growing MEMS components due to existing and new opportunities. The market will grow from $785M in 2013 to $1.65B by 2019. Shipments are expected to grow from 2.4B in 2013 to 6.6B units in 2019 which points to a market filled with opportunities for existing and new players.
In this report, Yole Développement has completely re-examined and updated the MEMS microphone market data to provide you with a clear 2013 to 2019 market forecast.
Medical and automotive MEMS microphone markets will grow, but the current markets are still small. The Internet of Things will definitely result in new opportunities for the automotive market. MEMS microphones facilitate man-machine communication and enable voice detection and control to make devices more effective. Increased device effectiveness will lead to greater opportunity.
In this report, we will provide a complete overview of traditional applications – mobile phone, notebook, camera and tablet, other consumer electronics, medical applications, and automotive applications – as well as identify emerging applications.
KNOWLES IS STILL ALIVE AND KICKING, BUT COMPETITION IS INCREASING!
The MEMS microphone market is huge and has many opportunities. Big players compete with different approaches and new comers keep entering the market.
The market is changing: Knowles’ domination is weakening; it has about 61% of the market now down from the 83% it had in 2010. However, total market expansion has increased Knowles’ MEMS microphone revenue from $173.5M in 2010 to $477M in 2013.
Even though Knowles is still the market leader, other players are competing to take its market share. However compared to 2012, Knowles managed to regain some market share in 2013: iPhone 5S and 5C are using two microphones from Knowles and one from AAC Technologies (AAC). Other players still have a long way to go if they want to take market share from Knowles...
New Receiver & Transmitter components with a SiGe:C HBT technology from Infineon
The new integrated Radar and Camera (RACam) 76GHz automotive radar from Delphi integrates receiver and transmitter components from Infineon. These components use the latest SiGe:C HBT technology.
The two bare dies RF component are developed and manufactured by Infineon. The two chips are integrated in the RF board with specific thermal management. The dies have wire bonding and are directly connected to microstrip line transmission which lead the signal to antenna via a specific way through the PCB.
The RF transistors are the newest generation SiGe:C HBT dies from Infineon. The circuits use advanced insulation structure and modern copper metal layers.
The report includes a complete physical analysis of the dies, with details on technical choices regarding the design and the manufacturing process. The SiGe HBT are equally analyzed.
Technical and cost overview of the evolution of radio frequency front-end module technologies integrated in 5G mmWave and Sub-6 GHz Phones.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-2-focus-on-5g-chipset/
Heart-Rate Monitor and Pulse Oximeter Sensor in LED Reflective Solution in the Samsung Galaxy S7
Maxim Integrated is a respected supplier for Samsung’s mobile phone flagships. From the 5th generation Galaxy S5 to the latest Galaxy S7, Maxim’s heart-rate sensor has always been found in the back of the smartphone. The Galaxy S7 uses the latest version of the heart-rate sensor, designed for both smartphone and wearables but very different to previous versions: the MAX30102.
The Samsung Galaxy S7 heart-rate sensor is located on the main board of the smartphone under the camera. The sensor is an optical heart-rate module and a pulse oximeter sensor in an LED reflective solution.
The main die features a photodiode area and an analysis part, with an integrated ambient light cancellation system comprising a photodetector and a wavelength cut-off filter based on Maxim’s proprietary technology. The component features two LEDs: one infra-red (IR) and one red. The LEDs are bonded on silicon substrates, the IR led is manufactured from AlInGaP material and the red LED from GaAs material.
The component is assembled with multiple devices in the package. Compared to the previous generation the design footprint and packaging are totally different. This has made the component more reliable.
Thanks to all these innovations, the MAX30102 is very cost effective, enforcing Maxim’s leadership in this domain.
Complete chip fabrication processes and cost estimation are presented in the report. It also includes comparison with the previous generation of the sensor that can be found in the Samsung Galaxy S6, highlighting and measuring all the differences.
More information on that report at http://www.i-micronews.com/reports.html
igh performance Vertical Thin Film with Vias (VTFV) dies in a new and more efficient packaging for harsh environment.
The LE UW U1A4, that belongs to OSTAR Headlamp Pro family, shows a breakdown voltage of 13.3V for a current of 1A (at 85°C) and delivers up to 1000 lumens at 5600K in a “20mm x 20mm” package. These performance are obtained due to a complex packaging and assembly process, completely described in this report.
