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©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 1
21 rue la Noue Bras de Fer
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Thermo Fisher Ion 520
Sample Tracking & DNA Sequencing Chip
MEMS report by Stéphane ELISABETH
July 2017 – version 1
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 2
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 6
o Thermo Fisher Scientific
o Leadership of Thermo Fisher
o Thermo Fisher Revenue Profile
o NGS – Next-Gen Sequencing – Ion Torrent Technology
o Thermo Fisher Ion Torrent Semiconductor Chip
o Microfluidic Market & Supply Chain
Physical Analysis 18
o Synthesis of the Physical Analysis
o Physical Analysis Methodology
o Package 21
 Package Views & Dimensions
 X-Ray Views
 Package Opening
 Package Cross-Section: PCB Substrate , Flow Cell Member, Wire Bonding
o Die 43
 Details View: Flow Chamber, Pixels
 View, Dimensions& Marking
 Active Area Deprocessing
 Die Delayering
 Die Process
 Die Cross-Section: Metal Layers, Active Area, ISFET
 Process Characteristics
Table of Contents
Manufacturing Process Flow 70
o Global Overview
o Front-End Process
o Wafer Fabrication Unit
o Sensor Layers Process Flow
o Packaging Process Flow
Cost Analysis 81
o Synthesis of the cost analysis
o Yields Explanation & Hypotheses
o Die 86
 Wafer Front-End Cost
 Sensor Layers Wafer Front-End Cost
 Sensor Layers Front-End Cost per process steps
 Total Front-End Cost
 Back-End 0 : Probe Test & Dicing
 Wafer & Die Cost
o Component 92
 Back-End : Packaging Cost
 Back-End : Packaging Cost per Process Steps
 Back-End : Final Test Cost
 Component Cost
Estimated Price Analysis 97
Company services 101
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 3
Overview / Introduction
Company Profile & Supply
Chain
o Thermo Fisher
o NGS Ion Torrent Tech.
o Market & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Microfluidic Market
Source : Yole Development
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 4
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Package Overview
o Package Cross-Section
o Die Overview
o Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Synthesis of the Physical Analysis
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 5
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Package Overview
o Package Cross-Section
o Die Overview
o Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package View & Dimensions
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 6
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Package Overview
o Package Cross-Section
o Die Overview
o Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package – X-Ray Views
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 7
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Package Overview
o Package Cross-Section
o Die Overview
o Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Cross-Section
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 8
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Package Overview
o Package Cross-Section
o Die Overview
o Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Die – View & Dimensions
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 9
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Package Overview
o Package Cross-Section
o Die Overview
o Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Die – Active Area
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 10
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Package Overview
o Package Cross-Section
o Die Overview
o Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Die Cross-Section – Metal Layers
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 11
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Package Overview
o Package Cross-Section
o Die Overview
o Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Die Cross-Section – ISFET
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 12
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
o Front-End Process
o Wafer Fabrication Unit
o Sensor Layers Process Flow
o Packaging Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Global Overview
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 13
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
o Front-End Process
o Wafer Fabrication Unit
o Sensor Layers Process Flow
o Packaging Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Process Flow (1/2)
drawing not to scale
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 14
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
o Front-End Process
o Wafer Fabrication Unit
o Sensor Layers Process Flow
o Packaging Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Packaging Process Flow 1/3
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 15
