The 3D camera is using infrared active stereo depth and red/green/blue sensors, and a VCSEL projector.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/intel-realsense-d435-3d-active-ir-stereo-depth-camera/
Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse ...Yole Developpement
INNOVATIVE 3D CAMERA FOR FACIAL ANALYSIS AND HAND/FINGER TRACKING, BASED ON RESONANT MICRO-MIRROR, IR LASER, VISIBLE AND NEAR INFRARED IMAGE SENSORS.
Intel RealSense is an intelligent 3D camera equipped with a system of three components: a conventional camera, a near infrared image sensor and an infrared laser projector. Infrared parts are used to calculate the distance between objects, but also to separate objects on different planes. They serve for facial recognition as well as gestures tracking.
The Intel 3D camera can scan the environment from 0.2m to 1.2m. The fixed-focal length camera will support up to 1080p @30FPS capture in RGB with a 77° FOV. Its lens has a built in IR cut filter. The 640x480 pixel VGA camera has a frame rate up to 60fps with a 90° FOV, moreover its lens has an IR Band Pass filter.
More information on that report at http://www.i-micronews.com/reports.html
LeddarVu8: The first off-the-shelf solid state high-definition LiDAR module f...Yole Developpement
LeddarTech’s new LiDAR has no moving parts, giving it the smallest form factor while integrating the latest innovations in LiDAR technology
The light detection and ranging principle and technology, also known as LiDAR, is used in a wide spectrum of applications. With upcoming autonomous or “self-driving” cars, LiDAR technology is being considered for one option for the “eyes” of such vehicles. However, existing systems do not match the challenging reliability, compactness and cost-efficiency specifications of the automotive world.
Based on “LeddarCore” components, Leddartech has developed LeddarVu8, a compact solid-state LiDAR without mechanical movement that provides highly accurate multi-target detection over eight independent segments. It detects targets at up to 215 m range despite its tiny size of 70 mm x 35 mm x 46 mm and weighing only 75 grams. The LeddarVu8 delivers nearly twice the range for half the volume compared to the previous version.
These qualities qualify the LeddarVu8 as a candidate for advanced driver assistance, replacing the radar. With its adjustable and interchangeable optics module, the LeddarVu8 can also be interesting for other applications, such as traffic management, speed enforcement, heavy-duty equipment collision warning, navigation, liquid level sensing and bulk volume measurements.
The light is emitted by Excelitas’ tri-stacked emitting edge laser diode of 75W and received by a photodiode array. The two components are designed for large volume markets and some innovations reduce their usually high cost. This first automotive version of the LeddarVu8 shows the full potential of this technology to go under the $100 barrier.
This report presents the full system manufacturing and packaging processes for the LeddarVu8 as well as the physical analysis of the two main optical components, the laser diode and the photodiode. An estimation of the manufacturing cost and selling price is included.
More information on that report at http://www.i-micronews.com/reports.html
This document provides an overview and market forecast of the 3D sensing industry from 2022 to 2028. It discusses key applications and trends in mobile, consumer, automotive, and other sectors. Emerging technologies like SWIR, metasurfaces, and event-based imaging are also reviewed, along with the supply chain dynamics and a forecast of strong growth in the 3D sensing market from $8.2 billion in 2022 to $17.2 billion by 2028.
LiDAR for Automotive and Industrial Applications 2019 by Yole DéveloppementYole Developpement
This document provides an overview and analysis of the LiDAR market from 2018-2024. It finds that the total LiDAR market is expected to grow at a 29% CAGR to $6 billion by 2024, driven primarily by the automotive sector. Within automotive, ADAS vehicles are forecasted to have a 55% CAGR and become the main application. The report also examines the various LiDAR technologies, players, investments, costs, and timelines for integration into vehicles. It finds that while over 50 companies are targeting the automotive market, industry consolidation is expected as only a limited number will succeed.
NITW_Improving Deep Neural Networks (1).pptxDrKBManwade
This document provides an overview of techniques for training deep neural networks. It discusses neural network parameters and hyperparameters, regularization strategies like L1 and L2 norm penalties, dropout, batch normalization, and optimization methods like mini-batch gradient descent. The key aspects covered are distinguishing parameters from hyperparameters, techniques for reducing overfitting like regularization and early stopping, and batch normalization for reducing internal covariate shift during training.
This document proposes a smart IoT device for two-wheelers to prevent theft. The existing systems have drawbacks like constantly using energy to track vehicles. The proposed system uses a vibration sensor and switch to detect movement only in parking mode. It sends alerts to the user's phone with GPS coordinates if movement is detected. It connects to a cloud server through LPWA when in parking mode to detect movement and send alerts. This provides a low-cost, small device to detect theft and track vehicles using less energy.
Fashion-Gen: The Generative Fashion Dataset and Challenge by Negar Rostamzade...WiMLDSMontreal
"Fashion-Gen: The Generative Fashion Dataset and Challenge"
By Negar Rostamzadeh, Research Scientist at Element AI
Abstract: We introduce Fashion-Gen, a new dataset of 293,008 high definition (1360 x 1360 pixels) fashion images paired with item descriptions provided by professional stylists. Each item is photographed from a variety of angles. We provide baseline results on 1) high-resolution image generation, and 2) image generation conditioned on the given text descriptions for 256 x 256, 3) analyzing the dataset details. We organized a competition at ECCV conference and invited the community to improve upon our baselines.
Triple Forward Camera from Tesla Model 3system_plus
Complete analysis of the main sensing part of the Tesla‘s autopilot system.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/triple-forward-camera-from-tesla-model-3/
Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse ...Yole Developpement
INNOVATIVE 3D CAMERA FOR FACIAL ANALYSIS AND HAND/FINGER TRACKING, BASED ON RESONANT MICRO-MIRROR, IR LASER, VISIBLE AND NEAR INFRARED IMAGE SENSORS.
Intel RealSense is an intelligent 3D camera equipped with a system of three components: a conventional camera, a near infrared image sensor and an infrared laser projector. Infrared parts are used to calculate the distance between objects, but also to separate objects on different planes. They serve for facial recognition as well as gestures tracking.
The Intel 3D camera can scan the environment from 0.2m to 1.2m. The fixed-focal length camera will support up to 1080p @30FPS capture in RGB with a 77° FOV. Its lens has a built in IR cut filter. The 640x480 pixel VGA camera has a frame rate up to 60fps with a 90° FOV, moreover its lens has an IR Band Pass filter.
More information on that report at http://www.i-micronews.com/reports.html
LeddarVu8: The first off-the-shelf solid state high-definition LiDAR module f...Yole Developpement
LeddarTech’s new LiDAR has no moving parts, giving it the smallest form factor while integrating the latest innovations in LiDAR technology
The light detection and ranging principle and technology, also known as LiDAR, is used in a wide spectrum of applications. With upcoming autonomous or “self-driving” cars, LiDAR technology is being considered for one option for the “eyes” of such vehicles. However, existing systems do not match the challenging reliability, compactness and cost-efficiency specifications of the automotive world.
Based on “LeddarCore” components, Leddartech has developed LeddarVu8, a compact solid-state LiDAR without mechanical movement that provides highly accurate multi-target detection over eight independent segments. It detects targets at up to 215 m range despite its tiny size of 70 mm x 35 mm x 46 mm and weighing only 75 grams. The LeddarVu8 delivers nearly twice the range for half the volume compared to the previous version.
These qualities qualify the LeddarVu8 as a candidate for advanced driver assistance, replacing the radar. With its adjustable and interchangeable optics module, the LeddarVu8 can also be interesting for other applications, such as traffic management, speed enforcement, heavy-duty equipment collision warning, navigation, liquid level sensing and bulk volume measurements.
The light is emitted by Excelitas’ tri-stacked emitting edge laser diode of 75W and received by a photodiode array. The two components are designed for large volume markets and some innovations reduce their usually high cost. This first automotive version of the LeddarVu8 shows the full potential of this technology to go under the $100 barrier.
This report presents the full system manufacturing and packaging processes for the LeddarVu8 as well as the physical analysis of the two main optical components, the laser diode and the photodiode. An estimation of the manufacturing cost and selling price is included.
