Edm micromaching [autosaved]
•Download as PPTX, PDF•
0 likes•54 views
This document discusses EDM micro machining. It begins by defining miniaturization as the process of making components smaller, noting demands for micro parts in fields like electronics and biomedicine. Micro parts may be a few millimeters in size but have microscale features from 1 to 500 micrometers. The history of microEDM is then summarized, including its demonstration in 1986 for drilling small holes. Key aspects of microEDM like the spark phenomenon and components like pulse generators are also briefly introduced. The document concludes by noting microEDM's advantages like machining complex shapes in hard materials and applications in medical, automotive, and other industries.
Report
Share
Report
Share
Recommended
Choice of laser sources for micromachining applications
Fiber lasers offer several advantages over traditional lamp-pumped Nd:YAG lasers for micromachining applications. Fiber lasers provide diffraction-limited beam quality, high power densities up to 108 W/cm2, enhanced processing speeds, and reduced heat-affected zones. Experimental results showed that single-mode fiber lasers produced the best cutting and drilling results compared to pulsed Nd:YAG lasers. Applications like cutting stents and silicon wafers for solar cells benefit from the fiber laser's high beam quality, stability, and ability to produce small kerf widths and smooth cut edges.
Laser micro machining
This document discusses laser micromachining, including its working principle, types, applications, advantages, disadvantages, and safety considerations. Laser micromachining uses focused laser beams to cut, drill, or modify small features less than 1 mm in size. It has applications in manufacturing integrated chips and microelectromechanical systems. The technique offers advantages like contactless machining, flexibility, and precision, but high equipment costs and safety hazards from high intensity light.
Micromachining technologies for future products
: Miniaturization is proceeding in various types of industrial products. Micromachining is the
foundation of the technology to realize such miniaturized products. A review of the literature, mostly of last
10years, that is enhancing our understanding of the mechanics of the rapidly growing field of micromachining
has been provided. The paper focuses only on methods of micromachining process along with applications of
major methods of micromachining.this paper gives you idea of current scenario of micromachining market of
world along with its benefits and challenges
Micromachining Technology Seminar Presentation
Micromachining is used to create micrometer-scale parts and devices. It is derived from traditional machining processes but operates on a smaller scale using less force. There are several micromachining processes including micro milling, laser ablation, etching, and lithography that use mechanical forces, lasers, or chemical reactions to shape materials like ceramics, metals, polymers, and silicon. Micromachining is used to fabricate components for microelectromechanical systems, integrated circuits, medical devices, and more.
Modern/Unconventional Machining Methods/ Non-traditional methods
Modern manufacturing has seen the development of harder materials that are difficult to machine using conventional methods. This has driven the creation of unconventional machining methods that use various forms of energy without physical contact between tool and workpiece. Some key unconventional methods are electrical discharge machining, electrochemical machining, laser beam machining, and abrasive jet machining. These methods allow machining of any material, produce less tool wear and residual stress, and enable intricate shaping. However, they are generally more costly and have limitations such as requiring electrically conductive materials. Overall, unconventional machining methods expand what is possible in modern manufacturing.
Micromilling
This document summarizes Prodintec's micromilling technology capabilities. Micromilling is a high precision machining process that can create complex geometries with features as small as microns. Prodintec has equipment that can micromill a wide range of materials with a precision of 2 microns using CAD/CAM software and CNC programming. Their facilities include machines with precision positioning and measurement systems to control and verify the micromilling process.
MEMS & micro systems
The document discusses micro-electro-mechanical systems (MEMS) and their evolution. It provides definitions of MEMS, describes their key components and manufacturing processes. MEMS applications are found in various fields like automotive, healthcare, instrumentation and consumer products. The document traces the history of MEMS from their inception in the late 1940s to more recent developments. It also outlines the advantages and disadvantages of MEMS and discusses their increasing role in systems that can sense and interact with their environment.
Si Laser Micro Machining
The document presents research on estimating temperature distribution in silicon during micro laser assisted machining. Experiments were conducted using a diamond tipped tool attached to an infrared laser to preferentially heat and soften silicon. Thermal imaging showed the temperature increased through stages as the high pressure phase of silicon transformed. Analytical and finite element models were developed to estimate the temperature profile using properties of silicon phases. The models predicted temperature increases of 778°C and 468°C that agreed with experimental results. Future work could investigate other laser wavelengths and machining processes.
Recommended
Choice of laser sources for micromachining applications
Fiber lasers offer several advantages over traditional lamp-pumped Nd:YAG lasers for micromachining applications. Fiber lasers provide diffraction-limited beam quality, high power densities up to 108 W/cm2, enhanced processing speeds, and reduced heat-affected zones. Experimental results showed that single-mode fiber lasers produced the best cutting and drilling results compared to pulsed Nd:YAG lasers. Applications like cutting stents and silicon wafers for solar cells benefit from the fiber laser's high beam quality, stability, and ability to produce small kerf widths and smooth cut edges.
Laser micro machining
This document discusses laser micromachining, including its working principle, types, applications, advantages, disadvantages, and safety considerations. Laser micromachining uses focused laser beams to cut, drill, or modify small features less than 1 mm in size. It has applications in manufacturing integrated chips and microelectromechanical systems. The technique offers advantages like contactless machining, flexibility, and precision, but high equipment costs and safety hazards from high intensity light.
Micromachining technologies for future products
: Miniaturization is proceeding in various types of industrial products. Micromachining is the
foundation of the technology to realize such miniaturized products. A review of the literature, mostly of last
10years, that is enhancing our understanding of the mechanics of the rapidly growing field of micromachining
has been provided. The paper focuses only on methods of micromachining process along with applications of
major methods of micromachining.this paper gives you idea of current scenario of micromachining market of
world along with its benefits and challenges
Micromachining Technology Seminar Presentation
Micromachining is used to create micrometer-scale parts and devices. It is derived from traditional machining processes but operates on a smaller scale using less force. There are several micromachining processes including micro milling, laser ablation, etching, and lithography that use mechanical forces, lasers, or chemical reactions to shape materials like ceramics, metals, polymers, and silicon. Micromachining is used to fabricate components for microelectromechanical systems, integrated circuits, medical devices, and more.
Modern/Unconventional Machining Methods/ Non-traditional methods
Modern manufacturing has seen the development of harder materials that are difficult to machine using conventional methods. This has driven the creation of unconventional machining methods that use various forms of energy without physical contact between tool and workpiece. Some key unconventional methods are electrical discharge machining, electrochemical machining, laser beam machining, and abrasive jet machining. These methods allow machining of any material, produce less tool wear and residual stress, and enable intricate shaping. However, they are generally more costly and have limitations such as requiring electrically conductive materials. Overall, unconventional machining methods expand what is possible in modern manufacturing.
