The document presents research on estimating temperature distribution in silicon during micro laser assisted machining. Experiments were conducted using a diamond tipped tool attached to an infrared laser to preferentially heat and soften silicon. Thermal imaging showed the temperature increased through stages as the high pressure phase of silicon transformed. Analytical and finite element models were developed to estimate the temperature profile using properties of silicon phases. The models predicted temperature increases of 778°C and 468°C that agreed with experimental results. Future work could investigate other laser wavelengths and machining processes.
Choice of laser sources for micromachining applicationsJK Lasers
Fiber lasers offer several advantages over traditional lamp-pumped Nd:YAG lasers for micromachining applications. Fiber lasers provide diffraction-limited beam quality, high power densities up to 108 W/cm2, enhanced processing speeds, and reduced heat-affected zones. Experimental results showed that single-mode fiber lasers produced the best cutting and drilling results compared to pulsed Nd:YAG lasers. Applications like cutting stents and silicon wafers for solar cells benefit from the fiber laser's high beam quality, stability, and ability to produce small kerf widths and smooth cut edges.
Micromachining is used to create micrometer-scale parts and devices. It is derived from traditional machining processes but operates on a smaller scale using less force. There are several micromachining processes including micro milling, laser ablation, etching, and lithography that use mechanical forces, lasers, or chemical reactions to shape materials like ceramics, metals, polymers, and silicon. Micromachining is used to fabricate components for microelectromechanical systems, integrated circuits, medical devices, and more.
This document discusses laser micromachining, including its working principle, types, applications, advantages, disadvantages, and safety considerations. Laser micromachining uses focused laser beams to cut, drill, or modify small features less than 1 mm in size. It has applications in manufacturing integrated chips and microelectromechanical systems. The technique offers advantages like contactless machining, flexibility, and precision, but high equipment costs and safety hazards from high intensity light.
Measurement techniques in micro machining PDF by badebhau4@gmail.comEr. Bade Bhausaheb
This document discusses various measurement techniques used in micro machining. It begins by explaining the need for developing new measurement techniques capable of accurately measuring micro-scale features between 0.1 to 100 μm. It then categorizes measuring systems as either dimensional or topographic and describes examples in each category. Key techniques discussed include optical microscopes, electron microscopes like SEM, interferometers, profilometers, scanning probe microscopes and laser-based systems. The document provides details on operating principles, applications, accuracy and resolution limits of these micro-measurement techniques.
Micro-drilling Using Step-forward MethodWaqas Ahmed
1. The document discusses micro-drilling using a step-forward feeding method to address issues with conventional micro-drilling such as tool breakage.
2. An experiment was conducted using different micro-drill diameters and step numbers to drill holes in steel workpieces with and without cutting oil.
3. The results showed that using step-forward feeding and cutting oil reduced cutting forces, burr formation, and tool damage compared to conventional micro-drilling without cutting oil.
This document discusses laser assisted micro machining (LAMM). LAMM uses a laser to locally thermally soften hard materials to enable micro machining with higher material removal rates and less tool wear compared to conventional machining. The document describes the LAMM process parameters, setup used, measurements taken, applications to machining ceramics and grinding, advantages like shorter times and tool life, and areas for further improvement.
MEMS (Micro-Electro-Mechanical Systems) involves integrating mechanical elements, sensors and actuators with electronics on a silicon chip using microfabrication. Silicon micromachining is used to create microscopic mechanical parts and structures through processes like bulk and surface micromachining. Bulk micromachining selectively removes silicon material to create mechanical structures using etching techniques like wet and dry etching.
Micro machining involves removing material at the micro/nano scale to create small features and high precision surfaces. Key techniques include photolithography, which uses light passing through masks to pattern photoresist, and various etching methods like wet, dry, and plasma etching to remove material. Other important microfabrication processes are bulk micromachining, which etches the silicon substrate, surface micromachining which builds structures in layers, and LIGA which uses X-rays to create high aspect ratio metal parts through electroplating. These micro machining techniques enable manufacturing of complex micro-scale parts for applications like MEMS devices and biomedical tools.
