This document discusses the history and applications of high-k dielectric materials. It begins by covering the early developments of atomic layer deposition (ALD) and its use in fabricating high-k metal-insulator-metal (MIM) capacitors in the 1990s. It then outlines several applications of high-k dielectrics in memory and logic devices, including DRAM, embedded memory, resistive RAM (RRAM), and ferroelectric memory (FRAM). The document proceeds to describe the work done with high-k materials at the Fraunhofer Institute, including integrated capacitors, system-on-chip (SoC) applications, and ferroelectric memory devices. It concludes by noting the potential for scaling ferro
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementYole Developpement
The stand-alone emerging NVM market keeps soaring, led by storage-class memory applications. Meanwhile, foundries are propelling the embedded business.
More info on: https://www.i-micronews.com/products/emerging-non-volatile-memory-2020/
This report takes a look into the patenting activity around gallium Nitride uncovering the companies, inventors, and key applications.
GaN is a binary III-V direct bandgap semiconductor commonly used in LEDs. Its wide-band gap of 3.4 eV affords its special properties for applications in optoelectronic, high-power and high-frequency devices. Because GaN offers very high breakdown voltages, high electron mobility, and saturation velocity it is also an ideal candidate for high-power and high-temperature microwave applications like RF power amplifiers at microwave frequencies and high-voltage switching devices for power grids. Solutions that use GaN-based RF transistors are also replacing the magnetrons used in microwave ovens.
Gallium Nitride (GaN) transistor models have evolved from GaAs (gallium arsenide) transistor models; however there are many advantages GaN offers:
• Higher operating voltage (over 100-V breakdown)
• Higher operating temperature (over 150°C channel temperature)
• Higher power density (5 to 30 W/mm)
• Durable and crack-resistant material
GaN devices are often grown on SiC (silicon carbide) substrates, but to achieve lower-cost GaN devices, they can be grown on sapphire and silicon wafers. GaN’s wide bandgap allows for higher breakdown voltages and operation at high temperatures. The high thermal conductivity of SiC makes it a better substrate than silicon for power amplifier applications that require good heat sinking.
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementYole Developpement
The stand-alone emerging NVM market keeps soaring, led by storage-class memory applications. Meanwhile, foundries are propelling the embedded business.
More info on: https://www.i-micronews.com/products/emerging-non-volatile-memory-2020/
This report takes a look into the patenting activity around gallium Nitride uncovering the companies, inventors, and key applications.
GaN is a binary III-V direct bandgap semiconductor commonly used in LEDs. Its wide-band gap of 3.4 eV affords its special properties for applications in optoelectronic, high-power and high-frequency devices. Because GaN offers very high breakdown voltages, high electron mobility, and saturation velocity it is also an ideal candidate for high-power and high-temperature microwave applications like RF power amplifiers at microwave frequencies and high-voltage switching devices for power grids. Solutions that use GaN-based RF transistors are also replacing the magnetrons used in microwave ovens.
Gallium Nitride (GaN) transistor models have evolved from GaAs (gallium arsenide) transistor models; however there are many advantages GaN offers:
• Higher operating voltage (over 100-V breakdown)
• Higher operating temperature (over 150°C channel temperature)
• Higher power density (5 to 30 W/mm)
• Durable and crack-resistant material
GaN devices are often grown on SiC (silicon carbide) substrates, but to achieve lower-cost GaN devices, they can be grown on sapphire and silicon wafers. GaN’s wide bandgap allows for higher breakdown voltages and operation at high temperatures. The high thermal conductivity of SiC makes it a better substrate than silicon for power amplifier applications that require good heat sinking.
Design of ESD protection for high-speed interfacesSofics
Semiconductor companies are developing ever faster wireless, wired and optical interfaces to satisfy the need for higher data throughputs. They rely on BiCMOS, advanced CMOS and FinFET nodes with ESD-sensitive circuits. However, the parasitic capacitance of the traditional ESD solutions limits the signal frequency. This paper demonstrates small area and low-cap Analog I/Os used in TSMC 28nm CMOS and TSMC 16nm, 12nm, 7nm FinFET technologies for high speed SerDes (28Gbps to 112Gbps) circuits. Parasitic capacitance of the ESD solutions is reduced below 100fF and for some silicon photonics applications even below 20fF.