Micromilling
This document summarizes Prodintec's micromilling technology capabilities. Micromilling is a high precision machining process that can create complex geometries with features as small as microns. Prodintec has equipment that can micromill a wide range of materials with a precision of 2 microns using CAD/CAM software and CNC programming. Their facilities include machines with precision positioning and measurement systems to control and verify the micromilling process.
MEMS & micro systems
The document discusses micro-electro-mechanical systems (MEMS) and their evolution. It provides definitions of MEMS, describes their key components and manufacturing processes. MEMS applications are found in various fields like automotive, healthcare, instrumentation and consumer products. The document traces the history of MEMS from their inception in the late 1940s to more recent developments. It also outlines the advantages and disadvantages of MEMS and discusses their increasing role in systems that can sense and interact with their environment.
Si Laser Micro Machining
The document presents research on estimating temperature distribution in silicon during micro laser assisted machining. Experiments were conducted using a diamond tipped tool attached to an infrared laser to preferentially heat and soften silicon. Thermal imaging showed the temperature increased through stages as the high pressure phase of silicon transformed. Analytical and finite element models were developed to estimate the temperature profile using properties of silicon phases. The models predicted temperature increases of 778°C and 468°C that agreed with experimental results. Future work could investigate other laser wavelengths and machining processes.
Micro-drilling Using Step-forward Method
1. The document discusses micro-drilling using a step-forward feeding method to address issues with conventional micro-drilling such as tool breakage.
2. An experiment was conducted using different micro-drill diameters and step numbers to drill holes in steel workpieces with and without cutting oil.
3. The results showed that using step-forward feeding and cutting oil reduced cutting forces, burr formation, and tool damage compared to conventional micro-drilling without cutting oil.
Micro-Electromechanical Systems (Mems)
Micro-electro-mechanical systems (MEMS) have been identified as one of the most promising technologies and will continue to revolutionize the industry as well as the industrial and consumer products by combining silicon-based microelectronics with micro-machining technology. All the spheres of industrial application including robots conception and development will be impacted by this new technology. If semiconductor microfabrication was contemplated to be the first micro-manufacturing revolution, MEMS is the second revolution. The paper reflects the results of a study about the state of the art of this technology and its future influence in the development of the construction industry. The interdisciplinary nature of MEMS utilizes design, engineering and manufacturing expertise from a wide and diverse range of technical areas including integrated circuit fabrication technology, mechanical engineering, materials science, electrical engineering, chemistry and chemical engineering, as well as fluid engineering, optics, instrumentation and packaging.
Lecture 03 overview of micro fabrication
The document discusses silicon crystal growth from melt using the Czochralski technique. It explains that high purity electronic grade silicon is used as the raw material. In the Czochralski process, silicon is melted in a crucible and a seed crystal is dipped into the melt and slowly extracted, allowing a single crystal ingot to form. The crystal is then sliced into wafers, which are used to produce microchips and other silicon devices. Key steps include purifying metallurgical grade silicon, controlling the furnace atmosphere, and precisely controlling the pull rate and crystal orientation.
INTRODUCTION (2)
This document provides an overview of machining and non-traditional machining processes. It discusses various traditional machining techniques like turning, milling, and grinding. It then introduces non-traditional machining processes like electrical discharge machining (EDM), laser beam machining, ultrasonic machining, and abrasive jet machining. These alternative processes allow machining of advanced materials, complex shapes, and micro-scale components. The document categorizes non-traditional machining into mechanical, electrical, chemical, electrochemical, and thermal processes and provides examples and applications of each.
Unit 1 introduction
This document provides an overview of unconventional machining processes (UCM). It discusses the need for UCM due to limitations of conventional machining. UCM is classified based on the energy used and mechanism. Examples of processes include mechanical (AWJM, USM), electrical (EDM, WEDM), chemical/electrochemical (ECM, ECG), and thermal (LBM, PAM, EBM). Selection of a UCM process depends on the workpiece parameters, shape, capability, and economic considerations. The document provides details on the working principles, equipment, parameters, finishes, and applications of different UCM processes.
Stapla tube sealer presentation
This document discusses ultrasonic metal welding provided by Stapla Ultrasonics and Schunk Sonosystems. It provides an overview of the companies and their locations, services, and products related to ultrasonic welding. Specific applications of tube sealing and the advantages of ultrasonic welding are highlighted, such as low heat, requiring minimal training, and providing a pure metallurgical bond.
NCMF
This document discusses conventional and non-conventional machining methods. It begins by defining conventional machining as using a sharp cutting tool for removal of metal. Non-conventional machining does not require physical contact between tool and workpiece and instead uses tools like laser beams or water jets. The document then covers several non-conventional machining processes in more detail like ultrasonic machining, abrasive jet machining, and water jet machining. It concludes by comparing characteristics of conventional and non-conventional machining.
Micro electro mechanical system (MEMS)
What is MEMS?
Micro electro mechanical system is a technique of combining electrical and mechanical combinations together on a chip, to produce a system of miniature dimensions.
MEMS is a integration of a number micro components on a single chip which allow the microsystem to both sense and control the environment.
The components are integrated on a single chip using micro fabrication technologies.
Micro Electro Mechanical System
This document summarizes the process of microelectromechanical systems (MEMS). It discusses that MEMS involve integrating mechanical and electrical components on a chip using microfabrication techniques. The fabrication process involves deposition, patterning through lithography, and etching. Common materials used include metals, polymers, ceramics and semiconductors. MEMS have applications in medical devices, automobiles, sensors, and more. They provide benefits of small size, low power consumption and cost advantages, but complex design and high initial costs.
Materials for MEMS
This document discusses materials used for MEMS and microsystems, including substrates, active materials, and packaging materials. Common substrate materials include silicon, quartz, and various polymers. Silicon is discussed in detail due to its ideal properties as a substrate. Other materials covered include silicon compounds, piezoelectric crystals, and conductive polymers. The document concludes with a brief overview of packaging materials and methods.
Piezoelectric Sensor as Smart Material in structural Health Monitoring
Piezoelectric sensors are smart materials that can be used in concrete structures for structural health monitoring. They possess both sensor and actuator characteristics. When mechanical stress is applied, piezoelectric materials generate an electrical potential. They were discovered in 1880 and common forms include quartz, lithium niobate, and lead zirconate titanate. Piezoelectric sensors can be installed in concrete either by bonding to surfaces or embedding during construction. In structures, they play key roles in determining damage location and severity to predict remaining service life. Benefits include enabling autonomous monitoring while limitations include small sensing areas and complex data processing. Future applications include post-earthquake damage detection in various infrastructure.
