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International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056
Volume: 09 Issue: 07 | July 2022 www.irjet.net p-ISSN: 2395-0072
© 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 2663
Star Test Topology for Testing Printed Circuits Boards
Salim A. S. Jayousi
Faculty of Science and Applied Technology, Al Quds Open University, Palestine
---------------------------------------------------------------------***---------------------------------------------------------------------
Abstract— primarily, testing printed circuit boards was
manual and based on the board structure, was also limited
by the chip complexity. Also, it requires expensive testers
and fixtures [1].
The performance of testers depends basically on the device
properties. To enhance tester performance, the efforts
should be focused on improving testing speed through
decreasing the interconnections between the tester and the
device under test [2]. The complexityoftheinterconnections
between the device under test (DUT) and the tester became
one of the major showstoppers in evaluating the health of
DUT [3]. To surpass these constraints, we introduce a new
test methodology based on star test topology (STT) for
connecting multipledevices. Suchtopologyprovidesa means
of arbitrarily observing test results and sourceteststimulus.
The model requires minimal on chip/board resources
(pins/nets). Also, it is not limited by the chip function or
complexity. The new methodology involves developing one
shared test access port (TAP) over the entire PCB and a re-
design of the on-chip DFT circuitry.
Keywords— Start test topology, STT, integrated circuit
testing, bidirectional data line, higher functionality, test
access port.
1. Introduction
The traditional testing methods is based on the board
structure,also its limited by superfinechippackages,double-
sidedboards,conformalcoating,multi-chipmodules(MCMs),
and chip complexity. Also, it requires expensive testers and
fixtures. In such tests,chipfunctionscanbeignoredforshorts
testing and must be considered for continuity tests [5].
The performance of testers depends basically on the device
properties. To enhancetesterperformance,theeffortsshould
be focused on improving testing speed through decreasing
the interconnections betweenthetesterandthedeviceunder
test. The complexityoftheinterconnectionsbetweentheDUT
and the tester became one of the major showstoppers in
evaluating the health of DUT [6].
Embedding memory and microcontroller units inside the
testers also causes many disadvantages. It increases cost,
size, and complexity of the tester. On the other hand,
decreasing memory size leads to a proportional decrease in
the number of devices that can be diagnosed by the tester.
Versatile and multi-faceted testers can be manufactured,but
the cost will be more expensive. The rapid growth in the
complexity of circuits
requires a parallel and continuous development in tester
microcontrollers, creating a difficult challenge [7].
To surpass these constraints, we introduce a new test
methodology based on JTAG and IEEE 1149.1 Std. The new
methodology involves developingonesharedtestaccessport
(TAP) over the entire PCB and a re-design of the on-chip DFT
circuitry. Such improvements will lead to a significant
reduction in the complexity of testing nets, resources, and
pins connections [8].
The new methodology uses star test topology for connecting
multiple devices; such topology provides a means of
arbitrarily observing test results and source test stimulus.
The model requires minimal on chip/board resources
(pins/nets). Also, it is not limited by the chip function or
complexity [9]. Moreover, test access is not limited by the
physical factors of the boardand the test generation ishighly
automated.
In the new methodology, only one bidirectional data line is
utilized in order to carry data between the TAP and each
device under test. Therefore, one test access pin is required
for each DUT. The new architecture will definitely help in
reducing any resultant yield loss due to the proven contact
problems [10, 11].
Many features and advantages are achieved byusingthenew
methodology. One such feature is the considerable cost
reduction due to utilizing only one TAP to interface all on-
board devices, and also due to the high simplification in
boundary scan circuits. Further advantageisthateachDUTis
diagnosed separately without any correlation with other
DUTs. Moreover, unlike the IEEE 1149.1 Std, there is no need
to embed instructions, identifications, or bypass units inside
integrated circuits [12].