More information on that report at http://www.i-micronews.com/reports.html
This document provides an overview and market forecast of the 3D sensing industry from 2022 to 2028. It discusses key applications and trends in mobile, consumer, automotive, and other sectors. Emerging technologies like SWIR, metasurfaces, and event-based imaging are also reviewed, along with the supply chain dynamics and a forecast of strong growth in the 3D sensing market from $8.2 billion in 2022 to $17.2 billion by 2028.
LiDAR for Automotive and Industrial Applications 2019 by Yole DéveloppementYole Developpement
This document provides an overview and analysis of the LiDAR market from 2018-2024. It finds that the total LiDAR market is expected to grow at a 29% CAGR to $6 billion by 2024, driven primarily by the automotive sector. Within automotive, ADAS vehicles are forecasted to have a 55% CAGR and become the main application. The report also examines the various LiDAR technologies, players, investments, costs, and timelines for integration into vehicles. It finds that while over 50 companies are targeting the automotive market, industry consolidation is expected as only a limited number will succeed.
NITW_Improving Deep Neural Networks (1).pptxDrKBManwade
This document provides an overview of techniques for training deep neural networks. It discusses neural network parameters and hyperparameters, regularization strategies like L1 and L2 norm penalties, dropout, batch normalization, and optimization methods like mini-batch gradient descent. The key aspects covered are distinguishing parameters from hyperparameters, techniques for reducing overfitting like regularization and early stopping, and batch normalization for reducing internal covariate shift during training.
This document proposes a smart IoT device for two-wheelers to prevent theft. The existing systems have drawbacks like constantly using energy to track vehicles. The proposed system uses a vibration sensor and switch to detect movement only in parking mode. It sends alerts to the user's phone with GPS coordinates if movement is detected. It connects to a cloud server through LPWA when in parking mode to detect movement and send alerts. This provides a low-cost, small device to detect theft and track vehicles using less energy.
Fashion-Gen: The Generative Fashion Dataset and Challenge by Negar Rostamzade...WiMLDSMontreal
"Fashion-Gen: The Generative Fashion Dataset and Challenge"
By Negar Rostamzadeh, Research Scientist at Element AI
Abstract: We introduce Fashion-Gen, a new dataset of 293,008 high definition (1360 x 1360 pixels) fashion images paired with item descriptions provided by professional stylists. Each item is photographed from a variety of angles. We provide baseline results on 1) high-resolution image generation, and 2) image generation conditioned on the given text descriptions for 256 x 256, 3) analyzing the dataset details. We organized a competition at ECCV conference and invited the community to improve upon our baselines.
Triple Forward Camera from Tesla Model 3system_plus
Complete analysis of the main sensing part of the Tesla‘s autopilot system.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/triple-forward-camera-from-tesla-model-3/
HEALTH PREDICTION ANALYSIS USING DATA MININGAshish Salve
As we know that health care industry is completely based on assumptions, which after get tested and verified via various tests and patient have to be depend on the doctors knowledge on that topic . so we made a system that uses data mining techniques to predict the health of a person based on various medical test results. so we can predict the health of that person based on that analysis performed by the system.The system currently design only for heart issues, for that we had used Statlog (Heart) Data Set from UCI Machine Learning Repository it includes attributes like age, sex, chest pain type, cholesterol, sugar, outcomes,etc.for training the system. we only need to passed few general inputs in order to generate the prediction and the prediction results from all algorithms are they merged together by calculating there mean value that value shows the actual outcome of the prediction process which entirely works in background
This presentation talks about Software Defined Vehicles, Automotive Standards including Cyber Security and Safety, Agile Methods like SAFe/Less , Continuous Delivery best practices.
This document provides an overview of convolutional neural networks (CNNs). It discusses the key steps in a CNN including convolution, ReLU activation, pooling, flattening and fully connected layers. Examples of feature maps being extracted at each convolution step are shown. CNNs have been very successful for tasks like image classification and are widely used by companies such as Google and Facebook.
Sensors and Data Management for Autonomous Vehicles report 2015 by Yole Devel...Yole Developpement
Multiple sensing technologies will ensure many market opportunities for Tier 1 players, Tier 2 players, and newcomers alike
Sensor technologies are a driving force in making fully autonomous vehicles a reality. Automakers are racing to develop safe self-driving cars, but this race is a distance run more than a sprint, where multiple automation stages will imply multiple sensors. Ultrasonic sensors, radars, and multiple cameras systems are already embedded in high-end vehicles -- and within 10 years, they could also include long-range cameras, LIDAR, micro bolometer and accurate dead reckoning. These devices will work concurrently and each technology will support another to ensure codependency and avoid concerns. Even though sensors are only part of the puzzle, their market opportunities are promising.
Denso’s Monocular Forward ADAS Camera in the Toyota Alphardsystem_plus
Denso has developed a new monocular forward camera for improved night vision, using Sony’s high-sensitivity 1.27M-pixel image sensor and Toshiba’s new advanced image recognition processor.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/densos-monocular-forward-adas-camera-in-the-toyota-alphard/
Aptiv’s Third Generation of 77 GHz-Based Short-Range Radar (SRR3)system_plus
The first highly integrated 77 GHz short range radar sensor for advanced driver assistance systems with a single receive-transmit MMIC bare die from Infineon found on the market.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/aptivs-third-generation-of-77-ghz-based-short-range-radar-srr3/
The document discusses Movimento's vision for a software defined car (SDC) through an OTA platform. It proposes defining virtual boundaries for car components through a car software agent and ECUs with wired connectivity and software/data management capabilities. The SDC platform would allow for over-the-air software/data management from the cloud to vehicle ECUs and components. This approach aims to address challenges with current OTA processes like escalating validation burdens and inconsistent handling of vehicles from R&D to post-sale.
This document discusses applications of deep learning, including computer vision, speech recognition, and natural language processing. It notes that deep learning is driven by scale - large neural networks with huge amounts of labeled training data can perform complex tasks like image captioning and question answering. Deep learning techniques are being applied across many domains from mobile devices to data centers and are powering intelligent assistants with capabilities like vision and speech recognition.
The document discusses geometric deep learning and spectral graph theory. It introduces convolutional neural networks (CNNs) and explains that they work well because image data has a grid structure that allows for weight sharing and translation invariance/equivariance. CNNs use filters with compact support on grid data and allow subsampling through pooling. The document then discusses spectral graph theory and spectral CNNs, introducing concepts like the graph Laplacian, eigenvectors of the Laplacian representing Fourier vectors, and spectral CNNs performing convolutions in the spectral domain using eigenvectors of the graph Laplacian.
Thermal Expert Infrared Camera for Smartphones and I3system I3BOL384_17A Micr...Yole Developpement
The highest resolution thermal camera for smartphones at 384 x 288 pixels, using a microbolometer with 17µm pixels from the South Korea’s I3 System.
Based on a high definition microbolometer from I3system, the Thermal Expert infrared camera is a high-end product for smartphones. A more conservative technological choice, the microbolometer is more expensive but offers better performance. The camera also embraces the quality approach with interchangeable lenses for different uses. I3system targets the professional market and competes more in standard IR cameras than IR cameras for smartphones.
The Thermal Expert camera is very compact and compatible with Android smartphones via its micro-USB-OTG connector. The camera does not use a battery, with power being supplied by the smartphone. The camera is shutterless.
The thermal camera uses a new 17µm pixel design from I3system. The I3BOL384_17A microbolometer features 384 x 288 pixel resolution, 24 times the resolution of the FLIR Lepton. The sensor technology in the I3system component is a titanium oxide microbolometer, technology which is not covered by Honeywell patents. The I3BOL384_17A is the consumer version of a military microbolometer.
This report presents a complete teardown analysis of the Thermal Expert camera and its microbolometer. Based on this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR One, Seek Thermal, Therm-App and Thermal Expert cameras and Lepton, EXC001, PICO384P and I3BOL384_17A microbolometers. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
Aerospace performance integrated into a tactical-grade 6-axis IMU for industrial applications.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/honeywell-hg4930ca51-6-axis-mems-inertial-sensor/
Alzheimer Disease Prediction using Machine Learning AlgorithmsIRJET Journal
This document summarizes research on using machine learning algorithms to predict Alzheimer's disease. It discusses collecting data from the Alzheimer's Disease Neuroimaging Initiative database and preprocessing MRI images. Feature extraction is performed using techniques like volume and thickness measurements. Machine learning models like CNNs and SVMs are trained on the data and tested to distinguish between patient groups and predict progression. The research aims to more accurately diagnose Alzheimer's at earlier stages by combining clinical assessments with structural neuroimaging data and machine learning. Accuracy of over 90% was achieved in some cases at distinguishing between patient classifications like AD vs normal control.