Ntmp2015 1
This document provides an introduction to nontraditional manufacturing processes (NTMPs). It discusses how NTMPs were developed as efficient alternatives to conventional machining to address its limitations for new materials and complex part geometries. The document outlines various NTMP categories including thermal, mechanical, electrochemical, and kinetic processes. It provides examples of applications for different NTMPs and highlights attributes like increased productivity, versatility, and reduced part rejection. The course objectives are defined as developing understanding of NTMP theories, characteristics, process variables, capabilities and limitations.
Unconventional machining process
This document provides an overview of unconventional machining processes. It begins by defining conventional machining and its limitations in machining complex geometries and hard materials. Unconventional machining uses indirect energy sources like sparks, heat, or chemicals instead of direct tool contact. The document then discusses various unconventional processes like EDM, laser beam machining, water jet machining, and their characteristics. It classifies unconventional processes and provides details on electrochemical machining, electrochemical grinding, and ultrasonic machining. In closing, it acknowledges the development of these nontraditional techniques for precision manufacturing applications.
Mems
Micro-electro-mechanical systems (MEMS) combine mechanical and electrical components at the microscale using microfabrication techniques. MEMS are fabricated using processes such as chemical and physical vapor deposition, photolithography, and wet or dry etching to create 3D mechanical structures. Common MEMS materials include metals, polymers, ceramics and semiconductors. MEMS have a wide variety of applications including in automotive, medical, military and consumer electronics as sensors, actuators and microsystems such as accelerometers and gyroscopes. Advantages of MEMS include miniaturization, improved accuracy and reliability while disadvantages include high initial costs and complex design processes.
Introduction to mems
MEMS (Microelectromechanical systems) are tiny integrated devices that combine electrical and mechanical components fabricated using IC processing techniques. They can sense, control, and actuate processes on the microscale and generate macroscale effects. Key enabling technologies include photolithography, etching, and deposition which allow creation of mechanical and electromechanical structures from materials like silicon, polymers, and metals. MEMS have diverse applications in areas like automotive, medical, communications, and more. They represent a new paradigm for miniaturized mechanical devices with great potential to impact many aspects of life.
Substrate / wafers and Basic concepts Of Mems & microsystems
Substrate/Wafers
Substrate/wafer Material
Silicon as substrate
Miller Indices
mechanical properties of silicon
Silicon compounds
MEMS Packaging
This document discusses MEMS packaging at different levels. It describes microelectronic packaging as providing mechanical support, electrical connections and protection from environmental threats for integrated circuits. There are 5 levels of microelectronic packaging from the silicon chip to larger systems. MEMS and microsystem packaging aims to protect delicate core elements from mechanical or environmental damage during operation. Proper packaging design considers costs, environmental effects, reliability and achieving minimum electrical connections to prevent failures.
Mems
MEMS are tiny integrated devices that combine mechanical and electrical components on a micro scale. They are able to sense, control and actuate on a micro scale but generate effects on a macro scale. MEMS utilize various fields including design, engineering, materials science and electrical engineering. Current MEMS devices include sensors in airbags, inkjet printer heads, and blood pressure sensors. MEMS are fabricated using deposition, patterning, and etching processes and are used in applications such as automotive, medical, military, and consumer electronics.
Stapla solar panel assembly
The document discusses ultrasonic metal welding systems and their applications in solar panel assembly. It describes universal welding systems for solar panel assembly, seam welding of solar collectors, and welding of components like thermal fins and absorbers. The systems can weld materials like aluminum, copper and gold. The document also discusses the welding of substrates, coatings, and busbars for photovoltaic applications. It provides information on the physical and mechanical properties of ultrasonic welds. The final pages cover the software, control systems, and advantages of ultrasonic metal welding.
Non traditional
Nontraditional machining processes like waterjet machining (WJM) and abrasive waterjet machining (AWJM) use mechanical energy from water and abrasives for material removal. WJM is used for softer materials while AWJM can machine harder materials. AWJM has advantages over traditional machining like fast setup, low heat generation, and ability to machine complex shapes. Parameters like orifice size, water pressure, abrasive type and flow rate, and traverse speed need to be optimized for effective AWJM.
Laser micromachining seminar ppt
laser micromachining seminar ppt including application advantage electron microscope imaze ,haet affected zone,safety.
Micron range complex structure in micro electrochemical machining- a review
This document provides a review of electrochemical micro-machining (EMM) including 16 studies that investigated various parameters of the EMM process. The studies examined parameters like voltage, electrolyte concentration, tool size, pulse characteristics, and more. The key outputs measured included material removal rate, overcut, surface roughness, hole diameter and depth ratios. EMM is able to machine complex shapes with high accuracy and surface finish without thermal or mechanical stresses.
More Related Content
What's hot
Micro-drilling Using Step-forward Method
1. The document discusses micro-drilling using a step-forward feeding method to address issues with conventional micro-drilling such as tool breakage.
2. An experiment was conducted using different micro-drill diameters and step numbers to drill holes in steel workpieces with and without cutting oil.
3. The results showed that using step-forward feeding and cutting oil reduced cutting forces, burr formation, and tool damage compared to conventional micro-drilling without cutting oil.
Micro-Electromechanical Systems (Mems)
Micro-electro-mechanical systems (MEMS) have been identified as one of the most promising technologies and will continue to revolutionize the industry as well as the industrial and consumer products by combining silicon-based microelectronics with micro-machining technology. All the spheres of industrial application including robots conception and development will be impacted by this new technology. If semiconductor microfabrication was contemplated to be the first micro-manufacturing revolution, MEMS is the second revolution. The paper reflects the results of a study about the state of the art of this technology and its future influence in the development of the construction industry. The interdisciplinary nature of MEMS utilizes design, engineering and manufacturing expertise from a wide and diverse range of technical areas including integrated circuit fabrication technology, mechanical engineering, materials science, electrical engineering, chemistry and chemical engineering, as well as fluid engineering, optics, instrumentation and packaging.
Lecture 03 overview of micro fabrication
The document discusses silicon crystal growth from melt using the Czochralski technique. It explains that high purity electronic grade silicon is used as the raw material. In the Czochralski process, silicon is melted in a crucible and a seed crystal is dipped into the melt and slowly extracted, allowing a single crystal ingot to form. The crystal is then sliced into wafers, which are used to produce microchips and other silicon devices. Key steps include purifying metallurgical grade silicon, controlling the furnace atmosphere, and precisely controlling the pull rate and crystal orientation.
INTRODUCTION (2)
This document provides an overview of machining and non-traditional machining processes. It discusses various traditional machining techniques like turning, milling, and grinding. It then introduces non-traditional machining processes like electrical discharge machining (EDM), laser beam machining, ultrasonic machining, and abrasive jet machining. These alternative processes allow machining of advanced materials, complex shapes, and micro-scale components. The document categorizes non-traditional machining into mechanical, electrical, chemical, electrochemical, and thermal processes and provides examples and applications of each.
