Imaps Nw Ness 4 23 03 Compressed

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This document discusses sources of variation in low temperature co-fired ceramic (LTCC) packaging processes and how to account for that variation in models. It outlines the sequential nature of LTCC processes and how the total process variation is the sum of the variations of each individual step. It provides examples of measuring variation in dielectric thickness and RF via transitions to incorporate into RF models using Monte Carlo simulation. The key is to measure process variations, physical features, and RF performance to build accurate models that consider observed sources of variation.

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[object Object],[object Object],[object Object],[object Object],Variational Analysis in LTCC Packages

Outline ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

LTCC Process 1 2 3 ,[object Object],PUNCH -- VIA FILL -- PRINTING --

LTCC Process ,[object Object],Collate Sheets -- 4 Lamination -- 5 Fired Ceramic Multilayer -- 6

LTCC Package cross-section Vias Stacked Vias Internal Conductors Thermal Vias Thick Film Dielectric or Post Fire Resistor Back side or External Conductor Top side or External Conductor Dielectric Layers Buried Resistors

Process Variance ,[object Object],[object Object], 2 1 +  2 2 +  2 3 +  2 4 + … =  2 TOTAL ,[object Object],[object Object]

Results: 64 panels measured PROCESS 3  FEATURE PUNCH 0.3 mil PATTERN PRINT 0.5 mil LAMINATION, VIA & PRINT 1.3 mil LAMINATION, CAVITY 2.7 mil FIRING (SHRINKAGE) 0.9 % THICKNESS (SHRINKAGE) 3.4 % SAW CUT 2.2 mil COMPONENT MACHINE 1.6 mil COMPONENT ATTACH 4.0 mil

RF Measurements ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

RF Stripline Design Calculations (S 21 in dB) ,[object Object],[object Object],Subtract 2) from 1) cancels 2*S 21  terms and gets… S 21L1 - S 21L2 = (S 21 /inch)*(L1-L2) Solve for S 21 /inch (S 21L1 - S 21L2 )/(L1-L2) = S 21 /inch Measured results  L1 L2

Example: Dielectric Thickness 1 2 3 4 5 6 GROUND TAPE DIELECTRIC GROUND PRINTED DIELECTRIC FILTER ELEMENT SONOSCAN IMAGE THROUGH FIRED PART Stripline BandPass Filter for 2.45 GHz

X-section ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Dielectric Thickness  Frequency Response

Comparison with model At 2.45 GHz -2.1 Measured -2.2 HFSS IL (dB) Data

Variation greatest within lot Insertion Loss at 2.45 GHz Avg(6): -2.42 dB Max: -2.04 dB; Filter: A2 Min: -2.81 dB; Filter: A6

Example: RF Via Transition RF VIA RF INPUT (LEAD) SOURCES OF VARIATION ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Parameter Measurement ,[object Object],[object Object]

Braze Fillet DIELECTRIC THICKNESS VIA ALIGNMENT BRAZE THICKNESS BRAZE FILLET SHAPE

Modeling: Braze Fillet Model rka_123 was modified to include a braze structure observed in cross-sections. Braze Board ceramic Lead Changes: added 2 mils to braze height for total 3 mils, Added 3 mil wide (each side) tapered braze fillets to full height of lead

Summary ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

http://www.surfacetreatments.it/thinfilms Surface and Thin Film Characterization of Superconducting Multilayer films for application in RF (Roland Schulze - 30') Speaker: Roland Schulze - Los Alamos National Laboratory | Duration: 30 min. Abstract The use of multilayer ultra-thin films on the interior surfaces of Nb superconducting RF cavities shows great promise in substantially improving the performance characteristics of superconducting RF cavities into the 100 MV/m range by increasing the RF critical magnetic field, HRF, through careful choice of new materials and thin film structures. However, there are substantial materials science challenges associated with producing such complex film structures, particularly for conformal application of uniform thin films on the interior surfaces of RF cavities. Here we present surface and thin film analysis of ultra-thin films of two candidate materials, MgB2 and NbN superconductors, deposited through several different methods, along with multilayers produced with alternating superconductor and dielectric films. We report on the analysis methods and techniques, using primarily x-ray photoelectron spectroscopy and Auger spectroscopy with ion sputter depth profiling, and describe results from variety of thin film samples. The materials stability, microstructure, chemistry, and thin film morphology are highly dependent on methods and parameters used in the thin film deposition. From our analysis, important factors for producing quality superconducting and dielectric films include chemical stoichiometry, impurity content, deposition temperature, substrate choice and conditioning, choice of dielectric material, and the nature of the thin film interfaces. These factors will be discussed in the context of the production methods used for these ultra-thin superconducting films.

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Imaps Nw Ness 4 23 03 Compressed

5. LTCC Package cross-section Vias Stacked Vias Internal Conductors Thermal Vias Thick Film Dielectric or Post Fire Resistor Back side or External Conductor Top side or External Conductor Dielectric Layers Buried Resistors

7. Single Layer Test Panel

8. Test Panel Features LOWER LEFT CENTER

9. Measurement Multi-layer Test

10. Results: 64 panels measured PROCESS 3  FEATURE PUNCH 0.3 mil PATTERN PRINT 0.5 mil LAMINATION, VIA & PRINT 1.3 mil LAMINATION, CAVITY 2.7 mil FIRING (SHRINKAGE) 0.9 % THICKNESS (SHRINKAGE) 3.4 % SAW CUT 2.2 mil COMPONENT MACHINE 1.6 mil COMPONENT ATTACH 4.0 mil

11.

12.

13. RF Stripline Insertion Loss

14. Example: Dielectric Thickness 1 2 3 4 5 6 GROUND TAPE DIELECTRIC GROUND PRINTED DIELECTRIC FILTER ELEMENT SONOSCAN IMAGE THROUGH FIRED PART Stripline BandPass Filter for 2.45 GHz

15.

16. Comparison with model At 2.45 GHz -2.1 Measured -2.2 HFSS IL (dB) Data

17. Variation greatest within lot Insertion Loss at 2.45 GHz Avg(6): -2.42 dB Max: -2.04 dB; Filter: A2 Min: -2.81 dB; Filter: A6

18.

19.

20. Braze Fillet DIELECTRIC THICKNESS VIA ALIGNMENT BRAZE THICKNESS BRAZE FILLET SHAPE

21. Modeling: Braze Fillet Model rka_123 was modified to include a braze structure observed in cross-sections. Braze Board ceramic Lead Changes: added 2 mils to braze height for total 3 mils, Added 3 mil wide (each side) tapered braze fillets to full height of lead

22. Variation Added to Model

23. Modeled Variation in Spec

24.

Imaps Nw Ness 4 23 03 Compressed

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