Compared with the first generation of Osram’s packaged LED for exterior automotive headlamps, the new OSTAR Headlamp Pro comes with an enhanced design to increase the corrosion robustness and, for the first time, with a remote ceramic phosphor to increase efficiency.
This reverse costing report provides an estimation of the production cost of the LE UW U1A4. It describes the overall manufacturing process and highlights key points of innovation developed by OSRAM.
More information on that report at http://www.i-micronews.com/reports/OSRAM-OSTAR-Automotive-Headlamp-Pro/14/451/
Comparative packaging analysis of over 100 inertial, environmental, acoustic, optical and radio-frequency MEMS components from major manufacturers
MEMS device manufacturers have to choose between shrinking their products, or and adding functionality. This leads to certain categories of components slowing down packaging integration and evolution.
To complement Yole Développe-ment’s MEMS Packaging 2017 Market report, System Plus Consulting has conducted a comparative technology review to provide insights into the packaging structure and technology of around 80 consumer and 20 automotive MEMS products from leading suppliers, including Bosch, Texas Instruments, Broadcom, STMicroelectronics, Knowles…
Several types of device are compared: Environmental sensors, including pressure, humidity, gas and combo sensors; Inertial devices including accelerometers, gyroscopes, magnetometers and sensor hubs; Optical MEMS including microbolometers and micromirrors; Microphones; and Radio frequency (RF) MEMS including antenna tuners, RF filters and oscillators.
More information on that report at http://www.i-micronews.com/reports.html
Physical analysis and cost comparison of seven leading flagship smartphone cameras: Apple iPhone X/XS/XR, Samsung Galaxy S9, Huawei Mate 20 Pro and P20 Pro, Xiaomi Mi8 Explorer Edition, Oppo Find X and Vivo X21UD.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/mobile-camera-module-comparison-2019/
RF Front End modules and components for cellphones 2017 - Report by Yole Deve...Yole Developpement
A dynamic market with high responsivity to technical innovation, the RF front end industry is set to grow at 14% CAGR to reach $22.7B in 2022.
A market that will more than double in six years!
The radio-frequency (RF) front end and components market for cellphones is highly dynamic. From being worth $10.1B last year, it is expected to reach $22.7B in 2022. Such high growth is definitely something that players in other semiconductor markets would envy. However, the growth is not evenly distributed.
Filters represent the biggest business in the RF front end industry, and the value of this business will more than triple from 2016 to 2022. Most of this growth will derive from additional filtering needs from new antennas as well as the need for more filtering functionality due to multiple carrier aggregation (CA).
Power amplifiers (PAs) and low noise amplifiers (LNAs), the second biggest business, will be almost flat over the same period. High-end LTE PA market growth will be balanced by a shrinking 2G/3G market. The LNA market will grow steadily, especially thanks to the addition of new antennas.
Switches, the third biggest business, will double. This market will mainly be driven by antenna switches.
Lastly, antenna tuners, a small business today with an estimated $36M market value, will expand 7.5-fold to reach $272M in 2022. This growth is mainly due to tuning being added to both the main and the diversity antennas.
For more discussion, please visit our website: http://www.i-micronews.com/reports.html
Global Advanced Driver Assistance Systems (ADAS) Market: Trends and Opportuni...Daedal Research
The report titled “Global Advanced Driver Assistance Systems (ADAS) Market: Trends and Opportunities (2013-2018)” provides an in-depth analysis of global advanced driver assistance system market. For more mail me: info@daedal-research.com
A compact, cost-effective and high-performance driving assistance system.
The Mid Range Radar Sensor, with its three Transmitter and four Receiver channels, operates in the 76-77 GHz frequency band that is standard for automotive radar applications. The front version works with an aperture angle of up to +/- 45 degrees and can detect objects up to 160 meters away. With a compact design (using fan-out RF components from Infineon), the system is easy to integrate into a vehicle’s body.
The system integrates two electronic boards including Bosch, Freescale and STMicroelectronics circuits. The RF board is manufactured with an asymmetric structure using Hybrid PTFE/FR4 substrate and is equipped with planar antennas.
Infineon 77GHZ SiGe Monolithic Microwave Integrated Circuits (MMIC) are used as High-Freqency transmitter and receiver.. The two RF dies are packaged is the last version of the eWLB, the Fan-Out Wafer level Package developed and manufactured by Infineon.
The Global Automotive RADAR applications Market Research Report 2016 give insights upon the world's major regional market conditions of the Automotive RADAR applications industry which mainly focus upon the main regions which include continents like North America, Europe and Asia and the main countries i.e. United States, Germany, Japan and China.