Unit 1 introduction
This document provides an overview of unconventional machining processes (UCM). It discusses the need for UCM due to limitations of conventional machining. UCM is classified based on the energy used and mechanism. Examples of processes include mechanical (AWJM, USM), electrical (EDM, WEDM), chemical/electrochemical (ECM, ECG), and thermal (LBM, PAM, EBM). Selection of a UCM process depends on the workpiece parameters, shape, capability, and economic considerations. The document provides details on the working principles, equipment, parameters, finishes, and applications of different UCM processes.
Stapla tube sealer presentation
This document discusses ultrasonic metal welding provided by Stapla Ultrasonics and Schunk Sonosystems. It provides an overview of the companies and their locations, services, and products related to ultrasonic welding. Specific applications of tube sealing and the advantages of ultrasonic welding are highlighted, such as low heat, requiring minimal training, and providing a pure metallurgical bond.
NCMF
This document discusses conventional and non-conventional machining methods. It begins by defining conventional machining as using a sharp cutting tool for removal of metal. Non-conventional machining does not require physical contact between tool and workpiece and instead uses tools like laser beams or water jets. The document then covers several non-conventional machining processes in more detail like ultrasonic machining, abrasive jet machining, and water jet machining. It concludes by comparing characteristics of conventional and non-conventional machining.
Micro electro mechanical system (MEMS)
What is MEMS?
Micro electro mechanical system is a technique of combining electrical and mechanical combinations together on a chip, to produce a system of miniature dimensions.
MEMS is a integration of a number micro components on a single chip which allow the microsystem to both sense and control the environment.
The components are integrated on a single chip using micro fabrication technologies.
Micro Electro Mechanical System
This document summarizes the process of microelectromechanical systems (MEMS). It discusses that MEMS involve integrating mechanical and electrical components on a chip using microfabrication techniques. The fabrication process involves deposition, patterning through lithography, and etching. Common materials used include metals, polymers, ceramics and semiconductors. MEMS have applications in medical devices, automobiles, sensors, and more. They provide benefits of small size, low power consumption and cost advantages, but complex design and high initial costs.
Materials for MEMS
This document discusses materials used for MEMS and microsystems, including substrates, active materials, and packaging materials. Common substrate materials include silicon, quartz, and various polymers. Silicon is discussed in detail due to its ideal properties as a substrate. Other materials covered include silicon compounds, piezoelectric crystals, and conductive polymers. The document concludes with a brief overview of packaging materials and methods.
Piezoelectric Sensor as Smart Material in structural Health Monitoring
Piezoelectric sensors are smart materials that can be used in concrete structures for structural health monitoring. They possess both sensor and actuator characteristics. When mechanical stress is applied, piezoelectric materials generate an electrical potential. They were discovered in 1880 and common forms include quartz, lithium niobate, and lead zirconate titanate. Piezoelectric sensors can be installed in concrete either by bonding to surfaces or embedding during construction. In structures, they play key roles in determining damage location and severity to predict remaining service life. Benefits include enabling autonomous monitoring while limitations include small sensing areas and complex data processing. Future applications include post-earthquake damage detection in various infrastructure.
Ntmp2015 1
This document provides an introduction to nontraditional manufacturing processes (NTMPs). It discusses how NTMPs were developed as efficient alternatives to conventional machining to address its limitations for new materials and complex part geometries. The document outlines various NTMP categories including thermal, mechanical, electrochemical, and kinetic processes. It provides examples of applications for different NTMPs and highlights attributes like increased productivity, versatility, and reduced part rejection. The course objectives are defined as developing understanding of NTMP theories, characteristics, process variables, capabilities and limitations.
Unconventional machining process
This document provides an overview of unconventional machining processes. It begins by defining conventional machining and its limitations in machining complex geometries and hard materials. Unconventional machining uses indirect energy sources like sparks, heat, or chemicals instead of direct tool contact. The document then discusses various unconventional processes like EDM, laser beam machining, water jet machining, and their characteristics. It classifies unconventional processes and provides details on electrochemical machining, electrochemical grinding, and ultrasonic machining. In closing, it acknowledges the development of these nontraditional techniques for precision manufacturing applications.
Mems
Micro-electro-mechanical systems (MEMS) combine mechanical and electrical components at the microscale using microfabrication techniques. MEMS are fabricated using processes such as chemical and physical vapor deposition, photolithography, and wet or dry etching to create 3D mechanical structures. Common MEMS materials include metals, polymers, ceramics and semiconductors. MEMS have a wide variety of applications including in automotive, medical, military and consumer electronics as sensors, actuators and microsystems such as accelerometers and gyroscopes. Advantages of MEMS include miniaturization, improved accuracy and reliability while disadvantages include high initial costs and complex design processes.
Introduction to mems
MEMS (Microelectromechanical systems) are tiny integrated devices that combine electrical and mechanical components fabricated using IC processing techniques. They can sense, control, and actuate processes on the microscale and generate macroscale effects. Key enabling technologies include photolithography, etching, and deposition which allow creation of mechanical and electromechanical structures from materials like silicon, polymers, and metals. MEMS have diverse applications in areas like automotive, medical, communications, and more. They represent a new paradigm for miniaturized mechanical devices with great potential to impact many aspects of life.
Substrate / wafers and Basic concepts Of Mems & microsystems
Substrate/Wafers
Substrate/wafer Material
Silicon as substrate
Miller Indices
mechanical properties of silicon
Silicon compounds
MEMS Packaging
This document discusses MEMS packaging at different levels. It describes microelectronic packaging as providing mechanical support, electrical connections and protection from environmental threats for integrated circuits. There are 5 levels of microelectronic packaging from the silicon chip to larger systems. MEMS and microsystem packaging aims to protect delicate core elements from mechanical or environmental damage during operation. Proper packaging design considers costs, environmental effects, reliability and achieving minimum electrical connections to prevent failures.
Mems
MEMS are tiny integrated devices that combine mechanical and electrical components on a micro scale. They are able to sense, control and actuate on a micro scale but generate effects on a macro scale. MEMS utilize various fields including design, engineering, materials science and electrical engineering. Current MEMS devices include sensors in airbags, inkjet printer heads, and blood pressure sensors. MEMS are fabricated using deposition, patterning, and etching processes and are used in applications such as automotive, medical, military, and consumer electronics.
Stapla solar panel assembly
The document discusses ultrasonic metal welding systems and their applications in solar panel assembly. It describes universal welding systems for solar panel assembly, seam welding of solar collectors, and welding of components like thermal fins and absorbers. The systems can weld materials like aluminum, copper and gold. The document also discusses the welding of substrates, coatings, and busbars for photovoltaic applications. It provides information on the physical and mechanical properties of ultrasonic welds. The final pages cover the software, control systems, and advantages of ultrasonic metal welding.