Choice of laser sources for micromachining applicationsJK Lasers
Fiber lasers offer several advantages over traditional lamp-pumped Nd:YAG lasers for micromachining applications. Fiber lasers provide diffraction-limited beam quality, high power densities up to 108 W/cm2, enhanced processing speeds, and reduced heat-affected zones. Experimental results showed that single-mode fiber lasers produced the best cutting and drilling results compared to pulsed Nd:YAG lasers. Applications like cutting stents and silicon wafers for solar cells benefit from the fiber laser's high beam quality, stability, and ability to produce small kerf widths and smooth cut edges.
Micromachining is used to create micrometer-scale parts and devices. It is derived from traditional machining processes but operates on a smaller scale using less force. There are several micromachining processes including micro milling, laser ablation, etching, and lithography that use mechanical forces, lasers, or chemical reactions to shape materials like ceramics, metals, polymers, and silicon. Micromachining is used to fabricate components for microelectromechanical systems, integrated circuits, medical devices, and more.
This document discusses laser micromachining, including its working principle, types, applications, advantages, disadvantages, and safety considerations. Laser micromachining uses focused laser beams to cut, drill, or modify small features less than 1 mm in size. It has applications in manufacturing integrated chips and microelectromechanical systems. The technique offers advantages like contactless machining, flexibility, and precision, but high equipment costs and safety hazards from high intensity light.
Measurement techniques in micro machining PDF by badebhau4@gmail.comEr. Bade Bhausaheb
This document discusses various measurement techniques used in micro machining. It begins by explaining the need for developing new measurement techniques capable of accurately measuring micro-scale features between 0.1 to 100 μm. It then categorizes measuring systems as either dimensional or topographic and describes examples in each category. Key techniques discussed include optical microscopes, electron microscopes like SEM, interferometers, profilometers, scanning probe microscopes and laser-based systems. The document provides details on operating principles, applications, accuracy and resolution limits of these micro-measurement techniques.
Micro-drilling Using Step-forward MethodWaqas Ahmed
1. The document discusses micro-drilling using a step-forward feeding method to address issues with conventional micro-drilling such as tool breakage.
2. An experiment was conducted using different micro-drill diameters and step numbers to drill holes in steel workpieces with and without cutting oil.
3. The results showed that using step-forward feeding and cutting oil reduced cutting forces, burr formation, and tool damage compared to conventional micro-drilling without cutting oil.
This document discusses laser assisted micro machining (LAMM). LAMM uses a laser to locally thermally soften hard materials to enable micro machining with higher material removal rates and less tool wear compared to conventional machining. The document describes the LAMM process parameters, setup used, measurements taken, applications to machining ceramics and grinding, advantages like shorter times and tool life, and areas for further improvement.
MEMS (Micro-Electro-Mechanical Systems) involves integrating mechanical elements, sensors and actuators with electronics on a silicon chip using microfabrication. Silicon micromachining is used to create microscopic mechanical parts and structures through processes like bulk and surface micromachining. Bulk micromachining selectively removes silicon material to create mechanical structures using etching techniques like wet and dry etching.
Micro machining involves removing material at the micro/nano scale to create small features and high precision surfaces. Key techniques include photolithography, which uses light passing through masks to pattern photoresist, and various etching methods like wet, dry, and plasma etching to remove material. Other important microfabrication processes are bulk micromachining, which etches the silicon substrate, surface micromachining which builds structures in layers, and LIGA which uses X-rays to create high aspect ratio metal parts through electroplating. These micro machining techniques enable manufacturing of complex micro-scale parts for applications like MEMS devices and biomedical tools.
This document discusses recent trends in non-conventional micromachining techniques. It describes several methods such as electrochemical micro-machining (EMM), micro-electrodischarge machining (MEDM), laser micro-machining (LMM), ultrasonic micro-machining (USM), and chemical micro-machining (CMM). For each method, it explains the basic principles, micro-machining processes, applications for micro components, and potential for future development at the nanoscale. The document also explores emerging nanomachining techniques using tools like atomic force microscopes and various top-down and bottom-up fabrication processes.