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...system_plus
Fourth generation of the S-Cam family from the leading ADAS camera player.
Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/zf-s-cam-4-forward-automotive-mono-and-tri-camera-for-adas/
These slides provide an overview of the most popular approaches up to date to solve the task of object detection with deep neural networks. It reviews both the two stages approaches such as R-CNN, Fast R-CNN and Faster R-CNN, and one-stage approaches such as YOLO and SSD. It also contains pointers to relevant datasets (Pascal, COCO, ILSRVC, OpenImages) and the definition of the Average Precision (AP) metric.
Full program:
https://www.talent.upc.edu/ing/estudis/formacio/curs/310400/postgraduate-course-artificial-intelligence-deep-learning/
This document describes a rear vehicle detection system using computer vision techniques for collision avoidance. The system aims to detect vehicles from a mounted camera on a host vehicle and alert the driver of an impending rear-end collision. It utilizes the fast radial symmetry transform to detect the blooming effect of vehicle rear lights under various illumination conditions. Candidate light pairs are identified and their symmetry and distance from the camera are estimated. The system achieves high detection rates on benchmark datasets, including in adverse weather. Future work involves correlating vehicle and braking detection with estimating driver attention level.
Tutorial on Generalization in Neural Fields, CVPR 2022 Tutorial on Neural Fie...Vincent Sitzmann
Slides for the "generalization" session of our CVPR 2022 tutorial on Neural Fields in Computer Vision.
Neural Fields are an emerging technique to parameterize signals that live in spatial coordinates plus time. They parameterize a signal as a continuous function that maps a space-time coordinate to whatever is at that spacetime coordinate - for instance, the geometry of a 3D scene could be encoded in a function that maps a 3D coordinate to whether that coordinate is occupied or not. A neural field parameterizes that function as a neural network.
In this session, I gave a high-level overview over how we may use neural fields as the output of a variety of inference algorithms, for instance to reconstruct a complete 3D shape from partial observations in the form of a pointcloud, or to reconstruct a 3D scene from only a single image.
You are free to use the slides for any purpose, as long as you keep a note on the slides that acknowledges their source.
Neural Fields database: https://neuralfields.cs.brown.edu/
Tutorial website: https://neuralfields.cs.brown.edu/cvpr22
This document discusses big data solutions for healthcare. It outlines trends driving huge increases in healthcare data from sources like medical imaging, patient monitoring, and genomics. This data holds value for personalized medicine, clinical decision support, and fraud detection. However, managing such varied and voluminous data presents challenges around volume, variety, and velocity. The document proposes methods for managing big data through distributed storage, optimization, security, and specialized platforms. Use cases are highlighted for connecting new analytics to healthcare applications and services.
LG Display Medianav ECU Available in the Dacia Dustersystem_plus
A competitive high resolution, high luminance and wide viewing angle automotive display.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/lg-display-medianav-ecu-available-in-the-dacia-duster/
Orbbec’s Front 3D Depth Sensing System in the Oppo Find Xsystem_plus
The first introduction of Orbbec’s 3D front depth sensing system in a mobile application featuring a global shutter, a dot projector and a custom system-on-chip.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/orbbecs-front-3d-depth-sensing-system-in-the-oppo-find-x/
HEALTH PREDICTION ANALYSIS USING DATA MININGAshish Salve
As we know that health care industry is completely based on assumptions, which after get tested and verified via various tests and patient have to be depend on the doctors knowledge on that topic . so we made a system that uses data mining techniques to predict the health of a person based on various medical test results. so we can predict the health of that person based on that analysis performed by the system.The system currently design only for heart issues, for that we had used Statlog (Heart) Data Set from UCI Machine Learning Repository it includes attributes like age, sex, chest pain type, cholesterol, sugar, outcomes,etc.for training the system. we only need to passed few general inputs in order to generate the prediction and the prediction results from all algorithms are they merged together by calculating there mean value that value shows the actual outcome of the prediction process which entirely works in background
This presentation talks about Software Defined Vehicles, Automotive Standards including Cyber Security and Safety, Agile Methods like SAFe/Less , Continuous Delivery best practices.
This document provides an overview of convolutional neural networks (CNNs). It discusses the key steps in a CNN including convolution, ReLU activation, pooling, flattening and fully connected layers. Examples of feature maps being extracted at each convolution step are shown. CNNs have been very successful for tasks like image classification and are widely used by companies such as Google and Facebook.
Sensors and Data Management for Autonomous Vehicles report 2015 by Yole Devel...Yole Developpement
Multiple sensing technologies will ensure many market opportunities for Tier 1 players, Tier 2 players, and newcomers alike
Sensor technologies are a driving force in making fully autonomous vehicles a reality. Automakers are racing to develop safe self-driving cars, but this race is a distance run more than a sprint, where multiple automation stages will imply multiple sensors. Ultrasonic sensors, radars, and multiple cameras systems are already embedded in high-end vehicles -- and within 10 years, they could also include long-range cameras, LIDAR, micro bolometer and accurate dead reckoning. These devices will work concurrently and each technology will support another to ensure codependency and avoid concerns. Even though sensors are only part of the puzzle, their market opportunities are promising.
Denso’s Monocular Forward ADAS Camera in the Toyota Alphardsystem_plus
Denso has developed a new monocular forward camera for improved night vision, using Sony’s high-sensitivity 1.27M-pixel image sensor and Toshiba’s new advanced image recognition processor.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/densos-monocular-forward-adas-camera-in-the-toyota-alphard/
Aptiv’s Third Generation of 77 GHz-Based Short-Range Radar (SRR3)system_plus
The first highly integrated 77 GHz short range radar sensor for advanced driver assistance systems with a single receive-transmit MMIC bare die from Infineon found on the market.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/aptivs-third-generation-of-77-ghz-based-short-range-radar-srr3/
The document discusses Movimento's vision for a software defined car (SDC) through an OTA platform. It proposes defining virtual boundaries for car components through a car software agent and ECUs with wired connectivity and software/data management capabilities. The SDC platform would allow for over-the-air software/data management from the cloud to vehicle ECUs and components. This approach aims to address challenges with current OTA processes like escalating validation burdens and inconsistent handling of vehicles from R&D to post-sale.
This document discusses applications of deep learning, including computer vision, speech recognition, and natural language processing. It notes that deep learning is driven by scale - large neural networks with huge amounts of labeled training data can perform complex tasks like image captioning and question answering. Deep learning techniques are being applied across many domains from mobile devices to data centers and are powering intelligent assistants with capabilities like vision and speech recognition.
The document discusses geometric deep learning and spectral graph theory. It introduces convolutional neural networks (CNNs) and explains that they work well because image data has a grid structure that allows for weight sharing and translation invariance/equivariance. CNNs use filters with compact support on grid data and allow subsampling through pooling. The document then discusses spectral graph theory and spectral CNNs, introducing concepts like the graph Laplacian, eigenvectors of the Laplacian representing Fourier vectors, and spectral CNNs performing convolutions in the spectral domain using eigenvectors of the graph Laplacian.
Thermal Expert Infrared Camera for Smartphones and I3system I3BOL384_17A Micr...Yole Developpement
The highest resolution thermal camera for smartphones at 384 x 288 pixels, using a microbolometer with 17µm pixels from the South Korea’s I3 System.
Based on a high definition microbolometer from I3system, the Thermal Expert infrared camera is a high-end product for smartphones. A more conservative technological choice, the microbolometer is more expensive but offers better performance. The camera also embraces the quality approach with interchangeable lenses for different uses. I3system targets the professional market and competes more in standard IR cameras than IR cameras for smartphones.