Request to Sample of This Report @ https://marketreportscenter.com/request-sample/345256
2015 D-STOP Symposium session by Robert Heath, UT Austin's Wireless Networking & Communications Group.
Get symposium details: http://ctr.utexas.edu/research/d-stop/education/annual-symposium/
Advanced driver assistance systems are designed to increase car safety more generally road safety.
Basically Advanced driver assists(ADS) systems helps the driver in the driving process and enables safe, relaxed driving. It makes sense to get your new car with driver assist features if you find it at a reasonable price as it helps you drive easily and safely in everyday use.
This is a presentation that focuses on autonomous vehicles technology. The presentation describes key sensor technologies integrated under the bonnet of a driverless car. After a brief introduction, the presentation dwells deeper into each sensor technology demonstrating examples of self driving cars such as Google's self driving car, DARPA URBAN challenge etc., along the way. It also introduces the concept of electronic control units which is responsible for collecting data from different sensors and respond to other units accordingly. The slides also build a platform for vehicle to vehicle communication technology, types and its application areas.
Autonomous vehicles: becoming economically feasible through improvements in l...Jeffrey Funk
These slides use concepts from my (Jeff Funk) course entitled analyzing hi-tech opportunities to analyze how autonomous vehicles are becoming economically feasible throug through improvements in lasers, microelectronic mechanical systems (MEMS), integrated circuits (ICs), and other components. Although the cost of the Google Car is currently about 150,000 USD, 30% annual improvements in lasers, MEMS, and ICs will make these economically feasible for a broad number of users in the next ten years. A key issue is when certain lanes, roads or even entire highway systems are restricted to automated vehicles. This would enable collision avoidance to rely more on between-vehicle communications. This would further reduce the cost of automated vehicles, stimulate diffusion, and also reduce transportation time and increase fuel efficiency.
Autonomous Vehicles: Technologies, Economics, and OpportunitiesJeffrey Funk
These slides use concepts from my (Jeff Funk) course entitled analyzing hi-tech opportunities to show how the cost and performance of autonomous vehicles are improving rapidly. LIDAR, other sensors, ICs, and wireless are experiencing rapid improvements that are enabling the overall cost of AVs to fall. For example, the latency of wireless systems is improving rapidly thus enabling vehicles to be controlled with wireless systems. This is also creating many new opportunities in the vehicle industry in the Internet of Things, data analytics, and logistics. The slides include a detailed discussion of AVs in Singapore, a likely early adopter.
Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony teardow...Yole Developpement
Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony
All in one CMOS Image Sensor: 2 levels Copper TSVs / Stacked ISP circuit with pixel array circuit / Smaller device with better sensitivity
For the iPhone 5S iSight camera module, Apple continues to integrate a 8Mpixel resolution CMOS Image Sensor. They achieve to obtain 33% increase in light sensitivity by improving the camera aperture from f/2.4 to f/2.2 and by rising the pixel size from 1.4µm to 1.5µm.
The unique technology from Sony (Exmor-RS) allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity by keeping a similar cost compared to the pervious CIS. The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit processed with a 65nm technology node. The two circuits are stacked with a wafer bonding process and connected together with copper TSVs.
The camera module, with dimensions of 8.5 x 7.8 x 5.7mm, is equipped with a 5-elements lens module and a VCM auto-focus actuator. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process.
COMPLETE TEARDOWN WITH:
- Detailed Photos
- Precise Measurements
- Material Analysis
- Manufacturing Process Flow
- Supply Chain Evaluation
- Manufacturing Cost Analysis
- Selling Price Estimation
- Comparison with previous technology choices from Sony
More information on that report at http://www.i-micronews.com/reports/Apple-iPhone-5S-Camera-Module-8Mpixel-1-5%C2%B5m-Stacked-BSI-CIS/19/434/
InvenSense MP67B 6-Axis MEMS IMU in iPhone 6 & 6 Plus 2015 teardown reverse c...Yole Developpement
InvenSense MP67B
6-Axis MEMS IMU in iPhone 6 & 6 Plus
InvenSense's first design win in Apple iPhone
InvenSense's Second Generation 6-Axis Devices for Consumer Applications
With 74.5 million units of iPhone sold during the last quarter 2014, InvenSense made a very good deal by replacing STMicroelectronics as the supplier of the gyroscope for the iPhone 6 and 6 Plus.