1) Micromachining involves fabrication of micro-components sized 1-500 micrometers. Common processes include etching, LIGA, EDM, and various types of lithography.
2) Etching can be isotropic or anisotropic, wet or dry. Bulk micromachining uses anisotropic etching of silicon while surface micromachining layers materials like polysilicon.
3) LIGA uses X-ray lithography combined with electroforming or molding to create high aspect ratio microstructures. EDM can machine any conductive material including complex 3D shapes.
The document discusses micro-electro-mechanical systems (MEMS) and their evolution. It provides definitions of MEMS, describes their key components and manufacturing processes. MEMS applications are found in various fields like automotive, healthcare, instrumentation and consumer products. The document traces the history of MEMS from their inception in the late 1940s to more recent developments. It also outlines the advantages and disadvantages of MEMS and discusses their increasing role in systems that can sense and interact with their environment.
Micromachining is used to fabricate micro-components between 1 to 500 μm in size. It involves removing material at the micro/nano level through techniques like photolithography, etching, LIGA, and mechanical micromachining. Photolithography uses light to transfer patterns to photoresist, while etching chemically removes layers. LIGA involves x-ray lithography, electroplating, and molding to produce high aspect ratio parts. Bulk machining etches the silicon substrate, while surface machining builds structures by depositing and etching layers on the substrate. Micromachining enables the miniaturization of devices and production of complex micro-scale parts with high precision and surface finishes.
The document provides an overview of microelectromechanical systems (MEMS) technology. It discusses key events in the development of MEMS such as Richard Feynman's 1959 talk on miniaturization and the invention of surface micromachining in the 1980s. The document then covers various MEMS fabrication techniques including lithography, deposition, etching, and bonding. It also describes different types of micromachining like bulk, surface, and high-aspect ratio micromachining. Finally, the challenges, applications, and future of MEMS are briefly discussed.
Michael B. Cohn has expertise in MEMS design and fabrication, including skills in CAD, FEA modeling, prototyping, manufacturing, and packaging. He has experience leading projects in areas such as biomedical devices, micro-optics, RF MEMS, and telerobotics. Specifically, he has designed and tested MEMS devices such as thermal microactuators, gyroscopes, and RF switches through modeling, fabrication, and characterization.
The document discusses micromachining, which refers to machining processes that remove small amounts of material to achieve high geometric accuracy at the micro level. Key points include:
- Micromachining is used to manufacture micro-structures and parts 1-500 micrometers in size.
- There is a growing demand for miniaturized products, driving increased use of micromachining.
- Micromachining techniques include bulk micromachining, surface micromachining, LIGA, and laser micromachining.
- Micromachining has applications in fields like biotechnology, medical devices, optics, and sensors.
This document outlines the topics to be covered in a course on microelectromechanical systems (MEMS). It includes 5 units: introduction to MEMS processes and devices; MUMPs multi-user MEMS processes; thermal transducers; wireless MEMS; and future applications of MEMS. Some key MEMS fabrication techniques discussed are bulk micromachining, surface micromachining, and lithography. Examples of common MEMS devices mentioned are accelerometers, inkjet print heads, and micromirrors.
This document discusses a study on reliability in MEMS (Micro Electro Mechanical Systems). It first provides an introduction to MEMS, describing their size and key fabrication processes like deposition, lithography, and etching. It then discusses two main MEMS fabrication techniques - bulk micromachining and surface micromachining. The document outlines several failure mechanisms in MEMS like mechanical fracture, corrosion, stiction, and wear. It concludes by stating that understanding the underlying physics of MEMS fabrication processes is key to overcoming mechanical and electrical failures.
