(1) MEMS are miniaturized mechanical and electro-mechanical devices between 1 to 100 micrometers in size that are fabricated using microfabrication techniques. (2) MEMS devices can be sensors, which output electrical signals in response to inputs, or actuators, which convert electrical signals into actions. (3) Two approaches are described for integrating MEMS onto textiles - developing flexible yarn-like devices or designing flexible silicon sensors and sewing them onto fabrics.
Smart Fabrics are ones which can change automatically to their surrounding. Smart fabrics are being developed to be able to sense what is happening to the wearer or its immediated surroundings.
According to engineering curriculum we have to choose a topic which is currently trending in the engineerig field. So, I had prepared a ppt on the topic Smart Fabrics for my seminar. You can also refer to this ppt . I hope this ppt would be informative for you. I have also uploaded the pdf of seminar report for this topic.
Smart Fabrics are ones which can change automatically to their surrounding. Smart fabrics are being developed to be able to sense what is happening to the wearer or its immediated surroundings.
According to engineering curriculum we have to choose a topic which is currently trending in the engineerig field. So, I had prepared a ppt on the topic Smart Fabrics for my seminar. You can also refer to this ppt . I hope this ppt would be informative for you. I have also uploaded the pdf of seminar report for this topic.
http://www.ualberta.ca/~jag3/smart_textiles/index.htm
Jose A. Gonzalez
Protective Clothing Research Group
Department of Human Ecology
University of Alberta
The textile industry is about to take a giant step from being a supplier of fabrics to become a positive force in the development of society. Textile innovations improve people’s everyday lives and benefit the industry, the health care sector and the environment.
Smart textiles can be defined as textiles that are able to sense and respond to changes in their environment.
The integration of electronics in clothing promises a variety of new products and applications. . Whether for performance or aesthetic reasons, the focus within the textiles orb is on smart fabrics – from those that change their hue to those that regulate body temperature. Researchers are developing smart fabrics that do things that traditional fabrics cannot.
http://www.ualberta.ca/~jag3/smart_textiles/index.htm
Jose A. Gonzalez
Protective Clothing Research Group
Department of Human Ecology
University of Alberta
The textile industry is about to take a giant step from being a supplier of fabrics to become a positive force in the development of society. Textile innovations improve people’s everyday lives and benefit the industry, the health care sector and the environment.
Smart textiles can be defined as textiles that are able to sense and respond to changes in their environment.
The integration of electronics in clothing promises a variety of new products and applications. . Whether for performance or aesthetic reasons, the focus within the textiles orb is on smart fabrics – from those that change their hue to those that regulate body temperature. Researchers are developing smart fabrics that do things that traditional fabrics cannot.
Introduction to Micro Sensors and Transducers. Application of MEMS in industries and their basic architecture. MEMS accelerometer and gyroscope explored a bit i.e. their structures and their applications.
This slide deals with different aspects of Comsol Multiphysics and it's possibility in the future as multiple physics properties can be studied simultaneously with the help of different inbuilt or user-defined modules in this software.
This file contains the notes on the basics of COMSOL, using the software and different implementations done on it.
Applications in Mechanical, MEMS and other fields is seen.
Making a capacitor, microgripper, cantilever etc.
MEMS is a technique of combining electrical and mechanical components together on a chip. It produces a system of miniature dimensions i.e the system having thickness less than the thickness of human hair. The components are integrated on a single chip using micro fabrication technology which allows the microsystem to both sense & control the environment.
Simulation-Led Design Using SolidWorks® and COMSOL Multiphysics®Design World
Multiphysics has earned the reputation as an excellent approach for simulation in engineering and science. Applying multiphysics simulation early in the product development process brings you reliable computer models to verify and optimize your designs
This webinar will demonstrate how the COMSOL LiveLink for SolidWorks bridges the gap between design and analysis, integrating real-world simulation right into the CAD design environment of SolidWorks.
Attend this webinar to learn:
The importance of multiphysics modeling for true simulation of real-world applications
How to integrate analysis into the design process
the workflow of modeling with COMSOL Multiphysics and SolidWorks
In an age where every teeny tiny bit of electricity is valued, conservation is much talked about, can piezoelectricity be the messiah to ease the burden off the conventional energy sources?
Who says it cannot?
--
Presentation as a part of seminar coursework.
This presentation outlines some of the most exciting medical MEMS and sensors devices that were introduced to the marketplace in the past few years. Some of the devices are already in volume production, and some are still being commercialized.
