Next generation of silicon/polymer microfluidic technology for fast throughput DNA sequencing from Thermo Fisher Ion Torrent®
Today a main challenge in life science research is to reduce the price of genomic analysis, and the time taken to do it. Back in 2003, the cost of sequencing the human genome was almost $3B. That decreased to $10,000 in 2011, and is headed towards $1,000 in the next few years.
Thermo Fisher, with 8% of the microfluidic product market, is one of the companies most involved in sequencing applications, along with its rival Illumina. However, the two companies have different objectives.
Thermo Fisher intends to reduce analysis time with fast throughput and short single-end reads. Illumina has high throughput with short paired reads. To deliver fast reading, Thermo Fisher uses Ion Torrent® technology, which relies on technology similar to an image sensor.
The innovative Ion 520 DNA sequencing chip uses this Ion Torrent technology. It includes a multiwell array, which captures the sphere particles that have DNA attached. The particles react with a solution of nucleotides, which changes the charge in the wells, which in turn is detected by the circuit and allows the DNA sequencing.
More information on that report at http://www.i-micronews.com/reports.html
Detailed analysis of HTC's smart approach to the VR experience
The Virtual Reality (VR) market has raised expectations extremely high. It is already worth several billion US dollars per year and growing rapidly, with millions of headsets due to be sold in coming years.
Three main companies lead thiHTC CMOS Image Sensor Die System Plus Consultings new market: HTC Corporation, Oculus VR, which was bought by Facebook in 2014 for $2 billion, and Sony Playstation.
They think this market has enough potential to invest billions of dollars to get ahead of their competitors. Most other major manufacturers also want good market shares, including Microsoft, Intel, Google, AMD, Samsung, Huawei, Archos and Alcatel.
Winning in this market is now HTC’s all-or-nothing strategy. The HTC Vive VR Head-Mounted Display (HMD) is aimed at saving HTC from collapse. Vive VR can be used in different sectors, including gaming, entertainment, health, automotive, retail and education. It promises a premium VR experience.
For more information please visit our website: http://www.i-micronews.com/reports.html
InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sens...Yole Developpement
World’s first ‘7-Axis’ motion tracking device targeting drone application
Having supplied Apple for many years, InvenSense (TDK) is a leader in the inertial measurement unit (IMU) market. It has a large market share, competing with Bosch and others. This year, with the acquisition of Sensirion’s barometric pressure sensor division, InvenSense has entered a new market area. It has now released of its first ‘7-axis’ motion tracking combo, bringing together a 6-axis IMU and a pressure sensor, moving it into drone applications.
The ICM-20789 7-axis combo sensor released by InvenSense features a 6-axis device, incorporating a 3-axis gyroscope and a 3-axis accelerometer, and a barometric pressure sensor previously developed by Sensirion in the same package. Compared with the stand-alone sensor hub, this approach eliminates a package and minimizes board area requirements.
More information on that report at http://www.i-micronews.com/reports.html
Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing ...Yole Developpement
A look into Texas Instruments’ system-on-chip, including Sony/Softkinetic’s time-of-flight pixel technology, for industrial applications
Today, Time-of-Flight (ToF) systems are among the most innovative technologies offering imaging companies an opportunity to lead the market. Every major player wants to integrate these devices to provide functions such as 3D imaging, proximity sensing, ambient light sensing and gesture recognition.
Sony/Softkinetic has been investigating this technology deeply, providing a unique pixel technology to several image sensor manufacturers in three application areas: consumer, automotive and industrial. For industrial applications, Sony/Softkinetic has licensed its technology to Texas Instruments, which is providing ToF imagers for human detection or robot-human interaction.
The OPT8241 3D ToF imager is packaged using Chip-On-Glass (COG) technology. The device comprises a system-on-chip (SoC) and glass filter in the same component in thin, 0.7 mm-thick, packaging.
This report analyzes the complete component, from the glass near-infrared band-pass filter to the collector based on ToF pixel licenses developed by Sony/Softkinetic and adapted by Texas Instruments. The report includes a complete cost analysis and price estimation of the device based on a detailed description of the package, and the ToF imager.
It also features a complete ToF pixel technology comparison with the Infineon/pmd, STMicroelectronics and Melexis automotive ToF imagers, which are all also based on Sony/Softkinetic technology, with details on the companies’ design choices.
More information on that report at http://www.i-micronews.com/reports.html
Take a look at the fifth generation of EPC’s low voltage transistor
The low voltage GaN device market is increasingly important, and Efficient Power Conversion Corporation (EPC) is a major player in low voltage GaN-on-silicon high-electron-mobility transistor (HEMT) devices. 100V GaN HEMTs are a very new technology but they already compete with silicon transistors, especially in the field of megahertz high frequency applications.
System Plus Consulting has investigated the company’s EPC2045 device, its latest driving 100V for applications such as single-stage 48V converters, USB-C data and power connectors, LiDAR sensors, point-of-load converters and loads in open rack server architectures.
With its new transistor and GaN epitaxy design, the EPC2045 achieves a breakdown voltage of 100V for a current of 16A at 25°C, and a very low RdsOn on-resistance of 7mΩ compared to the previous generation.
The chip-scale packaging of EPC products reduces the final device cost and decreases its inductance, bringing advantages not only with respect to competitors in GaN, but also silicon.
Compared to silicon transistors, GaN process developments have significantly lowered capacitance. This translates into lower gate drive losses and lower device switching losses at higher frequencies for the same on-resistance and voltage rating.
More information on that report at http://www.i-micronews.com/reports.html
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...Yole Developpement
Panasonic’s first 600V GaN HEMT has an innovative structure designed to integrate a normally-off transistor in a standard package, without a cascade structure
System Plus Consulting unveils Panasonic’s first GaN HEMT, assembled in a standard TO220 package. Thanks to its specific die design, the component is normally-off without using a cascade structure or special packaging.
Panasonic’s PGA26C09DV features a medium-voltage breakdown of 600V for a current of 15A (25°C), with very low RdsOn compared to its competitors. The transistor is optimized for AC-DC power supply, photovoltaic, and motor inverters.
The GaN and AlGaN layers are deposited by epitaxy on a silicon substrate. A complex buffer and template layer structure is used to reduce stress and dislocation. This is complemented by a thick superlattice structure clearly visible in the TEM analysis.
Based on a complete teardown analysis, this report also provides a production cost estimate for the epitaxy, HEMT, and package.
Moreover, this report offers a comparison with GaN Systems’ GS66504B and Transphorm’s GaN HEMT, highlighting the huge differences in design and manufacturing process and their impact on device size and production cost.
For more information visite us at: http://www.i-micronews.com/reports.html
This document provides an analysis of Tesla's UBQ01B0 chip used for full self-driving capabilities. It includes a physical analysis of the die and packaging, an overview of the manufacturing process, and a cost analysis. The chip is a system-on-chip designed and produced by Tesla to power its driver-assist and autonomous driving features. It utilizes quad-core ARM processors alongside a GPU and NPU for processing sensor data and neural network operations. The analysis examines the chip's design and architecture at the physical, manufacturing, and cost levels.
Panasonic 600 V GaN HEMT PGA26E19BA 2017 teardown reverse costing report publ...Yole Developpement
Panasonic adopts a DFN 8x8 package for its normally-off GaN HEMT structure
System Plus Consulting unveils the first GaN HEMT from Panasonic assembled in a dual flat no-lead (DFN) 8x8 package. Panasonic decided to abandon the standard TO220 package, probably because of poor electrical performance. Thanks to its proprietary X-GaN transistor structure and new die design the company has managed to produce a very competitive normally-off component.
The new PGA26E19BA from Panasonic features a medium breakdown voltage of 600V for a current of 10A at 25°C, with very low on-resistance with respect to its competitors and the TO220 assembled component.The transistor is optimized to be used in power supplies and AC-DC, photovoltaic and motor inverters.
Deep analysis of the 400Gb optical transceiver from a leading Chinese company.
More information: https://www.systemplus.fr/reverse-costing-reports/innolights-400g-qsfp-dd-optical-transceiver/
Detailed analysis of HTC's smart approach to the VR experience
The Virtual Reality (VR) market has raised expectations extremely high. It is already worth several billion US dollars per year and growing rapidly, with millions of headsets due to be sold in coming years.