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
o Synthesis of cost analysis
o Yield Explanation
o Front-End Cost
o Die Cost
o Packaging Cost
o Component Cost
Selling Price Analysis
About System Plus
Front-End Cost
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 16
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
o Synthesis of cost analysis
o Yield Explanation
o Front-End Cost
o Die Cost
o Packaging Cost
o Component Cost
Selling Price Analysis
About System Plus
Wafer & Die Cost
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 17
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
o Synthesis of cost analysis
o Yield Explanation
o Front-End Cost
o Die Cost
o Packaging Cost
o Component Cost
Selling Price Analysis
About System Plus
Component Cost
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 18
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
o Manufacturer Financial
o Estimated Price
About System Plus
Estimated Manufacturer Price
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 19
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
o Company services
o Related reports
o Feedbacks
o Contact
o Legal
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
MEDTECH
• Status of the Microfluidics Industry 2017
• Status of the MEMS Industry 2017
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
MEDTECH
• Given Imaging - PillCam COLON 2 Capsule
COMPLETE TEARDOWN
WITH:
• Detailed photos
• Precise
measurements
• Material analysis
• Manufacturing
process flow
• Supply chain
evaluation
• Manufacturing cost
analysis
• Estimated sales price
Thermo Fisher Ion 520 DNA Sequencing Chip
Title: Thermo Fisher
Ion 520 DNA
Sequencing Chip
Pages: 130
Date: July 2017
Format: PDF & Excel
file
Price: Full report:
EUR 3,490
Next generation of silicon/polymer microfluidic technology for fast
throughput DNA sequencing from Thermo Fisher Ion Torrent®
Thermo Fisher, with 8% of the microfluidic product market, is one of the
companies most involved in sequencing applications, along with its rival
Illumina. However, the two companies have different objectives. Thermo Fisher
intends to reduce analysis time with fast throughput and short single-end
reads. Illumina has high throughput with short paired reads. To deliver fast
reading, Thermo Fisher uses Ion Torrent® technology, which relies on
technology similar to an image sensor.
The innovative Ion 520 DNA sequencing chip uses this Ion Torrent technology. It
includes a multiwell array, which captures the sphere particles that have DNA
attached. The particles react with a solution of nucleotides, which changes the
charge in the wells, which in turn is detected by the circuit and allows the DNA
sequencing. With several materials involved in the chip manufacturing, 3D silicon
design, polymers for microfluidic processing and its special assembly, the
component appears to have a very high level of complexity.
Using Ion Torrent technology, Thermo Fisher has managed to provide a powerful
and cost-effective sensor chip. The process is entirely CMOS compatible.
Surprisingly, it uses well-proven standard packaging with a proprietary flow
chamber design.
This report includes a complete analysis of the Ion 520 chip from Thermo Fisher,
featuring chip disassembly and die analyses, processes and cross-sections. Finally,
it contains a full cost analysis and a selling price estimation of the component.
Today a main challenge in life science research
is to reduce the price of genomic analysis, and
the time taken to do it. Back in 2003, the cost of
sequencing the human genome was almost
$3B. That decreased to $10,000 in 2011, and is
headed towards $1,000 in the next few years.
TABLE OF CONTENTS
Overview / Introduction
Company Profile and Supply
Chain
Physical Analysis
• Package Analysis Methodology
• Package Analysis
 Views and dimensions
 Opening
 Cross-section: PCB Substrate,
Flow Cell Member
• Die Analysis
 Die View and Dimensions:
Flow Chamber, Pixels
 Die Active Area View and
Delayering
 Die Process
 Die Cross-Section: Metal
Layers, Wells, ISFET
Manufacturing Process
Flow
• Wafer Fabrication Unit
• Packaging Process Flow
Cost Analysis
• Overview of the Cost Analysis
• Supply Chain Description
• Yield Hypotheses
• Wafer Cost Analyses:
 Front-end cost
 Die cost
• Packaging Cost Analysis
 Packaging Back-End Cost
 Packaging Cost by Process
Step
• Component Cost
Estimated Price Analysis
Performed by
ANALYSIS PERFORMED WITH OUR COSTING TOOLS MEMS COSIM+, 3D PACKAGE
COSIM+ AND IC PRICE+
IC Price+
System Plus Consulting offers
powerful costing tools to
evaluate the production cost
and selling price from single chip
to complex structures.
MEMS Cosim+
Cost simulation tool to evaluate
the cost of any MEMS process
or device.
