ECAL provides electronic component testing and analysis services to detect counterfeit components. Their mission is to provide accurate, affordable and quick test results that meet or exceed customer expectations. Services include visual inspection, XRF analysis, x-ray, electrical testing, and more. ECAL aims to eliminate guesswork about component quality through reliable, cost-effective testing of all orders, large and small.
Ideal 3D Stacked Die Test - IEEE Semiconductor Wafer Test Workshop SWTW 2013Ira Feldman
My presentation from IEEE SWTW 2013 - For a full description please see my blog:
http://hightechbizdev.com/2013/06/10/ira-feldman-high-technology-business-development-ieee-semiconductor-wafer-test-workshop-2013/
Achieving Market Dominance through Technology Leadership -Cascade Microtech, Inc. is the leading provider of advanced probing systems, non-memory probes and sockets, from design through production
IEEE Semiconductor Wafer Test Workshop SWTW 2014 - International Technology R...Ira Feldman
Please see full abstract on my blog: http://hightechbizdev.com/2014/06/12/ira-feldman-high-technology-business-development-ieee-semiconductor-wafer-test-workshop-2014-presentation/. Co-authored with Dave Armstrong (Advantest) and Marc Loranger (FormFactor).
Ideal 3D Stacked Die Test - IEEE Semiconductor Wafer Test Workshop SWTW 2013Ira Feldman
My presentation from IEEE SWTW 2013 - For a full description please see my blog:
http://hightechbizdev.com/2013/06/10/ira-feldman-high-technology-business-development-ieee-semiconductor-wafer-test-workshop-2013/
Achieving Market Dominance through Technology Leadership -Cascade Microtech, Inc. is the leading provider of advanced probing systems, non-memory probes and sockets, from design through production
IEEE Semiconductor Wafer Test Workshop SWTW 2014 - International Technology R...Ira Feldman
Please see full abstract on my blog: http://hightechbizdev.com/2014/06/12/ira-feldman-high-technology-business-development-ieee-semiconductor-wafer-test-workshop-2014-presentation/. Co-authored with Dave Armstrong (Advantest) and Marc Loranger (FormFactor).
Professional history and resume for Mark Chase, Principal Electromagnetic Compatibility Engineer and Consultant, EMI/EMC Test, EMC Design and EMC Engineering Consultant
Vlsi Design of Low Transition Low Power Test Pattern Generator Using Fault Co...iosrjce
Now a day’s highly integrated multi layer board with IC’s is virtually impossible to be accessed
physically for testing. The major problem detected during testing a circuit includes test generation and gate to
I/O pin problems. In design of any circuit, consuming low power and less hardware utilization is an important
design parameter. Therefore reliable testing methods are introduced which reduces the cost of the hardware
required and also power consumed by the device. In this project a new fault coverage test pattern generator is
generated using a linear feedback shift register called FC-LFSR which can perform fault analysis and reduces
the total power of the circuit. In this test, it generates three intermediate patterns between the random patterns
which reduces the transitional activities of primary inputs so that the switching activities inside the circuit under
test will be reduced. The test patterns generated are applied to c17 benchmark circuit, whose results with fault
coverage of the circuit being tested. The simulation for this design is performed using Xilinx ISE software using
Verilog hardware description language
Lessons for MEMS Test Engineers - Ira Feldman 111020Ira Feldman
Semiconductor Wafer Test Technology and Trends: Lessons for MEMS Test Engineers presentation at MEMS Testing and Reliability 3rd Annual Conference (October 20, 2011) by Ira Feldman (www.hightechbizdev.com)
Copper and glass securing the foundation of your 10 gigabit data centersmithponting
How much time and money would you save if you
could assure the performance of your data center’s
10 Gigabit Ethernet network, before you turned
up service? How much confidence would you gain
by knowing the 10 Gigabit cabling was installed
according to standards? This Whitepaper describes
changes 10 Gigabit Ethernet brings to the network
infrastructure and the specific steps you can take
to make your new data center network rock-solid.
Physics of Failure Electronics Reliability Assurance SoftwareCheryl Tulkoff
Reliability Assurance Tool
•This powerful software tool uses the principles of PoF to predict the life of CCAs prior to prototypes being built.
•Optimization of the design layout can now take place early in the design cycle which greatly improves the chances of designing it right the first time.