Three main companies lead thiHTC CMOS Image Sensor Die System Plus Consultings new market: HTC Corporation, Oculus VR, which was bought by Facebook in 2014 for $2 billion, and Sony Playstation.
They think this market has enough potential to invest billions of dollars to get ahead of their competitors. Most other major manufacturers also want good market shares, including Microsoft, Intel, Google, AMD, Samsung, Huawei, Archos and Alcatel.
Winning in this market is now HTC’s all-or-nothing strategy. The HTC Vive VR Head-Mounted Display (HMD) is aimed at saving HTC from collapse. Vive VR can be used in different sectors, including gaming, entertainment, health, automotive, retail and education. It promises a premium VR experience.
For more information please visit our website: http://www.i-micronews.com/reports.html
InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sens...Yole Developpement
World’s first ‘7-Axis’ motion tracking device targeting drone application
Having supplied Apple for many years, InvenSense (TDK) is a leader in the inertial measurement unit (IMU) market. It has a large market share, competing with Bosch and others. This year, with the acquisition of Sensirion’s barometric pressure sensor division, InvenSense has entered a new market area. It has now released of its first ‘7-axis’ motion tracking combo, bringing together a 6-axis IMU and a pressure sensor, moving it into drone applications.
The ICM-20789 7-axis combo sensor released by InvenSense features a 6-axis device, incorporating a 3-axis gyroscope and a 3-axis accelerometer, and a barometric pressure sensor previously developed by Sensirion in the same package. Compared with the stand-alone sensor hub, this approach eliminates a package and minimizes board area requirements.
More information on that report at http://www.i-micronews.com/reports.html
Texas Instruments’ Time of Flight Image Sensor 2017 teardown reverse costing ...Yole Developpement
A look into Texas Instruments’ system-on-chip, including Sony/Softkinetic’s time-of-flight pixel technology, for industrial applications
Today, Time-of-Flight (ToF) systems are among the most innovative technologies offering imaging companies an opportunity to lead the market. Every major player wants to integrate these devices to provide functions such as 3D imaging, proximity sensing, ambient light sensing and gesture recognition.
Sony/Softkinetic has been investigating this technology deeply, providing a unique pixel technology to several image sensor manufacturers in three application areas: consumer, automotive and industrial. For industrial applications, Sony/Softkinetic has licensed its technology to Texas Instruments, which is providing ToF imagers for human detection or robot-human interaction.
The OPT8241 3D ToF imager is packaged using Chip-On-Glass (COG) technology. The device comprises a system-on-chip (SoC) and glass filter in the same component in thin, 0.7 mm-thick, packaging.
This report analyzes the complete component, from the glass near-infrared band-pass filter to the collector based on ToF pixel licenses developed by Sony/Softkinetic and adapted by Texas Instruments. The report includes a complete cost analysis and price estimation of the device based on a detailed description of the package, and the ToF imager.
It also features a complete ToF pixel technology comparison with the Infineon/pmd, STMicroelectronics and Melexis automotive ToF imagers, which are all also based on Sony/Softkinetic technology, with details on the companies’ design choices.
More information on that report at http://www.i-micronews.com/reports.html
Take a look at the fifth generation of EPC’s low voltage transistor
The low voltage GaN device market is increasingly important, and Efficient Power Conversion Corporation (EPC) is a major player in low voltage GaN-on-silicon high-electron-mobility transistor (HEMT) devices. 100V GaN HEMTs are a very new technology but they already compete with silicon transistors, especially in the field of megahertz high frequency applications.
System Plus Consulting has investigated the company’s EPC2045 device, its latest driving 100V for applications such as single-stage 48V converters, USB-C data and power connectors, LiDAR sensors, point-of-load converters and loads in open rack server architectures.
With its new transistor and GaN epitaxy design, the EPC2045 achieves a breakdown voltage of 100V for a current of 16A at 25°C, and a very low RdsOn on-resistance of 7mΩ compared to the previous generation.
The chip-scale packaging of EPC products reduces the final device cost and decreases its inductance, bringing advantages not only with respect to competitors in GaN, but also silicon.
Compared to silicon transistors, GaN process developments have significantly lowered capacitance. This translates into lower gate drive losses and lower device switching losses at higher frequencies for the same on-resistance and voltage rating.
More information on that report at http://www.i-micronews.com/reports.html
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...Yole Developpement
Panasonic’s first 600V GaN HEMT has an innovative structure designed to integrate a normally-off transistor in a standard package, without a cascade structure
System Plus Consulting unveils Panasonic’s first GaN HEMT, assembled in a standard TO220 package. Thanks to its specific die design, the component is normally-off without using a cascade structure or special packaging.
Panasonic’s PGA26C09DV features a medium-voltage breakdown of 600V for a current of 15A (25°C), with very low RdsOn compared to its competitors. The transistor is optimized for AC-DC power supply, photovoltaic, and motor inverters.
The GaN and AlGaN layers are deposited by epitaxy on a silicon substrate. A complex buffer and template layer structure is used to reduce stress and dislocation. This is complemented by a thick superlattice structure clearly visible in the TEM analysis.
Based on a complete teardown analysis, this report also provides a production cost estimate for the epitaxy, HEMT, and package.
Moreover, this report offers a comparison with GaN Systems’ GS66504B and Transphorm’s GaN HEMT, highlighting the huge differences in design and manufacturing process and their impact on device size and production cost.
For more information visite us at: http://www.i-micronews.com/reports.html
This document provides an analysis of Tesla's UBQ01B0 chip used for full self-driving capabilities. It includes a physical analysis of the die and packaging, an overview of the manufacturing process, and a cost analysis. The chip is a system-on-chip designed and produced by Tesla to power its driver-assist and autonomous driving features. It utilizes quad-core ARM processors alongside a GPU and NPU for processing sensor data and neural network operations. The analysis examines the chip's design and architecture at the physical, manufacturing, and cost levels.
Panasonic 600 V GaN HEMT PGA26E19BA 2017 teardown reverse costing report publ...Yole Developpement
Panasonic adopts a DFN 8x8 package for its normally-off GaN HEMT structure
System Plus Consulting unveils the first GaN HEMT from Panasonic assembled in a dual flat no-lead (DFN) 8x8 package. Panasonic decided to abandon the standard TO220 package, probably because of poor electrical performance. Thanks to its proprietary X-GaN transistor structure and new die design the company has managed to produce a very competitive normally-off component.
The new PGA26E19BA from Panasonic features a medium breakdown voltage of 600V for a current of 10A at 25°C, with very low on-resistance with respect to its competitors and the TO220 assembled component.The transistor is optimized to be used in power supplies and AC-DC, photovoltaic and motor inverters.
Deep analysis of the 400Gb optical transceiver from a leading Chinese company.
More information: https://www.systemplus.fr/reverse-costing-reports/innolights-400g-qsfp-dd-optical-transceiver/
This document provides an overview of NVIDIA's new A100 Ampere GPU. Some key points:
- It uses TSMC's 7nm process and CoWoS packaging to integrate over 6,000mm2 of silicon onto a single 55mm x 55mm package.
- It features a 7nm GPU die with 54 billion transistors and 40/80GB of HBM2 memory in a 3D stacked configuration connected via microbumps and TSVs.
- The report includes a physical analysis of the package, dies, and assembly, as well as a cost analysis and estimated price. It finds the A100 provides significantly higher performance than previous generations like the V100.
SPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE Invertersystem_plus
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/vitesco-technologies-power-module-in-jaguar-i-pace-inverter/
UnitedSiC UJN1205K 1200V SiC JFET report published by System Plus Consultingsystem_plus
Discover the technological choices made by United Silicon Carbide Inc. (UnitedSiC) for its most advanced SiC JFET and its associated features
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/unitedsic-ujn1205k-1200v-sic-jfet/
1200V CoolSiCTM MOSFET Module DF11MR12W1M1_B11, from Infineon 2018 teardown r...system_plus
The document provides a teardown analysis of Infineon's 1200V 50A CoolSiC MOSFET module, including a profile of Infineon, physical analysis of the module components, a description of the manufacturing processes, a cost analysis, and comparisons to other SiC MOSFET solutions. Through physical analysis, the report reveals Infineon's innovative SiC MOSFET and Schottky diode design assets. Manufacturing process details and a cost analysis estimate the costs to produce the module.