2020 04 sofics low cap esd
Atomic Layer Deposition solutions for SiC Power ElectronicsBeneq
Power Electronics International
Brussels, Belgium
19.04.2023
Atomic Layer Deposition solutions for SiC Power Electronics
Integrated ALD passivation/gate dielectric stack for SiC MOSFET
Presented by Mikko Söderlund from Beneq Oy
We are offering a comprehensive high speed networking solution which is including 3.2T Co-packaged Optic (CPO), 100G, 200G, 400G & 800G transceivers, DACs, AOCs, ACCs & Loopback modules. We are fulfil your research (R&D) stage product development, DVT/EVT pre-product testing, mass production and also for final application use.
Welcome to contact us for more product info.
White paper on ESD protection for 40nm/28nmbart_keppens
40/28nm ESD approach
On-chip ESD protection clamps for advanced 40nm and 28nm CMOS technology
Despite the rising cost for IC development, EDA tools and mask sets semiconductor design companies continue to use the most advanced CMOS technology for high performance applications because benefits like lower power dissipation, increased gate density, higher speed and lower manufacturing cost per die more than compensate the higher cost.
This return on investment however only pays off for ultra high volume applications. Due to the use of sensitive elements (such as ultra thin-oxide transistors, ultra-shallow junctions, narrow and thin metal layers), increased complexity through multiple voltage domains and the use of IP blocks from various vendors, a comprehensive ESD protection strategy becomes more important.
This white paper presents on-chip ESD protection clamps and approaches for 40/28nm CMOS that provide competitive advantage by improved yield, reduced silicon footprint and enable advanced multimedia and wireless interfaces like HDMI, USB 3.0, SATA, WiFi, GPS and Bluetooth. The solutions are validated in tens of products running in foundry and proprietary fabrication plants.
ANSYS RedHawk-CPA: New Paradigm for Faster Chip-Package ConvergenceAnsys
Due to the increasing size of SoCs and the variation in the switching current and parasitic profile across the chip, the individual connections between the SoC and the package at the C4 bump level need to be as granular as possible to provide resolution to the power analysis. To see the benefit from changes made to the chip and/or package in a timely manner requires that both layouts can be modified and modeled in an integrated manner. This presentation introduces RedHawk-CPA, a new feature which allows the inclusion of both chip and package layouts for a unified DC, transient and AC power integrity analysis. It will demonstrate how RedHawk-CPA can improve the level of accuracy as well as reduce the time to power closure. Learn more on our website: https://bit.ly/1ssSGM0
KEMET Webinar - Update on ESA and military standard portfolioIvana Ivanovska
KEMET has successfully launched several High Reliability Tantalum Polymer SMD solutions to the market during the last years. The existing series T540/T541 based on the Mil 55365 specification and T583 ESCC3012/005 provide better capacitance stability, better capacitance retention, lower ESR, higher ripple handling, and long life combined with extreme requirements of Military, Defense and Aerospace applications. Leading the market and bringing innovation to these high demanding segments drive us to continuously expand our portfolio. We will up-date you on T580/T581 1st to market Military Polymer Standard and the T584 series, the ESA ultra-low ESR expansion.
Design of ESD protection for high-speed interfacesSofics
Semiconductor companies are developing ever faster wireless, wired and optical interfaces to satisfy the need for higher data throughputs. They rely on BiCMOS, advanced CMOS and FinFET nodes with ESD-sensitive circuits. However, the parasitic capacitance of the traditional ESD solutions limits the signal frequency. This paper demonstrates small area and low-cap Analog I/Os used in TSMC 28nm CMOS and TSMC 16nm, 12nm, 7nm FinFET technologies for high speed SerDes (28Gbps to 112Gbps) circuits. Parasitic capacitance of the ESD solutions is reduced below 100fF and for some silicon photonics applications even below 20fF.