The MP67B is a custom version of InvenSense 6-Axis device (3-Axis gyroscope + 3-Axis accelerometer) made for Apple. Compared to InvenSense’s standard 6-Axis device MPU-6500, specific modifications have been realized. The main ones consist in the package modification with the use of a LGA substrate compared to a QFN leadframe, and in the ASIC which has been redesigned.
The MP67B uses a different design than InvenSense’s first generation 6-axis device with a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefit of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.
The report includes a complete comparison with InvenSense standard 6-Axis (MPU-6500) and with InvenSense first generation 6-Axis device.
More information on that report at http://www.i-micronews.com/reports.html
Intel® Curie™ Module High Density System-in-Package for IoT 2016 teardown rev...Yole Developpement
Ultra-small, low-power hardware module for wearables
Intel®, whose microprocessors can be found in almost every computer worldwide, has commenced the 2016 “wearables race” by introducing the Intel® Curie™ module. This tiny system-in-package (SiP) can be found in the latest Arduino® Board: the Genuino 101 for the European version and the Arduino 101 for the US version. The module includes the Intel Quark chip, Bluetooth low-energy radio, sensors, and battery charging, all in a single package of less than 150mm3.
This complete, low-power solution comes with computing, motion sensing, Bluetooth low energy, battery charging, and pattern matching capabilities for optimal sensor data analysis, enabling quick and easy identification of actions and motions. The module is packaged in a tiny form factor and runs a new software platform created especially for the Intel Curie module.
Located on the main board, the system uses non-conventional packaging developed by Intel. The main microcontroller is located at the bottom of the package, with features like Bluetooth and sensors placed on top.
More information on that report at http://www.i-micronews.com/reports.html
Advanced System-in-Package Technology in Apple’s AirPods Prosystem_plus
Analysis of Apple’s first SiP found in the latest AirPods, featuring a fully integrated SiP for audio codec and Bluetooth connectivity.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/advanced-system-in-package-technology-in-apples-airpods-pro/
STMicroelectronics’ Near Infrared Camera Sensor in the Apple iPhone X - 2017 ...system_plus
The first NIR camera sensor with multiple innovations based on imager-silicon-oninsulator substrate from SOITEC, supplied and produced by STMicroelectronics for the Apple True Depth Module.
COMPLETE TEARDOWN WITH:
• Detailed photos
• Precise measurements
• Materials analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Estimated sales price
More information on that report at http://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-near-infrared-camera-sensor-in-the-apple-iphone-x/
hilips integrates in its smartphone
the innovative fingerprint sensor developed by EgisTec
After a first introduction in the Aurora i966, EgisTec integrates again its fingerprint ET300 in the Philips i999, a smartphone for the Chinese market.
With very simple technical choices concerning the technical detection design and the packaging, EgisTec offers a very competitive sensor in terms of size and manufacturing cost.
Located on the back side of the smartphone, the fingerprint sensor of the Philips i999 has dimensions of 11.6 x 11.6. It is assembled on a square LGA packaging and is protected by metal support.
The sensor has a resolution of 17,920 pixels with a pixel density of 500ppi. It uses a capacitive touch technology to take an image of the fingerprint from the subepidermal layers of the skin.
The sensor die is manufactured with CMOS 0.15µm technology and it is connected by mean of wire bonding to the rigid PCB.
Thanks to its design and manufacturing process, EgisTec device is very smart and cost effective in respect to the competitors.
The report includes comparisons with the latest Huawei’s, Samsung’s and Apple’s fingerprints buttons.
More information on that report at http://www.i-micronews.com/reports.html
Fairchild’s first consumer IMU manufactured using a completely new bulk micro machining process and interconnection structure.
Fairchild enters the market of combo sensors, and particularly 6-axis IMU, with its first consumer IMU bundled with Fairchild's high-performance 9-axis sensor fusion algorithms, XKF3™, and on-chip AttitudeEngine™ motion processor.
Fairchild is presenting a product completely different than other devices on the market, from size, manufacturing process and cost point of view.
Fairchild proposes a 3.3x3.3x1mm device, a footprint increased by 18% when compared with the latest STMicroelectronics and Bosch 6-axis IMU.
The device presents one ASIC and one MEMS die stacked on 2 layers PCB and connected by wire bonding. The electrical connections in the MEMS structure are performed by TSV which allows a better utilization of the space and a larger gyroscope and accelerometer areas.
On the process side, new techniques has been introduced in the MEMS fabrication. The MEMS die is manufactured by bulk micromachining on three wafers bonded together by eutectic and direct bonding.