The Thermal Expert camera is very compact and compatible with Android smartphones via its micro-USB-OTG connector. The camera does not use a battery, with power being supplied by the smartphone. The camera is shutterless.
The thermal camera uses a new 17µm pixel design from I3system. The I3BOL384_17A microbolometer features 384 x 288 pixel resolution, 24 times the resolution of the FLIR Lepton. The sensor technology in the I3system component is a titanium oxide microbolometer, technology which is not covered by Honeywell patents. The I3BOL384_17A is the consumer version of a military microbolometer.
This report presents a complete teardown analysis of the Thermal Expert camera and its microbolometer. Based on this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.
The report’s final component is a comparison between the characteristics of the FLIR One, Seek Thermal, Therm-App and Thermal Expert cameras and Lepton, EXC001, PICO384P and I3BOL384_17A microbolometers. The comparison highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
Aerospace performance integrated into a tactical-grade 6-axis IMU for industrial applications.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/honeywell-hg4930ca51-6-axis-mems-inertial-sensor/
Alzheimer Disease Prediction using Machine Learning AlgorithmsIRJET Journal
This document summarizes research on using machine learning algorithms to predict Alzheimer's disease. It discusses collecting data from the Alzheimer's Disease Neuroimaging Initiative database and preprocessing MRI images. Feature extraction is performed using techniques like volume and thickness measurements. Machine learning models like CNNs and SVMs are trained on the data and tested to distinguish between patient groups and predict progression. The research aims to more accurately diagnose Alzheimer's at earlier stages by combining clinical assessments with structural neuroimaging data and machine learning. Accuracy of over 90% was achieved in some cases at distinguishing between patient classifications like AD vs normal control.
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...system_plus
Fourth generation of the S-Cam family from the leading ADAS camera player.
Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/zf-s-cam-4-forward-automotive-mono-and-tri-camera-for-adas/
These slides provide an overview of the most popular approaches up to date to solve the task of object detection with deep neural networks. It reviews both the two stages approaches such as R-CNN, Fast R-CNN and Faster R-CNN, and one-stage approaches such as YOLO and SSD. It also contains pointers to relevant datasets (Pascal, COCO, ILSRVC, OpenImages) and the definition of the Average Precision (AP) metric.
Full program:
https://www.talent.upc.edu/ing/estudis/formacio/curs/310400/postgraduate-course-artificial-intelligence-deep-learning/
This document describes a rear vehicle detection system using computer vision techniques for collision avoidance. The system aims to detect vehicles from a mounted camera on a host vehicle and alert the driver of an impending rear-end collision. It utilizes the fast radial symmetry transform to detect the blooming effect of vehicle rear lights under various illumination conditions. Candidate light pairs are identified and their symmetry and distance from the camera are estimated. The system achieves high detection rates on benchmark datasets, including in adverse weather. Future work involves correlating vehicle and braking detection with estimating driver attention level.
Tutorial on Generalization in Neural Fields, CVPR 2022 Tutorial on Neural Fie...Vincent Sitzmann
Slides for the "generalization" session of our CVPR 2022 tutorial on Neural Fields in Computer Vision.
Neural Fields are an emerging technique to parameterize signals that live in spatial coordinates plus time. They parameterize a signal as a continuous function that maps a space-time coordinate to whatever is at that spacetime coordinate - for instance, the geometry of a 3D scene could be encoded in a function that maps a 3D coordinate to whether that coordinate is occupied or not. A neural field parameterizes that function as a neural network.
In this session, I gave a high-level overview over how we may use neural fields as the output of a variety of inference algorithms, for instance to reconstruct a complete 3D shape from partial observations in the form of a pointcloud, or to reconstruct a 3D scene from only a single image.
You are free to use the slides for any purpose, as long as you keep a note on the slides that acknowledges their source.
Neural Fields database: https://neuralfields.cs.brown.edu/
Tutorial website: https://neuralfields.cs.brown.edu/cvpr22
This document discusses big data solutions for healthcare. It outlines trends driving huge increases in healthcare data from sources like medical imaging, patient monitoring, and genomics. This data holds value for personalized medicine, clinical decision support, and fraud detection. However, managing such varied and voluminous data presents challenges around volume, variety, and velocity. The document proposes methods for managing big data through distributed storage, optimization, security, and specialized platforms. Use cases are highlighted for connecting new analytics to healthcare applications and services.
LG Display Medianav ECU Available in the Dacia Dustersystem_plus
A competitive high resolution, high luminance and wide viewing angle automotive display.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/lg-display-medianav-ecu-available-in-the-dacia-duster/
Orbbec’s Front 3D Depth Sensing System in the Oppo Find Xsystem_plus
The first introduction of Orbbec’s 3D front depth sensing system in a mobile application featuring a global shutter, a dot projector and a custom system-on-chip.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/orbbecs-front-3d-depth-sensing-system-in-the-oppo-find-x/
Discover Axis’s high-end product integrating its latest ARTPEC-7 in-house system-on-chip dedicated to network video and machine learning capabilities.
More information : https://www.systemplus.fr/reverse-costing-reports/axis-p1375-e-network-camera/
SP20569 - IRay T3S Thermal Camera for Smartphonesystem_plus
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/iray-t3s-thermal-camera-for-smartphone/
Deep analysis of the latest generation of under-display optical fingerprint sensors using micro-optics.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/goodixs-ultra-thin-optical-in-display-fingerprint/
Synaptics’ Under-Display Fingerprint Scanner Inside the VIVO X21 UD Smartphonesystem_plus
Optical fingerprint technology allows integration behind the display.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/synaptics-under-display-fingerprint-scanner-inside-the-vivo-x21-ud-smartphone/
Epson PrecisionCore Printhead with MicroTFP Inkjet Diessystem_plus
For the first time, Epson integrates thin film PZT MEMS into its office inkjet printer.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/epson-precisioncore-printhead-with-microtfp-inkjet-dies/
Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing ...Yole Developpement
A look into Texas Instruments’ system-on-chip, including Sony/Softkinetic’s time-of-flight pixel technology, for industrial applications
Today, Time-of-Flight (ToF) systems are among the most innovative technologies offering imaging companies an opportunity to lead the market. Every major player wants to integrate these devices to provide functions such as 3D imaging, proximity sensing, ambient light sensing and gesture recognition.
Sony/Softkinetic has been investigating this technology deeply, providing a unique pixel technology to several image sensor manufacturers in three application areas: consumer, automotive and industrial. For industrial applications, Sony/Softkinetic has licensed its technology to Texas Instruments, which is providing ToF imagers for human detection or robot-human interaction.
The OPT8241 3D ToF imager is packaged using Chip-On-Glass (COG) technology. The device comprises a system-on-chip (SoC) and glass filter in the same component in thin, 0.7 mm-thick, packaging.
This report analyzes the complete component, from the glass near-infrared band-pass filter to the collector based on ToF pixel licenses developed by Sony/Softkinetic and adapted by Texas Instruments. The report includes a complete cost analysis and price estimation of the device based on a detailed description of the package, and the ToF imager.
It also features a complete ToF pixel technology comparison with the Infineon/pmd, STMicroelectronics and Melexis automotive ToF imagers, which are all also based on Sony/Softkinetic technology, with details on the companies’ design choices.
More information on that report at http://www.i-micronews.com/reports.html
Continental’s 3rd-generation short-range radar sensor: a simplified design improves cost-effectiveness.
The Continental SRR3-B is designed for automotive applications like blind-spot detection, lane-change assist, rear cross-traffic alert, rear pre-crash, safe exit, collision mitigation, distance warning /monitoring, and more. The SRR3-B is based on 24 GHz technology and contains a planar antenna. The sensor has a field of view of ±75° in azimuth and a maximum range of more than 90m.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/continental-srr3-b-24ghz-blind-spot-radar/
The first high reliability and highly rugged 9-axis IMU for industrial applications from Honeywell.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/honeywell-hg1120ca50-9-axis-mems-inertial-sensor/
SiGe based millimeter-wave chipset commercially available for
backhaul applications with beamforming capability.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/peraso-x710-chipset-60ghz-outdoor-wireless-broadband-solution/
The document provides an overview and teardown analysis of the Freebox Delta server. It includes:
- Executive summaries of the server's main components, capabilities and optional modules.