Technical and cost overview of the evolution of the radio frequency front-end module technologies integrated in the Apple iPhone series from 2016 - 2020.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-1-focus-on-apple/
Discover Axis’s high-end product integrating its latest ARTPEC-7 in-house system-on-chip dedicated to network video and machine learning capabilities.
More information : https://www.systemplus.fr/reverse-costing-reports/axis-p1375-e-network-camera/
Tesla Model 3 Inverter with SiC Power Module from STMicroelectronicssystem_plus
The first SiC power module in commercialized electric vehicles.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/tesla-model-3-inverter-with-sic-power-module-from-stmicroelectronics/
Apple iPhone X: MEMS Microphones from Goertek, Knowles, and AAC Technologies ...system_plus
Analysis and comparison of the design and process evolution used by Apple’s three MEMS microphone suppliers.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/apple-iphone-x-mems-microphones-from-goertek-knowles-and-aac-technologies/
Epson PrecisionCore Printhead with MicroTFP Inkjet Diessystem_plus
For the first time, Epson integrates thin film PZT MEMS into its office inkjet printer.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/epson-precisioncore-printhead-with-microtfp-inkjet-dies/
Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Editionsystem_plus
This document provides an analysis of Qualcomm's WiGig 60 GHz chipset for smartphones. It includes a physical analysis of the module and its two System-in-Package (SiP) components - a baseband SiP integrated on the main board and an antenna SiP featuring integrated antennae on an organic PCB. Both SiPs use a non-conventional double-sided molded packaging. The physical analysis examines the SiP and antenna board structures in detail. The document also provides a manufacturing process flow, cost analysis, and estimated selling price for the WiGig chipset solution.
Samsung’s Galaxy S9 Plus Processor Packages: Samsung’s iPoP vs. Qualcomm/Shin...system_plus
Comparison of both Samsung Galaxy S9 processor packages: Samsung Exynos 9810 with new TMV Package-on-Package vs. Qualcomm Snapdragon 845 with MCeP Packaging.
More information on that report at: https://www.i-micronews.com/report/product/samsung’s-galaxy-s9-plus-processor-packages-samsung’s-ipop-vs-qualcomm-shinko-mcep.html
Discover Infineon‘s first double sided cooling power module for automotive.
More information on that report at https://www.i-micronews.com/category-listing/product/infineon-ff400r07a01e3-double-side-cooled-igbt-module.html
Mitsubishi J1- Series 650V High-Power Modules for Automotivesystem_plus
The first power module with 7th-gen CSTBT IGBT and an innovative integrated substrate.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/mitsubishi-j1-series-650v-high-power-modules-for-automotive/
The Audi A8 zFAS ADAS Platform by Aptivsystem_plus
The first level 3 autonomous driving system, designed by Audi and manufactured by Aptiv (Delphi), integrates high-performance processors from Nvidia (Tegra K1), Altera (Cyclon V), Infineon (Aurix), and Mobileye (EyeQ3 image processor)
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/the-audi-a8-zfas-adas-platform-by-aptiv/
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Seriessystem_plus
This document provides a reverse costing analysis of the Broadcom AFEM-8100 SiP used in the Apple iPhone 11 series. It includes a physical analysis of the module and its dies, as well as a manufacturing process flow and cost analysis. Broadcom remains the sole supplier of the multi-die module, which features power amplifier, switch, filter and other dies. The analysis finds innovations that reduce the package size and cost, including a new EMI shielding integration method.
Sensonor STIM318 Inertial Measurement Unit (IMU)system_plus
Newest IMU with 9-axis detection and gyro bias instability of 0.3°/h from Sensonor.
More information: https://www.systemplus.fr/reverse-costing-reports/sensonor-stim318-inertial-measurement-unit-imu/
Advanced packaging technology in the Apple Watch Series 4’s System-in-Packagesystem_plus
Four major packaging technologies: TSMC’s info, ASE’s Double Side Molding/SESUB and SiP, Skyworks’ Double Side BGA.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/advanced-packaging-technology-in-the-apple-watch-series-4s-system-in-package/
Deep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.
More information : https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8200-pamid-in-the-apple-iphone-12-series/
Deep analysis of the latest generation of under-display optical fingerprint sensors using micro-optics.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/goodixs-ultra-thin-optical-in-display-fingerprint/
Cost-effective 1 mm2 miniature camera with customizable wafer-level optics for endoscopy and novel medical imaging devices.
More information : https://www.systemplus.fr/reverse-costing-reports/ams-naneye-mini-camera/
Tiny MEMS digital barometer for smartphones and wearables
The first barometric sensor from Infineon for the consumer market is targeting altitude, GPS, indoor and weather forecasting applications in portable devices. This MEMS sensor positions Infineon to compete with STMicroelectronics and Bosch Sensortec.
Infineon’s DPS310 pressure-sensing device is manufactured using a proprietary MEMS technology developed for and already sold for several years in the automotive market. The sensing element in the DPS310 is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is very small compared to traditional silicon micro-machined membranes. Moreover, Infineon has developed a capacitive sensor to be more accurate and less sensitive to temperature change compared to piezoresistive solutions.
For the DPS310, Infineon has introduced two important innovations. The first is a two-die solution more scalable than the monolithic solution used for some automotive pressure sensors.
The second innovation is a plastic metallized lid to replace the classic metal lid. The device comes in a tiny 2x2.5x0.9mm HLGA molded package.
The report presents a detailed analysis of the sensor’s structure and cost. Comparison with the characteristics of the STMicroelectronics pressure sensor LPS22HB and the Bosch Sensortec BMP280 highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
Apple iPhone X – Infrared Dot Projector 2017 teardown reverse costing report ...system_plus
The world’s most advanced dot projector for 3D sensing
with four innovative parts:
Its package; a dedicated VCSEL; a folded optic; and the active DOE.
Apple has made a great technology choice with its 3D facial identification for the iPhone X. The new technology is presented as being 20 times more accurate than the older fingerprint approach with a one-in-a million probability of a random person unlocking your iPhone.
This document provides an overview of NVIDIA's new A100 Ampere GPU. Some key points:
- It uses TSMC's 7nm process and CoWoS packaging to integrate over 6,000mm2 of silicon onto a single 55mm x 55mm package.
- It features a 7nm GPU die with 54 billion transistors and 40/80GB of HBM2 memory in a 3D stacked configuration connected via microbumps and TSVs.
- The report includes a physical analysis of the package, dies, and assembly, as well as a cost analysis and estimated price. It finds the A100 provides significantly higher performance than previous generations like the V100.
SPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE Invertersystem_plus
Multiple optimized packaging innovations for this automotive power module from Vitesco Technologies.
More : https://www.systemplus.fr/reverse-costing-reports/vitesco-technologies-power-module-in-jaguar-i-pace-inverter/
UnitedSiC UJN1205K 1200V SiC JFET report published by System Plus Consultingsystem_plus
Discover the technological choices made by United Silicon Carbide Inc. (UnitedSiC) for its most advanced SiC JFET and its associated features
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/unitedsic-ujn1205k-1200v-sic-jfet/
1200V CoolSiCTM MOSFET Module DF11MR12W1M1_B11, from Infineon 2018 teardown r...system_plus
The document provides a teardown analysis of Infineon's 1200V 50A CoolSiC MOSFET module, including a profile of Infineon, physical analysis of the module components, a description of the manufacturing processes, a cost analysis, and comparisons to other SiC MOSFET solutions. Through physical analysis, the report reveals Infineon's innovative SiC MOSFET and Schottky diode design assets. Manufacturing process details and a cost analysis estimate the costs to produce the module.
Technical and cost overview of the evolution of the radio frequency front-end module technologies integrated in the Apple iPhone series from 2016 - 2020.
More : https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-1-focus-on-apple/
Discover Axis’s high-end product integrating its latest ARTPEC-7 in-house system-on-chip dedicated to network video and machine learning capabilities.