2. STT Architicture
As previously mentioned, the new methodology uses STT to
connect all the peripherals. Each DUT is connected to the
central test access port TAP using point-to-point
connections. The TAP acts as a hub and the DUTs are
considered as clients. The connection does not necessarily
have to resemble a star in order to be classified as a star
topology, but all of the DUTs access pins must be connected
to one shared TAP. All traffic that traverses the testing
International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056
Volume: 09 Issue: 07 | July 2022 www.irjet.net p-ISSN: 2395-0072
© 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 2664
network has to pass through this TAP. It selects the targeted
DUT to be tested. It also forwards the test pattern and
returns the corresponding test data output (TDO) pattern.
To select a different DUT, the computertransmitsa testreset
signal (TRST) followed by a new data packet. The star
topology is an easier topology to design and implement.
The most important advantage of STT is that it responds
immediately to any node failure. Only one DUT will be
affected if an error occurs, while the entire circuit remains
running. Because of this, diagnosing a single device for an
error or defect is supposed to be easy.
In STT, the computer broadcasts test-data input (TDI)
packets to several DUTs via TAP, and the computer can
easily identify any failed DUT. Because of its simplicity in
testability, managing the STT using connected DUTs is
considered a trivially simple. Moreover, by STT, failures can
be located easily by a logical analysis and, as a result, it can
be simply diagnosed.
The new system architecture is illustrated in Figure 1; it has
TAP acting as main hub and the DUTs represent the nodes.
Each DUT exploits only one pin to interface the TAP.
Therefore, test signals are directly transferred from TAP to
the DUT without passing through other devices. To prevent
drive conflicts among the DUTs, theTAPcontrollerhandlesa
direct addressing method.
When a data packet is received by the TAP input line, the
port reads the address information in the packet header to
determine its ultimate destination. Then, using serial to
parallel shift registers and de-multiplexer circuits, it
forwards the test packet to the next DUT on its journey;
therefore, TAP performs the "data traffic control" functionon
the circuit.
Each DUT has its own test hub TH. It is the circuit that
interfaces multiple inputs and outputsoftheDUTandmakes
them act as a single network segment. The serial signal that
is introduced at the input of the TH appears at the parallel
outputs of the TH. It is specialized hardware that forwards
data packets between TAP and DUT inputs and vice versa.
Figure 1: STT Architicture
3. STT Simulation
The circuit is designed and simulated before starting
hardware building. We used the National Instruments (NI)
Multisim simulation and circuit design software version
12.0.1. It is sophisticated software that gives advanced
design and analysis features in order to optimize efficiency,
shorten time and reduce design errors toward prototype.
Intuitive Multisim tools result in saved (PCB) iterations and
significant savings in design costs.
In order to simulate transmitting test patterns by the
computer, we used the “Word Generator” instrument that is
available in the software. It can send digital words (bit
patterns) into digital circuits. The instrument is depicted in
Figure 1.
Figure 1: Word generator instrument in Multisim
software
The output pins (1) which appear on the left side of the
instrument are the last sixteen bits in the 32-bit word, while
the output pins (2) on the right side of the instrument are
the first sixteen bits in the 32-bit word. Label “T” refers to
the external trigger (T) terminal 3, label “R” is assigned for
the data-ready terminal (4).
International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056
Volume: 09 Issue: 07 | July 2022 www.irjet.net p-ISSN: 2395-0072
© 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 2665
The word generator settings can be entered by double
clicking on the instrument face. Figure 1 shows the settings
screen for the word generator instrument. As seen clearlyin
the figure, the output terminals (1) correspond to those on
the icon. The buffer (2) generates pre-defined patterns or
saves digital patterns.
Figure 2: Word generator settings screen
The circuit output signals are captured using the Logic
Analyzer instrument. It can display up to 16 digital signalsin
a circuit. This instrument offers an improvedtiminganalysis
and rapid data acquisition of logic states to help perform
troubleshooting and design very large systems. Figure 3
shows the icon of the logic analyzer instrument. Section 1
indicates the input terminals, section 2 is the external clock
terminal, section 3 is the clock qualifierterminal,andsection
4 is the trigger qualifier terminal.