- Detailed photos and identification of the server's electronic boards and over 3,000 total components.
- A bill of materials analysis identifying costs of individual components, printed circuit boards, and the overall material cost breakdown.
- Estimates of the manufacturing costs and a final estimated manufacturer price for the server, optical module, and security module.
FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...Yole Developpement
An infrared camera with a powerful vision processor in a small package, using a new 12μm microbolometer.
Based on a high definition ISC1406L micro-bolometer, the FLIR Boson thermal camera aims at a wide range of markets: military, drones, automotive, security and firefighting. Thanks to sound technological and economic choices, the microbolometer offers very good performance in definition and frame rate at low cost. The camera core’s economical approach involves new lens technology and sophisticated vision processing from Intel/Movidius to power its infrared vision.
The FLIR Boson camera core occupies only 4.9cm3 without its lens, including a 320x256 pixel microbolometer and an advanced processor. The system is made very compact and easy for integrators to handle. It includes a new chalcogenide glass for the lens and a powerful Vision Processing Unit for the first time.
More information on that report at http://www.i-micronews.com/reports.html
The document provides a reverse costing analysis of Xaar's 1201 GS2p5 piezoelectric (PZT) printhead. It includes a physical analysis of the printhead components, an overview of the manufacturing processes, and a cost analysis. The printhead integrates one inkjet chip with 1280 nozzles across four rows. The manufacturing cost is estimated for a volume of 50,000 units in 2018, not including costs such as intellectual property and licensing. A comparison is made to Epson's PrecisionCore printhead. The MEMS inkjet die uses two silicon substrates and a complex multilayer PZT actuator structure.
Ainstein T-79: Automotive 79GHz Short Range Radarsystem_plus
A next-generation short-range, wideband and high-resolution radar sensor for Advanced Driver Assistance Systems (ADAS).
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/ainstein-t-79-automotive-79ghz-short-range-radar/
Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Syste...Yole Developpement
This document provides a reverse costing analysis of the Continental SRL1 Short Range Lidar system. It includes a teardown analysis with detailed photos of the components. The cost analysis estimates the production costs and selling price based on the bill of materials. Continental's SRL1 provides reliable solid-state lidar for frontal collision detection up to 50km/h without any moving parts. Key components include a laser from Osram and a processing chipset from Freescale. The analysis estimates the SRL1 can be manufactured and tested in Germany for around 1 million units annually at a total production cost of approximately $80 per unit and a selling price of $125.
A PTFE-free radar, with single receive-transmit MMIC based on TowerJazz’s SiGe CMOS technology, for the first time associated with a phased array antenna.
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/denso-dnsrr004-short-range-radar/
Intel® Curie™ Module High Density System-in-Package for IoT 2016 teardown rev...Yole Developpement
Ultra-small, low-power hardware module for wearables
Intel®, whose microprocessors can be found in almost every computer worldwide, has commenced the 2016 “wearables race” by introducing the Intel® Curie™ module. This tiny system-in-package (SiP) can be found in the latest Arduino® Board: the Genuino 101 for the European version and the Arduino 101 for the US version. The module includes the Intel Quark chip, Bluetooth low-energy radio, sensors, and battery charging, all in a single package of less than 150mm3.
This complete, low-power solution comes with computing, motion sensing, Bluetooth low energy, battery charging, and pattern matching capabilities for optimal sensor data analysis, enabling quick and easy identification of actions and motions. The module is packaged in a tiny form factor and runs a new software platform created especially for the Intel Curie module.
Located on the main board, the system uses non-conventional packaging developed by Intel. The main microcontroller is located at the bottom of the package, with features like Bluetooth and sensors placed on top.
More information on that report at http://www.i-micronews.com/reports.html
Apple iPhone X – Infrared Dot Projector 2017 teardown reverse costing report ...system_plus
The world’s most advanced dot projector for 3D sensing
with four innovative parts:
Its package; a dedicated VCSEL; a folded optic; and the active DOE.
Apple has made a great technology choice with its 3D facial identification for the iPhone X. The new technology is presented as being 20 times more accurate than the older fingerprint approach with a one-in-a million probability of a random person unlocking your iPhone.
This document provides an overview of NVIDIA's new A100 Ampere GPU. Some key points:
- It uses TSMC's 7nm process and CoWoS packaging to integrate over 6,000mm2 of silicon onto a single 55mm x 55mm package.
- It features a 7nm GPU die with 54 billion transistors and 40/80GB of HBM2 memory in a 3D stacked configuration connected via microbumps and TSVs.
- The report includes a physical analysis of the package, dies, and assembly, as well as a cost analysis and estimated price. It finds the A100 provides significantly higher performance than previous generations like the V100.
Similar to Intel RealSense D435 3D Active IR Stereo Depth Camera 2018 teardown reverse costing report published by System Plus (20)
This document provides an analysis of Tesla's UBQ01B0 chip used for full self-driving capabilities. It includes a physical analysis of the die and packaging, an overview of the manufacturing process, and a cost analysis. The chip is a system-on-chip designed and produced by Tesla to power its driver-assist and autonomous driving features. It utilizes quad-core ARM processors alongside a GPU and NPU for processing sensor data and neural network operations. The analysis examines the chip's design and architecture at the physical, manufacturing, and cost levels.
SPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE Invertersystem_plus
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/vitesco-technologies-power-module-in-jaguar-i-pace-inverter/
Technical and cost overview of the evolution of radio frequency front-end module technologies integrated in 5G mmWave and Sub-6 GHz Phones.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-2-focus-on-5g-chipset/
Technical and cost overview of the evolution of the radio frequency front-end module technologies integrated in the Apple iPhone series from 2016 - 2020.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-1-focus-on-apple/
Deep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.
More information : https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8200-pamid-in-the-apple-iphone-12-series/
Apple iPhone 12 series mmWave 5G Chipset and Antennasystem_plus
A study of the complete first generation of the 5G millimeter-wave chipset for Apple’s phones including custom antenna, front-end module and antenna-on-package.
More information : https://www.systemplus.fr/reverse-costing-reports/apple-iphone-12-series-mmwave-5g-chipset-and-antenna/
Deep analysis of the 400Gb optical transceiver from a leading Chinese company.
More information: https://www.systemplus.fr/reverse-costing-reports/innolights-400g-qsfp-dd-optical-transceiver/
EPC’s 70 V ePower stage with separate and independent high and low side control inputs.
More information: https://www.systemplus.fr/reverse-costing-reports/epc2152-half-bridge-monolithic-gan-ic/
Microsoft - Holographic Lens from Hololens 2system_plus
See-through holographic display for mixed reality smartglasses.
More on : https://www.systemplus.fr/reverse-costing-reports/microsoft-holographic-lens-from-hololens-2/
Cost-effective 1 mm2 miniature camera with customizable wafer-level optics for endoscopy and novel medical imaging devices.
More information : https://www.systemplus.fr/reverse-costing-reports/ams-naneye-mini-camera/
Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1)system_plus
Dig deep into Hikvision’s AI-powered thermal network camera for security applications.
More information: https://www.systemplus.fr/reverse-costing-reports/hikvision-intelligent-thermal-network-camera-ds-2td2166-15-v1/
The first 600V system-in-package half-bridge driver from STMicroelectronics integrating two GaN-based HEMTs.
More information: https://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-mastergan1-half-bridge-driver/
Physical and cost analysis of Micron’s fifth-generation low-power DRAM memory.
More information: https://www.systemplus.fr/reverse-costing-reports/micron-lpddr5-12gb-mobile-memory/
This report analyzes Samsung's 12GB LPDDR5 mobile memory. It includes a full physical analysis of the memory package and die. High resolution images show the die, DRAM cells, and cross-sections. The manufacturing process flow and cost analysis are used to estimate production costs. The component cost includes die manufacturing, packaging, and testing. A comparison is made between LPDDR4 and LPDDR5 physical characteristics and manufacturing processes. This report provides a comprehensive technical and cost analysis of Samsung's latest low power DRAM technology.
Safran Colibrys MS1010 and MEMSIC MXA2500M High-End Accelerometerssystem_plus
Detailed technology and cost analysis of the high-end single-axis and dual-axis accelerometers integrated in the STIM318 IMU.