2020 04 sofics low cap esd
Atomic Layer Deposition solutions for SiC Power ElectronicsBeneq
Power Electronics International
Brussels, Belgium
19.04.2023
Atomic Layer Deposition solutions for SiC Power Electronics
Integrated ALD passivation/gate dielectric stack for SiC MOSFET
Presented by Mikko Söderlund from Beneq Oy
We are offering a comprehensive high speed networking solution which is including 3.2T Co-packaged Optic (CPO), 100G, 200G, 400G & 800G transceivers, DACs, AOCs, ACCs & Loopback modules. We are fulfil your research (R&D) stage product development, DVT/EVT pre-product testing, mass production and also for final application use.
Welcome to contact us for more product info.
White paper on ESD protection for 40nm/28nmbart_keppens
40/28nm ESD approach
On-chip ESD protection clamps for advanced 40nm and 28nm CMOS technology
Despite the rising cost for IC development, EDA tools and mask sets semiconductor design companies continue to use the most advanced CMOS technology for high performance applications because benefits like lower power dissipation, increased gate density, higher speed and lower manufacturing cost per die more than compensate the higher cost.
This return on investment however only pays off for ultra high volume applications. Due to the use of sensitive elements (such as ultra thin-oxide transistors, ultra-shallow junctions, narrow and thin metal layers), increased complexity through multiple voltage domains and the use of IP blocks from various vendors, a comprehensive ESD protection strategy becomes more important.
This white paper presents on-chip ESD protection clamps and approaches for 40/28nm CMOS that provide competitive advantage by improved yield, reduced silicon footprint and enable advanced multimedia and wireless interfaces like HDMI, USB 3.0, SATA, WiFi, GPS and Bluetooth. The solutions are validated in tens of products running in foundry and proprietary fabrication plants.
ANSYS RedHawk-CPA: New Paradigm for Faster Chip-Package ConvergenceAnsys
Due to the increasing size of SoCs and the variation in the switching current and parasitic profile across the chip, the individual connections between the SoC and the package at the C4 bump level need to be as granular as possible to provide resolution to the power analysis. To see the benefit from changes made to the chip and/or package in a timely manner requires that both layouts can be modified and modeled in an integrated manner. This presentation introduces RedHawk-CPA, a new feature which allows the inclusion of both chip and package layouts for a unified DC, transient and AC power integrity analysis. It will demonstrate how RedHawk-CPA can improve the level of accuracy as well as reduce the time to power closure. Learn more on our website: https://bit.ly/1ssSGM0
KEMET Webinar - Update on ESA and military standard portfolioIvana Ivanovska
KEMET has successfully launched several High Reliability Tantalum Polymer SMD solutions to the market during the last years. The existing series T540/T541 based on the Mil 55365 specification and T583 ESCC3012/005 provide better capacitance stability, better capacitance retention, lower ESR, higher ripple handling, and long life combined with extreme requirements of Military, Defense and Aerospace applications. Leading the market and bringing innovation to these high demanding segments drive us to continuously expand our portfolio. We will up-date you on T580/T581 1st to market Military Polymer Standard and the T584 series, the ESA ultra-low ESR expansion.
Medium Voltage Terminations- up to 42kV.| AKBAR TRADING EST.| mail@akbartradi...AKBAR TRADING
Cold Applied:
• TFTI-TFTO:
Single Core Polymeric Cable Termination - Pre Expanded on Holdout - up to 42kV
• TFTI-TFTO:
Single Core Polymeric Cable Termination - Push On - up to 42kV
Heat Shrinkable:
• IXSU/OXSU:
Uniterm - Terminations for Polymeric Cables - up to
42kV
Uniterm - Terminations for Polymeric Cables - up to
42kV - Selection Guide
• IXSU/OXSU - EPKT Quick Reference Guide
Heat Shrinkable Elbows:
• EPKT:
Heat Shrinkable Termination System for cables up to 36kV
Heat Shrinkable Termination Selection Guide
• RSRB:
Inline Bushing Boots
• RSRB:
Right Angle Bushing Boots
Inline & Right Angle Bushing Boot Selection Guide
Push On Elbows:
• RCAB:
Elastomeric Flexible Bushing Boot - up to 17.5kV ONLY
• RCAB:
Inline Cold Applied Boot - up to 24kV ONLY
• RICS:
Insulated Elbow Adaptors - up to 24kV
Insulated Elbow Adaptors - up to 24kV - Selection Guide
• RSES/RSSS:
Insulated Screened Elbows - 250A - up to 24kV
• RSTI:
Insulated Screened Elbows - 630A - up to 24kV
• RSTI:
Insulated Screened Elbows - 630A - up to 36kV
• RSTI:
Insulated Screened Elbow - Piggyback Coupling System - up to 36kV
GURO MV:
NEW
GUROFLEX Medium Voltage - Cold pour Insulating Compound
Section 4:
Energy Division
http://energy.tycoelectronics.com
Technological Trends in the Field of Circuit Board Design and ManufacturingToradex
Circuit boards are extensively used across in the electronics industry. So much so that nowadays a circuit board designer is expected to be also proficient in the manufacturing technology apart from understanding electrical engineering. Read this article which will provide you with an insight on the various current and emerging technological trends prevailing in the manufacture of printed circuit boards.