Non traditional
Nontraditional machining processes like waterjet machining (WJM) and abrasive waterjet machining (AWJM) use mechanical energy from water and abrasives for material removal. WJM is used for softer materials while AWJM can machine harder materials. AWJM has advantages over traditional machining like fast setup, low heat generation, and ability to machine complex shapes. Parameters like orifice size, water pressure, abrasive type and flow rate, and traverse speed need to be optimized for effective AWJM.
What's hot (20)
Piezoelectric Sensor as Smart Material in structural Health Monitoring
Piezoelectric Sensor as Smart Material in structural Health Monitoring
Substrate / wafers and Basic concepts Of Mems & microsystems
Substrate / wafers and Basic concepts Of Mems & microsystems
Similar to Edm micromaching [autosaved]
Laser micromachining seminar ppt
laser micromachining seminar ppt including application advantage electron microscope imaze ,haet affected zone,safety.
Micron range complex structure in micro electrochemical machining- a review
This document provides a review of electrochemical micro-machining (EMM) including 16 studies that investigated various parameters of the EMM process. The studies examined parameters like voltage, electrolyte concentration, tool size, pulse characteristics, and more. The key outputs measured included material removal rate, overcut, surface roughness, hole diameter and depth ratios. EMM is able to machine complex shapes with high accuracy and surface finish without thermal or mechanical stresses.
Micron range complex structure in micro electrochemical machining- a review
Abstract
The major problem in the micro-manufacturing is concerned with achieving the good dimensional accurate products with the better surface finish, high MRR, no tool wear, absence of stress and no heat-affected zone. Micro-machining proved itself as a promising solution of this major problem. In recent days, industries are regularly looking for fabricating the micro-components which can be able to perform their complex functions in the sensitive areas of electronics, automotive, biomedical and optics. Now a day for miniature components micro-machining plays a very important role, its techniques are excellent to machine any complex shapes with good accuracy and bright surface finish. Material with any value of the hardness can be machined easily with all the offered advantages of micro-machining in the electrochemical micro-machining process (EMM). In this article; review of different methodologies and effect of machining parameters were studied along with different electrolytes; which plays a significant role in electro chemical micro-machining. The objective of this study is to know about the optimum micro-machining parameters for the EMM process and it is also much important to find out the research gap through the different studies. In this study, it has been found out MRR and overcut are depends upon the voltage, electrolyte concentration, IEG, pulse ON/OFF time, pulse duration, pulse frequency, RPM of the tool and flow rate of electrolyte. The proper selections of parameters in EMM are essentials for achieving the overall improvement in the micro-machining operation.
Keywords: Micro-Manufacturing, Micro-Machining, Electrochemical Machining (ECM), Electrochemical Micro-Machining (EMM).
Mems introduction
MEMS (micro-electro-mechanical systems) are microscopic devices and integrated systems that combine electrical and mechanical components between 1-100 micrometers in size. They integrate sensors, actuators and electronics on a common silicon substrate through microfabrication technology. MEMS originated in the 1980s and are now used in automotive, biomedical, industrial and consumer applications. Some key advantages of MEMS include lower manufacturing costs, reduced size, and lower power consumption compared to macro-scale devices. Challenges include developing robust packaging and manufacturing processes for commercialization.
Edm
The document discusses non-conventional machining processes, specifically electric discharge machining (EDM). EDM uses electric sparks to thermally remove metal from a workpiece without contact between the tool and workpiece. There are several types of EDM including ram EDM, wire EDM, and small hole EDM. EDM can machine hard materials, achieve high accuracy and surface finish, and is widely used for dies, aerospace parts, and medical devices. While offering advantages over traditional machining, EDM also has limitations such as low material removal rates and electrode wear.
IRJET- The Process of Edm Cutting Parameters Optimizing by using Taguchi Meth...
The document discusses optimizing the parameters for wire electrical discharge machining (EDM) of Inconel 718 using the Taguchi method and analysis of variance (ANOVA). It aims to determine the optimal settings for wire feed rate, pulse on time, pulse off time, peak current, and servo voltage to maximize material removal rate, minimize kerf width and surface roughness. Experiments were conducted using two different wire materials - half hard brass wire and zinc-coated brass wire. The results showed that zinc-coated brass wire achieved a higher material removal rate and better surface finish compared to half hard brass wire. However, half hard brass wire produced a smaller kerf width. ANOVA was used to analyze the experimental data and determine the
ADVANCEMENT IN ULTRASONIC VIBRATION AND MAGNETIC FIELD ASSISTED MICROEDM PROC...
Micro-machining of components has been emerged as a peak demand in the world
of micro-manufacturing. Micro-EDM is proved to be the most suitable for micro
drilling purposes. It is very essential to fabricate micro holes as well as features with
very high dimensional accuracy and precision. The major drawbacks in micro-EDM
processes are the low metal removal, tool wear and surface roughness. Researchers
have carried out several investigations to compensate the various machining problems
in the micro-EDM process. So, there evolves a need for development of more
sophisticated machining features in micro-EDM process combining with additional
techniques. This paper presents a brief review on the latest advancement in ultrasonic
vibration and magnetic field assisted techniques to improve machining efficiency and
surface qualities of machined features in micro-EDM process. Latest industrial
applications of micro-EDM have been presented
ADVANCEMENT IN ULTRASONIC VIBRATION AND MAGNETIC FIELD ASSISTED MICROEDM PROC...
Micro-machining of components has been emerged as a peak demand in the world
of micro-manufacturing. Micro-EDM is proved to be the most suitable for micro
drilling purposes. It is very essential to fabricate micro holes as well as features with
very high dimensional accuracy and precision. The major drawbacks in micro-EDM
processes are the low metal removal, tool wear and surface roughness. Researchers
have carried out several investigations to compensate the various machining problems
in the micro-EDM process. So, there evolves a need for development of more
sophisticated machining features in micro-EDM process combining with additional
techniques. This paper presents a brief review on the latest advancement in ultrasonic
vibration and magnetic field assisted techniques to improve machining efficiency and
surface qualities of machined features in micro-EDM process. Latest industrial
applications of micro-EDM have been presented.
C0313015019
The document summarizes research on the micro-EDM process parameters for machining nickel-titanium shape memory alloys. It discusses how the micro-EDM process works based on electrical discharges that vaporize material in a small gap between the electrode and workpiece. The research investigated the effects of capacitance, discharge voltage, and electrode material on the material removal rate and tool wear rate during micro-EDM of nickel-titanium alloys. It found that material removal rate increased with higher capacitance and discharge voltage, and was better with a brass electrode than tungsten. Tool wear rate also increased with higher capacitance and voltage but was lower at lower energy levels and with a tungsten electrode.
