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The document discusses the challenges of ensuring reliability at the nanometer scale in integrated circuit design. As process sizes shrink and complexity increases, new reliability issues emerge such as hot electron effects, oxide degradation, electromigration, latchup, electrostatic discharge, voltage drop, and soft errors. Current verification flows check for reliability issues after blocks are designed but finding problems late leads to redesign delays. The document proposes performing early reliability analysis during layout construction to detect problems earlier when fixes are easier and help designs reach signoff checks with fewer issues. This includes analyzing critical signals and looking ahead during construction to create signoff-ready designs from the start.
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Esd the broad impact and design challenges part1of2
Ted Dangelmayer and Terry Welsher, of Dangelmayer Associates, present two topics involving Electrostatic Discharge (ESD) and the connection to product reliability. Please join both presentations to increase your understanding of the impact of ESD and specific considerations during product design.
Many engineers are aware of some aspects of the importance of ESD as a threat to product yield, returns and malfunction. What is surprising is the breadth of its impact across a wide variety of products, technologies, services and markets. For instance, it has recently been determined that, for some technologies, many EOS (Electrical Overstress) failures have been misdiagnosed and were actually ESD. In this seminar we present a broad survey of the impacts including this EOS misdiagnosis issue. The best known effects, those on integrated circuits, will be discussed and the implications of the IC technology and packaging roadmaps will be discussed. We will also describe the effects on other areas including MEMS, flat panel displays, phototools, manufacturing equipment, hand-held devices and operating systems. In each case we will describe how ESD caused failure or malfunction. Where available, industry-wide data will be summarized. Newly realized ESD failure mechanisms such as Charged-Board Events (CBE), Cable Discharge Events (CDE) and transient-induced latch-up will also be discussed.
2017 International Electrostatic Discharge Workshop
Experience the uniquely interactive program of the IEW Workshop. IEW facilitates access to and interactions with industry leaders through invited seminars, technical sessions,
discussion groups (DGs), and invited speakers
• Listen to viewpoints of industry experts
• Share your ideas and opinions on EOS/ESD topics
• Explore industry best practices and give your inputs
• Interact/network with EOS/ESD industry experts
Don't miss the IEW Keynote
Emerging Interconnect Technologies for Nanoelectronics
Krishna Saraswat, Stanford University
The Effect of Coating and Potting on the Reliability of QFN devices
1) QFN packages have a higher susceptibility to failures caused by thermal cycling compared to other packages like QFP and BGA due to a higher CTE mismatch between the silicon die and substrate.
2) The use of conformal coatings and pottings can significantly reduce the thermal cycling lifetime of QFN packages. Conformal coatings can infiltrate under the package and induce lift during temperature cycling. Pottings with high CTE and modulus can cause warpage of the PCB and high stresses on solder joints.
3) For reliable use of coatings and pottings with QFNs, the mechanical properties like CTE, modulus and Tg must be carefully chosen to minimize stresses and warpage during
Esd the broad impact and design challenges part2of2
Ted Dangelmayer and Terry Welsher, of Dangelmayer Associates, present two topics involving Electrostatic Discharge (ESD) and the connection to product reliability. Please join both presentations to increase your understanding of the impact of ESD and specific considerations during product design.
In this seminar, we discuss the challenges designers will be facing over the next several years. Changes in technology will continue to put pressure on designers to provide adequate protection but often without good information or tools. Highlights of the following will be covered: The shrinking design window for CMOS integrated circuits; changes in component level ESD threshold targets and the lack of availability of component information; the implications of new packaging and interconnect technologies such as through silicon vias (TSV); design of system connection and user interfaces; the use and misuse of component level ESD information for system level protection and emerging methods for co-design; and the evolution of EOS/ESD testing methods and standards.
ASQ RD Webinar: Improved QFN Reliability Process
Improved QFN Reliability Process by John Ganjei. John will talk about the improvements in the reliability process in this webinar.
It is free to attend - see www.reliabilitycalendar.org/webinars/ to register for upcoming events.
Pad design and process for voiding control at QFN assembly
The document summarizes a study on pad design and process parameters to minimize voiding during QFN assembly. Key findings include: (1) Dividing large thermal pads into sub-units significantly reduces the largest voids while modestly increasing discontinuity; (2) Placing thermal vias peripherally or plugging vias is important when via number is high to control voiding; (3) Increased venting accessibility via sub-pad shape/number reduces voiding but compromises joint continuity.