The Evolution Of An Electronic Materialdavekellerman
This presentation displays a development effort that took several years. The achieved goal was attained: a complete materials system that may be used to fabricate substrates for high speed and microwave single and multichip semiconductor substrates and packages
Advanced Materials International Forum, Bari 18-19 settembre, conferenza internazionale dedicata ai materiali avanzati e alle loro possibili applicazioni nei settori industriali, con un focus particolare sui trasporti (aerospazio, automotive, navale e cantieristico).
Key Trends Shaping the Future of Infrastructure.pdfCheryl Hung
Keynote at DIGIT West Expo, Glasgow on 29 May 2024.
Cheryl Hung, ochery.com
Sr Director, Infrastructure Ecosystem, Arm.
The key trends across hardware, cloud and open-source; exploring how these areas are likely to mature and develop over the short and long-term, and then considering how organisations can position themselves to adapt and thrive.
Essentials of Automations: Optimizing FME Workflows with ParametersSafe Software
Are you looking to streamline your workflows and boost your projects’ efficiency? Do you find yourself searching for ways to add flexibility and control over your FME workflows? If so, you’re in the right place.
Join us for an insightful dive into the world of FME parameters, a critical element in optimizing workflow efficiency. This webinar marks the beginning of our three-part “Essentials of Automation” series. This first webinar is designed to equip you with the knowledge and skills to utilize parameters effectively: enhancing the flexibility, maintainability, and user control of your FME projects.
Here’s what you’ll gain:
- Essentials of FME Parameters: Understand the pivotal role of parameters, including Reader/Writer, Transformer, User, and FME Flow categories. Discover how they are the key to unlocking automation and optimization within your workflows.
- Practical Applications in FME Form: Delve into key user parameter types including choice, connections, and file URLs. Allow users to control how a workflow runs, making your workflows more reusable. Learn to import values and deliver the best user experience for your workflows while enhancing accuracy.
- Optimization Strategies in FME Flow: Explore the creation and strategic deployment of parameters in FME Flow, including the use of deployment and geometry parameters, to maximize workflow efficiency.
- Pro Tips for Success: Gain insights on parameterizing connections and leveraging new features like Conditional Visibility for clarity and simplicity.
We’ll wrap up with a glimpse into future webinars, followed by a Q&A session to address your specific questions surrounding this topic.
Don’t miss this opportunity to elevate your FME expertise and drive your projects to new heights of efficiency.
JMeter webinar - integration with InfluxDB and GrafanaRTTS
Watch this recorded webinar about real-time monitoring of application performance. See how to integrate Apache JMeter, the open-source leader in performance testing, with InfluxDB, the open-source time-series database, and Grafana, the open-source analytics and visualization application.
In this webinar, we will review the benefits of leveraging InfluxDB and Grafana when executing load tests and demonstrate how these tools are used to visualize performance metrics.
Length: 30 minutes
Session Overview
-------------------------------------------
During this webinar, we will cover the following topics while demonstrating the integrations of JMeter, InfluxDB and Grafana:
- What out-of-the-box solutions are available for real-time monitoring JMeter tests?