Micromachined Electro-Mechanical Systems, also called microfabricated Systems, have evoked great interest in the scientific and engineering communities. This is primarily due to several substantive advantages that MEMS offer: orders of magnitude smaller size, better performance than other solutions, possibilities for batch fabrication and cost-effective integration with electronics, virtually zero dc power consumption and potentially large reduction in power consumption, etc.
This Seminar would give an introduction to these exciting developments and the technology and design approaches for the realization of these integrated systems. It would be followed with an introduction to the design of microsensors, such as the pressure sensor and the accelerometer, which began the MEMS revolution.
A systematic approach is developed to select manufacturing Process Chains for the generic elements of a MEMS device. A database of MEMS Process Chains and their attendant process attributes is developed from the existing literature, and used to construct Process Attribute charts. The performance requirements of MEMS beams and trenches are translated into the same set of Process Attributes. This allows for a screening of the Process Chains to obtain a list of candidate manufacturing methods.
I begin with a quick introduction to MEMS technology, micron scale and show that silicon is eminently suited for micromechanical devices and therefore the possibility of integrating MEMS with VLSI electronics. Smart cell phones and wireless enabled devices are poised to become commercial engines for the next generation of MEMS, since MEMS provide not only better functionality with smaller chip area, but also alternative transceiver architectures for improved functionality, performance and reliability.
The application domains cover microsensors and actuators for physical quantities, of which MEMS for automobile & consumer electronics forms a large segment; microfabricated subsystems for communications and computer systems.
Micro-electro-mechanical systems (MEMS) have been identified as one of the most promising technologies and will continue to revolutionize the industry as well as the industrial and consumer products by combining silicon-based microelectronics with micro-machining technology. All the spheres of industrial application including robots conception and development will be impacted by this new technology. If semiconductor microfabrication was contemplated to be the first micro-manufacturing revolution, MEMS is the second revolution. The paper reflects the results of a study about the state of the art of this technology and its future influence in the development of the construction industry. The interdisciplinary nature of MEMS utilizes design, engineering and manufacturing expertise from a wide and diverse range of technical areas including integrated circuit fabrication technology, mechanical engineering, materials science, electrical engineering, chemistry and chemical engineering, as well as fluid engineering, optics, instrumentation and packaging.
Micro-Electro-Mechanical Systems, or MEMS, is a technology that in its most general form can be defined as miniaturized mechanical and electro-mechanical elements (i.e., devices and structures) that are made using the techniques of microfabrication. The critical physical dimensions of MEMS devices can vary from well below one micron on the lower end of the dimensional spectrum, all the way to several millimeters. Likewise, the types of MEMS devices can vary from relatively simple structures having no moving elements, to extremely complex electromechanical systems with multiple moving elements under the control of integrated microelectronics. The one main criterion of MEMS is that there are at least some elements having some sort of mechanical functionality whether or not these elements can move. The term used to define MEMS varies in different parts of the world. In the United States they are predominantly called MEMS, while in some other parts of the world they are called “Microsystems Technology” or “micromachined devices”.
This article discusses MEMS, i.e. Micro-Electro Mechanical Systems.
It gives a rudimentry idea of MEMS technology, its block diagram, applications, advantages and disadvantages. It also gives a brief idea on the working principle of MEMS devices.
Generating a custom Ruby SDK for your web service or Rails API using Smithyg2nightmarescribd
Have you ever wanted a Ruby client API to communicate with your web service? Smithy is a protocol-agnostic language for defining services and SDKs. Smithy Ruby is an implementation of Smithy that generates a Ruby SDK using a Smithy model. In this talk, we will explore Smithy and Smithy Ruby to learn how to generate custom feature-rich SDKs that can communicate with any web service, such as a Rails JSON API.
Epistemic Interaction - tuning interfaces to provide information for AI supportAlan Dix
Paper presented at SYNERGY workshop at AVI 2024, Genoa, Italy. 3rd June 2024
https://alandix.com/academic/papers/synergy2024-epistemic/
As machine learning integrates deeper into human-computer interactions, the concept of epistemic interaction emerges, aiming to refine these interactions to enhance system adaptability. This approach encourages minor, intentional adjustments in user behaviour to enrich the data available for system learning. This paper introduces epistemic interaction within the context of human-system communication, illustrating how deliberate interaction design can improve system understanding and adaptation. Through concrete examples, we demonstrate the potential of epistemic interaction to significantly advance human-computer interaction by leveraging intuitive human communication strategies to inform system design and functionality, offering a novel pathway for enriching user-system engagements.
Software Delivery At the Speed of AI: Inflectra Invests In AI-Powered QualityInflectra
In this insightful webinar, Inflectra explores how artificial intelligence (AI) is transforming software development and testing. Discover how AI-powered tools are revolutionizing every stage of the software development lifecycle (SDLC), from design and prototyping to testing, deployment, and monitoring.
