Techniques for Improving
Element Bandwidth
Name :Ashish S. Patil
Roll no.:14MV009
ME MICROWAVE
CONTENT :
 Overview
 Impedance matching technique for increasing bandwidth of MA
 Probe compensation in Thick Microstrip patch
 Increasing bandwidth of microstrip antenna by Proximity coupling
 Characteristic of two layer electromagnetically coupled RPA
 The SSFIP: A global concept for high performance broadband planar
antenna
OVERVIEW
Impedance bandwidth
Pattern bandwidth
Gain bandwidth
Impedance matching technique for increasing
bandwidth of MA
Bandwidth increase by increasing substrate thickness
Or dielectric constant reduced
But this is limited by inductive Impedance
This problem overcome by use thick substrate with same type
Of additional impedance matching to cancel inductance
This paper use Bode Fano criteria to design matching network can
Increase impedance bandwidth by 10-12%
Probe compensation in Thick Microstrip patch
Increase the substrate thickness
Inductive effect occur in which probe inductance prevent matching
of patch impedance to input connector
This inductive effect can be overcome by adding series capacitor
in probe feed circuit
Increasing bandwidth of microstrip antenna by
Proximity coupling
Proximity coupling using small open tuning stub
Stub is connected in shunt with feed line
Provide broad bandwidth without excess substrate
thickness
Characteristic of two layer electromagnetically coupled RPA
Bandwidth extension technique use two or more stagger tuned
Resonator
Implemented with stacked patches or combination of dissimilar
Element filled by air
Bandwidth increase from 10 to 20%
The SSFIP: A global concept for high performance
broadband planar antenna
SSFIP = Strip-Slot-Foam-Inverted-Patch
Slot size used to increase bandwidth
Foam antenna substrate was used at x band to achieve excess of
bandwidth of 20%
Techniques for Improving Element Bandwidth
Techniques for Improving Element Bandwidth

Techniques for Improving Element Bandwidth

  • 1.
    Techniques for Improving ElementBandwidth Name :Ashish S. Patil Roll no.:14MV009 ME MICROWAVE
  • 2.
    CONTENT :  Overview Impedance matching technique for increasing bandwidth of MA  Probe compensation in Thick Microstrip patch  Increasing bandwidth of microstrip antenna by Proximity coupling  Characteristic of two layer electromagnetically coupled RPA  The SSFIP: A global concept for high performance broadband planar antenna
  • 3.
  • 4.
    Impedance matching techniquefor increasing bandwidth of MA Bandwidth increase by increasing substrate thickness Or dielectric constant reduced But this is limited by inductive Impedance This problem overcome by use thick substrate with same type Of additional impedance matching to cancel inductance This paper use Bode Fano criteria to design matching network can Increase impedance bandwidth by 10-12%
  • 6.
    Probe compensation inThick Microstrip patch Increase the substrate thickness Inductive effect occur in which probe inductance prevent matching of patch impedance to input connector This inductive effect can be overcome by adding series capacitor in probe feed circuit
  • 8.
    Increasing bandwidth ofmicrostrip antenna by Proximity coupling Proximity coupling using small open tuning stub Stub is connected in shunt with feed line Provide broad bandwidth without excess substrate thickness
  • 10.
    Characteristic of twolayer electromagnetically coupled RPA Bandwidth extension technique use two or more stagger tuned Resonator Implemented with stacked patches or combination of dissimilar Element filled by air Bandwidth increase from 10 to 20%
  • 12.
    The SSFIP: Aglobal concept for high performance broadband planar antenna SSFIP = Strip-Slot-Foam-Inverted-Patch Slot size used to increase bandwidth Foam antenna substrate was used at x band to achieve excess of bandwidth of 20%