The FIS1100 targets wearable sensors for sports, fitness, and health; pedestrian navigation; autonomous robots; and virtual and augmented reality.
The report includes a detailed technology and cost comparison with ST’s new generation LSM6DS3 and with leading edge 6-Axis IMUs from Bosch Sensortec (BMI160) and InvenSense (MPU-6500).
Opgal Therm-App Infrared Camera & Ulis IR Microbolometer teardown reverse cos...Yole Developpement
Opgal Therm-App Infrared Camera & Ulis IR Microbolometer
The highest resolution thermal camera for smartphone, 384 x 288 pixels using a microbolometer with 17µm pixel from Ulis.
Based on a high definition microbolometer from Ulis, the Therm-App infrared camera is a high-end product for smartphone. More conservative in their technological choices, the microbolometer is more expensive but better performance. The choice of the quality is also in the camera with the possibility of interchangeable lenses in function of the use. Opgal and Ulis target the professional market and are more in competition with standard IR cameras than with IR cameras for mobile.
The Therm-App camera has a very compact size and is compatible with Android smartphones via its micro-USB-OTG connector. The camera is shutterless and a interchangeable lenses system allow to upgrade the camera for the near or faraway application...
Industry’s first Custom-Programmable System-in-Package 9-Axis Motion Sensor
Like its competitor InvenSense, BOSCH Sensortec has unveiled a programmable all-in-one motion sensor for robotics, gaming, and household IoT devices, touted as the industry’s first custom-programmable 9-axis motion sensor.
The BMF055 is a new version of the BOSCH Sensortec 9-axis device (3-axis Gyroscope + 3-axis Accelerometer + 3-axis Magnetometer), with a MCU included in the package. Compared to the stand-alone sensor hub, this new approach eliminates a package and reduces system-level power. This device integrates six-chip in a complex System-in-Package.
The sensor hub combines a 14-bit accelerometer, a 16-bit gyroscope, and a geomagnetic sensor with a 32-bit ARM Cortex M0+ core. Compared to rivals, BOSCH Sensortec targets a broader range of customer applications with a high precision-sensor and dedicated MCU.
With BOSCH Sensortec’s approach, the MEMS sensor and the ASIC are fabricated separately. Final assembly entails wire bonding of all parts . The BMF055 is shipped in a 5.8x3.2x1.15mm LGA package, a footprint that’s larger than the competition.
This report features a detailed technology and cost comparison with the leading-edge sensor hub from InvenSense, highlighting the different choices from the two different designers.
More information on that report at http://www.i-micronews.com/reports.html
Nokia Lumia 920 - Camera Module with OIS teardown Report by published Yole De...Yole Developpement
Nokia Lumia 920 Camera Module with OIS
The first smartphone's camera module integrating Optical Image Stabilization (OIS) realized with a dual-core 3-axis MEMS gyroscope and a floating lens technology
While Digital Still Cameras commonly use optical image stabilization, it was not included in smartphones. The Nokia Lumia 920 is the first smartphone featuring an OIS function.
To performs Optical Image Stabilization, the camera module includes a floating lens technology which consists in moving the 5-elements lens module in perfect synchronization with the camera movement.
More information on that report at http://www.i-micronews.com/reports/Nokia-Lumia-920-Camera-Module-OIS/19/370/
Olympus and Given Imaging are leading intellectual property in the capsule endoscopy industry, but for how long?
The global capsule endoscopy systems market is expected to show a significant growth with the rise in aging population who require much medical care. However, since 2009, the number of new patent applications are decreasing. As the industry matures, there’s less and less room for breakthrough innovation and fundamental patents that could shape the industry. In such conditions, we can expect an increase in patent cross-licensing agreements, acquisitions (e.g. Covidien acquisition of Given Imaging) and litigation between the industry players in the next few years.
Capsule endoscopy is a medical procedure which has revolutionized endoscopy as it has enabled for the first time a painless inspection of the small intestine. The procedure was unveiled in 2000 and is based on a vitaminsize pill which captures images of the digestive tract while it is transported passively by peristalsis. The device consists of an image sensor, an illumination module, a radio-frequency transmitter and a battery.
More information on that report at http://www.i-micronews.com/reports/Capsule-Endoscopy-Patent-Landscape-2014/4/458/
Seek Thermal Infrared Camera & Raytheon IR Microbolometer teardown reverse co...Yole Developpement
The highest resolution thermal camera for smartphone, 156 x 206 pixels, using a microbolometer with 12 µm pixel from Raytheon, compatible with Android and IOS.