More information: https://www.systemplus.fr/reverse-costing-reports/safran-colibrys-ms1010-and-memsic-mxa2500m-high-end-accelerometers/
Sensonor STIM318 Inertial Measurement Unit (IMU)system_plus
Newest IMU with 9-axis detection and gyro bias instability of 0.3°/h from Sensonor.
More information: https://www.systemplus.fr/reverse-costing-reports/sensonor-stim318-inertial-measurement-unit-imu/
Hamamatsu Photodiode and Laser in Livox’s Horizon LiDARsystem_plus
Analysis of the six channels and 905nm pulsed laser and photodiode from Hamamatsu, in Livox’s LiDAR for automotive ADAS.
More information: https://www.systemplus.fr/reverse-costing-reports/hamamatsu-photodiode-and-laser-in-livox-horizon-lidar/
Everspin’s Spin Transfer Torque MRAM with perpendicular magnetic tunnel junction.
More information: https://www.systemplus.fr/reverse-costing-reports/everspin-emd3d256m-sttmram-memory/
MEMS Fabry-Perot interferometer in a very tiny NIR spectrometer.
More information: https://www.systemplus.fr/reverse-costing-reports/spectral-engines-nirone-sensor-x/
World’s first 76-81 GHz automotive single-chip radar in a System-on-Chip device with integrated Antenna-in-Package using Fan-Out packaging technology.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/mediatek-autus-r10-mt2706-77-79-ghz-ewlbaip-radar-chipset/
FREE A4 Cyber Security Awareness Posters-Social Engineering part 3Data Hops
Free A4 downloadable and printable Cyber Security, Social Engineering Safety and security Training Posters . Promote security awareness in the home or workplace. Lock them Out From training providers datahops.com
Freshworks Rethinks NoSQL for Rapid Scaling & Cost-EfficiencyScyllaDB
Freshworks creates AI-boosted business software that helps employees work more efficiently and effectively. Managing data across multiple RDBMS and NoSQL databases was already a challenge at their current scale. To prepare for 10X growth, they knew it was time to rethink their database strategy. Learn how they architected a solution that would simplify scaling while keeping costs under control.
Skybuffer SAM4U tool for SAP license adoptionTatiana Kojar
Manage and optimize your license adoption and consumption with SAM4U, an SAP free customer software asset management tool.
SAM4U, an SAP complimentary software asset management tool for customers, delivers a detailed and well-structured overview of license inventory and usage with a user-friendly interface. We offer a hosted, cost-effective, and performance-optimized SAM4U setup in the Skybuffer Cloud environment. You retain ownership of the system and data, while we manage the ABAP 7.58 infrastructure, ensuring fixed Total Cost of Ownership (TCO) and exceptional services through the SAP Fiori interface.
Best 20 SEO Techniques To Improve Website Visibility In SERPPixlogix Infotech
Boost your website's visibility with proven SEO techniques! Our latest blog dives into essential strategies to enhance your online presence, increase traffic, and rank higher on search engines. From keyword optimization to quality content creation, learn how to make your site stand out in the crowded digital landscape. Discover actionable tips and expert insights to elevate your SEO game.
Digital Marketing Trends in 2024 | Guide for Staying AheadWask
https://www.wask.co/ebooks/digital-marketing-trends-in-2024
Feeling lost in the digital marketing whirlwind of 2024? Technology is changing, consumer habits are evolving, and staying ahead of the curve feels like a never-ending pursuit. This e-book is your compass. Dive into actionable insights to handle the complexities of modern marketing. From hyper-personalization to the power of user-generated content, learn how to build long-term relationships with your audience and unlock the secrets to success in the ever-shifting digital landscape.
Taking AI to the Next Level in Manufacturing.pdfssuserfac0301
Read Taking AI to the Next Level in Manufacturing to gain insights on AI adoption in the manufacturing industry, such as:
1. How quickly AI is being implemented in manufacturing.
2. Which barriers stand in the way of AI adoption.
3. How data quality and governance form the backbone of AI.
4. Organizational processes and structures that may inhibit effective AI adoption.
6. Ideas and approaches to help build your organization's AI strategy.
Have you ever been confused by the myriad of choices offered by AWS for hosting a website or an API?
Lambda, Elastic Beanstalk, Lightsail, Amplify, S3 (and more!) can each host websites + APIs. But which one should we choose?
Which one is cheapest? Which one is fastest? Which one will scale to meet our needs?
Join me in this session as we dive into each AWS hosting service to determine which one is best for your scenario and explain why!
Salesforce Integration for Bonterra Impact Management (fka Social Solutions A...Jeffrey Haguewood
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on integration of Salesforce with Bonterra Impact Management.
Interested in deploying an integration with Salesforce for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
TrustArc Webinar - 2024 Global Privacy SurveyTrustArc
How does your privacy program stack up against your peers? What challenges are privacy teams tackling and prioritizing in 2024?
In the fifth annual Global Privacy Benchmarks Survey, we asked over 1,800 global privacy professionals and business executives to share their perspectives on the current state of privacy inside and outside of their organizations. This year’s report focused on emerging areas of importance for privacy and compliance professionals, including considerations and implications of Artificial Intelligence (AI) technologies, building brand trust, and different approaches for achieving higher privacy competence scores.
See how organizational priorities and strategic approaches to data security and privacy are evolving around the globe.
This webinar will review:
- The top 10 privacy insights from the fifth annual Global Privacy Benchmarks Survey
- The top challenges for privacy leaders, practitioners, and organizations in 2024
- Key themes to consider in developing and maintaining your privacy program
5th LF Energy Power Grid Model Meet-up SlidesDanBrown980551
5th Power Grid Model Meet-up
It is with great pleasure that we extend to you an invitation to the 5th Power Grid Model Meet-up, scheduled for 6th June 2024. This event will adopt a hybrid format, allowing participants to join us either through an online Mircosoft Teams session or in person at TU/e located at Den Dolech 2, Eindhoven, Netherlands. The meet-up will be hosted by Eindhoven University of Technology (TU/e), a research university specializing in engineering science & technology.
Power Grid Model
The global energy transition is placing new and unprecedented demands on Distribution System Operators (DSOs). Alongside upgrades to grid capacity, processes such as digitization, capacity optimization, and congestion management are becoming vital for delivering reliable services.
Power Grid Model is an open source project from Linux Foundation Energy and provides a calculation engine that is increasingly essential for DSOs. It offers a standards-based foundation enabling real-time power systems analysis, simulations of electrical power grids, and sophisticated what-if analysis. In addition, it enables in-depth studies and analysis of the electrical power grid’s behavior and performance. This comprehensive model incorporates essential factors such as power generation capacity, electrical losses, voltage levels, power flows, and system stability.
Power Grid Model is currently being applied in a wide variety of use cases, including grid planning, expansion, reliability, and congestion studies. It can also help in analyzing the impact of renewable energy integration, assessing the effects of disturbances or faults, and developing strategies for grid control and optimization.
What to expect
For the upcoming meetup we are organizing, we have an exciting lineup of activities planned:
-Insightful presentations covering two practical applications of the Power Grid Model.
-An update on the latest advancements in Power Grid -Model technology during the first and second quarters of 2024.
-An interactive brainstorming session to discuss and propose new feature requests.
-An opportunity to connect with fellow Power Grid Model enthusiasts and users.
A Comprehensive Guide to DeFi Development Services in 2024Intelisync
DeFi represents a paradigm shift in the financial industry. Instead of relying on traditional, centralized institutions like banks, DeFi leverages blockchain technology to create a decentralized network of financial services. This means that financial transactions can occur directly between parties, without intermediaries, using smart contracts on platforms like Ethereum.
In 2024, we are witnessing an explosion of new DeFi projects and protocols, each pushing the boundaries of what’s possible in finance.
In summary, DeFi in 2024 is not just a trend; it’s a revolution that democratizes finance, enhances security and transparency, and fosters continuous innovation. As we proceed through this presentation, we'll explore the various components and services of DeFi in detail, shedding light on how they are transforming the financial landscape.
