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©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 1
22 bd Benoni Goullin
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Mantis Vision’s 3D Depth Sensing System
Xiaomi Mi8 Explorer features Mantis’ 3D systems
IMAGING report by Stéphane ELISABETH
December 2018 – version 1
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o Mantis Vision
o Xiaomi Mi8 Explorer Edition Teardown
Market Analysis 24
o Ecosystem & Forecast
Physical Analysis 28
o Summary of the Physical Analysis 29
o NIR Camera Module Assembly 32
 Module Views
 Module Cross-Section
o NIR Image Sensor Die 51
 Sensor Die View & Dimensions
 Sensor Delayering & main Blocs
 Sensor Die Process
 Sensor Die Cross-Section
 Sensor Die Process Characteristic
o DOT Projector Module Assembly 71
 Module Views
 Module Cross-Section
o Mask Die 85
 Die View & Dimensions
 Die Process
 Die Cross-Section
 Die Process Characteristic
o NIR VCSEL Die 91
 Die View & Dimensions
 Die Process
 Die Cross-Section
 Die Process Characteristic
Xiaomi vs. Oppo vs. Apple 105
Manufacturing Process 113
o NIR Image Sensor Die Front-End Process & Fabrication Unit
o NIR VCSEL Process Flow
o NIR VCSEL Die Front-End Process & Fabrication Unit
o Mask Die Front-End Process & Fabrication Unit
o Summary of the main parts
Cost Analysis 122
o Summary of the cost analysis 123
o Yields Explanation & Hypotheses 126
o NIR Camera Module 127
 Sensor Die & Optical Front-End Cost
 Sensor Die Probe Test, Thinning & Dicing
 Sensor Die Wafer Cost
 Lens Module & Component Cost
o DOT Projector Module 135
 NIR VCSEL Front-End Cost
 NIR VCSEL Probe Test, Thinning & Dicing
 NIR VCSEL Die Wafer Cost
 Lens Module & Component Cost
Feedbacks 148
SystemPlus Consulting services 150
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 3
Overview / Introduction
o Executive Summary
o Reverse Costing Methodology
o Glossary
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price
of the Mantis Vision 3D Depth Sensing System found in the Xiaomi Mi 8 Explorer Edition.
• The front optical hub is packaged in one metal enclosure, featuring several cameras and sensors. The complete system
features a red-green-blue (RGB) camera module, a proximity sensor and an ambient light sensor. The 3D depth sensing
system comprises the NIR camera module, the flood illuminator and the dot projector.
• This report will be focused on the analysis of the 3D depth sensing systems. All components are standard products that can
be readily found in the market. That includes a GS image sensor featuring 3µm x 3µm pixels and standard resolution of one
megapixel and two vertical cavity surface emitting lasers (VCSELs), one for the dot projector and one for the flood
illuminator. Both are from the same supplier. Both the camera and dot projector use standard camera module assemblies
with wire bonding and optical modules featuring lenses. In order to provide coded structured light features, a mask is
integrated into the dot projector structure.
• This report analyzes the complete 3D depth sensing system, including a complete analysis of the NIR camera module, and
the dot projector, along with cost analysis and price estimation for the system. It also includes a physical and technical
comparison with other 3D sensing systems, such as those from Apple in the iPhone X and from Oppo in the Find X. The
comparison looks at system integration, the NIR camera module and the dot projector architecture.
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 4
Overview / Introduction
Company Profile & Supply Chain
o MantisVision
o Xiaomi Mi8 Explorer Teardown
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Xiaomi Mi8 Explorer Teardown
Xiaomi Mi8 Explorer Front View
©2018 by System Plus Consulting
Xiaomi Mi8 Explorer Front View – Opened
©2018 by System Plus Consulting
Flood Illuminator
NIR Camera
Proximity Sensor
Speaker
Dot projector
RGB Camera
• All the IR illuminator or sensor are covered with a windows with a filtering coating.