IC Price+
The tool performs the necessary
cost simulation of any
Integrated Circuit.
3D Package Cosim+
Cost simulation tool to evaluate
the cost of any Packaging
process: Wafer-level packaging,
TSV, 3D integration…
AUTHORS:
Stéphane
Elisabeth
Stéphane has a
deep knowledge of
materials characterizations and
electronics systems. He holds an
Engineering Degree in Electronics
and Numerical Technology, and a
PhD in Materials for Micro-
electronics.
Consulting in 2011 to setup its
laboratory. He previously worked
for 25 years at Atmel Nantes
Technological Analysis Laboratory
as fab support in physical analysis,
and for three years at Hirex
Engineering in Toulouse, in a
destructive physical analysis lab.
Yvon
Le Goff (Lab)
Yvon has joined
S y s t e m P l u s
3D Package CoSim+
MEMS CoSim+
Distributed by
ANNUAL SUBSCRIPTION OFFER
You can choose to buy over 12
months a set of 3, 4, 5, 7, 10 or
15 Reverse Costing® reports.
Up to 47% discount!
• MEMS & Sensors:
Accelerometer - Compass - Display /
Optics - Environment - Fingerprint -
Gyroscope - IMU/Combo - Light -
Microphone - Oscillator - Pressure sensor
• Power:
GaN - IGBT - MOSFET - Si Diode - SiC
• Systems:
Automotive - Consumer - Energy -
Medical - Telecom
Each year System Plus Consulting releases a comprehensive collection of new reverse engineering &
costing analyses in various domains.
• Imaging:
Infrared - Visible
• Integrated Circuits & RF:
Integrated Circuit (IC) - RF IC
• LEDs:
LED Lamp - UV LED - White/blue LED
• Packaging:
3D Packaging - Embedded - SIP - WLP
More than 60 reports released each year on the following topics (considered for 2017):
Performed by
RELATED REPORTS
Status of the Microfluidics
Industry 2017
Status of the MEMS
Industry 2017
Given Imaging - PillCam
COLON 2 Capsule
Diagnostics, point-of-care, and
pharmaceutical research will drive
the rapidly-expanding microfluidic
products industry to a potential
value of $23B by 2022.
With 14% market growth from
2017-2022, MEMS remain the
backbone of the sensor industry.
Impressive smart compact system
that includes efficient power
management, 2 cameras, 8 LEDs, 1
MEMS magnetic switch and 1 RF
ASIC!
Pages: 250
Date: May 2017
Full report: EUR 6,490*
Pages: 240
Date: June 2017
Full report: EUR 6,490*
Pages: 63
Date: December 2013
Full report: EUR 2,990*
Distributed by
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology
and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using
silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50
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The “More than Moore” company Yole, along with its partners System Plus Consulting, Blumorpho and KnowMade,
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solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due
time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which
shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
Distributed by
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 20
COMPANY
SERVICES
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 21
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
o Company services
o Related reports
o Feedbacks
o Contact
o Legal
Business Models Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>40 reports per year)
Costing Tools
Trainings
©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 22
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
o Company services
o Related reports
o Feedbacks
o Contact
o Legal
Contact
Headquarters
21 rue La Noue Bras de Fer
44200 Nantes
FRANCE
+33 2 40 18 09 16
sales@systemplus.fr
Europe Sales Office
Lizzie LEVENEZ
Frankfurt am Main
GERMANY
+49 151 23 54 41 82
llevenez@systemplus.fr
America Sales Office
Steve LAFERRIERE
Phoenix
USA
laferriere@yole.fr
www.systemplus.fr
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Tokyo
JAPAN
onozawa@yole.fr
Mavis WANG
GREATER CHINA
wang@yole.fr
NANTES
Headquarter
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LYON
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TOKYO
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Thermo Fisher Ion 520 DNA Sequencing Chip 2017 teardown reverse costing report published by Yole Developpement

  • 1. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 1 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr Thermo Fisher Ion 520 Sample Tracking & DNA Sequencing Chip MEMS report by Stéphane ELISABETH July 2017 – version 1
