The document summarizes a study on pad design and process parameters to minimize voiding during QFN assembly. Key findings include: (1) Dividing large thermal pads into sub-units significantly reduces the largest voids while modestly increasing discontinuity; (2) Placing thermal vias peripherally or plugging vias is important when via number is high to control voiding; (3) Increased venting accessibility via sub-pad shape/number reduces voiding but compromises joint continuity.
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The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages of QFNs are well documented, concerns arise with its reliability and manufacturability. Acceptance of this package, especially in long-life, severe-environment, high-reliability applications, is currently limited. One of the most common drivers for reliability failures is inappropriate adoption of new technologies, such as the case with QFN. In this presentation, we will review and discuss QFN related reliability concerns and challenges, and propose Physics-of-Failure (PoF) based approaches to allow the confident introduction of QFN components into electronics products.
This training is very necessary to them who are working in Electronics manufacturing because Soldering process is the Heart of Electronics Industry, that's why this training is very important to employees.
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Surface Mount components require less space so SMT is helpful in product miniaturization.
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We provide totally solution for LED lighting SMT PCB assembly.
Worldwide Installation and on site support.
Factory (machine and lighting assembly) training.
This presentation is all about the working of Surface mount technology department of electronics industry. This is my personal experience at iljin electronics pvt. ltd. during my internship.
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This training is very necessary to them who are working in Electronics manufacturing because Soldering process is the Heart of Electronics Industry, that's why this training is very important to employees.
Introduction to Surface Mount TechnologyABDUL MUNAFF
Surface Mount Technology (SMT) refers to a specific type of electronics assembly where electronic components are attached to the surface of a substrate (typically a printed circuit board).
SMT is a modern alternative to traditional thru-hole technology where components are attached to substrates by leads that passed through holes in the PCB.
Surface Mount components require less space so SMT is helpful in product miniaturization.
SMT Overview
SMT V/S THROUGH HOLE
Basic SMT process flow
Equipments used SMT Assembly
Through Hole Assembly & Soldering
ELECTROSTATIC DISCHARGE
RoHS
BTC: Bottom Termination Component or Biggest Technical Challenge?Cheryl Tulkoff
Bottom termination components (BTCs) are everywhere.
Despite the fact that these package types have been around since the mid ‘90s and have penetrated into almost every product market, companies still struggle to achieve the high yields the packages promise.
This presentation highlights the biggest mistakes and best practices to help conquer the BTC DEMInS: Design, Environment, Manufacturing, Inspection, and Stress.
PCBA Assembly Process Flow / PCB Assembly Manufacturing introduces the basic manufacturing process of PCBA / PCB assembly in different condition of component.It is about PCBA manufacture production.
This slide deck takes you through important elements of manula PCB inspection including some definitions, what makes a good inspector , what type of lighting is required to be able to see the important aspects of a PCB and the types of inspection aids. The slide deck ends with some real examples where the user is challenged to make a determination of defect/process indicator/acceptable of an electronics assembly in accordance with the IPC-A-610 and IPC-A-620 standards.
We provide totally solution for LED lighting SMT PCB assembly.
Worldwide Installation and on site support.
Factory (machine and lighting assembly) training.
This presentation is all about the working of Surface mount technology department of electronics industry. This is my personal experience at iljin electronics pvt. ltd. during my internship.
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Pad cratering is defined as cracking which initiates within the laminate during a dynamic mechanical event such as In Circuit Testing (ICT), board depanelization, connector insertion, and other shock and vibration inducing activities.
During this tutorial, you'll learn about the key drivers, measurement and detection protocols, and preventive tactics for this serious but prevalent failure. Pad cratering was first recognized in BGA packages but newer leadless, bottom termination components are also vulnerable.
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Pad design and process for voiding control at QFN assembly
1. Pad Design and Process for
Voiding Control at QFN
Assembly
Derrick Herron, Dr. Yan Liu, and
Dr. Ning-Cheng Lee
Indium Corporation
2. Background
• QFN prevailing due to (1) small size & light weight; (2) easy
PCB trace routing due to the use of perimeter I/O pads; (3)
reduced lead inductance; and (4) good thermal and
electrical performance due to the adoption of exposed
copper die-pad technology
• Voiding is issue at SMT assembly due to the large coverage
area, large number of thermal via, and low standoff
• Both design and process were studied for minimizing and
controlling the voiding
3. Parameters Studied
QFN with 68 pads, 10mm x 10mm, 0.5mm
pitch, daisy-chained, Sn surface finish
Parameter Sub parameter Layers
Thermal via number 0, 16, 32, 36
Peripheral venting for full With and without
thermal pad
Thermal Pad on PCB Dividing method Solder mask, venting
channel (0.22 & 0.33 mm)