Initially focused on the military market, uncooled thermal camera sales have grown significantly due to the substantial cost reduction of microbolometers and growing adoption in commercial markets. With the partnership with Seek Thermal and a fabless structure, Raytheon enters in the consumer market...
Comparative analysis of thermal management solution analysis of 10 flagship smartphones from Apple, Samsung, Huawei, LG and Xiaomi.
A smartphone contains several components that generate heat and other components sensitive to heat; to maintain acceptable temperature levels in these small handheld devices, manufacturers propose different solutions which require high performance and design constraints.
To complement Yole Développement’s Market Opportunities for Thermal Management Components in Smartphones report, System Plus Consulting has conducted a comparative technology review to provide insights into the assembling structure and thermal management technology of 10 flagship smartphones from leading suppliers: Apple, Samsung, Huawei, LG and Xiaomi.
In this report, we highlight the differences and the innovations in the thermal management solutions chosen by the end-user OEMs.
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...system_plus
Fourth generation of the S-Cam family from the leading ADAS camera player.
Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/zf-s-cam-4-forward-automotive-mono-and-tri-camera-for-adas/
Advanced packaging technology in the Apple Watch Series 4’s System-in-Packagesystem_plus
Four major packaging technologies: TSMC’s info, ASE’s Double Side Molding/SESUB and SiP, Skyworks’ Double Side BGA.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/advanced-packaging-technology-in-the-apple-watch-series-4s-system-in-package/
Bosch’s first 6-Axis IMU for Automotive Application combining 3-Axis Gyroscope and 3-Axis Accelerometer
MEMS are getting broadly adopted in the automotive industry and non-safety applications like in-dash navigation are now requiring low-cost and small footprint components.
The SMI130 combines a 12-bit 3-Axis accelerometer and a 16-bit 3-Axis gyroscope in a 4.5x3.0mm LGA packages which is AEC-Q100 qualified for automotive applications. The measurement range of the yaw rate sensor can be adjusted in up to five steps between ±125°/s and ±2000°/s; the acceleration sensor offers four different measurement ranges between ±2g and ±16g.
The gyro integrates a new process for the capping. Indeed, the classic "glass-frit" wafer bonding has been abandoned in favor of an eutectic Aluminum-Germanium bonding.
The accelerometer features a new design which uses now only one mass structure for the moving parts compared to three for the previous generations.
The SMI130 is designed for non-safety-critical applications in the automotive industry, including in-dash navigation and telematics systems such as toll, eCall, and alarm systems.
More information on that report at http://www.i-micronews.com/reports.html
InvenSense ICS-43432 Digital MEMS Microphone teardown reverse costing report...Yole Developpement
Following the acquisition of MEMS Microphone Business Line of Analog Devices for 100M$ in October 2013, InvenSense releases a high performance digital MEMS Microphone for consumer applications.
The ICS-43432 is a digital microphone equipped with MEMS and amplification ASIC into a single chip. It is designed using CMOS process, it has I2S protocol interface and a high SNR of 65 dBA. It is assembled in a 6-pins LGA 4.0 x 3.0 x 1.0mm package with bottom port.
The MEMS transducer is a condenser microphone with a flexible poly-Si membrane and a rigid reference electrode manufactured on SOI substrate. Compared with state of the art MEMS Microphones, it presents a new design of the diaphragm with octagonal shape and central fixation.
The reverse costing report contains a detailed analysis of the device design and process, its manufacturing cost, as well as a benchmark with competitors’ MEMS microphones.
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
PHP Frameworks: I want to break free (IPC Berlin 2024)Ralf Eggert
In this presentation, we examine the challenges and limitations of relying too heavily on PHP frameworks in web development. We discuss the history of PHP and its frameworks to understand how this dependence has evolved. The focus will be on providing concrete tips and strategies to reduce reliance on these frameworks, based on real-world examples and practical considerations. The goal is to equip developers with the skills and knowledge to create more flexible and future-proof web applications. We'll explore the importance of maintaining autonomy in a rapidly changing tech landscape and how to make informed decisions in PHP development.
This talk is aimed at encouraging a more independent approach to using PHP frameworks, moving towards a more flexible and future-proof approach to PHP development.