More information : https://www.systemplus.fr/reverse-costing-reports/axis-p1375-e-network-camera/
Tesla Model 3 Inverter with SiC Power Module from STMicroelectronicssystem_plus
The first SiC power module in commercialized electric vehicles.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/tesla-model-3-inverter-with-sic-power-module-from-stmicroelectronics/
Apple iPhone X: MEMS Microphones from Goertek, Knowles, and AAC Technologies ...system_plus
Analysis and comparison of the design and process evolution used by Apple’s three MEMS microphone suppliers.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/apple-iphone-x-mems-microphones-from-goertek-knowles-and-aac-technologies/
Epson PrecisionCore Printhead with MicroTFP Inkjet Diessystem_plus
For the first time, Epson integrates thin film PZT MEMS into its office inkjet printer.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/epson-precisioncore-printhead-with-microtfp-inkjet-dies/
Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Editionsystem_plus
This document provides an analysis of Qualcomm's WiGig 60 GHz chipset for smartphones. It includes a physical analysis of the module and its two System-in-Package (SiP) components - a baseband SiP integrated on the main board and an antenna SiP featuring integrated antennae on an organic PCB. Both SiPs use a non-conventional double-sided molded packaging. The physical analysis examines the SiP and antenna board structures in detail. The document also provides a manufacturing process flow, cost analysis, and estimated selling price for the WiGig chipset solution.
Samsung’s Galaxy S9 Plus Processor Packages: Samsung’s iPoP vs. Qualcomm/Shin...system_plus
Comparison of both Samsung Galaxy S9 processor packages: Samsung Exynos 9810 with new TMV Package-on-Package vs. Qualcomm Snapdragon 845 with MCeP Packaging.
More information on that report at: https://www.i-micronews.com/report/product/samsung’s-galaxy-s9-plus-processor-packages-samsung’s-ipop-vs-qualcomm-shinko-mcep.html
Discover Infineon‘s first double sided cooling power module for automotive.
More information on that report at https://www.i-micronews.com/category-listing/product/infineon-ff400r07a01e3-double-side-cooled-igbt-module.html
Mitsubishi J1- Series 650V High-Power Modules for Automotivesystem_plus
The first power module with 7th-gen CSTBT IGBT and an innovative integrated substrate.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/mitsubishi-j1-series-650v-high-power-modules-for-automotive/
The Audi A8 zFAS ADAS Platform by Aptivsystem_plus
The first level 3 autonomous driving system, designed by Audi and manufactured by Aptiv (Delphi), integrates high-performance processors from Nvidia (Tegra K1), Altera (Cyclon V), Infineon (Aurix), and Mobileye (EyeQ3 image processor)
Reverse Costing - Structure, process and cost report - find more here: https://www.systemplus.fr/reverse-costing-reports/the-audi-a8-zfas-adas-platform-by-aptiv/
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Seriessystem_plus
This document provides a reverse costing analysis of the Broadcom AFEM-8100 SiP used in the Apple iPhone 11 series. It includes a physical analysis of the module and its dies, as well as a manufacturing process flow and cost analysis. Broadcom remains the sole supplier of the multi-die module, which features power amplifier, switch, filter and other dies. The analysis finds innovations that reduce the package size and cost, including a new EMI shielding integration method.
Sensonor STIM318 Inertial Measurement Unit (IMU)system_plus
Newest IMU with 9-axis detection and gyro bias instability of 0.3°/h from Sensonor.
More information: https://www.systemplus.fr/reverse-costing-reports/sensonor-stim318-inertial-measurement-unit-imu/
Advanced packaging technology in the Apple Watch Series 4’s System-in-Packagesystem_plus
Four major packaging technologies: TSMC’s info, ASE’s Double Side Molding/SESUB and SiP, Skyworks’ Double Side BGA.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/advanced-packaging-technology-in-the-apple-watch-series-4s-system-in-package/
Deep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.
More information : https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8200-pamid-in-the-apple-iphone-12-series/
Deep analysis of the latest generation of under-display optical fingerprint sensors using micro-optics.
Reverse Costing - Structure, process and cost report by System Plus Consulting - find more here: https://www.systemplus.fr/reverse-costing-reports/goodixs-ultra-thin-optical-in-display-fingerprint/
Cost-effective 1 mm2 miniature camera with customizable wafer-level optics for endoscopy and novel medical imaging devices.
More information : https://www.systemplus.fr/reverse-costing-reports/ams-naneye-mini-camera/
Tiny MEMS digital barometer for smartphones and wearables
The first barometric sensor from Infineon for the consumer market is targeting altitude, GPS, indoor and weather forecasting applications in portable devices. This MEMS sensor positions Infineon to compete with STMicroelectronics and Bosch Sensortec.
Infineon’s DPS310 pressure-sensing device is manufactured using a proprietary MEMS technology developed for and already sold for several years in the automotive market. The sensing element in the DPS310 is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is very small compared to traditional silicon micro-machined membranes. Moreover, Infineon has developed a capacitive sensor to be more accurate and less sensitive to temperature change compared to piezoresistive solutions.
For the DPS310, Infineon has introduced two important innovations. The first is a two-die solution more scalable than the monolithic solution used for some automotive pressure sensors.
The second innovation is a plastic metallized lid to replace the classic metal lid. The device comes in a tiny 2x2.5x0.9mm HLGA molded package.
The report presents a detailed analysis of the sensor’s structure and cost. Comparison with the characteristics of the STMicroelectronics pressure sensor LPS22HB and the Bosch Sensortec BMP280 highlights differences in technical choices made by the companies.
More information on that report at http://www.i-micronews.com/reports.html
Apple iPhone X – Infrared Dot Projector 2017 teardown reverse costing report ...system_plus
The world’s most advanced dot projector for 3D sensing
with four innovative parts:
Its package; a dedicated VCSEL; a folded optic; and the active DOE.
Apple has made a great technology choice with its 3D facial identification for the iPhone X. The new technology is presented as being 20 times more accurate than the older fingerprint approach with a one-in-a million probability of a random person unlocking your iPhone.
ams’ Multi-Spectral Sensor in the Apple iPhone X 2017 teardown reverse costi...system_plus
The most advanced multispectral 6-channel ambient light sensor, supplied and produced by ams for its biggest customer, Apple.
For the semiconductor industry, the smartphone is a gold mine. Each component inside every OEM’s flagship phone holds substantial value for the component supplier, which sometimes gains a significant portion of the phone’s sales revenue too. Apple is one of the major OEMs that every supplier fights to work with, and for many years ams AG has been the world’s leading ambient light sensor (ALS) producer, due to its presence in every Apple iPhone.
LeddarVu8: The first off-the-shelf solid state high-definition LiDAR module f...Yole Developpement
LeddarTech’s new LiDAR has no moving parts, giving it the smallest form factor while integrating the latest innovations in LiDAR technology
The light detection and ranging principle and technology, also known as LiDAR, is used in a wide spectrum of applications. With upcoming autonomous or “self-driving” cars, LiDAR technology is being considered for one option for the “eyes” of such vehicles. However, existing systems do not match the challenging reliability, compactness and cost-efficiency specifications of the automotive world.
Based on “LeddarCore” components, Leddartech has developed LeddarVu8, a compact solid-state LiDAR without mechanical movement that provides highly accurate multi-target detection over eight independent segments. It detects targets at up to 215 m range despite its tiny size of 70 mm x 35 mm x 46 mm and weighing only 75 grams. The LeddarVu8 delivers nearly twice the range for half the volume compared to the previous version.
These qualities qualify the LeddarVu8 as a candidate for advanced driver assistance, replacing the radar. With its adjustable and interchangeable optics module, the LeddarVu8 can also be interesting for other applications, such as traffic management, speed enforcement, heavy-duty equipment collision warning, navigation, liquid level sensing and bulk volume measurements.
The light is emitted by Excelitas’ tri-stacked emitting edge laser diode of 75W and received by a photodiode array. The two components are designed for large volume markets and some innovations reduce their usually high cost. This first automotive version of the LeddarVu8 shows the full potential of this technology to go under the $100 barrier.
This report presents the full system manufacturing and packaging processes for the LeddarVu8 as well as the physical analysis of the two main optical components, the laser diode and the photodiode. An estimation of the manufacturing cost and selling price is included.