Thermal sub-pad shape Square, triangle
Thermal sub-pad number 1, 4, 8, 9
Stencil Aperture 85%, 100%
Reflow profile Short, long cool, long, long
Heat History hot
Other heat treatment Prebake, 1 reflow, 2 reflow
6. Voiding Examples
The drastic
difference in
voiding behavior
between the two
sets demonstrates 0.22 mm
the tremendous
impact of design
and process
conditions
0.33 mm
6 INDIUM CORPORATION
CONFIDENTIAL
7. Definition of 3 Voiding Properties
Property Definition
Discontinuity Percentage of area under the
QFN thermal pad where the
vertical metal continuity from
QFN to PCB surface is
interrupted
Void Average Average of multiple QFNs for
void area percentage within
the metallic pad of QFN
Largest Void The largest void measured for
a category of QFN joints
8. Individual Voiding Data Set
Dividing the thermal
pads into sub-units
results in an abrupt drop
in the largest void but an
increase in discontinuity
Net effect: a reduction in
the uncontrollable,
harmful large voids,
replacing it with a
controlled, even
distribution of
8 INDIUM CORPORATION
discontinuity CONFIDENTIAL
9. Dividing Desired for High Via No.
When the thermal via number is high, the discontinuity of a full
pad becomes comparable with that of a divided pad, and the
sporadic occurrence of large voids becomes a distinct
disadvantage of the full pad design
36 36 36
36
10. Thermal Via Aggravate Voiding
Propensity of voids at the
via locations is particularly
high for full pad solder
joints
Thus, voiding increase w
increasing via no.
If high via no. is needed, plugging the via
is the best option
11. Divided Pads with Peripheral Via Not
Sensitive to Via No. on Voiding
The number of thermal via bears no relation with voiding for
divided pads. This is attributed to the peripheral location of thermal
via for those divided pads. If plugging the thermal via is not an
option, design the thermal via at peripheral locations whenever
possible.
16 36 16 36
16 36 16 36
13. Increase Channel Width Has No Effect on Void Ave,
but Increase Channel Area & Discontinuity
14. Calculated Venting Accessibility of
Thermal Pad Designs
Venting Accessibility: Perimeter length per
unit area of metal pad
Thermal pad Venting
design accessibility
Full pad 4
Square 4 8
Triangle 4 9.66
Square 9 12
Triangle 8 13.66
15. Venting Accessibility Effect on
Largest Void & Void Average
With increasing venting accessibility, the void average and
largest void decrease readily
16. Divided Pad A Preferred Design
When Voiding A Major Threat
However, the advantage of voiding reduction is offset by the increase in
discontinuity, particularly for the short profile.
For a long cool profile, the discontinuity increases only moderately with increasing
venting accessibility. In other words, when the voiding is a major threat, such as
designs with a high number of thermal vias, or when a short profile is not a viable
option, then a venting channel design becomes a favorable choice.
17. Divided Thermal Pads
- SMD vs Channel (NSMD)
The higher voiding of channel system (NSMD) is attributed to (1)
thinner solder joint, (2) FR4 outgassing
20. Effect of Profile on Voiding
The short profile is preferred for a low void
average, while the long hot profile is better
for reducing the largest void
23. Discussion (1)
• Prospect of thermal via
– When mechanical drilled thermal via (0.3mm drill
diam/1.2mm pitch) evolve to microvia, the via
pitch decreases, thermal via density may
becomes higher, & voiding may worsen
• How much voiding is too much?
– Voiding up to 50% or even 60% OK
– But, the largest void should be < pitch
• What is less evil?
– High void or uneven size distribution?
24. Discussion (2)
• Patterned solder paste common approach
– Multiple opens
– 50-80% coverage
– 0.15-0.3 mm spacing
– But, still has voiding issue
• Permanent venting channel desired
– Higher discontinuity may be acceptable, since
50% voiding acceptable
– Controlled even distribution of discontinuity better
25. Discussion (3)
• Venting or being vented?
– Remove metal to form channel less obstruction on
vending
– But, allow FR4 to outgass moisture from channel
• What is next?
– Thin solder mask for SMD thermal pad
• Short vs long hot
– Long hot more consistent, due to a wider reflow
process window
– Price – slightly higher void average
26. Conclusion (1)
• Plugging is most effective in reducing voiding
• For unplugged via situations, a full thermal pad is desired for
a low no. of via
• For a high no. of thermal via, a divided thermal pad is
preferred, due to better venting capability
• Placement of thermal via at the perimeter lessens voiding
caused by via
• A wider venting channel has a negligible effect on voiding,
but reduces joint continuity
• For a divided thermal pad, a SMD system is more favorable
than a channel (NSMD) system, with the latter suffering more
voiding due to a thinner solder joint and possibly board
outgassing
27. Conclusion (2)
• Performance of a divided thermal pad is dictated by venting
accessibility, not by the shape
• Voiding decreases with increasing venting accessibility,
although the introduction of a channel area compromises
the continuity of the solder joint
• Reduced solder paste volume causes more voiding
• A short profile and a long hot profile are most promising in
reducing the voiding
• Voiding behavior of the QFN is similar to typical SMT
voiding and increases with pad oxidation and further reflow
