1. Intro. Conclusion
PA discretized reconfigurability Gate Bias Envelope Tracking
1
Integrated Passive Device design on glass substrate
S-parameters measurement
(5W diff. to 50W single)
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
2. Intro. Conclusion
PA discretized reconfigurability Gate Bias Envelope Tracking
2
Envelope Tracking Principle
Goal: making DC consumption follow envelope
variations
Adaptive control of power supply (VDD) or
Adaptive control of Current consumption (IDD)
Issues/requirements:
Reduced die area / complexity / Bill-Of-Material
Immunity on linearity and noise performances
Wide channel bandwidth to address 3G/4G and latest RF
standards.
Accurate reconfiguration of envelope tracking behavior to
optimize simultaneously linearity/ and efficiency.
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
3. Intro. Conclusion
PA discretized reconfigurability Gate Bias Envelope Tracking
3
Envelope Tracking general synoptic
General envelope tracking architecture (gate et drain control)
Efficient but based on DC/DC converter:
• Difficult to integrate
• Increased Bill-Of-Material
(at least 1 ext. Choke required)
Dynamic gate bias:
• Low complexity
• Low BOM
• Low silicon Option considered
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
4. Intro. PA discretized reconfigurability IDD Bias Envelope TrackingConclusion
4
Reconfigurable-Depth adaptive Bias technique
IDD adaptive bias modifies PA properties
Impact on AM/AM and AM/PM
1st-order base-band current law in classic IDD adaptive bias systems:
I DD I DDQ h Vg2,RF
where h is fixed-valued and presents minor frequency dependence
.
Proposed reconfigurable-depth adaptive bias law:
I DD I DDQ ηDEPTHVDEPTH , Δω Vg2,RF
where hDEPTH is frequency-controlled and voltage-controlled by VDEPTH
If VDEPTH is power dependent 2nd-order system with respect to power
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
5. Intro. PA discretized reconfigurability IDD Bias Envelope TrackingConclusion
5
Reconfigurable-Depth adaptive Bias technique
Dual adaptive bias system (patent pending)
Coarse adaptive bias: Diode-connected LDMOS linearizer
VSWR mismatch sensitive (PA protection purpose)
Inserted in a closed-loop for increased channel bandwidth and better
robustness
Fine tuning adjustable bias (for reconfiguration depth)
Includes a power detector featuring an negative to positive Voltage-
Controlled Gain
Includes a reconfigurable base-band filter to:
control the phase of the injected envelope harmonics
cancel / magnify memory effects
balance / unbalance lower and upper spectral regrowth
The control of PA response in base-band domain is of crucial
importance in the prospect of linearity immunity.
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
6. Intro. Conclusion
PA discretized reconfigurability Gate Bias Envelope Tracking
6
Reconfigurable-Depth Adaptive Bias LDMOS PA schematic
Envelope probe node LDMOS linearizer
Zero for wider
bandwidth
LDMOS linearizer
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
7. Intro. PA discretized reconfigurability IDD Bias Envelope TrackingConclusion
7
Base-band building blocks: Variable-Gain Mixer
V
sinh2 IN
2U
I OUT I OUT I BIAS t tanh VADJ
VIN 2U
cosh t
2U
t
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
8. Intro. PA discretized reconfigurability IDD Bias Envelope TrackingConclusion
8
Dual-tone illustration of linearity improvement via
reconfigurable-depth adaptive Bias (a)
3rd degree non-linearities (red harmonics) tend to compress the
magnitude of the output power (gm3<0).
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
9. Intro. PA discretized reconfigurability IDD Bias Envelope TrackingConclusion
9
Dual-tone illustration of linearity improvement via
reconfigurable-depth adaptive Bias (b)
The power detector generates an envelope signal that modulates
the base-band gate voltage (green harmonics) with an adjustable
conversion gain.
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
10. Intro. PA discretized reconfigurability IDD Bias Envelope TrackingConclusion
10
Dual-tone illustration of linearity improvement via
reconfigurable-depth adaptive Bias (c)
Base-band gate voltage harmonics combine with RF harmonics
via power transistor 2nd–order non-linearities (blue harmonics) and
combat 3rd degree non-linearities (gm3<0<gm2)
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
11. Intro. PA discretized reconfigurability IDD Bias Envelope TrackingConclusion
11
Dual-tone illustration of linearity improvement via
reconfigurable-depth adaptive Bias (d)
When the injected envelope magnitude exceeds a threshold level,
over-compensation is observed linearity is degraded.