ALS
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 5
Overview / Introduction
Company Profile & Supply Chain
o MantisVision
o Xiaomi Mi8 Explorer Teardown
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Front Sensing Module
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 6
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o NIR Camera Module
o NIR Image Sensor Die
o Views & Dimensions
o Delayering & Process
o Die Cross-section
o DOT Projector Module
o Mask Die
o Die Views & Dimensions
o Die Cross-section
o NIR VCSEL Die
o Views & Dimensions
o Die Process
o Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Summary of the Physical Analysis
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 7
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o NIR Camera Module
o NIR Image Sensor Die
o Views & Dimensions
o Delayering & Process
o Die Cross-section
o DOT Projector Module
o Mask Die
o Die Views & Dimensions
o Die Cross-section
o NIR VCSEL Die
o Views & Dimensions
o Die Process
o Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
NIR Camera Views & Dimensions
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o NIR Camera Module
o NIR Image Sensor Die
o Views & Dimensions
o Delayering & Process
o Die Cross-section
o DOT Projector Module
o Mask Die
o Die Views & Dimensions
o Die Cross-section
o NIR VCSEL Die
o Views & Dimensions
o Die Process
o Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
NIR Camera Cross-Section
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 9
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o NIR Camera Module
o NIR Image Sensor Die
o Views & Dimensions
o Delayering & Process
o Die Cross-section
o DOT Projector Module
o Mask Die
o Die Views & Dimensions
o Die Cross-section
o NIR VCSEL Die
o Views & Dimensions
o Die Process
o Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Sensor Die – Die Cross-Section – Pixels
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 10
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o NIR Camera Module
o NIR Image Sensor Die
o Views & Dimensions
o Delayering & Process
o Die Cross-section
o DOT Projector Module
o Mask Die
o Die Views & Dimensions
o Die Cross-section
o NIR VCSEL Die
o Views & Dimensions
o Die Process
o Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Dot Projector Cross-Section
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 11
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o NIR Camera Module
o NIR Image Sensor Die
o Views & Dimensions
o Delayering & Process
o Die Cross-section
o DOT Projector Module
o Mask Die
o Die Views & Dimensions
o Die Cross-section
o NIR VCSEL Die
o Views & Dimensions
o Die Process
o Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
DOT Pattern – Mask View & Dimensions
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 12
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o NIR Camera Module
o NIR Image Sensor Die
o Views & Dimensions
o Delayering & Process
o Die Cross-section
o DOT Projector Module
o Mask Die
o Die Views & Dimensions
o Die Cross-section
o NIR VCSEL Die
o Views & Dimensions
o Die Process
o Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
VCSEL Die Overview
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 13
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
o NIR Camera Module
o NIR Image Sensor Die
o Views & Dimensions
o Delayering & Process
o Die Cross-section
o DOT Projector Module
o Mask Die
o Die Views & Dimensions
o Die Cross-section
o NIR VCSEL Die
o Views & Dimensions
o Die Process
o Die Cross-section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
VCSEL Die Cross-Section
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 14
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
o Xiaomi vs. Oppo vs. Apple
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Xiaomi vs. Oppo vs. Apple – 3D Sensing System
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 15
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
o Xiaomi vs. Oppo vs. Apple
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Xiaomi vs. Oppo vs. Apple – DOT Projector
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 16
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o NIR Camera Module Cost
o DOT Projector Module Cost
o Complete Module Cost
Related Reports
About System Plus
NIR Camera Module – Sensor Front-End Cost
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 17
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o NIR Camera Module Cost
o DOT Projector Module Cost
o Complete Module Cost
Related Reports
About System Plus
DOT Projector – NIR VCSEL Front-End Cost
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 18
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o NIR Camera Module Cost
o DOT Projector Module Cost
o Complete Module Cost
Related Reports
About System Plus
DOT Projector – Component Cost
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 19
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o NIR Camera Module Cost
o DOT Projector Module Cost
o Complete Module Cost
Related Reports
About System Plus