  • 2. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 2 Overview / Introduction 3 o Executive Summary o Reverse Costing Methodology Company Profile 6 o Thermo Fisher Scientific o Leadership of Thermo Fisher o Thermo Fisher Revenue Profile o NGS – Next-Gen Sequencing – Ion Torrent Technology o Thermo Fisher Ion Torrent Semiconductor Chip o Microfluidic Market & Supply Chain Physical Analysis 18 o Synthesis of the Physical Analysis o Physical Analysis Methodology o Package 21  Package Views & Dimensions  X-Ray Views  Package Opening  Package Cross-Section: PCB Substrate , Flow Cell Member, Wire Bonding o Die 43  Details View: Flow Chamber, Pixels  View, Dimensions& Marking  Active Area Deprocessing  Die Delayering  Die Process  Die Cross-Section: Metal Layers, Active Area, ISFET  Process Characteristics Table of Contents Manufacturing Process Flow 70 o Global Overview o Front-End Process o Wafer Fabrication Unit o Sensor Layers Process Flow o Packaging Process Flow Cost Analysis 81 o Synthesis of the cost analysis o Yields Explanation & Hypotheses o Die 86  Wafer Front-End Cost  Sensor Layers Wafer Front-End Cost  Sensor Layers Front-End Cost per process steps  Total Front-End Cost  Back-End 0 : Probe Test & Dicing  Wafer & Die Cost o Component 92  Back-End : Packaging Cost  Back-End : Packaging Cost per Process Steps  Back-End : Final Test Cost  Component Cost Estimated Price Analysis 97 Company services 101
  • 3. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 3 Overview / Introduction Company Profile & Supply Chain o Thermo Fisher o NGS Ion Torrent Tech. o Market & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus Microfluidic Market Source : Yole Development
  • 4. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 4 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Package Overview o Package Cross-Section o Die Overview o Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus Synthesis of the Physical Analysis
  • 5. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 5 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Package Overview o Package Cross-Section o Die Overview o Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus Package View & Dimensions
  • 6. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 6 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Package Overview o Package Cross-Section o Die Overview o Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus Package – X-Ray Views
  • 7. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 7 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Package Overview o Package Cross-Section o Die Overview o Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus Package Cross-Section
  • 8. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 8 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Package Overview o Package Cross-Section o Die Overview o Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus Die – View & Dimensions
  • 9. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 9 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Package Overview o Package Cross-Section o Die Overview o Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus Die – Active Area
  • 10. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 10 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Package Overview o Package Cross-Section o Die Overview o Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus Die Cross-Section – Metal Layers
  • 11. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 11 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Package Overview o Package Cross-Section o Die Overview o Die Cross-Section Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus Die Cross-Section – ISFET
  • 12. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 12 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow o Front-End Process o Wafer Fabrication Unit o Sensor Layers Process Flow o Packaging Process Flow Cost Analysis Selling Price Analysis About System Plus Global Overview