Figure 3: Multisim Logic Analyzer icon
4. Capturing and Transmitting Response
Patterns
The TDO transmitter circuit carries out capturing the
response signals of the IC under test and broadcasting it in a
serial manner. It includes three main units: loading control
unit, parallel to serial shift register, and counter unit, as
illustrated in Figure . The startupsignal generatedbythe TDI
driver unit returns to play an important role in activating
this unit; it stimulates the loading control unit to load the
shift register and also it switches on the capturing counter
circuit. The capturing period is determined by the capturing
counter running time. At the end of the counting period, a
reset signal is generated by the counter unit to stop running
the loading control unit.
Figure 5: TDO transmitter block diagram
The circuit diagram shown in Figure 4 represents a TDO
transmitter for a four-output IC. The loading control unit is
formed of a D flip flop (74HC74D). It possesses three inputs:
startup, clock, and reset. At the moment the startup signal
turns to high, the D flip flop generates a load signal to the
shift register and the counter starts running. When the
counter finishes counting, it sends a reset signal to the D flip
flop causing unload for the shift register.
IO5
IO6
IO7
IO8
Startup
CLK
TDO
ReTest
U38
74HC165D_4V
A
11
B
12
C
13
D
14
E
3
F
4
G
5
H
6
QH 9
~QH 7
SER
10
SH/~LD
1
INH
15
CLK
2
U30B
74HC74D_4V
2D
12 2Q 9
~2Q 8
~2CLR
13
2CLK
11
~2PR
10
U35B
74HC126N_4V
1D
2 1Q 5
~1Q 6
~1CLR
1
1CLK
3
~1PR
4
2D
12 2Q 9
~2Q 8
~2CLR
13
2CLK
11
~2PR
10
1D
2 1Q 5
~1Q 6
~1CLR
1
1CLK
3
~1PR
4
2D
12 2Q 9
~2Q 8
~2CLR
13
2CLK
11
~2PR
10
Reset
Reset
Reset
Reset
Reset
U34C
74HC04D_4V
Figure 46: TDO transmitter circuit diagram
Since we utilize only one IN/OUT pin for testing, the TDO
should be shifted out serially, bit by bit. For this reason we
used a NXP-74HC165N shift register to perform parallel to
serial shifting. The 74HC165 is a high-speed Si-gate CMOS
device that complies with joint electron device engineering
International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056
Volume: 09 Issue: 07 | July 2022 www.irjet.net p-ISSN: 2395-0072
© 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 2666
council (JEDEC) standard 7A. It ispin-compatiblewitha low-
power Schottky TTL (LSTTL).
The 74HC165 are 8-bit, parallel-load registers with
complementary serial outputs. The parallel input data (D0–
D7) will be loaded asynchronously into the register if the
parallel load ( ) input is 0. Otherwise, data penetrates the
register serially bit by bit at the date serial (DS) input and
shift once to the right (Q0Q1Q2, etc.) with each rising
edge clock pulse if and only if the ( ) input is 1. Hence, by
tying the DS input to the Q7 output we allow parallel-to-
serial converter expansionof thesucceedingstage. Oneinput
is allowed to be used as an active LOW clock enable (CE)
input since the clock input is a gated-OR structure. The
assignment for the input pins CP and CE is arbitrary; it can
be rearranged based on the layout convenience. For
predictable operation, the rising edge (LOWHigh) of the
input CE can only take place while CP is High. To avoid any
data shifting while is activated, either theca or the CE
signals must be High before the rising edge of
signal.Table 4 illustrates the functional description for the
serial out shift register.
Table 41: Function table for NXP-74HC74 shift register
The IC response pattern must be settled on the shift register
inputs for N clock pulses where N is the number of IC
outputs. The pattern will be loaded while the inputislow.