More information on that report at http://www.i-micronews.com/reports.html
STMicroelectronics’ Near Infrared Camera Sensor in the Apple iPhone X - 2017 ...system_plus
The document provides a detailed analysis of the near infrared (NIR) camera sensor used in the Apple iPhone X for facial recognition. It includes a teardown of the true depth camera module containing the NIR sensor from STMicroelectronics. Physical analysis of the module reveals a lens module, filter, and ceramic substrate. Analysis of the ST NIR sensor die shows it has small pixels below 4 μm, a resolution of 2 megapixels, and was manufactured using ST's 140nm process on an Imager-SOI substrate from Soitec. The report also provides a cost analysis of manufacturing the sensor die and module, estimating the manufacturer price to be around $15. The document compares the ST sensor to other NIR sensors
SiGe based millimeter-wave chipset commercially available for
backhaul applications with beamforming capability.
More information on that report at: http://www.systemplus.fr/reverse-costing-reports/peraso-x710-chipset-60ghz-outdoor-wireless-broadband-solution/
Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in P...Yole Developpement
Taiyo Yuden’s Well-Proven Metal Seal Packaging and SAW/BAW technology in LTE Band 7 high isolation duplexer used in Skyworks’ PAMiD
In the last five years, Skyworks has been the largest radio-frequency (RF) component supplier for Huawei. In Huawei’s last flagship, the Mate 9 Pro, and the P10 series, Skyworks supplies entire Long-Term Evolution (LTE) front-end solutions based on its SkyOne® Technology. The solutions comprise Low-, Mid- and High-Band front end modules (FEMs) featuring Surface Acoustic Wave (SAW) and Bulk Acoustic Wave (BAW) filters. Skyworks is known to produce its own SAW filter and to outsource the BAW filter. In its High-Band PA Module integrated Duplexer (PAMiD), Skyworks integrates a duplexer supplied by Taiyo Yuden in metal seal packaging featuring a SAW and a Thin Film Bulk Acoustic Resonator (FBAR)-BAW filter based on Taiyo Yuden Technology.
The filters are located in a System In Package (SiP) with a power amplifier, switch and a RF integrated circuit. The device is a custom version of a Taiyo Yuden commercial device. The duplexer’s SAW filter uses sapphire and lithium tantalate substrates and its BAW filter has an original FBAR design using an air gap cavity on a silicon substrate.
In this report, the complete duplexer is analyzed, from the filters to the packaging developed by Fujitsu Media Limited, which was bought by Taiyo Yuden. The report includes a complete analysis of the package, the SAW filter and the BAW filter, featuring a cost analysis and price estimation for the device. A schematic of the BAW filter is also provided to understand the difference between shunt and series cells.
Finally, the report includes complete performance and technology comparisons with the previous generation of the band 7 duplexer from Taiyo Yuden and a technology comparison with BAW filters and packaging solutions from Qorvo and Broadcom.
More information on that report at http://www.i-micronews.com/reports.html
STMicroelectronics Proximity & Flood Illuminator in the Apple iPhone X - reve...system_plus
A unique combination of STMicroelectronics’ latest proximity sensor, based on single-photon avalanche diode (SPAD) technology and a VCSEL illuminator, all in Apple’s most advanced handset.
More information on that report at http://www.i-micronews.com/reports.html
FLIR Boson – a small, innovative,low power, smart thermal camera core 2017 te...Yole Developpement
An infrared camera with a powerful vision processor in a small package, using a new 12μm microbolometer.
Based on a high definition ISC1406L micro-bolometer, the FLIR Boson thermal camera aims at a wide range of markets: military, drones, automotive, security and firefighting. Thanks to sound technological and economic choices, the microbolometer offers very good performance in definition and frame rate at low cost. The camera core’s economical approach involves new lens technology and sophisticated vision processing from Intel/Movidius to power its infrared vision.
The FLIR Boson camera core occupies only 4.9cm3 without its lens, including a 320x256 pixel microbolometer and an advanced processor. The system is made very compact and easy for integrators to handle. It includes a new chalcogenide glass for the lens and a powerful Vision Processing Unit for the first time.
More information on that report at http://www.i-micronews.com/reports.html
Fingerprint Cards’ FPC1268 in the Huawei Mate 9 Pro & P10 series 2017 teardow...Yole Developpement
This report analyzes FPC's FPC1268 fingerprint sensor used in the Huawei Mate 9 Pro and P10 smartphones. It provides a teardown of the sensor package, including photos of the sensor and ASIC dies. The report details the manufacturing processes for the sensor and ASIC, from wafer fabrication to packaging. It estimates the costs for materials and manufacturing steps. Comparisons are made to FPC's previous FPC1025 sensor and Qualcomm's ultrasonic fingerprint sensor. This is the first capacitive fingerprint sensor successfully integrated under a glass cover, in a collaboration between FPC and TPK.
Sensirion SGP30 Gas Sensor 2018 - teardown reverse costing report published b...system_plus
The first monolithic multi-gas sensor from Sensirion, with a unique and innovative design using metal oxide technology.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/sgp30-gas-sensor-from-sensirion/
Sensirion, a leading manufacturer of digital microsensors and systems, recently released a gas sensor designed for consumer and appliance applications: the SGP30 Multi-Pixel. The SGP30 gas sensor is a new kind of sensor which measures different gas types in any environment. With a DFN package volume under 5.5 mm3, this gas sensor can be embedded in a variety of low-power systems, including smartphones, tablets, and laptops.
ams’s Color Sensor in the Apple iPhone 8 2018 teardown reverse costing report...Yole Developpement
A next-generation sensor with organic color filters, more photodiodes, and infrared detection.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/amss-color-sensor-in-the-apple-iphone-8/
Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple...system_plus
The latest Apple application processor engine : from the stacked board to the A11, and reverse costing of TSMC's updated inFO packaging
More information on that report at http://www.systemplus.fr/reverse-costing-reports/second-generation-of-tsmcs-integrated-fan-out-info-packaging-for-the-apple-a11-found-in-the-iphone-x/
Orbbec’s Front 3D Depth Sensing System in the Oppo Find Xsystem_plus
The first introduction of Orbbec’s 3D front depth sensing system in a mobile application featuring a global shutter, a dot projector and a custom system-on-chip.
More information on that report at: https://www.systemplus.fr/reverse-costing-reports/orbbecs-front-3d-depth-sensing-system-in-the-oppo-find-x/
MEMS Fabry-Perot interferometer in a very tiny NIR spectrometer.
More information: https://www.systemplus.fr/reverse-costing-reports/spectral-engines-nirone-sensor-x/
Comparison of main players AP: Apple A10 with inFO vs. Qualcomm Snapdragon 820 with MCeP packaging technology vs. HiSilicon Kirin 955 & Samsung Exynos 8 with standard Package-on-Package
Five major players are sharing the smartphone application processors (AP) market. Among them, Qualcomm, Apple, Samsung and HiSilicon propose the most powerful AP. They use almost the same technology node for the die, and the innovation is now at the packaging level. During this year, we observed different technologies inside the four main smartphone flagships: classic Package-on-Package (PoP) developed by Amkor for the Kirin 955 and for the Exynos 8, Molded Core Embedded Package (MCeP) technology developed by Shinko for the Snapdragon 820 and integrated Fan-Out packaging (inFO) developed by TSMC for the A10.
Located under the DRAM chip on the main board, the AP are packaged using PoP technology. The Apple A10 can be found in the iPhone 7 series. The HiSilicon Kirin 955 can be found in the Huawei P9 and the Samsung Exynos 8 as the Qualcomm Snapdragon 820 can be found in the Samsung Galaxy S7 series depending on the world version (US and Asia for the Snapdragon and International for the Exynos).
In this report, we highlight the differences and the innovations of the packages chosen by the end-user OEMs. Whereas some AP providers like for HiSilicon or Samsung choose to consider conventional PoP with embedded land-side capacitor (LSC), others like Apple or Qualcomm use innovative technologies like Fan-Out PoP and silicon based Deep Trench LSC or embedded die packaging with advanced PCB substrate. The detailed comparison between the four players will give the pros and the cons of the packaging technologies.
This report also compares the costs of the different approaches and includes a detailed technical comparison between the packaging structure of the Qualcomm Snapdragon 820, the Samsung Exynos 8, the HiSilicon Kirin 955 and the Apple A10.