Application of HALT at design stage becomes more and more common in electronics industry. Many discussions and disputations of the HALT test interpretation are in full swing. With our HALT test experiences in notebook, desktop and server products, we intend to share and discuss the safety factor of exact product operating limits to its operation specifications in temperature and vibration and common failure modes stimulated thereby. A general perspective of the test setup techniques by product types and its influence is also provided. The distinctive roles of HALT on board level and system level from thermal flow field point of view are also shared in this paper.
The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages of QFNs are well documented, concerns arise with its reliability and manufacturability. Acceptance of this package, especially in long-life, severe-environment, high-reliability applications, is currently limited. One of the most common drivers for reliability failures is inappropriate adoption of new technologies, such as the case with QFN. In this presentation, we will review and discuss QFN related reliability concerns and challenges, and propose Physics-of-Failure (PoF) based approaches to allow the confident introduction of QFN components into electronics products.
Probe Card Cost Drivers from Architecture to Zero Defects - IEEE Semiconductor Wafer Test Workshop 2011 presentation by Ira Feldman (www.hightechbizdev.com)
Ira Feldman's presentation about cost drivers for the design and fabrication of semiconductor wafer test probe cards. Presented at the IEEE Semiconductor Wafer Test Workshop, June 2011.
The integration of AMP (Barcode / Scanning) and Voice dictation into the path...Chris Godin✪
Presented to over 50 healthcare professionals at the North America ELEKTA Conference 2011 – “The integration of AMP and Voice dictation into the pathology process and how it has benefited The Ottawa Hospital in turnaround times, efficiencies and quality”
Professional history and resume for Mark Chase, Principal Electromagnetic Compatibility Engineer and Consultant, EMI/EMC Test, EMC Design and EMC Engineering Consultant
Vlsi Design of Low Transition Low Power Test Pattern Generator Using Fault Co...iosrjce
Now a day’s highly integrated multi layer board with IC’s is virtually impossible to be accessed
physically for testing. The major problem detected during testing a circuit includes test generation and gate to
I/O pin problems. In design of any circuit, consuming low power and less hardware utilization is an important
design parameter. Therefore reliable testing methods are introduced which reduces the cost of the hardware
required and also power consumed by the device. In this project a new fault coverage test pattern generator is
generated using a linear feedback shift register called FC-LFSR which can perform fault analysis and reduces
the total power of the circuit. In this test, it generates three intermediate patterns between the random patterns
which reduces the transitional activities of primary inputs so that the switching activities inside the circuit under
test will be reduced. The test patterns generated are applied to c17 benchmark circuit, whose results with fault
coverage of the circuit being tested. The simulation for this design is performed using Xilinx ISE software using
Verilog hardware description language
Lessons for MEMS Test Engineers - Ira Feldman 111020Ira Feldman
Semiconductor Wafer Test Technology and Trends: Lessons for MEMS Test Engineers presentation at MEMS Testing and Reliability 3rd Annual Conference (October 20, 2011) by Ira Feldman (www.hightechbizdev.com)
Copper and glass securing the foundation of your 10 gigabit data centersmithponting
How much time and money would you save if you
could assure the performance of your data center’s
10 Gigabit Ethernet network, before you turned
up service? How much confidence would you gain
by knowing the 10 Gigabit cabling was installed
according to standards? This Whitepaper describes
changes 10 Gigabit Ethernet brings to the network
infrastructure and the specific steps you can take
to make your new data center network rock-solid.
Physics of Failure Electronics Reliability Assurance SoftwareCheryl Tulkoff
Reliability Assurance Tool
•This powerful software tool uses the principles of PoF to predict the life of CCAs prior to prototypes being built.
•Optimization of the design layout can now take place early in the design cycle which greatly improves the chances of designing it right the first time.
Application of HALT at design stage becomes more and more common in electronics industry. Many discussions and disputations of the HALT test interpretation are in full swing. With our HALT test experiences in notebook, desktop and server products, we intend to share and discuss the safety factor of exact product operating limits to its operation specifications in temperature and vibration and common failure modes stimulated thereby. A general perspective of the test setup techniques by product types and its influence is also provided. The distinctive roles of HALT on board level and system level from thermal flow field point of view are also shared in this paper.