When the startup signal turns to high, the input receives
a High signal from the D flip flop and the shift register starts
serializing the pattern (Figure 4 7).
This register is chosen also because of its capability to deal
with excess currents that may result from defective ICs. As
listed in Table 2, the register can afford an input clamping
current of up to 20 mA. Moreover, it can be embedded in
high-temperature industrial integrated circuits with a
temperature up to 150oC.
Figure 47: Timing diagram for NXP-74HC74 shift
register
5. Conclusion
The proposed testing circuit was simulated successfully by
NI Multisim software. It smoothly transmitted test patterns
and received the corresponding response patterns. The
circuit succeeded in testing four ICs accurately. Also, the
hardware was built and ran successfully. It performed a
precise testing for several ICs.
The driving Arduino source code was written, compiled,and
loaded successfully. It prompts the user to enter the initial
values and accordingly drives the TAP interface. All the
system parts successfully integrated together to perform an
advanced and sophisticated test.
References
[1] C. A. Miller, "Contactless interfacing oftestsignalswitha
device under test", ed: Google Patents, 2011.
[2] M. H. Tehranipour, N. Ahmed, and M. Nourani, "Testing
SoC interconnects for signal integrity using extended
JTAG architecture", Computer-AidedDesignofIntegrated
Circuits and Systems, IEEE Transactions on, vol. 23, pp.
800-811, 2004.
[3] N. Ahmed, M. Tehranipour, and M. Nourani, "Extending
JTAG for testing signal integrity in SoCs", in Design,
Automation and Test in Europe Conference and
Exhibition, 2003, 2003, pp. 218-223.
Table 2: Limiting values for NXP-74HC74 shift
register
International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056
Volume: 09 Issue: 07 | July 2022 www.irjet.net p-ISSN: 2395-0072
© 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 2667
[4] B. Vermeulen, T. Waayers, and S. Bakker, "IEEE 1149.1-
compliant access architecture for multiple core debug
on digital system chips", in Test Conference, 2002.
Proceedings. International, 2002, pp. 55-63.
[5] L. Meng, Y. Savaria, Q. Bing, and J. Taillefer, "IEEE1149.1
based defect and fault tolerantscanchainforwaferscale
integration", in Defect and Fault Tolerance in VLSI
Systems, 2003. Proceedings. 18th IEEE International
Symposium on, 2003, pp. 18-25.
[6] V. D. Agrawal, "Testing for faults, looking for defects", in
Test Workshop (LATW), 2011 12thLatinAmerican,2011,
pp. 1-1.
[7] I. M. Filanovsky and B. Moore, "Contactlesstestingofon-
chip oscillator operation", in Circuits and Systems
(ISCAS), 2012 IEEE International Symposium on, 2012,
pp. 2605-2608.
[8] M. Scandiuzzo, S. Cani, L. Perugini, S. Spolzino, R.
Canegallo, L. Perilli, et al., "Input/Output Pad for Direct
Contact and Contactless Testing", in European Test
Symposium (ETS), 2011 16th IEEE, 2011, pp. 135-140.
[9] E. J. Marinissen, D. Y. Lee, J. P. Hayes, C. Sellathamby, B.
Moore, S. Slupsky, et al., "Contactless testing: Possibility
or pipe-dream?", in Design, Automation & Test in Europe
Conference & Exhibition, 2009. DATE'09., 2009, pp. 676-
681.
[10] G. P. Acharya and M. A. Rani, "Survey of test strategies
for System-on Chip and it's embedded memories", in
Intelligent Computational Systems (RAICS), 2013 IEEE
Recent Advances in, 2013, pp. 199-204.
[11] M. Moganti, F. Ercal, C. H. Dagli, and S. Tsunekawa,
"Automatic PCB Inspection Algorithms: A Survey",
Computer Vision and Image Understanding, vol. 63, pp.