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Ramesh Iyer
In today's fast-changing business world, Companies that adapt and embrace new ideas often need help to keep up with the competition. However, fostering a culture of innovation takes much work. It takes vision, leadership and willingness to take risks in the right proportion. Sachin Dev Duggal, co-founder of Builder.ai, has perfected the art of this balance, creating a company culture where creativity and growth are nurtured at each stage.
Epistemic Interaction - tuning interfaces to provide information for AI supportAlan Dix
Paper presented at SYNERGY workshop at AVI 2024, Genoa, Italy. 3rd June 2024
https://alandix.com/academic/papers/synergy2024-epistemic/
As machine learning integrates deeper into human-computer interactions, the concept of epistemic interaction emerges, aiming to refine these interactions to enhance system adaptability. This approach encourages minor, intentional adjustments in user behaviour to enrich the data available for system learning. This paper introduces epistemic interaction within the context of human-system communication, illustrating how deliberate interaction design can improve system understanding and adaptation. Through concrete examples, we demonstrate the potential of epistemic interaction to significantly advance human-computer interaction by leveraging intuitive human communication strategies to inform system design and functionality, offering a novel pathway for enriching user-system engagements.
SAP Sapphire 2024 - ASUG301 building better apps with SAP Fiori.pdfPeter Spielvogel
Building better applications for business users with SAP Fiori.
• What is SAP Fiori and why it matters to you
• How a better user experience drives measurable business benefits
• How to get started with SAP Fiori today
• How SAP Fiori elements accelerates application development
• How SAP Build Code includes SAP Fiori tools and other generative artificial intelligence capabilities
• How SAP Fiori paves the way for using AI in SAP apps
Smart TV Buyer Insights Survey 2024 by 91mobiles.pdf91mobiles
91mobiles recently conducted a Smart TV Buyer Insights Survey in which we asked over 3,000 respondents about the TV they own, aspects they look at on a new TV, and their TV buying preferences.
Le nuove frontiere dell'AI nell'RPA con UiPath Autopilot™UiPathCommunity
In questo evento online gratuito, organizzato dalla Community Italiana di UiPath, potrai esplorare le nuove funzionalità di Autopilot, il tool che integra l'Intelligenza Artificiale nei processi di sviluppo e utilizzo delle Automazioni.
📕 Vedremo insieme alcuni esempi dell'utilizzo di Autopilot in diversi tool della Suite UiPath:
Autopilot per Studio Web
Autopilot per Studio
Autopilot per Apps
Clipboard AI
GenAI applicata alla Document Understanding
👨🏫👨💻 Speakers:
Stefano Negro, UiPath MVPx3, RPA Tech Lead @ BSP Consultant
Flavio Martinelli, UiPath MVP 2023, Technical Account Manager @UiPath
Andrei Tasca, RPA Solutions Team Lead @NTT Data
22. COMPLETE TEARDOWN WITH:
• Detailed photos
• Precise measurements
• Material analysis
• Manufacturing process
flow
• Supply chain evaluation
• Manufacturing cost
analysis
• Selling price estimate
• Comparison with Samsung
Galaxy S7 & iPhone 6S
camera module
• Comparison with Huawei
P9 dual camera module
Apple iPhone 7 Plus:
Rear-Facing Dual Camera Module
Title: Apple iPhone 7 Plus
Rear-Facing Dual Camera
Module
Pages: 145
Date: November 2016
Format: PDF & Excel file
Price: Full report: EUR 3,490
In the iPhone 7 Plus, Apple
introduced a new rear camera
module. Like its competitors LG and
Huawei, they have chosen to
integrate a dual camera. The module
features two sensors, one closed to
the sensor in the previous flagship,
With its choice of a dual camera, Apple’s innovations include new objectives
lens assemblies, new bonding processes and a new type of autofocus
and another with a totally new structure.
Competition for the best camera phone was revived by Huawei with its
flagship, the P9, using a dual camera. Like the other main players except
Samsung, Apple has now introduced a dual camera module. This module
integrates two 12 megapixel resolution CMOS Image Sensors (CISs) from Sony,
using Exmor-RS Technology. The wide-angle objective lens assembly features
an aperture of f/1.8 and a pixel size of 1.22 µm. The telephoto has a pixel size
of 1 µm but a smaller aperture of f/2.8.
The iPhone 7 Plus dual camera module, with dimensions of 20.6 x 10.0 x 5.9
mm, is equipped with two sub-modules each including a Sony CIS. The wide-
angle module is equipped with an optical image stabilization (OIS) voice coil
motor (VCM), while the telephoto only comes with a general VCM. The CISs
are assembled using a flip-chip process on a ceramic substrate with a gold
stud bumping process.