This document provides an overview of advanced machining processes including chemical machining, electrochemical machining, electrical discharge machining, laser beam machining, water jet machining, and abrasive jet machining. It describes the basic mechanisms and capabilities of each process. Examples are given of complex parts that can be manufactured using these processes like biomedical implants, turbine blades, and microscopic gears. Nanofabrication techniques are also discussed for producing extremely small features at the micro and nanoscale.
Laser polishing is a non-contact surface finishing process that uses laser irradiation to smooth surfaces. There are two main methods - macro polishing using continuous wave lasers to re-melt surface layers 10-80 micrometers thick, and micro polishing using pulsed lasers to re-melt layers 0.5-5 micrometers thick. Factors like initial roughness, material properties, and laser parameters affect the final roughness. Laser polishing provides advantages over conventional methods like being automated, selective, and producing less waste. Applications include polishing glass, medical devices, and creating glossy surface designs.
Modeling and optimization of edm process parameters a reviewIAEME Publication
This document provides a review of research on modeling and optimization of electrical discharge machining (EDM) process parameters. It summarizes 22 research papers that developed mathematical models and applied optimization techniques like response surface methodology, Taguchi method, and genetic algorithms to determine optimal process parameters. The parameters studied include current, pulse on/off time, voltage, and material/electrode properties. The goals of optimization were to improve material removal rate, reduce tool wear and surface roughness. Modeling helped establish relationships between input and output parameters for better process control and performance.
electrochemical discharge machining.
also known as electrochemical spark machining.
we covert normal drilling machine in electrochemical spark machining and perform drilling operation on the work piece and create a macrohole in a quartz glass. the results are shown in the ppt.
we created this project under the head of department of mechanical engineering ER. Rakesh sigh sir and ER.mudit tyagi sir from mtech department from noida institute of engineering and technology, greater noida.
This document summarizes a study that uses Taguchi analysis to determine the optimal settings of control parameters (electrode speed, current, depth of cut) for maximizing material removal rate (MRR) in electro discharge machining (EDM) using different electrode and workpiece materials. Experiments were conducted using copper and graphite electrodes on mild steel and aluminum workpieces at various parameter levels. Material removal rate was calculated and analyzed using regression to determine the relationship between control parameters and MRR. The goal was to predict the maximum MRR and best parameter combination.
This document discusses laser induced plasma micro machining (LIPMM), a tool-less, multi-material micro manufacturing process. LIPMM uses ultra short pulsed lasers to generate localized plasma near the workpiece surface through dielectric breakdown. The plasma absorbs laser energy and transfers it to the workpiece through thermal and mechanical interactions, removing material. LIPMM can machine materials like ceramics, glass, and polymers, and offers advantages over micro-EDM and laser ablation like higher resolution, consistency, and ability to machine transparent materials. Key factors that affect the LIPMM process include laser parameters, dielectric properties, and machining setup configuration.
The document discusses silicon crystal growth from melt using the Czochralski technique. It explains that high purity electronic grade silicon is used as the raw material. In the Czochralski process, silicon is melted in a crucible and a seed crystal is dipped into the melt and slowly extracted, allowing a single crystal ingot to form. The crystal is then sliced into wafers, which are used to produce microchips and other silicon devices. Key steps include purifying metallurgical grade silicon, controlling the furnace atmosphere, and precisely controlling the pull rate and crystal orientation.
The document describes a study that developed an artificial neural network (ANN) model to predict surface roughness, cutting force, and temperature during machining of Nimonic-75 and Nicrofer C-263 super alloys. Experiments were conducted to collect input/output data on cutting speed, feed rate, depth of cut, surface roughness, cutting force, and temperature. The ANN model was trained on this data and could accurately model the complex relationships between cutting conditions and output parameters for process analysis and optimization.