287-313, 1996.
[12] M. Moganti and F. Ercal, "A Subpattern Level Inspection
System for Printed Circuit Boards", ComputerVisionand
Image Understanding, vol. 70, pp. 51-62, 1998.

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  • 1. International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056 Volume: 09 Issue: 07 | July 2022 www.irjet.net p-ISSN: 2395-0072 © 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 2663 Star Test Topology for Testing Printed Circuits Boards Salim A. S. Jayousi Faculty of Science and Applied Technology, Al Quds Open University, Palestine ---------------------------------------------------------------------***--------------------------------------------------------------------- Abstract— primarily, testing printed circuit boards was manual and based on the board structure, was also limited by the chip complexity. Also, it requires expensive testers and fixtures [1]. The performance of testers depends basically on the device properties. To enhance tester performance, the efforts should be focused on improving testing speed through decreasing the interconnections between the tester and the device under test [2]. The complexityoftheinterconnections between the device under test (DUT) and the tester became one of the major showstoppers in evaluating the health of DUT [3]. To surpass these constraints, we introduce a new test methodology based on star test topology (STT) for connecting multipledevices. Suchtopologyprovidesa means of arbitrarily observing test results and sourceteststimulus. The model requires minimal on chip/board resources (pins/nets). Also, it is not limited by the chip function or complexity. The new methodology involves developing one shared test access port (TAP) over the entire PCB and a re- design of the on-chip DFT circuitry. Keywords— Start test topology, STT, integrated circuit testing, bidirectional data line, higher functionality, test access port. 1. Introduction The traditional testing methods is based on the board structure,also its limited by superfinechippackages,double- sidedboards,conformalcoating,multi-chipmodules(MCMs), and chip complexity. Also, it requires expensive testers and fixtures. In such tests,chipfunctionscanbeignoredforshorts testing and must be considered for continuity tests [5]. The performance of testers depends basically on the device properties. To enhancetesterperformance,theeffortsshould be focused on improving testing speed through decreasing the interconnections betweenthetesterandthedeviceunder test. The complexityoftheinterconnectionsbetweentheDUT and the tester became one of the major showstoppers in evaluating the health of DUT [6]. Embedding memory and microcontroller units inside the testers also causes many disadvantages. It increases cost, size, and complexity of the tester. On the other hand, decreasing memory size leads to a proportional decrease in the number of devices that can be diagnosed by the tester. Versatile and multi-faceted testers can be manufactured,but the cost will be more expensive. The rapid growth in the complexity of circuits requires a parallel and continuous development in tester microcontrollers, creating a difficult challenge [7]. To surpass these constraints, we introduce a new test methodology based on JTAG and IEEE 1149.1 Std. The new methodology involves developingonesharedtestaccessport (TAP) over the entire PCB and a re-design of the on-chip DFT circuitry. Such improvements will lead to a significant reduction in the complexity of testing nets, resources, and pins connections [8]. The new methodology uses star test topology for connecting multiple devices; such topology provides a means of arbitrarily observing test results and source test stimulus. The model requires minimal on chip/board resources (pins/nets). Also, it is not limited by the chip function or complexity [9]. Moreover, test access is not limited by the physical factors of the boardand the test generation ishighly automated. In the new methodology, only one bidirectional data line is utilized in order to carry data between the TAP and each device under test. Therefore, one test access pin is required for each DUT. The new architecture will definitely help in reducing any resultant yield loss due to the proven contact problems [10, 11]. Many features and advantages are achieved byusingthenew methodology. One such feature is the considerable cost reduction due to utilizing only one TAP to interface all on- board devices, and also due to the high simplification in boundary scan circuits. Further advantageisthateachDUTis diagnosed separately without any correlation with other DUTs. Moreover, unlike the IEEE 1149.1 Std, there is no need to embed instructions, identifications, or bypass units inside integrated circuits [12]. 