Complete System Price
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 20
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Related Reports
About System Plus
Related Reports
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
IMAGING
• STMicroelectronics’ Near Infrared Camera Sensor in the
Apple iPhone X
• Apple iPhone X – Infrared Dot Projector
• Orbbec’s Front 3D Depth Sensing System in the Oppo Find
X
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
IMAGING
• 3D Imaging & Sensing 2018
• VCSELs - Technology, Industry and Market Trends
• Consumer Biometrics: Market and Technologies Trends 2018
• Hardware and Software for AI 2018 – Consumer focus
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 21
SystemPlus
Consulting
SERVICES
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 22
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
o Company services
o Contact
Business Models Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>40 reports per year)
Costing Tools
Trainings
©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 23
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
About System Plus
o Company services
o Contact
Contact
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REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
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Mantis Vision’s 3D Depth Sensing System in the Xiaomi Mi8 Explorer Edition

  • 1. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 1 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr Mantis Vision’s 3D Depth Sensing System Xiaomi Mi8 Explorer features Mantis’ 3D systems IMAGING report by Stéphane ELISABETH December 2018 – version 1 REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
  • 2. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 2 Table of Contents Overview / Introduction 4 o Executive Summary o Reverse Costing Methodology Company Profile 8 o Mantis Vision o Xiaomi Mi8 Explorer Edition Teardown Market Analysis 24 o Ecosystem & Forecast Physical Analysis 28 o Summary of the Physical Analysis 29 o NIR Camera Module Assembly 32  Module Views  Module Cross-Section o NIR Image Sensor Die 51  Sensor Die View & Dimensions  Sensor Delayering & main Blocs  Sensor Die Process  Sensor Die Cross-Section  Sensor Die Process Characteristic o DOT Projector Module Assembly 71  Module Views  Module Cross-Section o Mask Die 85  Die View & Dimensions  Die Process  Die Cross-Section  Die Process Characteristic o NIR VCSEL Die 91  Die View & Dimensions  Die Process  Die Cross-Section  Die Process Characteristic Xiaomi vs. Oppo vs. Apple 105 Manufacturing Process 113 o NIR Image Sensor Die Front-End Process & Fabrication Unit o NIR VCSEL Process Flow o NIR VCSEL Die Front-End Process & Fabrication Unit o Mask Die Front-End Process & Fabrication Unit o Summary of the main parts Cost Analysis 122 o Summary of the cost analysis 123 o Yields Explanation & Hypotheses 126 o NIR Camera Module 127  Sensor Die & Optical Front-End Cost  Sensor Die Probe Test, Thinning & Dicing  Sensor Die Wafer Cost  Lens Module & Component Cost o DOT Projector Module 135  NIR VCSEL Front-End Cost  NIR VCSEL Probe Test, Thinning & Dicing  NIR VCSEL Die Wafer Cost  Lens Module & Component Cost Feedbacks 148 SystemPlus Consulting services 150
  • 3. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 3 Overview / Introduction o Executive Summary o Reverse Costing Methodology o Glossary Company Profile & Supply Chain Market Analysis Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus Executive Summary This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Mantis Vision 3D Depth Sensing System found in the Xiaomi Mi 8 Explorer Edition. • The front optical hub is packaged in one metal enclosure, featuring several cameras and sensors. The complete system features a red-green-blue (RGB) camera module, a proximity sensor and an ambient light sensor. The 3D depth sensing system comprises the NIR camera module, the flood illuminator and the dot projector. • This report will be focused on the analysis of the 3D depth sensing systems. All components are standard products that can be readily found in the market. That includes a GS image sensor featuring 3µm x 3µm pixels and standard resolution of one megapixel and two vertical cavity surface emitting lasers (VCSELs), one for the dot projector and one for the flood illuminator. Both are from the same supplier. Both the camera and dot projector use standard camera module assemblies with wire bonding and optical modules featuring lenses. In order to provide coded structured light features, a mask is integrated into the dot projector structure. • This report analyzes the complete 3D depth sensing system, including a complete analysis of the NIR camera module, and the dot projector, along with cost analysis and price estimation for the system. It also includes a physical and technical comparison with other 3D sensing systems, such as those from Apple in the iPhone X and from Oppo in the Find X. The comparison looks at system integration, the NIR camera module and the dot projector architecture.