More information on: http://www.i-micronews.com/reports.html
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...Yole Developpement
A closer look at the impressive, industry-first, tri-layer stacked CIS.
Sony leads the global CMOS Image Sensor (CIS) market, commanding more than a third share of the industry’s total revenue. And over the years, Sony has maintained its leadership by providing innovative CIS products for original equipment manufacturers like Samsung or Apple. In 2017, Sony as a smartphone designer decided to release in its flagship the latest and potentially the greatest innovation in the past decade of CIS manufacturing.
Inside the Sony Xperia™ XZs and the XZ Premium, the latest Motion Eye™ can be found, with the new IMX400 CIS. This three-layer stacked CIS is made with the traditional pixel array and logic circuit on the same die, but also a 1Gb DRAM memory allowing slow motion at almost 960 frames per second.
This innovative CIS is Sony’s next generation technology. The CIS includes a 22 Mpixel array, a 1Gb DRAM die and a digital signal processor (DSP) on the same die footprint. This is the first tri-layer stacked CIS on the market. In this configuration, Sony can provide a fast readout image sensor with no distortion when shooting fast-moving objects thanks to the high capacity DRAM between the pixel array circuit and the DSP circuit.
Using Sony’s Exmor-RS and Xperi’s Zibond technologies, Sony has managed to integrate the three dies in a single thin, small and cost-effective sensor die. Surprisingly, the die sensor uses a unique sort of TSV at different levels to interconnect the dies.
This report includes a complete analysis of the camera module from the Sony Xperia™ XZs, featuring camera module disassembly and die analyses, processes and cross-sections. It also includes a comparison with the Samsung Galaxy S7, Apple iPhone 7 Plus, and Huawei P9 telephoto camera modules. At the CIS level, it compares the IMX400 with the IMX260, the IMX286, and the latest custom CIS for Apple from Sony’s portfolio. Finally, it contains a complete cost analysis and a selling price estimation of the CIS die.
More information on that report at http://www.i-micronews.com/reports.html
2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...Yole Developpement
Complete reports and comparison of the latest generation products for smartphones from the leading optical image stabilization gyro players.
2-Axis Gyroscopes for Optical Image Stabilization (OIS) constitute a market where 123 million units were shipped in 2015, according to Yole Développement. This market originates only from high-end smartphones and two players share most of it: InvenSense, with 49%, and STMicroelectronics, with 39%.
The 2-axis gyroscopes are located inside the camera module of high-end smartphones. The main constraints are a small footprint and, more importantly, thinness.
Previously, thickness was the same as standard land grid array (LGA) or quad flat no-leads (QFN) package, close to 1mm. Now the standard is 0.65mm, which products from both InvenSense and STMicroelectronics attain.
InvenSense was first, with the IDG-2030, a 2.3x2.3x0.65mm gyroscope, which is still the smallest on the market. Since its introduction we found it in several smartphones from various manufacturers. The IDG-2030 uses the same Nasiri platform as other InvenSense inertial devices, with wafer-level integration of the MEMS sensor on top of the application specific integrated circuit (ASIC), thus providing only one die in the final LGA package.
Months later, STMicroelectronics released the L2G2IS, which shares the same dimensions. The device is manufactured using the same THELMA process as all STMicroelectronics inertial devices. The THELMA platform involves a two-die approach that is challenging for very thin package integration. However, both players now offer very low-cost gyros thanks to die size reduction and process optimization.
Both gyroscopes analyzed are 2-axis X, Y (Pitch, Roll). The two reports can be purchased separately or together in order to compare the technology and pricing of the main smartphone OIS gyro players, including previous generation products.
More information on that report at http://www.i-micronews.com/reports.html
The ARS4-A is a 77 GHz radar sensor offering simultaneous long and short range detection
The Continental ARS4-A Radar is designed for forward collision warning, emergency brake assist, collision mitigation system or Adaptive Cruise Control (ACC). A special feature of the device is the simultaneous measurement of long distances, up to 250m with +/-0.2m accuracy, and short range, up to 70m, relative velocity and angle between two objects. It is thus able to detect stationary objects without any camera support.
The system integrates two electronic boards including an NXP Semiconductor microcontroller and Broadcom Ethernet transceiver. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.
The NXP Semiconductor multi-channel 77 GHz radar transceiver chipset, composed of four receivers, two transmitters and an associated voltage controlled oscillator (VCO), is used as high-frequency transmitter and receiver. The RF dies are packaged in redistributed chip package (RCP) fan-out wafer level packages initially developed and manufactured by Freescale.
Based on a complete teardown analysis of the Continental radar, the report provides the bill-of-material (BOM) and the manufacturing cost of the radar sensor.
A complete physical analysis and manufacturing cost estimation of the NXP semiconductor monolithic microwave integrated circuits (MMICs) is available in a separate report.
More information on that report at http://www.i-micronews.com/reports.html
Broadcom AFEM-8072 – Mid and High Band LTE RF Front-End Module (FEM) - teardo...system_plus
The first mid/high band Long Term Evolution (LTE) Radio Frequency (RF) FEM in the Apple iPhone X integrates the latest generation of Film Bulk Acoustic Resonator (FBAR) technology with advanced and innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8072-mid-and-high-band-lte-rf-front-end-module-fem/
Similar to Thermo Fisher Ion 520 DNA Sequencing Chip 2017 teardown reverse costing report published by Yole Developpement (20)
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
This report from Yole Développement analyzes the high-end performance packaging market. It defines high-end performance packaging as technologies that provide high IO density (≥16/mm2) and fine IO pitch (≤130μm). The report aims to identify relevant technologies, analyze market drivers and challenges, describe technology trends and roadmaps, examine the supply chain landscape, and provide market forecasts. It evaluates the market by technology, end application, and region. The report also profiles key players' technology roadmaps and analyzes intellectual property in the 3D SoC hybrid bonding space.
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
The report provides a market analysis of the GaAs wafer and epiwafer markets from 2019 to 2025. It forecasts that the GaAs wafer market will increase from $200 million in 2019 to $348 million in 2025, with the largest application segments being RF, photonics, and LED. The open epiwafer market is also analyzed, with IQE and VPEC together comprising almost 80% of the $262 million total market in 2019. Key drivers of growth are discussed for various applications such as 5G adoption for RF and increasing use of VCSELs for 3D sensing and LiDAR.
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
How to Interpret Trends in the Kalyan Rajdhani Mix Chart.pdfChart Kalyan
A Mix Chart displays historical data of numbers in a graphical or tabular form. The Kalyan Rajdhani Mix Chart specifically shows the results of a sequence of numbers over different periods.
zkStudyClub - LatticeFold: A Lattice-based Folding Scheme and its Application...Alex Pruden
Folding is a recent technique for building efficient recursive SNARKs. Several elegant folding protocols have been proposed, such as Nova, Supernova, Hypernova, Protostar, and others. However, all of them rely on an additively homomorphic commitment scheme based on discrete log, and are therefore not post-quantum secure. In this work we present LatticeFold, the first lattice-based folding protocol based on the Module SIS problem. This folding protocol naturally leads to an efficient recursive lattice-based SNARK and an efficient PCD scheme. LatticeFold supports folding low-degree relations, such as R1CS, as well as high-degree relations, such as CCS. The key challenge is to construct a secure folding protocol that works with the Ajtai commitment scheme. The difficulty, is ensuring that extracted witnesses are low norm through many rounds of folding. We present a novel technique using the sumcheck protocol to ensure that extracted witnesses are always low norm no matter how many rounds of folding are used. Our evaluation of the final proof system suggests that it is as performant as Hypernova, while providing post-quantum security.
Paper Link: https://eprint.iacr.org/2024/257
The Microsoft 365 Migration Tutorial For Beginner.pptxoperationspcvita
This presentation will help you understand the power of Microsoft 365. However, we have mentioned every productivity app included in Office 365. Additionally, we have suggested the migration situation related to Office 365 and how we can help you.
You can also read: https://www.systoolsgroup.com/updates/office-365-tenant-to-tenant-migration-step-by-step-complete-guide/
Your One-Stop Shop for Python Success: Top 10 US Python Development Providersakankshawande
Simplify your search for a reliable Python development partner! This list presents the top 10 trusted US providers offering comprehensive Python development services, ensuring your project's success from conception to completion.