Review Article on Machining of Nickel-Based Super Alloys by Electric Discharg...sushil Choudhary
Electric discharge machining (EDM) process generally used for burrs free, less metallurgical damage, stress free and very precise machining and produces mould cavity, deep holes, complex shapes & size by arc erosion in all types of electro-conductive materials. In this process, the metal is removed from the work piece due to erosion caused by rapidly recurring spark discharge taking place between the tool electrode and work-piece. Tool electrode and wok-piece both submersed into the dielectric fluid. The main aims of this review paper work is to present the consolidated information about the contribution of various researchers on the machining applications of electric discharge machining process on Nickel-Base Super alloys materials, utilization of various tool and techniques for correlating experiment results and applications of product through the EDM. Nickel-Base Super alloys materials is widely used for fuel tanks, aircraft & rocket engine components, nuclear fuel element spacers, casings, fasteners, rings, seal, measuring instrument, cryogenic storage tanks and automobile components etc.
This document provides an introduction to non-traditional machining processes. It defines non-traditional machining as processes that remove material using mechanical, thermal, electrical or chemical energy without using sharp cutting tools. The need for developing such processes is discussed, such as difficulties in machining new hard materials and complex geometries. A comparison is provided between traditional and non-traditional machining. The document outlines the classification and selection of various non-traditional machining processes and provides examples of when they may be preferable to traditional processes. It introduces several specific non-traditional machining techniques that will be covered in more depth later in the document.
Characterization Of Ferrogels Prepared Ferrite Nano Pk1suthar
The document describes methods used to synthesize ferrogel samples using γ-Fe2O3 and Fe3O4 nanoparticles. Characterization techniques like Ultra Small Angle X-ray Scattering (USAXS) and SEM were used to analyze particle size and distribution within the gel. USAXS analysis showed different systems of nanoparticle agglomeration between the samples, with γ-Fe2O3 having lower degrees of agglomeration than Fe3O4.
The document discusses laser-assisted machining (LAM) of hardened 4130 steel parts. It presents a thermal model to predict temperatures during LAM of a hollow shaft with varying thickness. Experimental results show LAM achieved a surface roughness of 0.2-0.4 μm at feeds less than 0.1 mm/rev while reducing specific cutting energy by 20% compared to conventional machining. LAM also produced more uniform surface hardness and lower residual stress variations than conventional machining.
This document discusses recent trends in non-conventional micromachining techniques. It describes several methods such as electrochemical micro-machining (EMM), micro-electrodischarge machining (MEDM), laser micro-machining (LMM), ultrasonic micro-machining (USM), and chemical micro-machining (CMM). For each method, it explains the basic principles, micro-machining processes, applications for micro components, and potential for future development at the nanoscale. The document also explores emerging nanomachining techniques using tools like atomic force microscopes and various top-down and bottom-up fabrication processes.
1) Micromachining involves fabrication of micro-components sized 1-500 micrometers. Common processes include etching, LIGA, EDM, and various types of lithography.
2) Etching can be isotropic or anisotropic, wet or dry. Bulk micromachining uses anisotropic etching of silicon while surface micromachining layers materials like polysilicon.
3) LIGA uses X-ray lithography combined with electroforming or molding to create high aspect ratio microstructures. EDM can machine any conductive material including complex 3D shapes.
The document discusses micro-electro-mechanical systems (MEMS) and their evolution. It provides definitions of MEMS, describes their key components and manufacturing processes. MEMS applications are found in various fields like automotive, healthcare, instrumentation and consumer products. The document traces the history of MEMS from their inception in the late 1940s to more recent developments. It also outlines the advantages and disadvantages of MEMS and discusses their increasing role in systems that can sense and interact with their environment.
Micromachining is used to fabricate micro-components between 1 to 500 μm in size. It involves removing material at the micro/nano level through techniques like photolithography, etching, LIGA, and mechanical micromachining. Photolithography uses light to transfer patterns to photoresist, while etching chemically removes layers. LIGA involves x-ray lithography, electroplating, and molding to produce high aspect ratio parts. Bulk machining etches the silicon substrate, while surface machining builds structures by depositing and etching layers on the substrate. Micromachining enables the miniaturization of devices and production of complex micro-scale parts with high precision and surface finishes.