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
12. Intro. PA discretized reconfigurability IDD Bias Envelope TrackingConclusion
12
Dual-tone illustration of linearity degradation /
improvement due to slow rate memory effects (a)
Importance of memory effects:
Phase shifts in envelope injection
Spectral regrowth unbalance
Vectorial illustration on IMD3
No memory effect
Lower and upper IMD3 balance
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
13. Intro. PA discretized reconfigurability IDD Bias Envelope TrackingConclusion
13
Dual-tone illustration of linearity degradation /
improvement due to slow rate memory effects (b)
Importance of memory effects:
Phase shifts in envelope injection
Spectral regrowth unbalance
Vectorial illustration on IMD3
With memory effects
Lower and upper IMD3 unbalanced
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
14. Intro. PA discretized reconfigurability IDD Bias Envelope TrackingConclusion
14
Effect of reconfigurable depth adaptive bias
on 2-tone PA response
Locuses of G3/G1 ratio for:
• various power levels
• various VDEPTH values
Minimum G3/G1 ratio locus in green
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
15. Intro. PA discretized reconfigurability IDD Bias Envelope TrackingConclusion
15
Effect of reconfigurable depth adaptive bias
on ACLR and EVM
ACLR peaks can be shifted with
respect to power
EVM notches can be shifted with
respect to power
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
16. Intro. Conclusion
PA discretized reconfigurability Gate Bias Envelope Tracking
16
BiCMOS Silicon Power Amplifier
A 32dBm differential 2ndG LDMOS PA (100W diff. to 5W diff.)
Power stage: (320x20µm)x2 overall gate width
Driver stage: (48x20µm)x2 overall gate width
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
17. Intro. Conclusion
PA discretized reconfigurability Gate Bias Envelope Tracking
17
Continuous wave PA performances @1.75GHz (DCS/EDGE)
On-wafer singled-ended load-pull
PA characterization was
performed.
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
18. Intro. Conclusion
PA discretized reconfigurability Gate Bias Envelope Tracking
18
Continuous wave PA performances @1.75GHz (DCS/EDGE)
On-wafer singled-ended load-pull PA characterization was
performed.
Max. PAE=47%
PAE @ OCP1=40%
OCP1=27.5dBm
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
19. Intro. Conclusion
PA discretized reconfigurability Gate Bias Envelope Tracking
19
Continuous wave PA performances @1.95GHz (WCDMA)
OCP1=27.5dBm
Max. PAE=57%
PAE @OCP1=51%
Min. IDD=120mA
PAE @OCP1-10dBm=12%
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
20. Intro. Conclusion
PA discretized reconfigurability Gate Bias Envelope Tracking
20
Dynamic PA performances @1.75GHz (DCS/EDGE)
50dBm OIP3
Max. EDGE output
200kHz 2tone power =21dBm
spacing
Max. EDGE PAE
=17%
Non symetric phase shift
(memory effect)
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
21. Intro. Conclusion
PA discretized reconfigurability Gate Bias Envelope Tracking
21
Dynamic PA performances @1.95GHz (WCDMA)
35dBm OIP3
Max. PAE for slow rate HPSK=43%
Max. linear power for slow rate HPSK
=26.5dBm @ACLR=33dBc
Max. linear power for WCDMA Max. PAE for WCDMA
=21dBm @ACLR=33dBc =22%
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
22. Intro. Conclusion
PA discretized reconfigurability Gate Bias Envelope Tracking
22
Effect of reconfigurable depth adaptive bias on linearity
Probed HPSK
envelope
IMD3 can be optimized by a few dB
up to 10dB
VDEPTH polarity reversal (,,)
required for linearity optimization
over wide power range
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
23. Intro. Conclusion
PA discretized reconfigurability Gate Bias Envelope Tracking
24
IV. Conclusion & Prospects (a)
Many issues are to be considered for PA design:
Quantization noise
Memory effects …
Some were overcome, some others not.
Demonstrators have proven to be efficient with some linearity
degradation however.
1 national publication:
JNM2005
6 international publications:
DCIS2004, IMOC2005, BCTM2006, IEEE Topical Workshop on Power
Amplifiers for Wireless Communications 2008, RWS2009, SBCCI2009
1 book contribution In Microwave Filters and Amplifiers (2005)
1 patent pending
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
24. Intro. Conclusion
PA discretized reconfigurability Gate Bias Envelope Tracking
25
IV. Conclusion & Prospects (b)
Increasing S modulator bandwidth
Investigating decimator filter impact, and complexity
Taking into account phase noise
Combined reconfigurable/cartesian dual-loop
Better correction of memory effects
Accurate characterizing thermal effect
Integration of a fast temperature sensor
Integration of base-band filter
Reconfiguration of phase advance/delay
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2
25. Intro. Conclusion
PA discretized reconfigurability Gate Bias Envelope Tracking
26
Thank you for your attention
Laurent Leyssenne – November 27th 2009 – Bordeaux – Part 2