Learn about:
• The Future of Testing: How AI is shifting testing towards verification, analysis, and higher-level skills, while reducing repetitive tasks.
• Test Automation: How AI-powered test case generation, optimization, and self-healing tests are making testing more efficient and effective.
• Visual Testing: Explore the emerging capabilities of AI in visual testing and how it's set to revolutionize UI verification.
• Inflectra's AI Solutions: See demonstrations of Inflectra's cutting-edge AI tools like the ChatGPT plugin and Azure Open AI platform, designed to streamline your testing process.
Whether you're a developer, tester, or QA professional, this webinar will give you valuable insights into how AI is shaping the future of software delivery.
Kubernetes & AI - Beauty and the Beast !?! @KCD Istanbul 2024Tobias Schneck
As AI technology is pushing into IT I was wondering myself, as an “infrastructure container kubernetes guy”, how get this fancy AI technology get managed from an infrastructure operational view? Is it possible to apply our lovely cloud native principals as well? What benefit’s both technologies could bring to each other?
Let me take this questions and provide you a short journey through existing deployment models and use cases for AI software. On practical examples, we discuss what cloud/on-premise strategy we may need for applying it to our own infrastructure to get it to work from an enterprise perspective. I want to give an overview about infrastructure requirements and technologies, what could be beneficial or limiting your AI use cases in an enterprise environment. An interactive Demo will give you some insides, what approaches I got already working for real.
Securing your Kubernetes cluster_ a step-by-step guide to success !KatiaHIMEUR1
Today, after several years of existence, an extremely active community and an ultra-dynamic ecosystem, Kubernetes has established itself as the de facto standard in container orchestration. Thanks to a wide range of managed services, it has never been so easy to set up a ready-to-use Kubernetes cluster.
However, this ease of use means that the subject of security in Kubernetes is often left for later, or even neglected. This exposes companies to significant risks.
In this talk, I'll show you step-by-step how to secure your Kubernetes cluster for greater peace of mind and reliability.
Neuro-symbolic is not enough, we need neuro-*semantic*Frank van Harmelen
Neuro-symbolic (NeSy) AI is on the rise. However, simply machine learning on just any symbolic structure is not sufficient to really harvest the gains of NeSy. These will only be gained when the symbolic structures have an actual semantics. I give an operational definition of semantics as “predictable inference”.
All of this illustrated with link prediction over knowledge graphs, but the argument is general.
Encryption in Microsoft 365 - ExpertsLive Netherlands 2024Albert Hoitingh
In this session I delve into the encryption technology used in Microsoft 365 and Microsoft Purview. Including the concepts of Customer Key and Double Key Encryption.
LF Energy Webinar: Electrical Grid Modelling and Simulation Through PowSyBl -...DanBrown980551
Do you want to learn how to model and simulate an electrical network from scratch in under an hour?
Then welcome to this PowSyBl workshop, hosted by Rte, the French Transmission System Operator (TSO)!
During the webinar, you will discover the PowSyBl ecosystem as well as handle and study an electrical network through an interactive Python notebook.
PowSyBl is an open source project hosted by LF Energy, which offers a comprehensive set of features for electrical grid modelling and simulation. Among other advanced features, PowSyBl provides:
- A fully editable and extendable library for grid component modelling;
- Visualization tools to display your network;
- Grid simulation tools, such as power flows, security analyses (with or without remedial actions) and sensitivity analyses;
The framework is mostly written in Java, with a Python binding so that Python developers can access PowSyBl functionalities as well.
What you will learn during the webinar:
- For beginners: discover PowSyBl's functionalities through a quick general presentation and the notebook, without needing any expert coding skills;
- For advanced developers: master the skills to efficiently apply PowSyBl functionalities to your real-world scenarios.
Smart TV Buyer Insights Survey 2024 by 91mobiles.pdf91mobiles
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GraphRAG is All You need? LLM & Knowledge GraphGuy Korland
Guy Korland, CEO and Co-founder of FalkorDB, will review two articles on the integration of language models with knowledge graphs.
1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/
2. Micro-Electro-Mechanical Systems is a technology that in its most general form can be
defined as miniaturized mechanical and electro-mechanical elements that are made
using the techniques of micro fabrication.
MEMS are made up of components between 1 to 100 micrometres in size (i.e. 0.001 to
0.1 mm), and MEMS devices generally range in size from 20 micrometres (20 millionths
of a metre) to a millimetre (i.e. 0.02 to 1.0 mm).