2. STT Architicture As previously mentioned, the new methodology uses STT to connect all the peripherals. Each DUT is connected to the central test access port TAP using point-to-point connections. The TAP acts as a hub and the DUTs are considered as clients. The connection does not necessarily have to resemble a star in order to be classified as a star topology, but all of the DUTs access pins must be connected to one shared TAP. All traffic that traverses the testing
  • 2. International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056 Volume: 09 Issue: 07 | July 2022 www.irjet.net p-ISSN: 2395-0072 © 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 2664 network has to pass through this TAP. It selects the targeted DUT to be tested. It also forwards the test pattern and returns the corresponding test data output (TDO) pattern. To select a different DUT, the computertransmitsa testreset signal (TRST) followed by a new data packet. The star topology is an easier topology to design and implement. The most important advantage of STT is that it responds immediately to any node failure. Only one DUT will be affected if an error occurs, while the entire circuit remains running. Because of this, diagnosing a single device for an error or defect is supposed to be easy. In STT, the computer broadcasts test-data input (TDI) packets to several DUTs via TAP, and the computer can easily identify any failed DUT. Because of its simplicity in testability, managing the STT using connected DUTs is considered a trivially simple. Moreover, by STT, failures can be located easily by a logical analysis and, as a result, it can be simply diagnosed. The new system architecture is illustrated in Figure 1; it has TAP acting as main hub and the DUTs represent the nodes. Each DUT exploits only one pin to interface the TAP. Therefore, test signals are directly transferred from TAP to the DUT without passing through other devices. To prevent drive conflicts among the DUTs, theTAPcontrollerhandlesa direct addressing method. When a data packet is received by the TAP input line, the port reads the address information in the packet header to determine its ultimate destination. Then, using serial to parallel shift registers and de-multiplexer circuits, it forwards the test packet to the next DUT on its journey; therefore, TAP performs the "data traffic control" functionon the circuit. Each DUT has its own test hub TH. It is the circuit that interfaces multiple inputs and outputsoftheDUTandmakes them act as a single network segment. The serial signal that is introduced at the input of the TH appears at the parallel outputs of the TH. It is specialized hardware that forwards data packets between TAP and DUT inputs and vice versa. Figure 1: STT Architicture 3. STT Simulation The circuit is designed and simulated before starting hardware building. We used the National Instruments (NI) Multisim simulation and circuit design software version 12.0.1. It is sophisticated software that gives advanced design and analysis features in order to optimize efficiency, shorten time and reduce design errors toward prototype. Intuitive Multisim tools result in saved (PCB) iterations and significant savings in design costs. In order to simulate transmitting test patterns by the computer, we used the “Word Generator” instrument that is available in the software. It can send digital words (bit patterns) into digital circuits. The instrument is depicted in Figure 1. Figure 1: Word generator instrument in Multisim software The output pins (1) which appear on the left side of the instrument are the last sixteen bits in the 32-bit word, while the output pins (2) on the right side of the instrument are the first sixteen bits in the 32-bit word. Label “T” refers to the external trigger (T) terminal 3, label “R” is assigned for the data-ready terminal (4).