- What are the benefits of integrating InfluxDB and Grafana into the load testing stack?
- Which features are provided by Grafana?
- Demonstration of InfluxDB and Grafana using a practice web application
To view the webinar recording, go to:
https://www.rttsweb.com/jmeter-integration-webinar
Epistemic Interaction - tuning interfaces to provide information for AI supportAlan Dix
Paper presented at SYNERGY workshop at AVI 2024, Genoa, Italy. 3rd June 2024
https://alandix.com/academic/papers/synergy2024-epistemic/
As machine learning integrates deeper into human-computer interactions, the concept of epistemic interaction emerges, aiming to refine these interactions to enhance system adaptability. This approach encourages minor, intentional adjustments in user behaviour to enrich the data available for system learning. This paper introduces epistemic interaction within the context of human-system communication, illustrating how deliberate interaction design can improve system understanding and adaptation. Through concrete examples, we demonstrate the potential of epistemic interaction to significantly advance human-computer interaction by leveraging intuitive human communication strategies to inform system design and functionality, offering a novel pathway for enriching user-system engagements.
The Art of the Pitch: WordPress Relationships and SalesLaura Byrne
Clients don’t know what they don’t know. What web solutions are right for them? How does WordPress come into the picture? How do you make sure you understand scope and timeline? What do you do if sometime changes?
All these questions and more will be explored as we talk about matching clients’ needs with what your agency offers without pulling teeth or pulling your hair out. Practical tips, and strategies for successful relationship building that leads to closing the deal.
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
UiPath Test Automation using UiPath Test Suite series, part 4DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 4. In this session, we will cover Test Manager overview along with SAP heatmap.
The UiPath Test Manager overview with SAP heatmap webinar offers a concise yet comprehensive exploration of the role of a Test Manager within SAP environments, coupled with the utilization of heatmaps for effective testing strategies.
Participants will gain insights into the responsibilities, challenges, and best practices associated with test management in SAP projects. Additionally, the webinar delves into the significance of heatmaps as a visual aid for identifying testing priorities, areas of risk, and resource allocation within SAP landscapes. Through this session, attendees can expect to enhance their understanding of test management principles while learning practical approaches to optimize testing processes in SAP environments using heatmap visualization techniques
What will you get from this session?
1. Insights into SAP testing best practices
2. Heatmap utilization for testing
3. Optimization of testing processes
4. Demo
Topics covered:
Execution from the test manager
Orchestrator execution result
Defect reporting
SAP heatmap example with demo
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Neuro-symbolic is not enough, we need neuro-*semantic*Frank van Harmelen
Neuro-symbolic (NeSy) AI is on the rise. However, simply machine learning on just any symbolic structure is not sufficient to really harvest the gains of NeSy. These will only be gained when the symbolic structures have an actual semantics. I give an operational definition of semantics as “predictable inference”.
All of this illustrated with link prediction over knowledge graphs, but the argument is general.
Connector Corner: Automate dynamic content and events by pushing a buttonDianaGray10
Here is something new! In our next Connector Corner webinar, we will demonstrate how you can use a single workflow to:
Create a campaign using Mailchimp with merge tags/fields
Send an interactive Slack channel message (using buttons)
Have the message received by managers and peers along with a test email for review
But there’s more:
In a second workflow supporting the same use case, you’ll see:
Your campaign sent to target colleagues for approval
If the “Approve” button is clicked, a Jira/Zendesk ticket is created for the marketing design team
But—if the “Reject” button is pushed, colleagues will be alerted via Slack message
Join us to learn more about this new, human-in-the-loop capability, brought to you by Integration Service connectors.
And...
Speakers:
Akshay Agnihotri, Product Manager
Charlie Greenberg, Host
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Ramesh Iyer
In today's fast-changing business world, Companies that adapt and embrace new ideas often need help to keep up with the competition. However, fostering a culture of innovation takes much work. It takes vision, leadership and willingness to take risks in the right proportion. Sachin Dev Duggal, co-founder of Builder.ai, has perfected the art of this balance, creating a company culture where creativity and growth are nurtured at each stage.