  • 13. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 13 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow o Front-End Process o Wafer Fabrication Unit o Sensor Layers Process Flow o Packaging Process Flow Cost Analysis Selling Price Analysis About System Plus Process Flow (1/2) drawing not to scale
  • 14. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 14 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow o Front-End Process o Wafer Fabrication Unit o Sensor Layers Process Flow o Packaging Process Flow Cost Analysis Selling Price Analysis About System Plus Packaging Process Flow 1/3
  • 15. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 15 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Synthesis of cost analysis o Yield Explanation o Front-End Cost o Die Cost o Packaging Cost o Component Cost Selling Price Analysis About System Plus Front-End Cost
  • 16. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 16 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Synthesis of cost analysis o Yield Explanation o Front-End Cost o Die Cost o Packaging Cost o Component Cost Selling Price Analysis About System Plus Wafer & Die Cost
  • 17. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 17 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis o Synthesis of cost analysis o Yield Explanation o Front-End Cost o Die Cost o Packaging Cost o Component Cost Selling Price Analysis About System Plus Component Cost
  • 18. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 18 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis o Manufacturer Financial o Estimated Price About System Plus Estimated Manufacturer Price
  • 19. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 19 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus o Company services o Related reports o Feedbacks o Contact o Legal Related Reports MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT MEDTECH • Status of the Microfluidics Industry 2017 • Status of the MEMS Industry 2017 REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MEDTECH • Given Imaging - PillCam COLON 2 Capsule
  • 20. COMPLETE TEARDOWN WITH: • Detailed photos • Precise measurements • Material analysis • Manufacturing process flow • Supply chain evaluation • Manufacturing cost analysis • Estimated sales price Thermo Fisher Ion 520 DNA Sequencing Chip Title: Thermo Fisher Ion 520 DNA Sequencing Chip Pages: 130 Date: July 2017 Format: PDF & Excel file Price: Full report: EUR 3,490 Next generation of silicon/polymer microfluidic technology for fast throughput DNA sequencing from Thermo Fisher Ion Torrent® Thermo Fisher, with 8% of the microfluidic product market, is one of the companies most involved in sequencing applications, along with its rival Illumina. However, the two companies have different objectives. Thermo Fisher intends to reduce analysis time with fast throughput and short single-end reads. Illumina has high throughput with short paired reads. To deliver fast reading, Thermo Fisher uses Ion Torrent® technology, which relies on technology similar to an image sensor. The innovative Ion 520 DNA sequencing chip uses this Ion Torrent technology. It includes a multiwell array, which captures the sphere particles that have DNA attached. The particles react with a solution of nucleotides, which changes the charge in the wells, which in turn is detected by the circuit and allows the DNA sequencing. With several materials involved in the chip manufacturing, 3D silicon design, polymers for microfluidic processing and its special assembly, the component appears to have a very high level of complexity. Using Ion Torrent technology, Thermo Fisher has managed to provide a powerful and cost-effective sensor chip. The process is entirely CMOS compatible. Surprisingly, it uses well-proven standard packaging with a proprietary flow chamber design. This report includes a complete analysis of the Ion 520 chip from Thermo Fisher, featuring chip disassembly and die analyses, processes and cross-sections. Finally, it contains a full cost analysis and a selling price estimation of the component. Today a main challenge in life science research is to reduce the price of genomic analysis, and the time taken to do it. Back in 2003, the cost of sequencing the human genome was almost $3B. That decreased to $10,000 in 2011, and is headed towards $1,000 in the next few years.