At Intelisync, we specialize in providing comprehensive DeFi development services tailored to meet the unique needs of our clients. From smart contract development to dApp creation and security audits, we ensure that your DeFi project is built with innovation, security, and scalability in mind. Trust Intelisync to guide you through the intricate landscape of decentralized finance and unlock the full potential of blockchain technology.
Ready to take your DeFi project to the next level? Partner with Intelisync for expert DeFi development services today!
17. Integrated in a compact aluminum case,
the Intel RealSense D435 is an intelligent
USB-C powered 3D active infra-red global
shutter stereo depth camera. It combines
a conventional red/green/blue (RGB) color
sensor, a vertical-cavity surface-emitting
laser (VCSEL) projector and left- and right-
side imagersfor stereo vision.
The 3D camera has a minimum depth of
0.2m and can scan environments up to
10m wide with a resolution depth of up to
1280x720 at 90 frames per second (fps).
The system uses a 28nm Intel D4 vision
processor for processing complex depth
data in real timeand a Realtek color image
processor.
The infrared laser projector is tiny,
measuring only 2.7mm x 1.8mm, uses
VCSEL technology and can record 60fps.
Omnivision supplies the three image
sensors; a CMOS 1080p RGB sensor and
twin 1-megapixel sensors for the left and
right side imagers.
The components and sensors are
contained in ball grid array (BGA) and
wafer level packaging, all mounted on two
single-sided boards whose total surface
area is less than 20cm².
Based on a complete teardown analysis of
the RealSense D435, the report provides
high definition pictures of the vision
processor, VCSEL IR projector and image
sensor dies as well as the bill-of-material
(BOM) and the manufacturing cost of the
depth module.
COMPLETE TEARDOW WITH
• Detailedteardown photos
• Componentidentification
• Diepictures
• PCB cross-sections
• Lens modulecrosssectionsand
analyses
• Intel vision processorphysical
analysisandcostestimate
• VCSEL and CMOS imagesensordie
physicalanalysesand costestimates
• Completeand priced bills-of-material
• Manufacturingprocessflow
• Manufacturingcostanalysis
• Estimated costand salesprice
The 3D camera is using infrared active stereo depth
and red/green/blue sensors,and a VCSEL projector.
REVERSE COSTING® – STRUCTURE, PROCESS & COSTREPORT
Title: Intel
RealSenseD435
Pages:90
Date:
May 2018
Format:
PDF & Excel file
Price:
EUR 3,490
Intel RealSense D435
3D Active IR Stereo Depth Camera
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
18. TABLE OFCONTENTS
IntelCompanyProfile,CameraMain Featuresand Main
Chipset
Physical Analysis
• Camera Teardown
• ElectronicBoards
Overview
High definition photos
Components markings and identification
• DiePictures
• Sensors BoardCrossSection
• Lens ModulesCrossSection
Cost Analysis
• AccessingtheBOM
• PCBs CrossSectionsand CostAnalysis
• Omnivision OV9282 CIS DiePictures and Cost
Estimation
AUTHORS
Lacroix Electronics where he was in charge of
components database. He holds a master degree
in microelectronics from the University of Rennes.
Analysis Labo-ratory as fab support in physical
analysis, and 3 years at Hirex Engineering in
Toulouse, in a DPA lab.
• VCSEL DiePictures,CrossSection and
CostEstimation
• Estimation of thecostof theLens Module
• BOMCost- MCUBoard
• BOMCost- SensorsBoard
• BOMCost- Housing
• Material CostBreakdown
• AccessingtheAdded Value(AV) cost
• MCUBoard ManufacturingFlowand
Added ValueCost
• SensorsBoardManufacturingFlowand
Added ValueCost
• Detailsof theSystemAssembly AVCost
• Added-ValueCostBreakdown
• ManufacturingCostBreakdown
Estimation ofthe SellingPrice - Intel
INTEL REALSENSED4353D ACTIVEIR STEREODEPTH CAMERA
David Le Gac has joined System
Plus Consulting as a cost
engineer in 2013. He is in
charge of reverse costing with a
focus on boards and systems.
He prev iously wo rked fo r
Yvon Le Goff has joined
System Plus Consulting in
2011, in order to setup the
Laboratory. He previously
worked during 25 years in
Atmel Nantes Technological
AppleiPhoneX Infrared Dot
Projector
A look inside the Single Photon
Avalanche Diode (SPAD) from
STMicroelectronics entering the
high-end Applehandset.
January 2017- EUR3,990*
Lenovo Phab2Pro 3D Timeof
Flight (ToF) Camera Google
Tango Ready
World’s first 3D tri-camera bundle
including Infineon/pmd REAL3TM
ToF image sensor integrated into a
consumersmartphone.
January 2017- EUR 3,990*
IntelRealSense3D Camera
& STMicroelectronics
IR LaserProjector
Innovative 3D camera for facial
analysisand hand/finger tracking,
basedon resonant micro-mirror, IR
laser, visible and near infrared
imagesensors.
September 2015 - EUR3,290*
RELATEDREPORTS
19. COSTINGTOOLS
IC Price+
The tool performs the necessary cost simulation
of any Integrated Circuit: ASICs, microcontrollers,
DSP, memories, smartpower, and more.
SYSCost+
It provides all component costs estimation
including PCB, housing and connectors, and a
simulation of the assembly cost and test process
at the board and system level.
REVERSECOSTING® –STRUCTURE& PROCESS REPORT
Process-Based
Costing Tools
Parametric
Costing Tools
WHAT IS A REVERSE COSTING®?
Reverse Costing® is the process of disassembling a device (or a
system) in order to identify its technology and calculate its
manufacturing cost,usingin-housemodels andtools.
IC
Price+
MEMS
CoSim+
MEMS
Price+
Power
CoSim+
Power
Price+
LED
CoSim+
3D
Package
CoSim+
Display
Price+
PCB
Price+
SYSCost+
Our analysis is performed withour costing tools IC Price+ and SYSCost+.
System Plus Consulting offers powerful costing tools to evaluate the production cost and selling price from
single chip tocomplex structures.
CONTACTS
Headquarters
22,bd Benoni Goullin
Nantes Biotech
44200 Nantes
France
+33 2 40 18 09 16
sales@systemplus.fr
Europe SalesOffice
LizzieLEVENEZ
FrankfurtamMain
Germany
+49 151 23 54 41 82
llevenez@systemplus.fr
AmericaSalesOffice
Steve LAFERRIERE
Western USA
+1 310-600-8267
laferriere@yole.fr
Troy BLANCHETTE
Eastern USA
+1 704-859-0453
troy.blanchette@yole.fr
Asia SalesOffice
Takashi ONOZAWA
Japan & Restof Asia
+81 3 4405 9204
onozawa@yole.fr
MavisWANG
Greater China
+886 979 336 809
wang@yole.fr
SYSTEM PLUS CONSULTING
System Plus Consulting is
specialized in the cost
analysis of electronics from
semiconductor devices to
electronicsystems.
A complete rangeof
services and costing tools to
provide in-depth production
cost studies and toestimate
the objective selling price of
a product is available.
Our services:
• STRUCTURE & PROCESS
ANALYSES
• CUSTOM ANALYSES
• COSTING SERVICES
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20. ORDER FORM
Please process my order for “IntelRealSense D435 3D Active IR Stereo
DepthCamera” Reverse Costing® – Structure& Process Report
Ref: SP18404
Full Structure& Process Report : EUR 3,490*
SHIPTO
Name(Mr/Ms/Dr/Pr): .............................................................
Job Title: …….............................................................................
Company: ….............................................................................
Address: …….............................................................................
City: ………………………………… State: ..........................................
Postcode/Zip: ..........................................................................
Country: ……............................................................................
VAT ID Number for EU members: ..........................................
Tel: ……………….........................................................................
Email: .....................................................................................
Date: ......................................................................................
Signature: ..............................................................................
BILLINGCONTACT
First Name : ............................................................................
Last Name: …….......................................................................
Email: …..................................................................................
Phone: ……..............................................................................