  • 4. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 4 Overview / Introduction Company Profile & Supply Chain o MantisVision o Xiaomi Mi8 Explorer Teardown Market Analysis Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus Xiaomi Mi8 Explorer Teardown Xiaomi Mi8 Explorer Front View ©2018 by System Plus Consulting Xiaomi Mi8 Explorer Front View – Opened ©2018 by System Plus Consulting Flood Illuminator NIR Camera Proximity Sensor Speaker Dot projector RGB Camera • All the IR illuminator or sensor are covered with a windows with a filtering coating. ALS
  • 5. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 5 Overview / Introduction Company Profile & Supply Chain o MantisVision o Xiaomi Mi8 Explorer Teardown Market Analysis Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus Front Sensing Module
  • 6. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 6 Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o NIR Camera Module o NIR Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o DOT Projector Module o Mask Die o Die Views & Dimensions o Die Cross-section o NIR VCSEL Die o Views & Dimensions o Die Process o Die Cross-section Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus Summary of the Physical Analysis
  • 7. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 7 Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o NIR Camera Module o NIR Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o DOT Projector Module o Mask Die o Die Views & Dimensions o Die Cross-section o NIR VCSEL Die o Views & Dimensions o Die Process o Die Cross-section Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus NIR Camera Views & Dimensions
  • 8. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 8 Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o NIR Camera Module o NIR Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o DOT Projector Module o Mask Die o Die Views & Dimensions o Die Cross-section o NIR VCSEL Die o Views & Dimensions o Die Process o Die Cross-section Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus NIR Camera Cross-Section
  • 9. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 9 Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o NIR Camera Module o NIR Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o DOT Projector Module o Mask Die o Die Views & Dimensions o Die Cross-section o NIR VCSEL Die o Views & Dimensions o Die Process o Die Cross-section Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus Sensor Die – Die Cross-Section – Pixels
  • 10. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 10 Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o NIR Camera Module o NIR Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o DOT Projector Module o Mask Die o Die Views & Dimensions o Die Cross-section o NIR VCSEL Die o Views & Dimensions o Die Process o Die Cross-section Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus Dot Projector Cross-Section
  • 11. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 11 Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o NIR Camera Module o NIR Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o DOT Projector Module o Mask Die o Die Views & Dimensions o Die Cross-section o NIR VCSEL Die o Views & Dimensions o Die Process o Die Cross-section Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus DOT Pattern – Mask View & Dimensions
  • 12. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 12 Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o NIR Camera Module o NIR Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o DOT Projector Module o Mask Die o Die Views & Dimensions o Die Cross-section o NIR VCSEL Die o Views & Dimensions o Die Process o Die Cross-section Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus VCSEL Die Overview
  • 13. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 13 Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis o NIR Camera Module o NIR Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o DOT Projector Module o Mask Die o Die Views & Dimensions o Die Cross-section o NIR VCSEL Die o Views & Dimensions o Die Process o Die Cross-section Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus VCSEL Die Cross-Section
  • 14. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 14 Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis Physical Comparison o Xiaomi vs. Oppo vs. Apple Manufacturing Process Flow Cost Analysis Related Reports About System Plus Xiaomi vs. Oppo vs. Apple – 3D Sensing System
  • 15. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 15 Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis Physical Comparison o Xiaomi vs. Oppo vs. Apple Manufacturing Process Flow Cost Analysis Related Reports About System Plus Xiaomi vs. Oppo vs. Apple – DOT Projector
  • 16. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 16 Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o NIR Camera Module Cost o DOT Projector Module Cost o Complete Module Cost Related Reports About System Plus NIR Camera Module – Sensor Front-End Cost