The document provides an overview of microelectromechanical systems (MEMS) technology. It discusses key events in the development of MEMS such as Richard Feynman's 1959 talk on miniaturization and the invention of surface micromachining in the 1980s. The document then covers various MEMS fabrication techniques including lithography, deposition, etching, and bonding. It also describes different types of micromachining like bulk, surface, and high-aspect ratio micromachining. Finally, the challenges, applications, and future of MEMS are briefly discussed.
Michael B. Cohn has expertise in MEMS design and fabrication, including skills in CAD, FEA modeling, prototyping, manufacturing, and packaging. He has experience leading projects in areas such as biomedical devices, micro-optics, RF MEMS, and telerobotics. Specifically, he has designed and tested MEMS devices such as thermal microactuators, gyroscopes, and RF switches through modeling, fabrication, and characterization.
The document discusses micromachining, which refers to machining processes that remove small amounts of material to achieve high geometric accuracy at the micro level. Key points include:
- Micromachining is used to manufacture micro-structures and parts 1-500 micrometers in size.
- There is a growing demand for miniaturized products, driving increased use of micromachining.
- Micromachining techniques include bulk micromachining, surface micromachining, LIGA, and laser micromachining.
- Micromachining has applications in fields like biotechnology, medical devices, optics, and sensors.
This document outlines the topics to be covered in a course on microelectromechanical systems (MEMS). It includes 5 units: introduction to MEMS processes and devices; MUMPs multi-user MEMS processes; thermal transducers; wireless MEMS; and future applications of MEMS. Some key MEMS fabrication techniques discussed are bulk micromachining, surface micromachining, and lithography. Examples of common MEMS devices mentioned are accelerometers, inkjet print heads, and micromirrors.
This document discusses a study on reliability in MEMS (Micro Electro Mechanical Systems). It first provides an introduction to MEMS, describing their size and key fabrication processes like deposition, lithography, and etching. It then discusses two main MEMS fabrication techniques - bulk micromachining and surface micromachining. The document outlines several failure mechanisms in MEMS like mechanical fracture, corrosion, stiction, and wear. It concludes by stating that understanding the underlying physics of MEMS fabrication processes is key to overcoming mechanical and electrical failures.
This document provides an overview of advanced machining processes including chemical machining, electrochemical machining, electrical discharge machining, laser beam machining, water jet machining, and abrasive jet machining. It describes the basic mechanisms and capabilities of each process. Examples are given of complex parts that can be manufactured using these processes like biomedical implants, turbine blades, and microscopic gears. Nanofabrication techniques are also discussed for producing extremely small features at the micro and nanoscale.
Laser polishing is a non-contact surface finishing process that uses laser irradiation to smooth surfaces. There are two main methods - macro polishing using continuous wave lasers to re-melt surface layers 10-80 micrometers thick, and micro polishing using pulsed lasers to re-melt layers 0.5-5 micrometers thick. Factors like initial roughness, material properties, and laser parameters affect the final roughness. Laser polishing provides advantages over conventional methods like being automated, selective, and producing less waste. Applications include polishing glass, medical devices, and creating glossy surface designs.
Modeling and optimization of edm process parameters a reviewIAEME Publication
This document provides a review of research on modeling and optimization of electrical discharge machining (EDM) process parameters. It summarizes 22 research papers that developed mathematical models and applied optimization techniques like response surface methodology, Taguchi method, and genetic algorithms to determine optimal process parameters. The parameters studied include current, pulse on/off time, voltage, and material/electrode properties. The goals of optimization were to improve material removal rate, reduce tool wear and surface roughness. Modeling helped establish relationships between input and output parameters for better process control and performance.
electrochemical discharge machining.
also known as electrochemical spark machining.
we covert normal drilling machine in electrochemical spark machining and perform drilling operation on the work piece and create a macrohole in a quartz glass. the results are shown in the ppt.
we created this project under the head of department of mechanical engineering ER. Rakesh sigh sir and ER.mudit tyagi sir from mtech department from noida institute of engineering and technology, greater noida.