  • 3. International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056 Volume: 09 Issue: 07 | July 2022 www.irjet.net p-ISSN: 2395-0072 © 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 2665 The word generator settings can be entered by double clicking on the instrument face. Figure 1 shows the settings screen for the word generator instrument. As seen clearlyin the figure, the output terminals (1) correspond to those on the icon. The buffer (2) generates pre-defined patterns or saves digital patterns. Figure 2: Word generator settings screen The circuit output signals are captured using the Logic Analyzer instrument. It can display up to 16 digital signalsin a circuit. This instrument offers an improvedtiminganalysis and rapid data acquisition of logic states to help perform troubleshooting and design very large systems. Figure 3 shows the icon of the logic analyzer instrument. Section 1 indicates the input terminals, section 2 is the external clock terminal, section 3 is the clock qualifierterminal,andsection 4 is the trigger qualifier terminal. Figure 3: Multisim Logic Analyzer icon 4. Capturing and Transmitting Response Patterns The TDO transmitter circuit carries out capturing the response signals of the IC under test and broadcasting it in a serial manner. It includes three main units: loading control unit, parallel to serial shift register, and counter unit, as illustrated in Figure . The startupsignal generatedbythe TDI driver unit returns to play an important role in activating this unit; it stimulates the loading control unit to load the shift register and also it switches on the capturing counter circuit. The capturing period is determined by the capturing counter running time. At the end of the counting period, a reset signal is generated by the counter unit to stop running the loading control unit. Figure 5: TDO transmitter block diagram The circuit diagram shown in Figure 4 represents a TDO transmitter for a four-output IC. The loading control unit is formed of a D flip flop (74HC74D). It possesses three inputs: startup, clock, and reset. At the moment the startup signal turns to high, the D flip flop generates a load signal to the shift register and the counter starts running. When the counter finishes counting, it sends a reset signal to the D flip flop causing unload for the shift register. IO5 IO6 IO7 IO8 Startup CLK TDO ReTest U38 74HC165D_4V A 11 B 12 C 13 D 14 E 3 F 4 G 5 H 6 QH 9 ~QH 7 SER 10 SH/~LD 1 INH 15 CLK 2 U30B 74HC74D_4V 2D 12 2Q 9 ~2Q 8 ~2CLR 13 2CLK 11 ~2PR 10 U35B 74HC126N_4V 1D 2 1Q 5 ~1Q 6 ~1CLR 1 1CLK 3 ~1PR 4 2D 12 2Q 9 ~2Q 8 ~2CLR 13 2CLK 11 ~2PR 10 1D 2 1Q 5 ~1Q 6 ~1CLR 1 1CLK 3 ~1PR 4 2D 12 2Q 9 ~2Q 8 ~2CLR 13 2CLK 11 ~2PR 10 Reset Reset Reset Reset Reset U34C 74HC04D_4V Figure 46: TDO transmitter circuit diagram Since we utilize only one IN/OUT pin for testing, the TDO should be shifted out serially, bit by bit. For this reason we used a NXP-74HC165N shift register to perform parallel to serial shifting. The 74HC165 is a high-speed Si-gate CMOS device that complies with joint electron device engineering
  • 4. International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056 Volume: 09 Issue: 07 | July 2022 www.irjet.net p-ISSN: 2395-0072 © 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 2666 council (JEDEC) standard 7A. It ispin-compatiblewitha low- power Schottky TTL (LSTTL). The 74HC165 are 8-bit, parallel-load registers with complementary serial outputs. The parallel input data (D0– D7) will be loaded asynchronously into the register if the parallel load ( ) input is 0. Otherwise, data penetrates the register serially bit by bit at the date serial (DS) input and shift once to the right (Q0Q1Q2, etc.) with each rising edge clock pulse if and only if the ( ) input is 1. Hence, by tying the DS input to the Q7 output we allow parallel-to- serial converter expansionof thesucceedingstage. Oneinput is allowed to be used as an active LOW clock enable (CE) input since the clock input is a gated-OR structure. The assignment for the input pins CP and CE is arbitrary; it can be rearranged based on the layout convenience. For predictable operation, the rising edge (LOWHigh) of the input CE can only