ESD PRESENTATION
The document discusses electrostatic discharge (ESD) and provides information on controlling ESD in electronics manufacturing environments. Some key points:
- ESD occurs when a charged object discharges to another object, which can damage electronic components. Static electricity builds up from friction and movement.
- ESD costs the electronics industry millions annually in damaged parts. Despite efforts, ESD still affects production yields and costs.
- Controlling ESD involves designing products to withstand ESD, reducing charge generation, grounding conductive materials to dissipate charges, and neutralizing charges that do occur.
How to Identify and Prevent ESD Failures using PathFinder
This presentation provides an introduction to common ESD failure mechanism in today's ICs and the challenges in addressing them. It will highlight PathFinder, a layout based ESD integrity analysis platform with an integrated modeling, extraction and simulation environment that enables IC designers perform exhaustive verification of all ESD discharge pathways at the IP and full-chip level. It will also share case study of some real life ESD failure scenarios and how PathFinder was used to root-cause them. It reviews the list of ESD checks that can be performed from early floor planning to final sign-off for ESD robustness and ESD failure prevention. Learn more on our website: https://bit.ly/1vRDycB
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Coatings and-pottings-issues-challenges-and-the-reason-for-a-consortium
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Esd the broad impact and design challenges part1of2
Esd the broad impact and design challenges part1of2
2017 International Electrostatic Discharge Workshop
2017 International Electrostatic Discharge Workshop
The Effect of Coating and Potting on the Reliability of QFN devices
The Effect of Coating and Potting on the Reliability of QFN devices
Esd the broad impact and design challenges part2of2
Esd the broad impact and design challenges part2of2
Pad design and process for voiding control at QFN assembly
Pad design and process for voiding control at QFN assembly
How to Identify and Prevent ESD Failures using PathFinder
How to Identify and Prevent ESD Failures using PathFinder
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EDM.pptx
Electrical discharge machining (EDM) is a machining process that uses electrical discharges to erode material from a conductive workpiece. It was pioneered in the 1940s and uses a tool and workpiece submerged in a dielectric fluid. An electric current is applied between the tool and workpiece, causing electric sparks that melt and vaporize small amounts of material. Key parameters that affect the process include discharge voltage, current, pulse duration and polarity. EDM allows machining very hard materials and complex shapes regardless of hardness, and provides a high-quality surface finish.
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The document discusses electric discharge machining (EDM), including its principle of operation, mechanism of metal removal, and classification of spark erosion processes. EDM uses electric sparks to erode metal by thermal melting or vaporization. In the EDM process, a tool electrode precisely shapes the workpiece metal through short-duration electrical pulses generating temperatures over 8000°C, which removes microscopic amounts of metal per spark. The document categorizes EDM into sinking, cutting, and grinding processes based on relative tool-workpiece movement and intended metal removal during the operation.
Thermal metal removal process 4 unit
The document discusses electric discharge machining (EDM), including its principle of operation, mechanism of metal removal, and classification of spark erosion processes. EDM uses electric sparks to erode metal by melting or vaporizing small areas of the workpiece. The sparks generate extreme heat between 8,000-12,000°C, causing metal fusion or vaporization. Discharged particles are dispersed into the dielectric fluid, leaving tiny craters and slowly shaping the workpiece. EDM can be used for sinking, cutting, or grinding depending on the relative motion between the electrode and workpiece.
Thermal metal removal process 4 unit
The document discusses electric discharge machining (EDM), including its principle of operation, mechanism of metal removal, and classification of spark erosion processes. EDM uses electric sparks to erode metal by melting or vaporizing small areas of the workpiece. The sparks generate extreme heat between 8,000-12,000°C, causing metal fusion or vaporization. Discharged particles are dispersed into the dielectric fluid, leaving tiny craters and slowly shaping the workpiece. EDM can be used for sinking, cutting, or grinding depending on the relative motion between the electrode and workpiece.
Electrical discharge machining
The document provides information on Electrical Discharge Machining (EDM). EDM is a manufacturing process where electrical discharges are used to erode material from a workpiece to achieve a desired shape. In EDM, a series of sparks erode material by rapidly recurring electrical discharges between two electrodes separated by a dielectric liquid and subject to an electric voltage. One electrode is the tool that shapes the workpiece. Material removal occurs through thermal melting and vaporization caused by the extreme heat of electrical sparks between the electrodes.