Because of the large surface area to volume ratio of MEMS, surface effects such as
electrostatics and wetting dominate over volume effects such as inertia or thermal mass.
3. Micro machines are divided into two functional groups: the sensors and the
actuators.
A sensor is defined as a device that provides a usable electrical output signal
in response to a signal. When a sensor is integrated with signal processing
circuits in a single package (usually a polysilicon chip), it is referred to as an
integrated sensor or smart sensor.
An actuator is a device that converts an electrical signal, which may be taken
from a sensor to an action.
A transducer is considered as a device that transforms one form of signal or
energy into another form. Therefore, the term transducer can be used to
include both sensors and actuators.
Smart Sensors
Smart sensors have all the electronic integrated in a MEMS structure. A photo
of a silicon wafer with one hundred microstructures.
4. Principles Used in Sensors
Physical principles or effects grouped according to the six forms of physical energy.
5. Advantages of MEMS devices
•The function is replicated numerous times giving a higher accuracy to the
measurement.
•Due to the replications, failure of some sensors would not affect the system
performance. Such system is usually referred to as an array of sensors.
• A small device interferes less with the environment that it is trying to
measure when it is of a smaller size.
• They can be placed in small places where traditional macro devices could
not fit.
• A higher precision is achieved with actuators. Motions of micrometer range
are precisely achievable.
6. MEMS FABRICATION
The micromechanical components are fabricated using compatible
"micromachining" processes that selectively etch away parts of the silicon wafer or
add new structural layers to form the mechanical and electromechanical devices.
Typical MEMS are miniature sensors and actuators.
7. Approaches to integrate the MEMS on textiles .
The first approach is trying to develop yarn-like electronics and transducers using
existing and new flexible materials in order to stitch up the sensors on the textile
directly, which may result in limited sensing capabilities and computation capabilities.
The other approach is trying to design and fabricate the silicon-based flexible sensors
with MEMS technology and then sew the flexible sensors array on the textile.
A MEMS device in general is rigid so that it cannot be bent. However, if MEMS devices
of the rigidity of these small size are fabricated on a flexible substrate in the form of
isolated islands, one flexible silicon sensor skin is then obtained The flexible substrate is
patterned with metal wires that are to be used as interconnects between the MEMS and
processing circuits. Then the intelligent textiles are obtained by sewing up this flexible
silicon sensor skin on the fabric.
8. In order to achieve flexible
skin, there are two approaches
to fabricate MEMS devices on
the flexible substrate: (1) First
we fabricate MEMS devices
using
"surface
additive
processes" after depositing a
layer of polymer on a fourinch wafer, and make MEMS
devices isolate each other and
obtain flexible silicon sensor
skin promptly to strip off the
coating polymer on the wafer.
9. (2) Second, here first we deposit a
layer of polymer on front side of
the wafer after fabricating MEMS
devices using "bulk subtractive
processes", then corrode the
reverse side of the wafer to make
MEMS devices form the detached
islands in isolation each other, later
deposit a layer of polymer and
obtain the base skin of flexible
silicon promptly on the wafer
reverse side again.
The bulk subtractive processes is more practical and cost effective.
10. The principle of the thermo resistive transducer is that the resistance changes
according to material heat change and the resistance (R) of the material can be
calculated according to the following formula:
ᵨ
where
is resistance coefficient of the material, L is the length of the material, and A is
the area of the material. For being compatible with MEMS, we have chosen the p-Doped
silicon as the resistance material, and the resistance coefficient of the p-Doped silicon can be
calculated according to the following formula:
where p is the carrier concentration, q is charge on electron, and µp is the hole mobility.
11. MEMS Fabrication on Fabrics
Fabrics present a very different substrate compared with a silicon wafer
– Rough, uneven surface with pilosity (hairiness).
– Flexible and elastic
– Suitable for low temperature processing
– Limited compatibility with solvents and chemicals
To use standard printing techniques to deposit a range of custom inks in order to realise
freestanding mechanical structures coupled with active films for sensing and actuating.
12. SCREEN PRINTING
Also known as thick-film printing, this is normally used in the fabrication
of hybridised circuits and in the manufacture of semiconductor packages.
16. Case Study: Strain Gauge
Exploits the piezoresistive effect: the resistance of a printed film changes as it is
strained (stretched) due to a change in the resistivity of the material. Useful for
sensing movement, forces and strains.
Printed Sensor
Silver electrodes printed using a low temperature polymer silver paste.
Piezoresistive paste is based on graphite.
Cured at 120-1250C
17. Ink types required
Printed Heater
•Simple heater is a current carrying conductive element.
