The Evolution Of An Electronic Material

The Evolution of a Ceramic Materials System for Chip Packaging Dave Kellerman April 27, 2006

Acknowledgements ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Materials System Requirements ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Low Dielectric Constant (K, Er) Low Loss (tan delta, dissipation factor)

Dielectric Properties of Ceramic Substrates and Dielectrics ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Candidate Substrate Technologies for Low K ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Thick Film Technology ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Approach Hollow Microspheres (K=1+) Standard Thick Film dielectric (K=8) Composite Thick Film Dielectric (K=4)

Porous Materials ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

New Thick Film Dielectric Formulation ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Particle Size Distribution ,[object Object],[object Object],[object Object],[object Object]

Microsphere Electrical Measurement ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Dielectric Properties of Microspheres over Frequency

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Microsphere Materials Analysis ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Final Microsphere Attributes ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Electrical Insulation Properties of the Low K Thick Film Dielectric ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

High Current Carrying Capability ,[object Object],[object Object],[object Object]

Thick Film on Low Temperature Cofired Ceramic

High Dimensional Stability, Power Dissipation, Thermal Conduction

Dimensional Stability ,[object Object],[object Object],[object Object]

Thick Film on Alumina ,[object Object]

Thick Film on Cofired Ceramic on Molded Aluminum Nitride: Patent 5,158,912

Microwave Characterization and Applications

Microwave Characterization, T Resonator ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Microwave Characterization: Stripline ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Application: Re-Design Single Layer Thin Film Microwave Circuit ,[object Object],[object Object],[object Object]

Device Development Steps ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Thick Film Design Signal Layer Signal Layer Ground Plane Ground Plane Ground Plane Vias ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Materials Issues ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Redesigned Thick Film Lincoln Labs Circuit First Layer Second Layer (EMCA/Ferro)

Buried Resistor Performance On alumina, under Low K On Low K, under Low K

Electrical Performance ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]

Bottom Lines ,[object Object],[object Object]

The Evolution Of An Electronic Material

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