With this new dual camera module and Sony’s Exmor-RS technology, Apple
has innovated its offering in areas including phase detection autofocus (PDAF),
its objective lens assembly structure, its sensor, and adopts a second
generation of through-silicon vias (TSVs). Surprisingly both logic circuit sensors
for controlling PDAF are very similar.
The report includes technology and cost analysis of the iPhone 7 Plus dual
camera module. Also, comparisons with the Huawei P9, Samsung Galaxy S7
and iPhone 6S rear camera modules are provided. These comparisons
highlight differences in structures, technical choices and manufacturing cost.
23. Véronique is in charge of
structure analysis of semi-
conductors. She has a deep
knowledge in chemical &
physical technical analyses. She
previously worked for 20 years
in Atmel Nantes Laboratory.
Author (Lab):
Véronique
Le Troadec
AUTHORS:
sical analysis. He has a deep
knowledge in chemical and
physical analyses. He
previously worked in micro-
electronics R&D for CEA/LETI
in Grenoble and for
STMicroelectronics in Crolles.
Nicolas
Radufe (Lab)
N ico las is in
charge of phy-
Performed by
TABLE OF CONTENTS
Overview/Introduction
Dual Camera Module Supply
Chain and Company Profile
iPhone 7 Plus Teardown
Physical Analysis
• Physical Analysis Methodology
• Dual Camera Module View and
Dimensions
• Dual Camera Module Disassembly
• Cross-Section of the Dual Camera
Module, Housing, Flex PCB, and
IR Filter
• Comparison With Apple iPhone
6S Plus Structure
• CMOS Image Sensors
View and dimensions
Pads and tungsten grid
CIS pixels
• Cross-Section of the CMOS Image
Sensor
Overview
Pixel array and logic circuit
• Comparison of Right / Left CMOS
Image Sensors
• Comparison With Huawei P9,
Samsung Galaxy S7 and Apple
iPhone 6S Plus
CIS Manufacturing Process Flow
• Overview
• Logic Circuit Front-End, Pixel Array
Circuit Process
• BSI + TSV + Microlens Processes /
Wide angle & Telephoto CIS
• CIS Wafer Fabrication Unit
Cost Analysis
• Yield Hypotheses
• CMOS Image Sensor Cost
• Wide angle CMOS Image Sensor /
Telephoto CMOS Image Sensor
Front-end costs: logic circuit,
pixel array, BSI and TSV Color
filter and Microlens
Total front-end cost
Back-end: tests and dicing
CIS wafer and die cost
• Dual Camera Module Assembly
Cost
• Lens Module Cost
• AFA Cost
• Final Assembly Cost
• Dual Camera Module Cost
Estimated Price Analysis
Comparison with Huawei P9,
Galaxy S7 and iPhone 6S Plus cost
System Plus Consulting offers
powerful costing tools to
evaluate the production cost &
selling price from single chip to
complex structures.
IC Price+
The tool performs the necessary
cost simulation of any
Integrated Circuit: ASICs,
microcontrollers, memories,
DSP, smartpower…
3D Package Cosim+
Cost simulation tool to evaluate
the cost of any Packaging
process: Wafer-level packaging,
TSV, 3D integration…
ANALYSIS PERFORMED WITH OUR COSTING TOOLS POWER COSIM+ AND POWER PRICE+
of materials characterizations
and electronics systems. He
holds an Engineering Degree
in Electronics and Numerical
Technology, and a PhD in
Materials for Micro-
electronics.
Stéphane
Elisabeth
Stéphane has a
deep knowledge
IC Price+
3D-Package CoSim+
24. Huawei P9 Rear-Facing
Dual Camera Module
Camera Module Industry
2015 - Mobile CCM
Technology Review
Status of the CMOS
Image Sensor Industry
2016
With strategic technical choices in
its dual camera module, Huawei is
seeking to differentiate itself from
Samsung and Apple.
19 Camera Modules from the
main OEM analyzed and
compared !
New functions are pushing change
in CMOS image sensors, boosting
the market toward $18.8B in 2021
at 10.4% CAGR.
Pages: 145
Date: July 2016
Full report: EUR 3,490*
Pages: 200
Date: December 2015
Full report: EUR 4,990*
Pages: 190
Date: June 2016
Full report: EUR 6,490*
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Each year System Plus Consulting releases a comprehensive collection of new reverse engineering &
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology
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