  • 17. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 17 Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o NIR Camera Module Cost o DOT Projector Module Cost o Complete Module Cost Related Reports About System Plus DOT Projector – NIR VCSEL Front-End Cost
  • 18. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 18 Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o NIR Camera Module Cost o DOT Projector Module Cost o Complete Module Cost Related Reports About System Plus DOT Projector – Component Cost
  • 19. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 19 Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o NIR Camera Module Cost o DOT Projector Module Cost o Complete Module Cost Related Reports About System Plus Complete System Price
  • 20. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 20 Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Related Reports About System Plus Related Reports REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING IMAGING • STMicroelectronics’ Near Infrared Camera Sensor in the Apple iPhone X • Apple iPhone X – Infrared Dot Projector • Orbbec’s Front 3D Depth Sensing System in the Oppo Find X MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT IMAGING • 3D Imaging & Sensing 2018 • VCSELs - Technology, Industry and Market Trends • Consumer Biometrics: Market and Technologies Trends 2018 • Hardware and Software for AI 2018 – Consumer focus
  • 21. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 21 SystemPlus Consulting SERVICES
  • 22. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 22 Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks About System Plus o Company services o Contact Business Models Fields of Expertise Custom Analyses (>130 analyses per year) Reports (>40 reports per year) Costing Tools Trainings
  • 23. ©2018 by System Plus Consulting | Xiaomi Mi8 Explorer Edition 3D Depth Sensing 23 Overview / Introduction Company Profile & Supply Chain Market Analysis Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Feedbacks About System Plus o Company services o Contact Contact Headquarters 22 bd Benoni Goullin 44200 Nantes FRANCE +33 2 40 18 09 16 sales@systemplus.fr Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY +49 151 23 54 41 82 llevenez@systemplus.fr America Sales Office Steve LAFERRIERE Phoenix, AZ WESTERN US T : +1 310 600 8267 laferriere@yole.fr Troy Blanchette EASTERN US T : +1 704 859 0456 troy.blanchette@yole.fr www.systemplus.fr Asia Sales Office Takashi ONOZAWA Tokyo JAPAN T : +81 804 371 4887 onozawa@yole.fr Mavis WANG TAIWAN T :+886 979 336 809 wang@yole.fr NANTES Headquarter FRANKFURT/MAIN Europe Sales Office LYON YOLE HQ TOKYO YOLE KK GREATER CHINA YOLE PHOENIX YOLE Inc. KOREA YOLE
  • 24. ORDER FORM Please process my order for “Mantis Vision’s 3D Depth Sensing System in the Xiaomi Mi8 Explorer Edition” Reverse Costing® – Structure, Process & Cost Report Ref: SP18438  Full Structure, Process & Cost Report : EUR 3,990*  Annual Subscription offers possible from 3 reports, including this report as the first of the year. Contact us for more information. SHIP TO Name (Mr/Ms/Dr/Pr): ............................................................. Job Title: ……............................................................................. Company: …............................................................................. Address: ……............................................................................. City: ………………………………… State: .......................................... Postcode/Zip: .......................................................................... Country: ……............................................................................ VAT ID Number for EU members: .......................................... Tel: ………………......................................................................... Email: ..................................................................................... Date: ...................................................................................... Signature: .............................................................................. BILLING CONTACT First Name : ............................................................................ Last Name: ……....................................................................... Email: ….................................................................................. Phone: …….............................................................................. PAYMENT By credit card: Number: |__|__|__|__| |__|__|__|__| |__|__|__|__| |__|__|__|__| Expiration date: |__|__|/|__|__| Card Verification Value: |__|__|__| By bank transfer: HSBC - CAE- Le Terminal -2 rue du Charron - 44800 St Herblain France BIC code: CCFRFRPP • In EUR Bank code : 30056 - Branch code : 00955 - Account : 09550003234 IBAN: FR76 3005 6009 5509 5500 0323 439 • In USD Bank code : 30056 - Branch code : 00955 - Account : 09550003247 IBAN: FR76 3005 6009 5509 5500 0324 797 REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT MANTIS VISIONS'S 3D DEPTH SENSING SYSTEM INTHE XIAOMI MI8EXPLORER EDITION Each year System Plus Consulting releases a comprehensive collection of new reverse engineering and costing analyses in various domains. You can choose to buy over 12 months a set of 3, 4, 5, 7, 10 or 15 Reverse Costing® reports. Up to 47% discount! More than 60 reports released each year on the following topics (considered for 2018): • MEMS & Sensors: Accelerometer – Environment - Fingerprint - Gas - Gyroscope - IMU/Combo - Microphone - Optics - Oscillator - Pressure • Power: GaN - IGBT - MOSFET - Si Diode - SiC • Imaging: Camera - Spectrometer • LED and Laser: UV LED – VCSEL - White/blue LED • Packaging: 3D Packaging - Embedded - SIP - WLP • Integrated Circuits: IPD – Memories – PMIC - SoC • RF: FEM - Duplexer • Systems: Automotive - Consumer - Energy - Telecom ANNUAL SUBSCRIPTIONS Return order by: FAX: +33 2 53 55 10 59 MAIL: SYSTEM PLUS CONSULTING 22, bd Benoni Goullin Nantes Biotech 44200 Nantes – France EMAIL: sales@systemplus.fr *For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format *For French customer, add 20 % for VAT *Our prices are subject to change. Please check our new releases and price changes on www.systemplus.fr. The present document is valid 6 months after its publishing date: December 2018
  • 25. 1.INTRODUCTION The present terms and conditions apply to the offers, sales and deliveries of services managed by System Plus Consulting except in the case of a particular written agreement. Buyer must note that placing an order means an agreement without any restriction with these terms and conditions. 2.PRICES Prices of the purchased services are those which are in force on the date the order is placed. Prices are in Euros and worked out without taxes. Consequently, the taxes and possible added costs agreed when the order is placed will be charged on these initial prices. System Plus Consulting may change its prices whenever the company thinks it necessary. However, the company commits itself in invoicing at the prices in force on the date the order is placed. 3.REBATES and DISCOUNTS The quoted prices already include the rebates and discounts that System Plus Consulting could have granted according to the number of orders placed by the Buyer, or other specific conditions. No discount is granted in case of early payment. 4.TERMS OF PAYMENT System Plus Consulting delivered services are to be paid within 30 days end of month by bank transfer except in the case of a particular written agreement. If the payment does not reach System Plus Consulting on the deadline, the Buyer has to pay System Plus Consulting a penalty for late payment the amount of which is three times the legal interest rate. The legal interest rate is the current one on the delivery date. This penalty is worked out on the unpaid invoice amount, starting from the invoice deadline. This penalty is sent without previous notice. When payment terms are over 30 days end of month, the Buyer has to pay a deposit which amount is 10% of the total invoice amount when placing his order. 5. OWNERSHIP System Plus Consulting remains sole owner of the delivered services until total payment of the invoice. 6.DELIVERIES The delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed. Consequently any reasonable delay in the delivery of services will not allow the buyer to claim for damages or to cancel the order. 7.ENTRUSTED GOODS SHIPMENT The transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost or damage on the base of their real value, he must imperatively point it out to System Plus Consulting when the shipment takes place. Without any specific requirement, insurance terms for the return of goods will be the carrier current ones (reimbursement based on good weight instead of the real value). 8.FORCE MAJEURE System Plus Consulting responsibility will not be involved in non execution or late delivery of one of its duties described in the current terms and conditions if these are the result of a force majeure case. Therefore, the force majeure includes all external event unpredictable and irresistible as defined by the article 1148 of the French Code Civil? 9.CONFIDENTIALITY As a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential. A non-disclosure agreement can be signed on demand. 10.RESPONSABILITY LIMITATION The Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting. Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirect damage, financial or otherwise, that may result from the use of the results of our analysis or results obtained using one of our costing tools. 11.APPLICABLE LAW Any dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolved applying the French law. It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes. TERMS AND CONDITIONS OF SALES