The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages of QFNs are well documented, concerns arise with its reliability and manufacturability. Acceptance of this package, especially in long-life, severe-environment, high-reliability applications, is currently limited. One of the most common drivers for reliability failures is inappropriate adoption of new technologies, such as the case with QFN. In this presentation, we will review and discuss QFN related reliability concerns and challenges, and propose Physics-of-Failure (PoF) based approaches to allow the confident introduction of QFN components into electronics products.
Probe Card Cost Drivers from Architecture to Zero Defects - IEEE Semiconductor Wafer Test Workshop 2011 presentation by Ira Feldman (www.hightechbizdev.com)
Ira Feldman's presentation about cost drivers for the design and fabrication of semiconductor wafer test probe cards. Presented at the IEEE Semiconductor Wafer Test Workshop, June 2011.
The integration of AMP (Barcode / Scanning) and Voice dictation into the path...Chris Godin✪
Presented to over 50 healthcare professionals at the North America ELEKTA Conference 2011 – “The integration of AMP and Voice dictation into the pathology process and how it has benefited The Ottawa Hospital in turnaround times, efficiencies and quality”
The cable harness tester has an important role in bringing in the quality and reliability of electrical cable assemblies that are used in many industries, such as aerospace, automotive, defence, and manufacturing. This is one of the most important functions of cable harness assembly as it helps in finding defects, ensuring the connectivity is right, and testing the on-field performance of the harnesses.
Boundary scan has become an indispensable technology as engineers like you face increasing test challenges. Agilent is proud to introduce the new x1149 Boundary Scan Analyzer - bringing the best of our technology and vast test experience - to your workbench!
TestEquipment is a leading company of Iran. They are the distributor of test equipment used in telecommunication industry and IT. They are Exclusive dealer of Fluke Networks and Anritsu, Spirent, Rhode & Schwarz, Empirix, JDSU, EXFO, Agilent Technologies.
They provide and supply all types of equipment that used in testing. They deals in product like IP Network testing, signals analysis, sources, generators, radio network, fiber network etc...
Our new edition of the Newsletter "Market Insights by CORIAL" is now available!
Download your copy and read about plasma technology and applications for the Failure Analysis sector
High Cost of a Low-Cost Cable Certification TesterFluke Networks
Things to consider while selecting a new certification tester for network cabling. Good certification testers also typically support performance standards for premises fiber optic cabling, and have diagnostic capabilities for both copper and fiber network cabling.
High Cost of a Low-Cost Cable Certification Tester
Counterfeit Detection Services
1. Electronic
Component
Analytics
Lab
Our Mission: To provide
accurate, affordable,
quick-turn test results for
electronic components
that meet or exceed our
customer’s expectations.
2. About us: ECAL Services
Electronic Component Analytics
Lab (ECAL) is a subsidiary of US- Test & Analysis:
Bid, established to address the • Component Surface Inspection
increasing threat posed by coun- • Mechanical Dimension
terfeit electronic components Sampling
entering the marketplace. USBid • Marking Permanency Testing
is an independent distributor, • XRF (RoHS) Analysis
founded in 1998, that specializes conformities and provide input • X-Ray Lead Frame, Die, and
in providing dependable access on product suitability for a given Wire Bond Verification
to reliable electronic compo- application. • Electrical Testing (Discrete
nents. We recently completed
ECAL eliminates the guesswork Functional Testing, IC pin
a major facility upgrade that in-
about the condition of your com- correlation)
cludes the primary elements of
the Electronic Component Ana- ponents, regardless of where • Solderability (Dip and Look)
lytics Lab - expanded test and they were bought. • IC Decapsulation and Die
analytical capabilities utilizing the Verification
Services:
Third party test house charges Value Added:
range from hundreds of dollars to • Tape & Reel
thousands (or more) depending • Baking and Dry Packing
on the services provided which
• Memory Program/Erase
can quickly double or even triple
the cost of the original compo- • Kitting
nent purchase. The ECAL test
and analysis capabilities were
latest X-Ray, IC Decapsulation, developed specifically to pro-
XRF, and counterfeit IC test- vide counterfeit avoidance and
ing equipment. ECAL provides protection methods that meet
results that are accurate, afford- or exceed CCAP-101 Standards,
able, and quick. as well as the preliminary AS6081
ECAL provides counterfeit de- requirements – at a fraction of
tection services to customers in typical 3rd party test house cost.
