This document describes the design calculations for a low voltage dropout regulator to provide an output voltage of 3.3V from an input of 5V. It involves calculating the range of bias voltages and sizes of the transistors in the regulator circuit. Transistor widths are determined to keep transistors in saturation and ensure sufficient drive. The calculations result in transistor width and length values that are then simulated before and after layout to verify the regulator design meets specifications.
IC Design of Power Management Circuits (IV)Claudia Sin
by Wing-Hung Ki
Integrated Power Electronics Laboratory
ECE Dept., HKUST
Clear Water Bay, Hong Kong
www.ee.ust.hk/~eeki
International Symposium on Integrated Circuits
Singapore, Dec. 14, 2009
Series and parallel connection of mosfetMafaz Ahmed
The parallel connection of MOSFETs allows higher load currents to be handled by sharing the current between the individual switches. Because MOSFETs have a positive temperature coefficient they can be parallel without the need for source resistors.
IC Design of Power Management Circuits (IV)Claudia Sin
by Wing-Hung Ki
Integrated Power Electronics Laboratory
ECE Dept., HKUST
Clear Water Bay, Hong Kong
www.ee.ust.hk/~eeki
International Symposium on Integrated Circuits
Singapore, Dec. 14, 2009
Series and parallel connection of mosfetMafaz Ahmed
The parallel connection of MOSFETs allows higher load currents to be handled by sharing the current between the individual switches. Because MOSFETs have a positive temperature coefficient they can be parallel without the need for source resistors.
Designed a differential input and single ended output high gain (>= 85 dB) operational amplifier using CMOS 0.35um technology using a single independent current source. The amplifier was also designed to achieve a CMRR (>= 80dB), Average Slew Rate (>= 15 V/us), UGF (>= 15 MHz) & Output Voltage Swing ( >= 1.4V). The maximum power dissipation through the complete circuit including the current source branch was limited to 0.3 mW.
NMOS is nothing but negative channel metal oxide semiconductor; it is pronounced as en-moss. It is a type of semiconductor that charges negatively.
NMOS advantages, disadvantage, TTL, DTL
IC Design of Power Management Circuits (I)Claudia Sin
by Wing-Hung Ki
Integrated Power Electronics Laboratory
ECE Dept., HKUST
Clear Water Bay, Hong Kong
www.ee.ust.hk/~eeki
International Symposium on Integrated Circuits
Singapore, Dec. 14, 2009
A detailed step-by-step procedure for the design of a buck converter. Different active and passive components are selected as per the requirement specified in the design problem.
• Developed standard library cells using IBM 130nm technology in Cadence Virtuoso Layout editor for inverter, nand2, nor2, xnor2, mux2:1, oai2221, aoi22, oai121 and a master-slave negative edge triggered D-flip-flop with minimum area and diffusion breaks. Constructed the schematic, performed DRC-LVS closure of layout and generated a SPICE netlist with Calibre PEX extraction of all the standard cells.
• Simulated the netlists by HSPICE, verified the correctness of its functionality and also made timing analysis of D-flip-flop setup and hold times. Generated a new Synopsys cell library using SiliconSmart ACE and a new Cadence cell library from all the standard cells.
DIFFERENTIAL AMPLIFIER using MOSFET, Modes of operation,
The MOS differential pair with a common-mode input voltage ,Common mode rejection,gain, advantages and disadvantages.
This presentation provides a detailed overview of various IC's for power management and battery management applications. Compare models to each other and the competition!
Designed a differential input and single ended output high gain (>= 85 dB) operational amplifier using CMOS 0.35um technology using a single independent current source. The amplifier was also designed to achieve a CMRR (>= 80dB), Average Slew Rate (>= 15 V/us), UGF (>= 15 MHz) & Output Voltage Swing ( >= 1.4V). The maximum power dissipation through the complete circuit including the current source branch was limited to 0.3 mW.
NMOS is nothing but negative channel metal oxide semiconductor; it is pronounced as en-moss. It is a type of semiconductor that charges negatively.
NMOS advantages, disadvantage, TTL, DTL
IC Design of Power Management Circuits (I)Claudia Sin
by Wing-Hung Ki
Integrated Power Electronics Laboratory
ECE Dept., HKUST
Clear Water Bay, Hong Kong
www.ee.ust.hk/~eeki
International Symposium on Integrated Circuits
Singapore, Dec. 14, 2009
A detailed step-by-step procedure for the design of a buck converter. Different active and passive components are selected as per the requirement specified in the design problem.
• Developed standard library cells using IBM 130nm technology in Cadence Virtuoso Layout editor for inverter, nand2, nor2, xnor2, mux2:1, oai2221, aoi22, oai121 and a master-slave negative edge triggered D-flip-flop with minimum area and diffusion breaks. Constructed the schematic, performed DRC-LVS closure of layout and generated a SPICE netlist with Calibre PEX extraction of all the standard cells.
• Simulated the netlists by HSPICE, verified the correctness of its functionality and also made timing analysis of D-flip-flop setup and hold times. Generated a new Synopsys cell library using SiliconSmart ACE and a new Cadence cell library from all the standard cells.
DIFFERENTIAL AMPLIFIER using MOSFET, Modes of operation,
The MOS differential pair with a common-mode input voltage ,Common mode rejection,gain, advantages and disadvantages.
This presentation provides a detailed overview of various IC's for power management and battery management applications. Compare models to each other and the competition!