IRJET- Investigation of Wire EDM Process Parameters for Machining of Mild...
This document discusses an investigation of wire electrical discharge machining (WEDM) process parameters for machining mild steel specimens using Taguchi methods. The parameters investigated are pulse-on time, pulse-off time, peak current, and servo voltage. The responses measured are cutting rate, surface roughness, dimensional deviation, and wire wear ratio. Experiments will be conducted on a WEDM machine to determine the optimal process parameters that maximize cutting rate while minimizing surface roughness, dimensional deviation, and wire wear.
Mems unit 1 ppt
This document provides an introduction to microelectromechanical systems (MEMS). It defines MEMS as systems that combine electrical and mechanical components on the micrometer scale to sense and control the physical world. MEMS components include microsensors to detect environmental changes, an intelligent component to make decisions based on sensor input, and microactuators to change the environment based on the decisions. Common MEMS applications include accelerometers, inkjet printer heads, medical devices, and sensors in automobiles. The document discusses fabrication techniques like deposition, patterning, and etching used to create MEMS, as well as their advantages like low cost, small size, and high functionality.
Micro mach
This document discusses recent trends in non-conventional micromachining techniques. It describes several methods such as electrochemical micro-machining (EMM), micro-electrodischarge machining (MEDM), laser micro-machining (LMM), ultrasonic micro-machining (USM), and chemical micro-machining (CMM). For each method, it explains the basic principles, micro-machining processes, applications for micro components, and potential for future development at the nanoscale. The document also explores emerging nanomachining techniques using tools like atomic force microscopes and various top-down and bottom-up fabrication processes.
A Comparative Study to Maximize MRR in Electro Discharge Machining Process by...
This document describes a study that uses Taguchi analysis to determine the optimal machining parameters for maximizing material removal rate (MRR) in electro discharge machining (EDM) processes. Experiments were conducted using copper and graphite electrodes on mild steel and aluminum workpieces. The parameters varied were electrode speed, current, and depth of cut. Regression analysis was used to develop a polynomial equation relating MRR to the machining parameters. The experiments followed a Taguchi L9 orthogonal array design with three levels of each parameter. Observations of machining time and calculated MRR were recorded for each experimental run.
J503035966
This document summarizes a study that uses Taguchi analysis to determine the optimal settings of control parameters (electrode speed, current, depth of cut) for maximizing material removal rate (MRR) in electro discharge machining (EDM) using different electrode and workpiece materials. Experiments were conducted using copper and graphite electrodes on mild steel and aluminum workpieces at various parameter levels. Material removal rate was calculated and analyzed using regression to determine the relationship between control parameters and MRR. The goal was to predict the maximum MRR and best parameter combination.
Mems brahma
Micro-electro-mechanical systems (MEMS) are miniature devices that combine electrical and mechanical components. MEMS components range in size from 1-100 micrometers and are fabricated using microfabrication techniques. MEMS devices can sense and control the physical world on small scales and have applications in areas like sensors, actuators, and biomedical devices. The document discusses MEMS fabrication techniques including deposition, patterning, etching, and packaging and provides examples of common MEMS devices and applications. Challenges to the future development of MEMS include access to foundries, design and simulation tools, packaging and testing standards, and education.
Mems unit 1-lec_1
Micro-electro-mechanical systems (MEMS) are miniature devices that combine electrical and mechanical components. MEMS components range in size from 1-100 micrometers and are fabricated using microfabrication techniques. MEMS devices can sense and control the physical world on small scales and have applications in areas like sensors, actuators, and biomedical devices. The document discusses MEMS fabrication techniques including deposition, patterning, etching, and packaging and provides examples of common MEMS devices and applications.
Micro machining and classification, and Electro chemical micro machining Elec...
A detail description of Micro machining, its classification
Electro chemical micro machining
Electric Discharge Micro machining
micro turning
their resource and application
By Muhammad Mustafa memon
BE Qucest larkana
ME MUET jamshoro
UNCONVENTIONAL MACHINING PROCESS
This document provides an introduction to electrical discharge machining (EDM). EDM is an unconventional machining process where material is removed by electric sparks between an electrode tool and conductive workpiece, with no direct contact between them. Key aspects of EDM covered include the construction of EDM machines, the role of dielectric fluids, factors that affect the material removal rate such as capacitance and spark parameters, and electrode tool materials and wear characteristics. Graphite, copper, and copper-tungsten are commonly used as tool materials in EDM due to properties like machinability and erosion resistance.
UNIT 5 RECENT TRENDS IN NON-TRADITIONAL MACHINING PROCESSES.pptx
Recent developments in non-traditional machining processes, their working principles, equipments, effect of process parameters, applications, advantages and limitations. Comparison of non-traditional machining processes.
Similar to Edm micromaching [autosaved] (20)
Micron range complex structure in micro electrochemical machining- a review
Micron range complex structure in micro electrochemical machining- a review
Micron range complex structure in micro electrochemical machining- a review
Micron range complex structure in micro electrochemical machining- a review
IRJET- The Process of Edm Cutting Parameters Optimizing by using Taguchi Meth...
IRJET- The Process of Edm Cutting Parameters Optimizing by using Taguchi Meth...
ADVANCEMENT IN ULTRASONIC VIBRATION AND MAGNETIC FIELD ASSISTED MICROEDM PROC...
ADVANCEMENT IN ULTRASONIC VIBRATION AND MAGNETIC FIELD ASSISTED MICROEDM PROC...
ADVANCEMENT IN ULTRASONIC VIBRATION AND MAGNETIC FIELD ASSISTED MICROEDM PROC...
ADVANCEMENT IN ULTRASONIC VIBRATION AND MAGNETIC FIELD ASSISTED MICROEDM PROC...
IRJET- Investigation of Wire EDM Process Parameters for Machining of Mild...
IRJET- Investigation of Wire EDM Process Parameters for Machining of Mild...
A Comparative Study to Maximize MRR in Electro Discharge Machining Process by...
A Comparative Study to Maximize MRR in Electro Discharge Machining Process by...
Micro machining and classification, and Electro chemical micro machining Elec...
Micro machining and classification, and Electro chemical micro machining Elec...
UNIT 5 RECENT TRENDS IN NON-TRADITIONAL MACHINING PROCESSES.pptx
UNIT 5 RECENT TRENDS IN NON-TRADITIONAL MACHINING PROCESSES.pptx
Recently uploaded
New techniques for characterising damage in rock slopes.pdf
rock mass characterization and New techniques for characterising damage in rock slopes
Comparative analysis between traditional aquaponics and reconstructed aquapon...
