This document outlines the chemical and physical properties of tin, its alloys, and applications. It discusses how tin forms alloys with many metals like copper to create bronze, an important material in early civilization. It also summarizes tin-based solder alloys that are important in electronics, replacing lead-based solders. The document concludes that tin is a key element in bronze and that most tin today is used to produce solders for electronics applications.

1. PRESENTED BY
AZEEZ AKEEM ABIODUN
HENRY K WEEFAR
Lecturer: Dr. A.R Adetunji

2. OUTLINES
Chemical properties of Tin
Physical properties of Tin
Tin and its Alloys
Tin based solder alloys
Melting and solidification of tin alloy (Bronze)
Application of Tin and its alloy
Conclusion
References

3. Chemical Properties of Tin
Tin has atomic number 50, and its atomic weight is
118.71. It has the electronic configuration of 4d105s2 5p2.
Accordingly tin is tetravalent in many of its compounds.

4. Physical properties of Tin
 Tin (Sn) is a relatively soft and ductile metal with a
silvery white color.
It has density of 7.29 g/cm3
Low melting point of 231.88oC
It is allotropic in nature
It is normally extracted from Cassiterite (SnO2)
.

5. TIN AND ITS ALLOYS
Tin form many alloys with several metals:
Bronze: Is an alloy consisting primarily of copper,
commonly with about 12% tin and often with the
addition of other metals (such
as aluminium, manganese, nickel or zinc).
Source:gotascent.wikia.com

6. TIN AND ITS ALLOYS CONT’D
Babbitt (metal):This is also called Bearing metal and
is one of several alloys used for the bearing surface in
a plain bearing.
Galinstan: Is a commercial liquid metal alloy whose
composition is taken from a family
of eutectic alloys mainly consisting of gallium, indium,
and tin.
Lead tin telluride: Lead tin telluride, also referred to
as PbSnTe or Pb1-xSnxTe, is a ternary alloy of lead, tin
and tellurium, generally made by alloying either tin
into lead telluride or lead into tin telluride.

7. TIN AND ITS ALLOYS CONT’D
Niobium-tin: Niobium-tin (Nb3Sn) or triniobium-tin
is a metallic chemical compound of niobium (Nb)
and tin (Sn), used industrially as a type II
superconductor.
Pewter: Is a malleable metal alloy, traditionally 85–
99% tin, with the remaining consisting
of copper, antimony, bismuth and sometimes, less
commonly today, lead. Silver is also sometimes used.

8. TIN AND ITS ALLOYS CONT’D
Rose's metal: Rose's metal consists of 50% bismuth,
25–28% lead and 22–25% tin. Its melting point is
between 94 °C (201 °F) and 98 °C (208 °F). The alloy
does not contract on cooling.
Silicon-tin: Silicon-tin or SiSn, is in general a term
used for an alloy of the form Si(1-x)Snx. The molecular
ratio of tin in silicon can vary based on the fabrication
methods or doping conditions.
Terne: Is an alloy coating that was historically made
of lead and tin used to cover steel, in the ratio of 20%
tin and 80% lead.

9. TIN AND ITS ALLOYS CONT’D
Bearing alloys: Alloys of tin with about 7 percent antimony
and 3 percent copper have proved to be the best materials
for plain bearings running against a steel shaft.
Bell metal: Is a hard alloy used for making bells and related
instruments, such as cymbals. It is a form of bronze, usually
in approximately a 4:1 ratio of copper to tin (e.g., 78%
copper, 22% tin by mass).

10. Tin based Solder Alloys
Lead-based solders had dominated the solder market until
recently with the advent of tin-based solder. The decline is as a
result of toxicity of lead.
Tin-Lead: An alloy of 61.9% tin and 38.1% lead melts at
326oF (183oC). This is the eutectic composition of the tin-lead
solder. An alloy of 60% tin and 40% lead is commercially
available and is close enough to the eutectic alloy.
Tin-Antimony: This family of solder alloy has a higher
tensile strength and lower creep than the tin-lead solders.
The most common alloy is 95% tin and 5% antimony.
8/29/2015 10

11. Tin based Solder Alloys
Tin-Antimony-Lead: Antimony is added to tin-lead solders
in amount up to 6% to increase the strength and mechanical
properties of the alloy. Tin-antimony-lead solder alloys can
be used when higher joint strength is required.
Springwelding.en.ecplaza.net

12. Melting and Solidification of tin
alloy (Bronze)
Let us look into the solidification of tin alloy for
example bronze (88% Cu and 12% tin). Pure copper
melts at 1083oC while pure Sn melts at a low
temperature of 231.88oC.Bronze with a tin content of
12% is located in the equilibrium diagram.
There are four basic temperatures area of
transformations (1000oC, 799oC, 586oC, 520oC, 350oC)

13. Melting and Solidification of tin
alloy (Bronze)
Source: www.Calqlata.com
1000oC
799oC
586oC
350oC

14. Melting and Solidification of tin
alloy (Bronze) cont’d.
The first stage takes place in temperature range 1000° C to
799 ° C.
The solid solution  is a substitution solid solution of tin in
copper. It has a face-centered cubic lattice. The second stage
takes place at temperature 799 ° C:

15. Melting and Solidification of tin
alloy (Bronze) cont’d.
In further cooling down at temperature 586 °C is going on
eutectoid disintegration of  phase:
High temperature intermetallic phase  is an electron
compound Cu5Sn, which has a body centred cubic lattice and
electron concentration of 3/2. Another high-temperature
intermetallic phase  is the electron compounds Cu31Sn8.
Cu31Sn8 has a body centred cubic lattice and electron
concentration 21/13.

16. Melting and Solidification of tin
alloy (Bronze) cont’d.
After the end of eutectoid disintegration consists the alloy
structure of a solid solution, the mixture of phases ( + ).
At the temperature of 520 ° C disintegrates  phase by
eutectoid reaction:

17. Melting and Solidification of tin
alloy (Bronze) cont’d.
Phase  is the Cu31Sn8 electron compounds with
complex cubic lattice. Because there is a large tin
microsegregation therefore  phase is deposited on the
grain boundaries of  phase.

18. Applications of Tin and its Alloys
Source:www.itri.co.uk

19. CONCLUSION
Tin is an important element in bronze formation.
Bronze was a catalyst for early civilization.
Larger part of the tin produced today go into the production
of solders which are very important in electronics.

20. REFERENCES
 http://www.britannica.com/technology/tin-processing retrieved on 26th
August, 2015.
 "British Museum, "Scope Note" for "copper alloy"". British Museum. Retrieved
25th August 2015.
 "Bronze Disease, Archaeologies of the Greek Past". Retrieved 25th August 2015
 A. Alavudeen; N. Venkateshwaran; J. T. Winowlin Jappes (1 January 2006). A
Textbook of Engineering Materials and Metallurgy. Firewall Media. pp. 136–
. ISBN 978-81-7008-957-5. Retrieved 25th August 2015.
 http://www.carnmetals.co.uk/tin.htm retrieved on 25th August, 2015
 http://alasir.com/reference/solder_alloys/ retrieved on 25th August, 2015
 Welding and metal fabrication by larry Jeffus page447
 http://nautilus.fis.uc.pt/st2.5/scenes-e/elem/e05030.html retrieved on 25th
August, 2015
 MACHUTA Jiří ,NOVÁ lva
(http://www.metal2015.com/files/proceedings/21/papers/3695.pdf)
“Monitoring of copper alloys structures during solidification and cooling of
casting”

21. THANK YOU FOR
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