LOW VOLTAGE LOW DROPOUT REGULATOR USING CURRENT SPLITTING TECHNIQUEEditor IJMTER
We proposed a low voltage low dropout regulator that converts an input of 1 v to an
output of 0.85-0.5 v with 90-nm CMOS technology. Current splitting technique used to boost the
gain by using an error amplifier. A power noise cancellation mechanism is formed in the rail-to-rail
output stage of the error amplifier, to minimize the size of power MOS transistor. In this paper we
achieve a fast transient response, high power supply rejection, low dropout regulator, low voltage,
and small area. CMOS processes have been used in Large scale integrated circuits like LSI and
microprocessor they have been miniaturized constantly. Taking full advantage of the miniaturization
technology, CMOS linear regulators have become the power management ICs that are widely used in
portable electronics products to realize low profile, low dropout, and low supply current.
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•Designed a two stage OPAMP with a current mirror amplifier and a second CS stage along with miller compensation to provide sufficient Phase margin for stability.The circuit is also provided with temperature independent self-biased startup circuit.
•Our OPAMP exhibited a gain of 82.74dB, OVSR of 1.57V, Slew rate of 9.79V/us, Phase margin of 60 deg, GBW of 18.6 MHz, CMRR of 88.473dB, Power dissipation of 0.22mW with a 1.8V power supply.
• Designed a single stage folded cascode op-amp which had atleast 50 dB gain and 135 MHz Unity Gain Bandwidth for the three temperature corners (typical, slow and fast), in Cadence.
• The op-amp had a phase margin of atleast 64º and an output swing of atleast 1.46 V for the temperature corners (27,-40,100).
• Designed a common mode feedback for the amplifier and achieved a common mode accuracy of 0.01 V.
A 100-kW PV array is connected to a 25-kV grid via a DC-DC boost converter and a three-phase three-level Voltage Source Converter (VSC). Maximum Power Point Tracking (MPPT) is implemented in the boost converter by means of a Simulink® model using the 'Incremental Conductance + Integral Regulator' technique.
Another example (see PVArrayGridAverageModel model) uses average models for the DC_DC and VSC converters. In this average model the MPPT controller is based on the 'Perturb and Observe' technique.
3. For the calculations we assume the
following constants:
- Pass transistor current = 1ma
- Vout = 3.3V
- Dropout voltage =
- VDD=5V
-
4. Calculations:
- Calculation of a range of Vbias1
1. To find Ibias1:
From the desired a photodiode range, the minimum
value of Ibias1:
VGS3
=Vphmin
Ibias1 = ½ K1(W/L)3
(VGS3
-VTHN
)2
= ½ * 50 * 10-6 A/V2
*
3µm/0.6µm * (0.8V – 0.617)2
= 4.186µA =4µA
The maximum value of Ibias1:
Ibias1 = ½ K1(W/L)3
(VGS3
-VTHN
)2
= ½ * 50 * 10-6 A/V2
*
3µm/0.6µm * (3.0V – 0.617)2
= 0.7mA
5. Calculations:
- Calculation of a range of Vbias1
2. To find Vbias1:
Next we find the value of Vbias1 given by
Vbias1
= VDD
– VGS0
= VDD
- √[(2Ibias1)/(K2
(W/L)0
] –
VTHp
Vbias1
= VDD
– VGS0
= VDD
- √[
(2Ibias1)/(K2
(W/L)0
] – VTHp
p
The maximum value of Vbias1:
Vbias1(max) = 5V - √[(2*4µA)/(19.1µA/V2*
20µm/0.6µm)] – 0.915V =1.026 = 4V
The minimum value of Vbias1:
Vbias1(min) = VDD
– VGS0
= 5V- √[(2*0.7*10-3
)/25*
10-6
/V2 * 20µm/0.6µm) – 0.915V = 2.8V
6. Calculations:
- Calculation of sizes of the transistors M5, M4
1. To determine W5
From requirement to keep M5 in saturation
region:
VTH
≤VGS5
= Vbias1(min) + VTHp
– Vph
(max) =
2.8V +0.9V – 3.0V = 0.7V
W5 = (2InL5
)/(K1
(VGS5
-VTHN
)2
) = (2 * 1.2µA *
0.6µm)/(50µA/V2
* (0.7V – 0.617V)2
) = 4µm
8. Calculations:
- Calculation of the gain for the current mirror transistors
M1, M2, M7
1. To find VGS
for M1, M2, M7
VGS1
= VDS1
= VGS2
= VGS1
= √[(2Iout)/(K2
(W/L)2,7
] + VTHp
= √(2 *
1.2µA)/(25µA/V2
* (20/2.4)) + 0.915V = 0.107V + 0.915V = 1V
9. Calculations:
- Calculation of the gain for the current mirror transistors
M1, M2, M7
2. To find VDS
for current mirror:
Next we find VDS2
and VDS7
(which are the same in value)
VDS2,7
= VDD
– VDS6
= VDD
- √[(2Iout)/(K1
(W/L)6
] - VTHN
=
5V - √(2 * 1.2µA)/(50µA/V2
* (1.5/8.55)) - 0.617V = 3.85V
10. Calculations:
- Calculation of the gain for the current mirror transistors
M1, M2, M7
3. To determine W1:
Finally, we calculate the size of transistor M1. It's required that Iin =
Iout. Consequently, the current conveyor ought to have I1 = I2,7.
Assuming L1= L2,7:
W1/L1* (1 + ƛpDS2,7) = W2,7/L2,7(1 + ƛpDS2,7)
W1 = 2(1 + ƛpDS2,7)/(1 + ƛpDS1)
W1 = (20µm*(1+0.2*3.85V)/(1+0.2*1V) = 29.5µm
11. Summary of Transistor Sizes:
- Summary of calculated transistor sizes vs the
transistor simulation sizes
TransistTor Calculated Size Actual Size Used
Width(µm) Length(µm) Width(µm) Length(µm)
M1 100 0.6 19.55 0.6
M2 100 0.6 21.3 2.4
M3 20 0.6 19.55 0.6
M4 20 0.6 3 0.6
M5 300 0.6 3 1.5