This document discusses different types of bonds that can form between atoms in solids, including ionic bonds, covalent bonds, and metallic bonds. Ionic bonds form when atoms transfer electrons, resulting in positively charged ions attracting negatively charged ions. Covalent bonds form through the sharing of electrons between atoms to achieve stable electron configurations. Metallic bonds involve the partial sharing of valence electrons that are delocalized throughout the crystal structure. The type of bonding determines properties like conductivity, melting points, and solubility.
Contents
The Atom
Materials Used in Electronics
Current in Semiconductors
N-Type and P-Type Semiconductors
The PN Junctions
Diode Operation, Voltage-Current (V-I) Characteristics
Bipolar Junction Transistor (BJT) Structure, Operation, and Characteristics and Parameters
Junction Field Effect Transistors (JFETs) Structure, Characteristics and Parameters and Biasing
Metal Oxide Semiconductor FET (MOSFET) Structure, Characteristics and Parameters and Biasing
The ATOM: Learning Objectives
Describe the structure of an atom
Discuss the Bohr model of an atom
Define electron, proton, neutron, and nucleus
Define atomic number
Discuss electron shells and orbits
Explain energy levels
Define valence electron
Discuss ionization
Define free electron and ion
Discuss the basic concept of the quantum model of the atom
Discuss insulators, conductors, and semiconductors and how they differ
Define the core of an atom
Describe the carbon atom
Name two types each of semiconductors, conductors, and insulators
Explain the band gap
Define valence band and conduction band
Compare a semiconductor atom to a conductor atom
Discuss silicon and germanium atoms
Explain covalent bonds
Define crystal
Describe how current is produced in a semiconductor
Discuss conduction electrons and holes
Explain an electron-hole pair
Discuss recombination
Explain electron and hole current
Describe the properties of n-type and p-type semiconductors
Define doping
Explain how n-type semiconductors are formed
Describe a majority carrier and minority carrier in n-type material
Explain how p-type semiconductors are formed
Describe a majority carrier and minority carrier in p-type material
Describe how a pn junction is formed
Discuss diffusion across a pn junction
Explain the formation of the depletion region
Define barrier potential and discuss its significance
State the values of barrier potential in silicon and germanium
Discuss energy diagrams
Define energy hill
Contents
The Atom
Materials Used in Electronics
Current in Semiconductors
N-Type and P-Type Semiconductors
The PN Junctions
Diode Operation, Voltage-Current (V-I) Characteristics
Bipolar Junction Transistor (BJT) Structure, Operation, and Characteristics and Parameters
Junction Field Effect Transistors (JFETs) Structure, Characteristics and Parameters and Biasing
Metal Oxide Semiconductor FET (MOSFET) Structure, Characteristics and Parameters and Biasing
The ATOM: Learning Objectives
Describe the structure of an atom
Discuss the Bohr model of an atom
Define electron, proton, neutron, and nucleus
Define atomic number
Discuss electron shells and orbits
Explain energy levels
Define valence electron
Discuss ionization
Define free electron and ion
Discuss the basic concept of the quantum model of the atom
Discuss insulators, conductors, and semiconductors and how they differ
Define the core of an atom
Describe the carbon atom
Name two types each of semiconductors, conductors, and insulators
Explain the band gap
Define valence band and conduction band
Compare a semiconductor atom to a conductor atom
Discuss silicon and germanium atoms
Explain covalent bonds
Define crystal
Describe how current is produced in a semiconductor
Discuss conduction electrons and holes
Explain an electron-hole pair
Discuss recombination
Explain electron and hole current
Describe the properties of n-type and p-type semiconductors
Define doping
Explain how n-type semiconductors are formed
Describe a majority carrier and minority carrier in n-type material
Explain how p-type semiconductors are formed
Describe a majority carrier and minority carrier in p-type material
Describe how a pn junction is formed
Discuss diffusion across a pn junction
Explain the formation of the depletion region
Define barrier potential and discuss its significance
State the values of barrier potential in silicon and germanium
Discuss energy diagrams
Define energy hill
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All constructive comments are welcome.
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http://sandymillin.wordpress.com/iateflwebinar2024
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2. • In nature one comes across several types of solids.
• Many solids are aggregates of atoms.
• The arrangement of atoms in any solid material is
determined by the character, strength and
directionality of the chemical binding forces, cohesive
forces or chemical bonds. We call these binding
forces as atomic interaction forces.
3. • The atoms, molecules or ions in a solid state
are more closely packed than in the gaseous
and liquid states and are held together by
strong mutual forces of attraction and
repulsion.
• One can describe the atomic arrangement in
elements and compounds on the basis of this.
• The type of bond that appears between
atoms in crystal is determined by the
electronic structure of interacting atoms.
7. Ionic Bond
• Ionic bond is formed when the atoms with small number
of electrons on the outer shells, have a tendency to give
up electrons to the atoms with an almost filled outer
shell.
• Ionic bond is the simplest type of interatomic bond.