Driving Business Innovation: Latest Generative AI Advancements & Success StorySafe Software
Are you ready to revolutionize how you handle data? Join us for a webinar where we’ll bring you up to speed with the latest advancements in Generative AI technology and discover how leveraging FME with tools from giants like Google Gemini, Amazon, and Microsoft OpenAI can supercharge your workflow efficiency.
During the hour, we’ll take you through:
Guest Speaker Segment with Hannah Barrington: Dive into the world of dynamic real estate marketing with Hannah, the Marketing Manager at Workspace Group. Hear firsthand how their team generates engaging descriptions for thousands of office units by integrating diverse data sources—from PDF floorplans to web pages—using FME transformers, like OpenAIVisionConnector and AnthropicVisionConnector. This use case will show you how GenAI can streamline content creation for marketing across the board.
Ollama Use Case: Learn how Scenario Specialist Dmitri Bagh has utilized Ollama within FME to input data, create custom models, and enhance security protocols. This segment will include demos to illustrate the full capabilities of FME in AI-driven processes.
Custom AI Models: Discover how to leverage FME to build personalized AI models using your data. Whether it’s populating a model with local data for added security or integrating public AI tools, find out how FME facilitates a versatile and secure approach to AI.
We’ll wrap up with a live Q&A session where you can engage with our experts on your specific use cases, and learn more about optimizing your data workflows with AI.
This webinar is ideal for professionals seeking to harness the power of AI within their data management systems while ensuring high levels of customization and security. Whether you're a novice or an expert, gain actionable insights and strategies to elevate your data processes. Join us to see how FME and AI can revolutionize how you work with data!
TrustArc Webinar - 2024 Global Privacy SurveyTrustArc
How does your privacy program stack up against your peers? What challenges are privacy teams tackling and prioritizing in 2024?
In the fifth annual Global Privacy Benchmarks Survey, we asked over 1,800 global privacy professionals and business executives to share their perspectives on the current state of privacy inside and outside of their organizations. This year’s report focused on emerging areas of importance for privacy and compliance professionals, including considerations and implications of Artificial Intelligence (AI) technologies, building brand trust, and different approaches for achieving higher privacy competence scores.
See how organizational priorities and strategic approaches to data security and privacy are evolving around the globe.
This webinar will review:
- The top 10 privacy insights from the fifth annual Global Privacy Benchmarks Survey
- The top challenges for privacy leaders, practitioners, and organizations in 2024
- Key themes to consider in developing and maintaining your privacy program
Digital Marketing Trends in 2024 | Guide for Staying AheadWask
https://www.wask.co/ebooks/digital-marketing-trends-in-2024
Feeling lost in the digital marketing whirlwind of 2024? Technology is changing, consumer habits are evolving, and staying ahead of the curve feels like a never-ending pursuit. This e-book is your compass. Dive into actionable insights to handle the complexities of modern marketing. From hyper-personalization to the power of user-generated content, learn how to build long-term relationships with your audience and unlock the secrets to success in the ever-shifting digital landscape.
Dandelion Hashtable: beyond billion requests per second on a commodity serverAntonios Katsarakis
This slide deck presents DLHT, a concurrent in-memory hashtable. Despite efforts to optimize hashtables, that go as far as sacrificing core functionality, state-of-the-art designs still incur multiple memory accesses per request and block request processing in three cases. First, most hashtables block while waiting for data to be retrieved from memory. Second, open-addressing designs, which represent the current state-of-the-art, either cannot free index slots on deletes or must block all requests to do so. Third, index resizes block every request until all objects are copied to the new index. Defying folklore wisdom, DLHT forgoes open-addressing and adopts a fully-featured and memory-aware closed-addressing design based on bounded cache-line-chaining. This design offers lock-free index operations and deletes that free slots instantly, (2) completes most requests with a single memory access, (3) utilizes software prefetching to hide memory latencies, and (4) employs a novel non-blocking and parallel resizing. In a commodity server and a memory-resident workload, DLHT surpasses 1.6B requests per second and provides 3.5x (12x) the throughput of the state-of-the-art closed-addressing (open-addressing) resizable hashtable on Gets (Deletes).
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2024/06/how-axelera-ai-uses-digital-compute-in-memory-to-deliver-fast-and-energy-efficient-computer-vision-a-presentation-from-axelera-ai/
Bram Verhoef, Head of Machine Learning at Axelera AI, presents the “How Axelera AI Uses Digital Compute-in-memory to Deliver Fast and Energy-efficient Computer Vision” tutorial at the May 2024 Embedded Vision Summit.
As artificial intelligence inference transitions from cloud environments to edge locations, computer vision applications achieve heightened responsiveness, reliability and privacy. This migration, however, introduces the challenge of operating within the stringent confines of resource constraints typical at the edge, including small form factors, low energy budgets and diminished memory and computational capacities. Axelera AI addresses these challenges through an innovative approach of performing digital computations within memory itself. This technique facilitates the realization of high-performance, energy-efficient and cost-effective computer vision capabilities at the thin and thick edge, extending the frontier of what is achievable with current technologies.
In this presentation, Verhoef unveils his company’s pioneering chip technology and demonstrates its capacity to deliver exceptional frames-per-second performance across a range of standard computer vision networks typical of applications in security, surveillance and the industrial sector. This shows that advanced computer vision can be accessible and efficient, even at the very edge of our technological ecosystem.
"Choosing proper type of scaling", Olena SyrotaFwdays
Imagine an IoT processing system that is already quite mature and production-ready and for which client coverage is growing and scaling and performance aspects are life and death questions. The system has Redis, MongoDB, and stream processing based on ksqldb. In this talk, firstly, we will analyze scaling approaches and then select the proper ones for our system.
Ivanti’s Patch Tuesday breakdown goes beyond patching your applications and brings you the intelligence and guidance needed to prioritize where to focus your attention first. Catch early analysis on our Ivanti blog, then join industry expert Chris Goettl for the Patch Tuesday Webinar Event. There we’ll do a deep dive into each of the bulletins and give guidance on the risks associated with the newly-identified vulnerabilities.
GraphRAG for Life Science to increase LLM accuracyTomaz Bratanic
GraphRAG for life science domain, where you retriever information from biomedical knowledge graphs using LLMs to increase the accuracy and performance of generated answers
Fueling AI with Great Data with Airbyte WebinarZilliz
This talk will focus on how to collect data from a variety of sources, leveraging this data for RAG and other GenAI use cases, and finally charting your course to productionalization.
Have you ever been confused by the myriad of choices offered by AWS for hosting a website or an API?
Lambda, Elastic Beanstalk, Lightsail, Amplify, S3 (and more!) can each host websites + APIs. But which one should we choose?
Which one is cheapest? Which one is fastest? Which one will scale to meet our needs?
Join me in this session as we dive into each AWS hosting service to determine which one is best for your scenario and explain why!
Monitoring and Managing Anomaly Detection on OpenShift.pdfTosin Akinosho
Monitoring and Managing Anomaly Detection on OpenShift
Overview
Dive into the world of anomaly detection on edge devices with our comprehensive hands-on tutorial. This SlideShare presentation will guide you through the entire process, from data collection and model training to edge deployment and real-time monitoring. Perfect for those looking to implement robust anomaly detection systems on resource-constrained IoT/edge devices.
Key Topics Covered
1. Introduction to Anomaly Detection
- Understand the fundamentals of anomaly detection and its importance in identifying unusual behavior or failures in systems.
2. Understanding Edge (IoT)
- Learn about edge computing and IoT, and how they enable real-time data processing and decision-making at the source.
3. What is ArgoCD?
- Discover ArgoCD, a declarative, GitOps continuous delivery tool for Kubernetes, and its role in deploying applications on edge devices.
4. Deployment Using ArgoCD for Edge Devices
- Step-by-step guide on deploying anomaly detection models on edge devices using ArgoCD.
5. Introduction to Apache Kafka and S3
- Explore Apache Kafka for real-time data streaming and Amazon S3 for scalable storage solutions.
6. Viewing Kafka Messages in the Data Lake
- Learn how to view and analyze Kafka messages stored in a data lake for better insights.