The aquaponic system of planting is a method that does not require soil usage. It is a method that only needs water, fish, lava rocks (a substitute for soil), and plants. Aquaponic systems are sustainable and environmentally friendly. Its use not only helps to plant in small spaces but also helps reduce artificial chemical use and minimizes excess water use, as aquaponics consumes 90% less water than soil-based gardening. The study applied a descriptive and experimental design to assess and compare conventional and reconstructed aquaponic methods for reproducing tomatoes. The researchers created an observation checklist to determine the significant factors of the study. The study aims to determine the significant difference between traditional aquaponics and reconstructed aquaponics systems propagating tomatoes in terms of height, weight, girth, and number of fruits. The reconstructed aquaponics system’s higher growth yield results in a much more nourished crop than the traditional aquaponics system. It is superior in its number of fruits, height, weight, and girth measurement. Moreover, the reconstructed aquaponics system is proven to eliminate all the hindrances present in the traditional aquaponics system, which are overcrowding of fish, algae growth, pest problems, contaminated water, and dead fish.
Unit-III-ELECTROCHEMICAL STORAGE DEVICES.ppt
Batteries -Introduction – Types of Batteries – discharging and charging of battery - characteristics of battery –battery rating- various tests on battery- – Primary battery: silver button cell- Secondary battery :Ni-Cd battery-modern battery: lithium ion battery-maintenance of batteries-choices of batteries for electric vehicle applications.
Fuel Cells: Introduction- importance and classification of fuel cells - description, principle, components, applications of fuel cells: H2-O2 fuel cell, alkaline fuel cell, molten carbonate fuel cell and direct methanol fuel cells.
2008 BUILDING CONSTRUCTION Illustrated - Ching Chapter 02 The Building.pdf
2008 BUILDING CONSTRUCTION Illustrated - Ching Chapter 02 The Building
IEEE Aerospace and Electronic Systems Society as a Graduate Student Member
IEEE Aerospace and Electronic Systems Society as a Graduate Student Member
The Python for beginners. This is an advance computer language.
Python language is very important language at this time. we can easily understand this language by these notes.
A SYSTEMATIC RISK ASSESSMENT APPROACH FOR SECURING THE SMART IRRIGATION SYSTEMS
The smart irrigation system represents an innovative approach to optimize water usage in agricultural and landscaping practices. The integration of cutting-edge technologies, including sensors, actuators, and data analysis, empowers this system to provide accurate monitoring and control of irrigation processes by leveraging real-time environmental conditions. The main objective of a smart irrigation system is to optimize water efficiency, minimize expenses, and foster the adoption of sustainable water management methods. This paper conducts a systematic risk assessment by exploring the key components/assets and their functionalities in the smart irrigation system. The crucial role of sensors in gathering data on soil moisture, weather patterns, and plant well-being is emphasized in this system. These sensors enable intelligent decision-making in irrigation scheduling and water distribution, leading to enhanced water efficiency and sustainable water management practices. Actuators enable automated control of irrigation devices, ensuring precise and targeted water delivery to plants. Additionally, the paper addresses the potential threat and vulnerabilities associated with smart irrigation systems. It discusses limitations of the system, such as power constraints and computational capabilities, and calculates the potential security risks. The paper suggests possible risk treatment methods for effective secure system operation. In conclusion, the paper emphasizes the significant benefits of implementing smart irrigation systems, including improved water conservation, increased crop yield, and reduced environmental impact. Additionally, based on the security analysis conducted, the paper recommends the implementation of countermeasures and security approaches to address vulnerabilities and ensure the integrity and reliability of the system. By incorporating these measures, smart irrigation technology can revolutionize water management practices in agriculture, promoting sustainability, resource efficiency, and safeguarding against potential security threats.
22CYT12-Unit-V-E Waste and its Management.ppt
Introduction- e - waste – definition - sources of e-waste– hazardous substances in e-waste - effects of e-waste on environment and human health- need for e-waste management– e-waste handling rules - waste minimization techniques for managing e-waste – recycling of e-waste - disposal treatment methods of e- waste – mechanism of extraction of precious metal from leaching solution-global Scenario of E-waste – E-waste in India- case studies.
DEEP LEARNING FOR SMART GRID INTRUSION DETECTION: A HYBRID CNN-LSTM-BASED MODEL
As digital technology becomes more deeply embedded in power systems, protecting the communication
networks of Smart Grids (SG) has emerged as a critical concern. Distributed Network Protocol 3 (DNP3)
represents a multi-tiered application layer protocol extensively utilized in Supervisory Control and Data
Acquisition (SCADA)-based smart grids to facilitate real-time data gathering and control functionalities.
Robust Intrusion Detection Systems (IDS) are necessary for early threat detection and mitigation because
of the interconnection of these networks, which makes them vulnerable to a variety of cyberattacks. To
solve this issue, this paper develops a hybrid Deep Learning (DL) model specifically designed for intrusion
detection in smart grids. The proposed approach is a combination of the Convolutional Neural Network
(CNN) and the Long-Short-Term Memory algorithms (LSTM). We employed a recent intrusion detection
dataset (DNP3), which focuses on unauthorized commands and Denial of Service (DoS) cyberattacks, to
train and test our model. The results of our experiments show that our CNN-LSTM method is much better
at finding smart grid intrusions than other deep learning algorithms used for classification. In addition,
our proposed approach improves accuracy, precision, recall, and F1 score, achieving a high detection
accuracy rate of 99.50%.
Recycled Concrete Aggregate in Construction Part II
Using recycled concrete aggregates (RCA) for pavements is crucial to achieving sustainability. Implementing RCA for new pavement can minimize carbon footprint, conserve natural resources, reduce harmful emissions, and lower life cycle costs. Compared to natural aggregate (NA), RCA pavement has fewer comprehensive studies and sustainability assessments.
Casting-Defect-inSlab continuous casting.pdf
Casting-Defect-inSlab continuous casting. Casting-Defect-inSlab continuous casting. Casting-Defect-inSlab continuous casting. Casting-Defect-inSlab continuous casting. Casting-Defect-inSlab continuous casting. Casting-Defect-inSlab continuous casting. Casting-Defect-inSlab continuous casting. Casting-Defect-inSlab continuous casting
Literature Review Basics and Understanding Reference Management.pptx
Three-day training on academic research focuses on analytical tools at United Technical College, supported by the University Grant Commission, Nepal. 24-26 May 2024
ACEP Magazine edition 4th launched on 05.06.2024
This document provides information about the third edition of the magazine "Sthapatya" published by the Association of Civil Engineers (Practicing) Aurangabad. It includes messages from current and past presidents of ACEP, memories and photos from past ACEP events, information on life time achievement awards given by ACEP, and a technical article on concrete maintenance, repairs and strengthening. The document highlights activities of ACEP and provides a technical educational article for members.