• By loosing electrons, metallic atoms like alkali-metals,
alkaline-earth metals etc.,
• Ionic bonding occurs between electropositive elements
(metals, i.e., those elements on the left side of the
periodic table) and the electronegative elements (non-
metals; i.e. on the right hand of the periodic table).
11. CHA.IONIC SOLIDS
• Ionic solids are generally rigid and crystalline in nature.
• In ionic bonding, a metallic element loses from the outer
electron shell of its atom a number of electrons equal to
its valency (numerical). Obviously, an electrostatic
attraction between positive and negative ions occurs.
• In ionic crystal each positive ion attracts all neighbouring
negative ions and vice versa, the bond itself is non-
directional.
• Ionic solids are generally non-conductors of electricity.
• Ionic solids are highly soluble in water but insoluble in
organic solvents.
12. COVALENT BOND
• In covalent bonding, stable electron setups are expected
by the sharing of electrons between neighbouring
atoms.
• Two neighbouring atoms each having incomplete
outermost shells.
• Unlike ionic bonding, the atoms participating in the
covalent bond have such electronic configurations that
they cannot complete their octets by the actual transfer
of electrons from one atom to the other.
• Obviously, there is no charge associated with any atom of
the crystal.
• The majority of solids incorporating covalent bonds are
also bound by either ionic or Vander Waals bonds.
13. covalent bond
• A covalent bond is formed between similar or dissimilar
atoms each having a deficiency of an equal number of
electrons.
• When two atoms, each having a deficiency of one
electron, come so close that their electronic shells start
overlapping, the original atomic charge distributions of
atoms are distorted and each atom transfers its unpaired
electron to the common space between the atoms.
• Obviously, the common space contains a pair of electrons
which belongs equally to both the atoms and serves to
complete the outermost shell of each atom. This is called
sharing of electrons.
14. covalent bond
• The sharing is effective if the shared electrons have
opposite spins.
• In such a case the atoms attract each other and a
covalent bond is formed.
• As the participating atoms in the bond have the same
valence state, this bond is also called the ‘valence
bond’.
16. CHA. Covalent COMPOUNDS
• Covalent compounds are mostly gases and liquids.
• They are usually electric insulators.
• They are directional in nature.
• They are insoluble in polar solvents like water but are soluble
in non-polar solvents, e.g,, benzene, chloroform, alcohol,
paraffins etc.
• Covalent compounds are homopolar, i.e. the valence electrons
are bound to individual or pairs of atoms and electrons cannot
move freely through the material as in the case of metallic
bonds.
• Covalent compounds are soft, rubbery elastomers, and form a
variety of structural materials usually termed as plastics.
• The melting and boiling points of these compounds are low.
17. Metallic bond
• Metallic bond is formed by the partial sharing of
valence electrons by the neighbouring atoms.
• It is somewhat intermediate between covalent and
ionic bonding.
• They are formed by the elements of all subgroups A
and I-III, subgroups B.
• Metallic materials have one, two, or at most, three
valence electrons.
18. Metallic bond
• With this model, these valence electrons are not
bound to a specific molecule in particular and are
pretty much allowed to float all through the whole
metal.
• They might be considered having a place with the
metal overall, or framing an “ocean of electrons” or
an “electron cloud.”
• Metallic bonds are electropositive.
• When interacting with elements of other groups,
atoms in a metallic crystal can easily give off their
valence electrons and change into positive ions.
19. Metallic bond
• When interacting with one another, the valence energy
zones of atoms overlap and form a common zone with
unoccupied sublevels.
• The valence electrons thus acquire the possibility to
move freely with the zone.
• Obviously, valence electrons are shared in the volume of
a whole crystal. Thus the valence electrons in a metal
cannot be considered lost or acquired by atoms.
• They are shared by atoms in the volume of a crystal,
unlike covalent crystals where sharing of electrons is
limited to a single pair of atoms.
21. CHA. Metallic compounds
• Metallic compounds are crystalline in nature due to
the symmetrical arrangements of the positive ions in
a space lattice .
• Metallic bonding is weaker than ionic and covalent
bonding, but stronger than Vanderwaals' bonding.
• Metallic bonds being weak, metals have a melting
point moderate to high, i.e., the melting points of
metallic crystals are lower than those of
electrovalent crystals.
• Metals are opaque to light, because the free
electrons in a metal absorb light energy.
22. • Metals possess high thermal and electrical conductivities. This
is because of the free electron movement in the lattice.
Metals exhibit ductility.
• They are brittle below a certain temperature. Metals exhibit
brittle to ductile fracture transition at a certain temperature.
Many metals like tungsten are tough. But some metal like
pure silver, aluminium, gold are soft and malleable. Their
melting points vary from 64 0 C (Potassium) to 2000 0 C
[Titanium (1812 0 C), Molydenum, Tungsten].
• Metallic alloys are extremely useful for all engineering
applications. Their high conducting values (gold, platinum,
silver, copper etc.,) make them useful as electrodes in
scientific and technical devices. Metals are opaque to light
and they reflect light energy very efficiently.
CHA. Metallic compounds