•Existing heaters integrated in textiles by weaving or knitting.
•Woven approach limited by direction of warp and weft.
•Knitted solution requires specialist equipment .
Heated car seat element(BMW)
18. Interface layer
Overcomes surface roughness and pilosity of fabric substrate providing a continuous
planar surface for subsequent printed layers.
Cross-section SEM micrograph of 4
screen printed interface layers on
polyester cotton fabric
19. Screen Design
Heater has three layers: Interface, Conductor and Encapsulation.
•
Interface layer improves heater performance but increases fabric coverage to ~40% still below limit of 50%.
21. Piezoelectric Films
Piezoelectric materials expand when subject to an electrical field, similarly they produce
an electrical charge when strained.
Ideal material for sensing and actuating applications.
22. Piezoelectric Structure
Piezoelectric material sandwiched between electrodes.
Polarising voltage required after printing to make the piezoelectric active.
Cured at temperatures below 150 oC.
23. Textile-based (MEMS) Accelerometer for Pelvic Tilt Mesurement
An accelerometer is a device that measures
proper acceleration (in relativity theory, proper
acceleration is the physical acceleration
experienced by an object. It is thus acceleration
relative to a free fall, or inertial, observer who is
momentarily at rest relative to the object being
measured. Gravitation therefore does not cause
proper acceleration, since gravity acts upon the
inertial observer that any proper acceleration
must depart from (accelerate from). A corollary
is that all inertial observers always have a proper
acceleration of zero. The proper acceleration
measured by an accelerometer is not necessarily
the coordinate acceleration (rate of change of
velocity). Instead, the accelerometer sees the
acceleration associated with the phenomenon of
weight experienced by any test mass at rest in the
frame of the accelerometer device.
24. Micro Electro Mechanical System (MEMS) accelerometer is an electro-mechanical
device that measure acceleration force exerted on it. The development of textilesbased MEMS for pelvic tilt measurement is an effort to reduce the cost in medical
sensor devices.
The piezoresistive effect describes change in the electrical resistivity of a
semiconductor or metal when mechanical strain is applied. In contrast to the
piezoelectric effect, the piezoresistive effect only causes a change in electrical
resistance, not in electric potential.
Sensor Design
The accelerometer sensor is designed as a cantilever beam structure with suspended
mass at one end.
25. (a)Schematic drawing of accelerometer design. (b) Close-up drawing on conductive section of accelerometer.
(c) Actual photo of textile cantilever accelerometer.
26. Advantages
1. Textile-based accelerometer provides an alternative to the costly and hazardous
radiographic measurement of pelvic tilt.
2. The flexibility of textile structure makes it more advantageous to conform to body
contour than rigid digital inclinometer and more accurate than indirect
trigonometric
3. measurement
4. Textile material is relatively low-cost, flexible, lightweight, readily
available, environmental friendly and easy to use.
29. Other research areas and future scope
Monitoring warp end tension and breaks during fabric formation. A custom designed
micro machine sensor has been designed is being fabricated. It will replace the off shelves
sensors currently used to measure warp tension.
Manipulating and aligning micro fibres in up to 6 axes is the first step towards a micro
weaving machine. Future work could absolutely be the fabrication of this micro weaving
machine.
30. References
1. Rakesh B. Katragadda, Yong Xu, A novel intelligent textile technology based
on silicon flexible skins, ECE Department, Wayne State University, Detroit, MI
48202, USA.
2. S Beeby, M J Tudor, R Torah, K Yang, Y Wei, MICROFLEX Project: MEMS on
New Emerging Smart Textiles/Flexibles, Electronics and Computer Science, University of
Southampton.
3. Maozhou Meng, Yong Xu, Honghai Zhang, and Sheng Liu, Intelligent Textiles Based on
MEMS Technology, Division ofMOEMS, Wuhan National Laboratory for Optoelectronics
and Institute of Microsystems, Huazhong University of Science and Technology
1037 Luo Yu Road, Wuhan, Hubei 430074, China and Electrical and Computer
Engineering, Wayne State University, Detroit, Michigan, USA .
4. Nik Nur Zuliyana Mohd. Rajdia, Azam Ahmad Bakira, Syaidah Md. Saleha, and Dedy
H.B.
Wicaksonoa, Textile-based Micro Electro Mechanical System (MEMS) Accelerometer for
Pelvic Tilt Mesurement, International Symposium on Robotics and Intelligent Sensors
2012 (IRIS 2012).
5. S Beeby, R Torah, K Yang, Y Wei, J Tudor, MICROFLEX Project - Microtechnology in
Smart Fabrics, Electronics and Computer Science, University of Southampton.