Understanding Inductive Bias in Machine Learning
This presentation explores the concept of inductive bias in machine learning. It explains how algorithms come with built-in assumptions and preferences that guide the learning process. You'll learn about the different types of inductive bias and how they can impact the performance and generalizability of machine learning models.
The presentation also covers the positive and negative aspects of inductive bias, along with strategies for mitigating potential drawbacks. We'll explore examples of how bias manifests in algorithms like neural networks and decision trees.
By understanding inductive bias, you can gain valuable insights into how machine learning models work and make informed decisions when building and deploying them.
哪里办理(csu毕业证书)查尔斯特大学毕业证硕士学历原版一模一样
原版一模一样【微信：741003700 】【(csu毕业证书)查尔斯特大学毕业证硕士学历】【微信：741003700 】学位证，留信认证（真实可查，永久存档）offer、雅思、外壳等材料/诚信可靠,可直接看成品样本，帮您解决无法毕业带来的各种难题！外壳，原版制作，诚信可靠，可直接看成品样本。行业标杆！精益求精，诚心合作，真诚制作！多年品质 ,按需精细制作，24小时接单,全套进口原装设备。十五年致力于帮助留学生解决难题，包您满意。
本公司拥有海外各大学样板无数，能完美还原海外各大学 Bachelor Diploma degree, Master Degree Diploma
1:1完美还原海外各大学毕业材料上的工艺：水印，阴影底纹，钢印LOGO烫金烫银，LOGO烫金烫银复合重叠。文字图案浮雕、激光镭射、紫外荧光、温感、复印防伪等防伪工艺。材料咨询办理、认证咨询办理请加学历顾问Q/微741003700
留信网认证的作用:
1:该专业认证可证明留学生真实身份
2:同时对留学生所学专业登记给予评定
3:国家专业人才认证中心颁发入库证书
4:这个认证书并且可以归档倒地方
5:凡事获得留信网入网的信息将会逐步更新到个人身份内，将在公安局网内查询个人身份证信息后，同步读取人才网入库信息
6:个人职称评审加20分
7:个人信誉贷款加10分
8:在国家人才网主办的国家网络招聘大会中纳入资料，供国家高端企业选择人才
Recently uploaded (20)
New techniques for characterising damage in rock slopes.pdf
New techniques for characterising damage in rock slopes.pdf
Comparative analysis between traditional aquaponics and reconstructed aquapon...
Comparative analysis between traditional aquaponics and reconstructed aquapon...
2008 BUILDING CONSTRUCTION Illustrated - Ching Chapter 02 The Building.pdf
2008 BUILDING CONSTRUCTION Illustrated - Ching Chapter 02 The Building.pdf
IEEE Aerospace and Electronic Systems Society as a Graduate Student Member
IEEE Aerospace and Electronic Systems Society as a Graduate Student Member
The Python for beginners. This is an advance computer language.
The Python for beginners. This is an advance computer language.
A SYSTEMATIC RISK ASSESSMENT APPROACH FOR SECURING THE SMART IRRIGATION SYSTEMS
A SYSTEMATIC RISK ASSESSMENT APPROACH FOR SECURING THE SMART IRRIGATION SYSTEMS
DEEP LEARNING FOR SMART GRID INTRUSION DETECTION: A HYBRID CNN-LSTM-BASED MODEL
DEEP LEARNING FOR SMART GRID INTRUSION DETECTION: A HYBRID CNN-LSTM-BASED MODEL
Recycled Concrete Aggregate in Construction Part II
Recycled Concrete Aggregate in Construction Part II
Engineering Drawings Lecture Detail Drawings 2014.pdf
Engineering Drawings Lecture Detail Drawings 2014.pdf
Manufacturing Process of molasses based distillery ppt.pptx
Manufacturing Process of molasses based distillery ppt.pptx
Literature Review Basics and Understanding Reference Management.pptx
Literature Review Basics and Understanding Reference Management.pptx
Edm micromaching [autosaved]
- 1. EDM Micro Machining SUBMITTED BY Name- Jagabandhu Sahoo Branch – Manufacturing Engineering
- 2. MINIATURIZATION • Process of making smaller • Until recently watch parts were considered to be the micro components produced for the purpose of making watches. • Recent demands for micro parts in different fields from entertainment electronics to biomedical implants • In the medical field, diagnosis and surgery without pain is possible through miniaturization of medical tools • Micro parts may have overall size of few millimeters but it has many features that falls in micro range from 1 µm to 500 µm • With the trend toward miniaturization, micromachining becomes increasingly important in fabricating micro parts.
- 3. History of microEDM IN 1986 Kurafuji and Masuzawa demonstrated the first application of micro-EDM by drilling a minute hole in 50-µm- thick carbide plate.
- 6. Componets
- 7. Pulse generator Static pulse generator R-C pulse generator
- 8. Convectional Edm vs Micro Edm
- 9. Operating parameter • Gap voltage • Peak current • Pulse on time (Ton) • Pulse off time (Toff)
- 10. Process Parameter Effect of voltage on a) MRR, b) WR, c) spark gap, d) taper, e) circularity of the micro-holes
- 13. Performance Parameter • Spark gap • Material removal rate • Surface quality • Tool wear ratio
- 14. Advantages • Can cut metal ,ceramics ,semiconductor (silicon) • low installation cost • ideal for prototypes or small batches of products with a high added value. • easily machine complex (even 3D) micro-shapes • Shapes that are difficult for etching are relatively easy for micro- EDM. • machine any conductive material irrespective of their mechanical hardness • High-aspect-ratio machining
- 15. Disadvantages • Low metal removal • Heat affected zone • High electrode wear rate
- 16. Applications • Automotive Nozzles • Spinnerets • Micro-molds • Fiber-optics and Optics • Aerospace • Surgical needle • In fabrication of micro tool
- 17. Applications Medical products 1.Surgical needles 2.Implants 3.Surgical precise and fine instruments Intra-ocular lenses Dental Implants
- 19. Conclusion The capability of machining intricate micro-features with sub- micron-level dimensional accuracy in difficult-to-cut material has made the micro-EDM process an inevitable and one of the most popular non-conventional micro-machining processes.
- 20. References 1. Ho KH, Newman ST (2003) State of the art electrical discharge machining (EDM). Int J Mach Tools Manuf 43:1287–1300 2. Ho KH, Newman ST, Rahimifard S, Allen RD (2004) State of the art wire electrical Discharge machining. Int J Mach Tools Manuf 44:1247–1259 3. Arbizu ID, Pérez CJL (2013) History and foundations of EDM: the least conventional of the machining http://www.interempresas.net/MetalWorking/Articles/12068-The-leasT- conventional of- the-machining.html 4. Kurafuji H, Masuzawa T (1968) Micro-EDM of cemented carbide alloys. Jpn Soc ElectrMach Eng 2(3):1–16
- 21. THANK YOU