take place while CP is High. To avoid any data shifting while is activated, either theca or the CE signals must be High before the rising edge of signal.Table 4 illustrates the functional description for the serial out shift register. Table 41: Function table for NXP-74HC74 shift register The IC response pattern must be settled on the shift register inputs for N clock pulses where N is the number of IC outputs. The pattern will be loaded while the inputislow. When the startup signal turns to high, the input receives a High signal from the D flip flop and the shift register starts serializing the pattern (Figure 4 7). This register is chosen also because of its capability to deal with excess currents that may result from defective ICs. As listed in Table 2, the register can afford an input clamping current of up to 20 mA. Moreover, it can be embedded in high-temperature industrial integrated circuits with a temperature up to 150oC. Figure 47: Timing diagram for NXP-74HC74 shift register 5. Conclusion The proposed testing circuit was simulated successfully by NI Multisim software. It smoothly transmitted test patterns and received the corresponding response patterns. The circuit succeeded in testing four ICs accurately. Also, the hardware was built and ran successfully. It performed a precise testing for several ICs. The driving Arduino source code was written, compiled,and loaded successfully. It prompts the user to enter the initial values and accordingly drives the TAP interface. All the system parts successfully integrated together to perform an advanced and sophisticated test. References [1] C. A. Miller, "Contactless interfacing oftestsignalswitha device under test", ed: Google Patents, 2011. [2] M. H. Tehranipour, N. Ahmed, and M. Nourani, "Testing SoC interconnects for signal integrity using extended JTAG architecture", Computer-AidedDesignofIntegrated Circuits and Systems, IEEE Transactions on, vol. 23, pp. 800-811, 2004. [3] N. Ahmed, M. Tehranipour, and M. Nourani, "Extending JTAG for testing signal integrity in SoCs", in Design, Automation and Test in Europe Conference and Exhibition, 2003, 2003, pp. 218-223. Table 2: Limiting values for NXP-74HC74 shift register
  • 5. International Research Journal of Engineering and Technology (IRJET) e-ISSN: 2395-0056 Volume: 09 Issue: 07 | July 2022 www.irjet.net p-ISSN: 2395-0072 © 2022, IRJET | Impact Factor value: 7.529 | ISO 9001:2008 Certified Journal | Page 2667 [4] B. Vermeulen, T. Waayers, and S. Bakker, "IEEE 1149.1- compliant access architecture for multiple core debug on digital system chips", in Test Conference, 2002. Proceedings. International, 2002, pp. 55-63. [5] L. Meng, Y. Savaria, Q. Bing, and J. Taillefer, "IEEE1149.1 based defect and fault tolerantscanchainforwaferscale integration", in Defect and Fault Tolerance in VLSI Systems, 2003. Proceedings. 18th IEEE International Symposium on, 2003, pp. 18-25. [6] V. D. Agrawal, "Testing for faults, looking for defects", in Test Workshop (LATW), 2011 12thLatinAmerican,2011, pp. 1-1. [7] I. M. Filanovsky and B. Moore, "Contactlesstestingofon- chip oscillator operation", in Circuits and Systems (ISCAS), 2012 IEEE International Symposium on, 2012, pp. 2605-2608. [8] M. Scandiuzzo, S. Cani, L. Perugini, S. Spolzino, R. Canegallo, L. Perilli, et al., "Input/Output Pad for Direct Contact and Contactless Testing", in European Test Symposium (ETS), 2011 16th IEEE, 2011, pp. 135-140. [9] E. J. Marinissen, D. Y. Lee, J. P. Hayes, C. Sellathamby, B. Moore, S. Slupsky, et al., "Contactless testing: Possibility or pipe-dream?", in Design, Automation & Test in Europe Conference & Exhibition, 2009. DATE'09., 2009, pp. 676- 681. [10] G. P. Acharya and M. A. Rani, "Survey of test strategies for System-on Chip and it's embedded memories", in Intelligent Computational Systems (RAICS), 2013 IEEE Recent Advances in, 2013, pp. 199-204. [11] M. Moganti, F. Ercal, C. H. Dagli, and S. Tsunekawa, "Automatic PCB Inspection Algorithms: A Survey", Computer Vision and Image Understanding, vol. 63, pp. 287-313, 1996. [12] M. Moganti and F. Ercal, "A Subpattern Level Inspection System for Printed Circuit Boards", ComputerVisionand Image Understanding, vol. 70, pp. 51-62, 1998.