7. What is Prometheus?
- Get to know Prometheus, an open-source monitoring and alerting toolkit, and its application in monitoring edge devices.
8. Monitoring Application Metrics with Prometheus
- Detailed instructions on setting up Prometheus to monitor the performance and health of your anomaly detection system.
9. What is Camel K?
- Introduction to Camel K, a lightweight integration framework built on Apache Camel, designed for Kubernetes.
10. Configuring Camel K Integrations for Data Pipelines
- Learn how to configure Camel K for seamless data pipeline integrations in your anomaly detection workflow.
11. What is a Jupyter Notebook?
- Overview of Jupyter Notebooks, an open-source web application for creating and sharing documents with live code, equations, visualizations, and narrative text.
12. Jupyter Notebooks with Code Examples
- Hands-on examples and code snippets in Jupyter Notebooks to help you implement and test anomaly detection models.
Skybuffer SAM4U tool for SAP license adoptionTatiana Kojar
Manage and optimize your license adoption and consumption with SAM4U, an SAP free customer software asset management tool.
SAM4U, an SAP complimentary software asset management tool for customers, delivers a detailed and well-structured overview of license inventory and usage with a user-friendly interface. We offer a hosted, cost-effective, and performance-optimized SAM4U setup in the Skybuffer Cloud environment. You retain ownership of the system and data, while we manage the ABAP 7.58 infrastructure, ensuring fixed Total Cost of Ownership (TCO) and exceptional services through the SAP Fiori interface.
20. COMPLETE TEARDOWN
WITH:
• Detailed photos
• Precise
measurements
• Material analysis
• Manufacturing
process flow
• Supply chain
evaluation
• Manufacturing cost
analysis
• Estimated sales price
Thermo Fisher Ion 520 DNA Sequencing Chip
Title: Thermo Fisher
Ion 520 DNA
Sequencing Chip
Pages: 130
Date: July 2017
Format: PDF & Excel
file
Price: Full report:
EUR 3,490
Next generation of silicon/polymer microfluidic technology for fast
throughput DNA sequencing from Thermo Fisher Ion Torrent®
Thermo Fisher, with 8% of the microfluidic product market, is one of the
companies most involved in sequencing applications, along with its rival
Illumina. However, the two companies have different objectives. Thermo Fisher
intends to reduce analysis time with fast throughput and short single-end
reads. Illumina has high throughput with short paired reads. To deliver fast
reading, Thermo Fisher uses Ion Torrent® technology, which relies on
technology similar to an image sensor.
The innovative Ion 520 DNA sequencing chip uses this Ion Torrent technology. It
includes a multiwell array, which captures the sphere particles that have DNA
attached. The particles react with a solution of nucleotides, which changes the
charge in the wells, which in turn is detected by the circuit and allows the DNA
sequencing. With several materials involved in the chip manufacturing, 3D silicon
design, polymers for microfluidic processing and its special assembly, the
component appears to have a very high level of complexity.
Using Ion Torrent technology, Thermo Fisher has managed to provide a powerful
and cost-effective sensor chip. The process is entirely CMOS compatible.
Surprisingly, it uses well-proven standard packaging with a proprietary flow
chamber design.
This report includes a complete analysis of the Ion 520 chip from Thermo Fisher,
featuring chip disassembly and die analyses, processes and cross-sections. Finally,
it contains a full cost analysis and a selling price estimation of the component.
Today a main challenge in life science research
is to reduce the price of genomic analysis, and
the time taken to do it. Back in 2003, the cost of
sequencing the human genome was almost
$3B. That decreased to $10,000 in 2011, and is
headed towards $1,000 in the next few years.
21. TABLE OF CONTENTS
Overview / Introduction
Company Profile and Supply
Chain
Physical Analysis
• Package Analysis Methodology
• Package Analysis
Views and dimensions
Opening
Cross-section: PCB Substrate,
Flow Cell Member
• Die Analysis
Die View and Dimensions:
Flow Chamber, Pixels
Die Active Area View and
Delayering
Die Process
Die Cross-Section: Metal
Layers, Wells, ISFET
Manufacturing Process
Flow
• Wafer Fabrication Unit
• Packaging Process Flow
Cost Analysis
• Overview of the Cost Analysis
• Supply Chain Description
• Yield Hypotheses
• Wafer Cost Analyses:
Front-end cost
Die cost
• Packaging Cost Analysis
Packaging Back-End Cost
Packaging Cost by Process
Step
• Component Cost
Estimated Price Analysis
Performed by
ANALYSIS PERFORMED WITH OUR COSTING TOOLS MEMS COSIM+, 3D PACKAGE
COSIM+ AND IC PRICE+
IC Price+
System Plus Consulting offers
powerful costing tools to
evaluate the production cost
and selling price from single chip
to complex structures.
MEMS Cosim+
Cost simulation tool to evaluate
the cost of any MEMS process
or device.
IC Price+
The tool performs the necessary
cost simulation of any
Integrated Circuit.
3D Package Cosim+
Cost simulation tool to evaluate
the cost of any Packaging
process: Wafer-level packaging,
TSV, 3D integration…
AUTHORS:
Stéphane
Elisabeth
Stéphane has a
deep knowledge of
materials characterizations and
electronics systems. He holds an
Engineering Degree in Electronics
and Numerical Technology, and a
PhD in Materials for Micro-
electronics.
Consulting in 2011 to setup its
laboratory. He previously worked
for 25 years at Atmel Nantes
Technological Analysis Laboratory
as fab support in physical analysis,
and for three years at Hirex
Engineering in Toulouse, in a
destructive physical analysis lab.
Yvon
Le Goff (Lab)
Yvon has joined
S y s t e m P l u s
3D Package CoSim+
MEMS CoSim+
Distributed by
22. ANNUAL SUBSCRIPTION OFFER
You can choose to buy over 12
months a set of 3, 4, 5, 7, 10 or
15 Reverse Costing® reports.
Up to 47% discount!
• MEMS & Sensors:
Accelerometer - Compass - Display /
Optics - Environment - Fingerprint -
Gyroscope - IMU/Combo - Light -
Microphone - Oscillator - Pressure sensor
• Power:
GaN - IGBT - MOSFET - Si Diode - SiC
• Systems:
Automotive - Consumer - Energy -
Medical - Telecom
Each year System Plus Consulting releases a comprehensive collection of new reverse engineering &
costing analyses in various domains.
• Imaging:
Infrared - Visible
• Integrated Circuits & RF:
Integrated Circuit (IC) - RF IC
• LEDs:
LED Lamp - UV LED - White/blue LED
• Packaging:
3D Packaging - Embedded - SIP - WLP
More than 60 reports released each year on the following topics (considered for 2017):
Performed by
RELATED REPORTS
Status of the Microfluidics
Industry 2017
Status of the MEMS
Industry 2017
Given Imaging - PillCam
COLON 2 Capsule
Diagnostics, point-of-care, and
pharmaceutical research will drive
the rapidly-expanding microfluidic
products industry to a potential
value of $23B by 2022.
With 14% market growth from
2017-2022, MEMS remain the
backbone of the sensor industry.
Impressive smart compact system
that includes efficient power
management, 2 cameras, 8 LEDs, 1
MEMS magnetic switch and 1 RF
ASIC!
Pages: 250
Date: May 2017
Full report: EUR 6,490*
Pages: 240
Date: June 2017
Full report: EUR 6,490*
Pages: 63
Date: December 2013
Full report: EUR 2,990*
Distributed by
23. ORDER FORM
Please process my order for “Thermo Fisher Ion 520 DNA Sequencing Chip” Reverse Costing Report
Full Reverse Costing report: EUR 3,490* Ref.: SP17346
*For price in dollars please use the day’s exchange rate. All reports are delivered electronically in pdf format. For French customer, add 20 % for VAT.
Performed by
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology
and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using
silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50
collaborators worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics,
Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy
Management.
The “More than Moore” company Yole, along with its partners System Plus Consulting, Blumorpho and KnowMade,
support industrial companies, investors and R&D organizations worldwide to help them understand markets and
follow technology trends to grow their business.
CUSTOM STUDIES
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analysis
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services
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More information on www.yole.fr
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All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer.
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