  • 21. TABLE OF CONTENTS Overview / Introduction Company Profile and Supply Chain Physical Analysis • Package Analysis Methodology • Package Analysis  Views and dimensions  Opening  Cross-section: PCB Substrate, Flow Cell Member • Die Analysis  Die View and Dimensions: Flow Chamber, Pixels  Die Active Area View and Delayering  Die Process  Die Cross-Section: Metal Layers, Wells, ISFET Manufacturing Process Flow • Wafer Fabrication Unit • Packaging Process Flow Cost Analysis • Overview of the Cost Analysis • Supply Chain Description • Yield Hypotheses • Wafer Cost Analyses:  Front-end cost  Die cost • Packaging Cost Analysis  Packaging Back-End Cost  Packaging Cost by Process Step • Component Cost Estimated Price Analysis Performed by ANALYSIS PERFORMED WITH OUR COSTING TOOLS MEMS COSIM+, 3D PACKAGE COSIM+ AND IC PRICE+ IC Price+ System Plus Consulting offers powerful costing tools to evaluate the production cost and selling price from single chip to complex structures. MEMS Cosim+ Cost simulation tool to evaluate the cost of any MEMS process or device. IC Price+ The tool performs the necessary cost simulation of any Integrated Circuit. 3D Package Cosim+ Cost simulation tool to evaluate the cost of any Packaging process: Wafer-level packaging, TSV, 3D integration… AUTHORS: Stéphane Elisabeth Stéphane has a deep knowledge of materials characterizations and electronics systems. He holds an Engineering Degree in Electronics and Numerical Technology, and a PhD in Materials for Micro- electronics. Consulting in 2011 to setup its laboratory. He previously worked for 25 years at Atmel Nantes Technological Analysis Laboratory as fab support in physical analysis, and for three years at Hirex Engineering in Toulouse, in a destructive physical analysis lab. Yvon Le Goff (Lab) Yvon has joined S y s t e m P l u s 3D Package CoSim+ MEMS CoSim+ Distributed by
  • 22. ANNUAL SUBSCRIPTION OFFER You can choose to buy over 12 months a set of 3, 4, 5, 7, 10 or 15 Reverse Costing® reports. Up to 47% discount! • MEMS & Sensors: Accelerometer - Compass - Display / Optics - Environment - Fingerprint - Gyroscope - IMU/Combo - Light - Microphone - Oscillator - Pressure sensor • Power: GaN - IGBT - MOSFET - Si Diode - SiC • Systems: Automotive - Consumer - Energy - Medical - Telecom Each year System Plus Consulting releases a comprehensive collection of new reverse engineering & costing analyses in various domains. • Imaging: Infrared - Visible • Integrated Circuits & RF: Integrated Circuit (IC) - RF IC • LEDs: LED Lamp - UV LED - White/blue LED • Packaging: 3D Packaging - Embedded - SIP - WLP More than 60 reports released each year on the following topics (considered for 2017): Performed by RELATED REPORTS Status of the Microfluidics Industry 2017 Status of the MEMS Industry 2017 Given Imaging - PillCam COLON 2 Capsule Diagnostics, point-of-care, and pharmaceutical research will drive the rapidly-expanding microfluidic products industry to a potential value of $23B by 2022. With 14% market growth from 2017-2022, MEMS remain the backbone of the sensor industry. Impressive smart compact system that includes efficient power management, 2 cameras, 8 LEDs, 1 MEMS magnetic switch and 1 RF ASIC! Pages: 250 Date: May 2017 Full report: EUR 6,490* Pages: 240 Date: June 2017 Full report: EUR 6,490* Pages: 63 Date: December 2013 Full report: EUR 2,990* Distributed by
  • 23. ORDER FORM Please process my order for “Thermo Fisher Ion 520 DNA Sequencing Chip” Reverse Costing Report  Full Reverse Costing report: EUR 3,490* Ref.: SP17346 *For price in dollars please use the day’s exchange rate. All reports are delivered electronically in pdf format. For French customer, add 20 % for VAT. Performed by DELIVERY on receipt of payment: By credit card: Number: |__|__|__|__| |__|__|__|__| |__|__|__|__| |__|__|__|__| Expiration date: |__|__|/|__|__| Card Verification Value: |__|__|__| By bank transfer: BANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France, Bank code : 30056, Branch code : 00170 Account No : 0170 200 1565 87, SWIFT or BIC code : CCFRFRPP, IBAN : FR76 3005 6001 7001 7020 0156 587 Return order by: • FAX: +33 (0)472 83 01 83 • MAIL: YOLE DEVELOPPEMENT, 75 Cours Emile Zola, F - 69100 Lyon - Villeurbanne Contact: • Japan: Miho - Ohtake@yole.fr • Greater China: Mavis - Wang@yole.fr • Asia: Takashi - Onozawa@yole.fr • EMEA: Lizzie - Levenez@yole.fr • North America: Steve – laferriere@yole.fr • General: info@yole.fr The present document is valid till March 15, 2018 SHIP TO PAYMENT BILLING CONTACT ABOUT YOLE DEVELOPPEMENT Name (Mr/Ms/Dr/Pr): ...................................................................................... Job Title: ...................................................................................... Company: ...................................................................................... Address: ...................................................................................... City: State: ...................................................................................... Postcode/Zip: ...................................................................................... Country: ...................................................................................... VAT ID Number for EU members: ...................................................................................... Tel: ...................................................................................... Email: ..................................................................................... Date: ....................................................................................... Signature: ...................................................................................... Distributed by First Name: .................................................................. Last Name: ............................................................................ Email:............................................................................ Phone:..................................................................................... Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management. The “More than Moore” company Yole, along with its partners System Plus Consulting, Blumorpho and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business. CUSTOM STUDIES • Market data & research, marketing analysis • Technology analysis • Reverse engineering & costing services • Strategy consulting • Patent analysis More information on www.yole.fr MEDIA • i-Micronews.com, online disruptive technologies website and its weekly e- newsletter, @Micronews • Communication & webcasts services • Events: Yole Seminars, Market Briefings More information on http://www.i-micronews.com/media-kit.html TECHNOLOGY & MARKET REPORTS • Collection of technology & market reports • Manufacturing cost simulation tools • Component reverse engineering & costing analysis • Patent investigation More information on http://www.i- micronews.com/reports.html
  • 24. Performed by TERMS AND CONDITIONS OF SALES . Definitions: “Acceptance”: Action by which the Buyer accepts the terms and conditions of sale in their entirety. It is done by signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. “Buyer”: Any business user (i.e. any person acting in the course of its business activities, for its business needs) entering into the following general conditions to the exclusion of consumers acting in their personal interests. “Contracting Parties” or “Parties”: The Seller on the one hand and the Buyer on the other hand. “Intellectual Property Rights” (“IPR”) means any rights held by the Seller in its Products, including any patents, trademarks, registered models, designs, copyrights, inventions, commercial secrets and know-how, technical information, company or trading names and any other intellectual property rights or similar in any part of the world, notwithstanding the fact that they have been registered or not and including any pending registration of one of the above mentioned rights. “License”: For the reports and databases, 3 different licenses are proposed. The buyer has to choose one license: • One user license: one person at the company can use the report. • Multi-user license: the report can be used by unlimited users within the company. Subsidiaries and Joint-Ventures are not included. • Corporate license: purchased under “Annual Subscription” program, the report can be used by unlimited users within the company. Joint-Ventures are not included. “Products”: Depending on the purchase order, reports or database on MEMS, CSC, Optics/MOEMS, Nano, bio… to be bought either on a unit basis or as an annual subscription. (i.e. subscription for a period of 12 calendar months). The annual subscription to a package (i.e. a global discount based on the number of reports that the Buyer orders or accesses via the service, a global search service on line on I-micronews and a consulting approach), is defined in the order. Reports are established in PowerPoint and delivered on a PDF format and the database may include Excel files. “Seller”: Based in Lyon (France headquarters), Yole Développement is a market research and business development consultancy company, facilitating market access for advanced technology industrial projects. With more than 20 market analysts, Yole works worldwide with the key industrial companies, R&D institutes and investors to help them understand the markets and technology trends. 1. Scope 1.1 The Contracting Parties undertake to observe the following general conditions when agreed by the Buyer and the Seller. ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS AND CONDITIONS IN ANY OTHER DOCUMENTS ISSUED BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE MADE HEREUNDER AND SHALL NOT BE BINDING IN ANY WAY ON THE SELLER. 1.2 This agreement becomes valid and enforceable between the Contracting Parties after clear and non-equivocal consent by any duly authorized person representing the Buyer. For these purposes, the Buyer accepts these conditions of sales when signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. This results in acceptance by the Buyer. 1.3 Orders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from the date of order, to be sent either by email or to the Buyer’s address. In the absence of any confirmation in writing, orders shall be deemed to have been accepted. 2. Mailing of the Products 2.1 Products are sent by email to the Buyer: - within [1] month from the order for Products already released; or - within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavours to inform the Buyer of an indicative release date and the evolution of the work in progress. 