Let ECAL be your first line of
the military, aerospace, medical,
defense against counterfeit elec- Test & Analysis
automotive, and Telecom/Com-
puter industries. The proliferation tronic components. Services:
of counterfeit and substandard Prior to any tests or analysis all
electronic components infiltrating products undergo a thorough
the global supply chain requires visual inspection adopted from
highly reliable, cost-effective test MIL-STD-883G, Method 2009.9
and analysis solutions for ALL and IDEA-STD-1010-B, that in-
orders – large and small. ECAL cludes evaluation of the incoming
is a quick-turn, ISO-9001 Certi- package, shipping information
fied facility designed to rapidly and carrier, as well as a detailed
detect and report product non- inspection that includes a mi-
3. croscopic visual inspection of all lot under test. ECAL in-house uses a JetEtch automated acid
surfaces and leads, solvent tests, equipment includes an 80kV, delivery system for plastic epoxy
and mechanical dimension mea- 5um resolution x-ray system. packages and assorted lab tools
surements. Next, an ECAL test for other types of packages.
n Electrical Testing:
flow in accordance with your re-
quirements is followed using the ECAL’s electrical testing capa-
following equipment to insure bilities provide accurate first-pass
the product analysis meets your analysis of the basic functional
individual needs. operation of your device. In-
house equipment such as an
n XRF: assortment of precision meters,
X-ray fluorescence (XRF) analy- curve tracers, memory testers,
sis is used not only to determine
the amount of controlled metals
specified in the RoHS Directive, n Solderability Test:
but also to assure acceptable The test complies with J-STD-
Pb (Lead) levels in the leads of 002B and provides a means to
devices used in military applica- determine the solderability of
tions. Testing is non-destructive, device package terminations.
efficient, and capable of testing
a large number of elements at Value Added
once. and Counterfeit IC Detectors are Services:
used to measure manufacturer’s Our customers asked for addi-
specs on passive devices (resis- tional solutions to keep their lines
tors, capacitors, etc.), discrete running smoothly and ECAL set
devices such as transistors, di- up value added services to ad-
odes, MOSFETs, IGBTs, etc., pin dress these needs. Quick-turn,
correlation and limited functional in-house tape and reel capabil-
testing on ICs and memory tests ity is available for a variety of
for programs, check sums, and products including ICs, resistors,
basic functionality. and caps. In addition, ECAL of-
n X-Ray: fers bake ovens and dry pack for
X-ray examination is a non-de- moisture sensitive devices and
structive test used to verify the memory testing/erasure as well
internal contents of your semi- as kitting and specialty pack-
conductor package including the ing – let us solve your “one-off”
presence of a die, the integrity of problems.
the wire bonds, lead frame con-
dition, as well the consistency of
the internal elements across the
n IC Decapsulation:
Physical verification of the in-
ternal die provides evidence of
manufacturer’s markings, logos,
and topography as well as the
die’s physical dimensions. ECAL
4. Quality:
ECAL’s quality policy is to “provide total customer satisfaction
through continuous quality improvement” and our business
practices are driven by our commitment to meet customer de-
mands. The lab is ISO 9001:2008 certified and includes 100%
compliance to ANSI’s electro static discharge control program
ESD S20:20-2007.
Our inspection process is IDEA-STD-1010-B and CCAP-101
compliant and incorporates the latest counterfeit components
avoidance procedures to detect and quarantine any substandard
product before it arrives on your dock. The program consists of
four (4) parts consistent with AS6081 protocol:
• Procurement – Purchase from suppliers using Approved Vendor
List (AVL) policy
• Risk Assessment – Provide customer with Risk Assessment of the
supplier and product
• Control/Mitigation of Counterfeit Product – Prevents product
from re-entry to the supply chain
• Reporting – ECAL reports all nonconforming product for public
review
Certificates and Accreditations:
• ISO 9001:2008 (2004)
• ESD S20.20/2007 Compliant (2008)
• IDEA-STD-1010B Compliant (2009)
• CCAP-101 Compliant (2012)
ECAL – Accurate, Affordable, Quick
2320 Commerce Park Drive
Palm Bay, FL 32905 USA
321-725-9565 (Dial 7 for ECAL)
Visit us at: www.E-CALab.com