Electrical discharge machining
Electrical Discharge Machining (EDM) is a manufacturing process where electrical discharges are used to erode material from a workpiece to achieve a desired shape. In EDM, a potential difference is applied between an electrode tool and the workpiece, which are separated by a dielectric liquid. This causes electric sparks to form that melt and vaporize small amounts of material from both the tool and workpiece. Kerosene or deionized water is typically used as the dielectric liquid to facilitate flushing of debris and prevent oxidation during the process.
Electrical discharge machining
Electrical Discharge Machining (EDM) is a manufacturing process where electrical discharges are used to erode material from a workpiece to achieve a desired shape. In EDM, a series of electrical sparks are generated between two electrodes submerged in a dielectric liquid and subject to an electric voltage. This causes material to be removed from both electrodes through localized melting and vaporization due to the extreme heat of the sparks. EDM can be used to machine hard metals and intricate shapes that would be difficult to machine through conventional methods.
Electrical Discharge Machining Process
Here you are watching PowerPoint Presentation of EDM (Electrical Machining Process). It is a kind of unconventional machining process.Thanks for watching.
Electrical discharge machining
The document discusses Electrical Discharge Machining (EDM). EDM is a manufacturing process where a desired shape is obtained by removing material from a workpiece using electrical discharges between two electrodes separated by a dielectric liquid. As the distance between the electrodes is reduced, current flows due to dielectric breakdown causing material removal from both electrodes. EDM was invented in the 1940s and has since improved, increasing machining speeds and reducing costs. EDM can machine hard metals and intricate shapes without needing to soften the material. The main components of an EDM system are the power supply, dielectric medium, workpiece and tool electrodes, and servo control unit. Material is removed through the formation and collapse of plasma channels between the electrodes during
sameer amale edm presentation
Two Russian scientists invented electrical discharge machining in 1943 while trying to prevent erosion of tungsten contacts from sparking. EDM works by using electrical sparks to erode metal by melting and vaporizing small amounts of material. Key components of EDM include electrodes, dielectric fluid, and a power supply that provides pulsed voltage. EDM can machine hard metals and complex shapes and is especially useful for dies and molds due to its ability to machine without affecting heat treatment of the workpiece material.
Contactor Generalizations
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Basic Cathodic Protection - CP Series - Eric Langelund
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Welcome to International Journal of Engineering Research and Development (IJERD)
This document discusses how different gate dielectric materials affect the threshold voltage of nanoscale MOSFETs. Simulations were conducted using MATLAB and SCHRED software to obtain C-V characteristics for MOSCAP structures with different dielectric materials (PTFE, Polyethylene, SiO2) and thicknesses. Threshold voltages were extracted from the C-V curves using classical, semi-classical, and quantum mechanical models. The results show that lower dielectric constant materials like PTFE reduce threshold voltage more than higher k materials like SiO2. PTFE is suggested as a suitable low-k material for developing MOSFETs and interconnects at the nanoscale.
PowerPlanning.pdf
Before 2000 area, delay and performance were the most important parameters, if anyone design circuit the main focus was on how much less area is occupied by the circuit on the chip and what the speed is. Now situation is changed, the performance and speed is a secondary concern. In all nanometer (deep sub-micron) technology power becomes the most important parameter in the design. Almost all portable devices run on battery power. Power consumption is a very big challenge in modern-day VLSI design as technology is going to shrinks Because of
Increasing transistors count on small chip
Higher speed of operations
Greater device leakage currents
Simulation of Induction heater using IRFZ44N MOSFET
This PPT contains the Schematic circuit model and simulated output of Induction heater using IRFZ44N MOSFET along with the working principle and block diagram.
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A Temperature-Aware Time-Dependent Dielectric Breakdown Analysis Framework
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Basic Cathodic Protection - CP Series - Eric Langelund
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Date: May 29, 2024
Tags: Information Security, ISO/IEC 27001, ISO/IEC 42001, Artificial Intelligence, GDPR
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Training: ISO/IEC 27001 Information Security Management System - EN | PECB
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Article: https://pecb.com/article
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- 7. Electromigration & Self Heat (Cont.) Short Circuit OPEN Circuit Images Source: Computer Simulation Laboratory ; Clark University
- 16. Early Detection – Example #1
- 17. Early Detection – Example #2
- 18. Early Detection – Example #3
- 19. Thank you for your time!
- 20. Thank you for your time!