PAYMENT
By credit card:
Number: |__|__|__|__| |__|__|__|__| |__|__|__|__|
|__|__|__|__|
Expiration date: |__|__|/|__|__|
Card Verification Value: |__|__|__|
By bank transfer:
HSBC, 1placedela Bourse,F-69002Lyon,France
SWIFT or BICcode: CCFRFRPP
Bank code : 30056 - Branchcode : 00170 - Account : 0170200156587
IBAN: FR76 3005 6001 7001 7020 0156 587
• In USD
Bank code : 30056 - Branchcode : 00955 - Account :
09550003247
IBAN: FR76 3005 6009 5509 5500 0324 797
Return orderby:
FAX: +33 (0)472 83 01 83
MAIL: YOLE DEVELOPPEMENT
75 Cours Emile Zola
69100 Villeurbanne – France
*Forprice in dollarspleaseusetheday’s
exchangerate.
*All reports aredelivered electronically in
pdf format.
*ForFrench customer,add 20 %forVAT.
*Ourprices aresubjectto change.Please
check ournewreleases and price
changes on www.systemplus.fr.The
presentdocumentis valid 6 months after
its publishingdate:June2018
REVERSECOSTING® –STRUCTURE, PROCESS & COSTREPORTINTEL REALSENSED4353D ACTIVEIR STEREODEPTH CAMERA
Each year System Plus Consulting
releases a comprehensive collection
of new reverse engineering and
costing analyses in various domains.
You can choose to buy over 12
months a set of 3, 4, 5, 7, 10 or 15
Reverse Costing® reports.
Up to 47% discount!
More than 60 reports released each
year on the following topics
(considered for 2018):
• MEMS & Sensors: Accelerometer
– Environment - Fingerprint - Gas -
Gyroscope - IMU/Combo-
Microphone - Optics - Oscillator -
Pressure
• Power: GaN- IGBT - MOSFET - Si
Diode - SiC
• Imaging: Camera- Spectrometer
• LED and Laser: UVLED – VCSEL -
White/blue LED
• Packaging: 3D Packaging -
Embedded- SIP - WLP
• Integrated Circuits: IPD –
Memories– PMIC - SoC
• RF: FEM - Duplexer
• Systems: Automotive - Consumer
- Energy - Telecom
ANNUAL SUBSCRIPTIONS
21. for a period of 12 calendar months). The annual subscription to a package (i.e. a global discount based on the number of reports that the Buyer orders or acces ses via the service, a global search service on line on I-micronews and
a consulting approach), is defined in the order. Reports are established in PowerPoint and delivered on a PDF format and the database may include Excel files.
“Seller”: Based in Lyon (France headquarters), Yole Développement is a market research and business development consultancy company, facilitating market access for advanced technology industrial projects. With more than 20
market analysts, Yole works worldwide with the key industrial companies, R&D institutes and investors to help them understand the markets and technology trends.
1. Scope
1.1 The Contracting Parties undertake to observe the following general conditions when agreed by the Buyer and the Seller. ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS AND CONDITIONSIN ANY OTHER DOCUMENTS
ISSUED BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE MADE HEREUNDER AND SHALL NOT BE BINDING IN ANY WAY ON THE SELLER.
1.2 This agreement becomes valid and enforceable between the Contracting Parties after clear and non-equivocal consent by any duly authorized person representing the Buyer. For these purposes, the Buyer accepts these
conditions of sales when signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. This results in acceptance by the Buyer.
1.3 Orders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from the date of order, to be sent either by email or to the Buyer’s address. In the absence of any confirmation
in writing, orders shall be deemed to have been accepted.
2. Mailing of the Products
2.1 Products are sent by email to the Buyer:
- within [1] month from the order for Products already released; or
- within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavours to inform the Buyer of an indicative release date and the evolution of the work in progress.
2.2 Some weeks prior to the release date the Seller can propose a pre-release discount to the Buyer
The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including incases where a new event or access to new contradictory information would require for the analyst extra time to compute or
compare the data in order to enable the Seller to deliver a high quality Products.
2.3 The mailing ofthe Product will occur onlyupon payment by the Buyer, in accordance with the conditions contained in article 3.
2.4. The mailing is operated through electronic means either by email via the sales department or automatically online via an email/password. If the Product’s electronic delivery format is defective, the Seller undertakes to
replace it at no charge to the Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product.
2.5 The person receiving the Products on behalf ofthe Buyer shall immediately verify the quality of the Products and thei r conformity to the order. Any claim for apparent defects or for non-conformity shall be sent in writing to
the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. .
2.6 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providingprior information to the Seller as required under article
2.5 shall remain at the Buyer’s risk.
3. Price, invoicing and payment
3.1 Prices are given in the orders corresponding to each Product sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated from time to time. The
effective price is deemed to be the one applicable at the time of the order.
3.2 Yole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange to this
uncertainty, the company will get a discount that can vary from 15% to 10%.
3.3 Payments due bythe Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account:
HSBC, 1 place de la Bourse 69002 Lyon France
Bank code: 30056
Branch code: 00170
Account n°: 0170 200 1565 87
BIC or SWIFT code: CCFRFRPP
IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order.
3.4 Payment is due by the Buyer to the Seller within 30 days from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be entitled
to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441 -6 of the French Commercial Code. Our publications (report, database, tool...) are delivered only after reception
of the payment.
3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages.
4. Liabilities
4.1 The Buyer or any other individual or legal person acting on its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and
interpretations he makes of the documents it purchases, of the results he obtains, and ofthe advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arisingfrom a material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental or consequential damages (including, but notlimited to, damages for loss of profits, business interruption and loss of programs or information) arising out of the
use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof.
4.4All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot be
guaranteed to be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the liability of
the Seller, provided that the Seller ensures the substituted Product is similar to the Product initiallyordered.
4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and withoutindemnities or compensation of any
kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are no t guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the orders,
except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down payment to the
exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied, including, without limitation, those ofsale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take reasonable steps
to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive prop erties before making the Products available, the Seller cannot guarantee that any Product will be free
from infection.
5. Force majeure
The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties, equipment
failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault ofthe Seller.
6. Protection of the Seller’s IPR
6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to an y other party other than employees of its company. The Buyer shall have the right to use the Products solely
for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as:
- Information storage and retrieval systems;
- Recordings and re-transmittals over any network (including any local area network);
- Use in any timesharing, service bureau, bulletin board or similar arrangement or public display;
- Posting any Product to any other online service (including bulletin boards or the Internet);
- Licensing, leasing, selling, offering for sale or assigningthe Product.
6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall
personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company pointof contact for the needs of the contract. This person will be the reci pient of each new report in PDF format. This person shall also be responsible for respect of the copyrights
and will guaranty that the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person ofcontact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a maximum of
10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to ch eck from time to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company, the joint
venture done with a third party etc..cannot access the report and should pay a full license price.
7. Termination
7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such delay or
cancellation. This may also applyfor any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without solving
the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without beingliable for any compensation.
8. Miscellaneous
All the provisions ofthese Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts ofLyon, which shall have
exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
TERMS ANDCONDITIONSOF SALES
. Definitions: “Acceptance”: Action by which the Buyer accepts the terms and conditions ofsale in their entirety. It is done bysigning the purchase order which mentions “I hereby accept Yole’s
Terms and Conditions of Sale”.
“Buyer”: Any business user (i.e. any person acting in the course of its business activities, for its business needs) entering into the following general conditions to the exclusion ofconsumers acting
in their personal interests.
“Contracting Parties” or “Parties”: The Seller on the one hand and the Buyer on the other hand.
“Intellectual Property Rights” (“IPR”) means any rights held by the Seller in its Products, including any patents, trademarks , registered models, designs, copyrights, inventions, commercial secrets
and know-how, technical information, company or trading names and any other intellectual property rights or similar in any partof the world, notwithstanding the fact that they have been
registered or not and including any pending registration of one of the above mentioned rights.
“License”: For the reports and databases, 3 different licenses are proposed. The buyer has to choose one license:
• One user license: one person at the company can use the report.
• Multi-user license: the report can be used by unlimited users within the company. Subsidiaries and Joint-Ventures are not included.
• Corporate license: purchased under “Annual Subscription” program, the report can be used by unlimited users within the company. Joint-Ventures are not included.
“Products”: Depending on the purchase order, reports or database on MEMS, CSC, Optics/MOEMS, Nano, bio… to be boughteither on a unit basis or as an annual subscription. (i.e. subscription