This document summarizes structural analysis of an electronics assembly using Solidworks FEA simulation. It analyzed the assembly under random vibration, shock, and inertial acceleration load cases. The analysis found that the maximum stresses occurred under combined acceleration loading but were still below the yield strength of the 6061-T4 aluminum material. Shock load stresses were insignificant. The assembly's main mounting bolts require a yield strength of at least 100,000 psi. The analysis concluded the assembly design is structurally adequate for the specified environments.