2.2 Some weeks prior to the release date the Seller can propose a pre-release discount to the Buyer The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including incases where a new event or access to new contradictory information would require for the analyst extra time to compute or compare the data in order to enable the Seller to deliver a high quality Products. 2.3 The mailing of the Product will occur only upon payment by the Buyer, in accordance with the conditions contained in article 3. 2.4. The mailing is operated through electronic means either by email via the sales department or automatically online via an email/password. If the Product’s electronic delivery format is defective, the Seller undertakes to replace it at no charge to the Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product. 2.5 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity shall be sent in writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. . 2.6 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providing prior information to the Seller as required under article 2.5 shall remain at the Buyer’s risk. 3. Price, invoicing and payment 3.1 Prices are given in the orders corresponding to each Product sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated from time to time. The effective price is deemed to be the one applicable at the time of the order. 3.2 Yole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange to this uncertainty, the company will get a discount that can vary from 15% to 10%. 3.3 Payments due by the Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account: HSBC, 1 place de la Bourse 69002 Lyon France Bank code: 30056 Branch code: 00170 Account n°: 0170 200 1565 87 BIC or SWIFT code: CCFRFRPP IBAN: FR76 3005 6001 7001 7020 0156 587 To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order. 3.4 Payment is due by the Buyer to the Seller within 30 days from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441-6 of the French Commercial Code. Our publications (report, database, tool...) are delivered only after reception of the payment. 3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages. 4. 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The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot be guaranteed to be free from errors. 4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered. 4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in article 5 below. 4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down payment to the exclusion of any further damages. 4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that any Product will be free from infection. 5. Force majeure The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties, equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller. 6. Protection of the Seller’s IPR 6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions. 6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as: - Information storage and retrieval systems; - Recordings and re-transmittals over any network (including any local area network); - Use in any timesharing, service bureau, bulletin board or similar arrangement or public display; - Posting any Product to any other online service (including bulletin boards or the Internet); - Licensing, leasing, selling, offering for sale or assigning the Product. 6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety. 6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the copyrights and will guaranty that the Products are not disseminated out of the company. 6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password. 6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company, the joint venture done with a third party etc..cannot access the report and should pay a full license price. 7. Termination 7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision. 7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation. 8. Miscellaneous All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer. Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party. The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due time. 9. Governing law and jurisdiction 9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which shall have exclusive jurisdiction upon such issues. 9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions. Distributed by
  • 25. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 20 COMPANY SERVICES
  • 26. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 21 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus o Company services o Related reports o Feedbacks o Contact o Legal Business Models Fields of Expertise Custom Analyses (>130 analyses per year) Reports (>40 reports per year) Costing Tools Trainings
  • 27. ©2017 by System Plus Consulting | Thermo Fisher Ion 520 DNA Sequencing Chip 22 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis About System Plus o Company services o Related reports o Feedbacks o Contact o Legal Contact Headquarters 21 rue La Noue Bras de Fer 44200 Nantes FRANCE +33 2 40 18 09 16 sales@systemplus.fr Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY +49 151 23 54 41 82 llevenez@systemplus.fr America Sales Office Steve LAFERRIERE Phoenix USA laferriere@yole.fr www.systemplus.fr Asia Sales Office Takashi ONOZAWA Tokyo JAPAN onozawa@yole.fr Mavis WANG GREATER CHINA wang@yole.fr NANTES Headquarter FRANKFURT/MAIN Europa Sales Office LYON YOLE HQ TOKYO YOLE KK GREATER CHINA YOLE PHOENIX YOLE Inc. KOREA YOLE