This document summarizes a study that uses Taguchi analysis to determine the optimal settings of control parameters (electrode speed, current, depth of cut) for maximizing material removal rate (MRR) in electro discharge machining (EDM) using different electrode and workpiece materials. Experiments were conducted using copper and graphite electrodes on mild steel and aluminum workpieces at various parameter levels. Material removal rate was calculated and analyzed using regression to determine the relationship between control parameters and MRR. The goal was to predict the maximum MRR and best parameter combination.
This document discusses laser induced plasma micro machining (LIPMM), a tool-less, multi-material micro manufacturing process. LIPMM uses ultra short pulsed lasers to generate localized plasma near the workpiece surface through dielectric breakdown. The plasma absorbs laser energy and transfers it to the workpiece through thermal and mechanical interactions, removing material. LIPMM can machine materials like ceramics, glass, and polymers, and offers advantages over micro-EDM and laser ablation like higher resolution, consistency, and ability to machine transparent materials. Key factors that affect the LIPMM process include laser parameters, dielectric properties, and machining setup configuration.
The document discusses silicon crystal growth from melt using the Czochralski technique. It explains that high purity electronic grade silicon is used as the raw material. In the Czochralski process, silicon is melted in a crucible and a seed crystal is dipped into the melt and slowly extracted, allowing a single crystal ingot to form. The crystal is then sliced into wafers, which are used to produce microchips and other silicon devices. Key steps include purifying metallurgical grade silicon, controlling the furnace atmosphere, and precisely controlling the pull rate and crystal orientation.
The document describes a study that developed an artificial neural network (ANN) model to predict surface roughness, cutting force, and temperature during machining of Nimonic-75 and Nicrofer C-263 super alloys. Experiments were conducted to collect input/output data on cutting speed, feed rate, depth of cut, surface roughness, cutting force, and temperature. The ANN model was trained on this data and could accurately model the complex relationships between cutting conditions and output parameters for process analysis and optimization.
Review Article on Machining of Nickel-Based Super Alloys by Electric Discharg...sushil Choudhary
Electric discharge machining (EDM) process generally used for burrs free, less metallurgical damage, stress free and very precise machining and produces mould cavity, deep holes, complex shapes & size by arc erosion in all types of electro-conductive materials. In this process, the metal is removed from the work piece due to erosion caused by rapidly recurring spark discharge taking place between the tool electrode and work-piece. Tool electrode and wok-piece both submersed into the dielectric fluid. The main aims of this review paper work is to present the consolidated information about the contribution of various researchers on the machining applications of electric discharge machining process on Nickel-Base Super alloys materials, utilization of various tool and techniques for correlating experiment results and applications of product through the EDM. Nickel-Base Super alloys materials is widely used for fuel tanks, aircraft & rocket engine components, nuclear fuel element spacers, casings, fasteners, rings, seal, measuring instrument, cryogenic storage tanks and automobile components etc.
This document provides an introduction to non-traditional machining processes. It defines non-traditional machining as processes that remove material using mechanical, thermal, electrical or chemical energy without using sharp cutting tools. The need for developing such processes is discussed, such as difficulties in machining new hard materials and complex geometries. A comparison is provided between traditional and non-traditional machining. The document outlines the classification and selection of various non-traditional machining processes and provides examples of when they may be preferable to traditional processes. It introduces several specific non-traditional machining techniques that will be covered in more depth later in the document.
Characterization Of Ferrogels Prepared Ferrite Nano Pk1suthar
The document describes methods used to synthesize ferrogel samples using γ-Fe2O3 and Fe3O4 nanoparticles. Characterization techniques like Ultra Small Angle X-ray Scattering (USAXS) and SEM were used to analyze particle size and distribution within the gel. USAXS analysis showed different systems of nanoparticle agglomeration between the samples, with γ-Fe2O3 having lower degrees of agglomeration than Fe3O4.
The document discusses laser-assisted machining (LAM) of hardened 4130 steel parts. It presents a thermal model to predict temperatures during LAM of a hollow shaft with varying thickness. Experimental results show LAM achieved a surface roughness of 0.2-0.4 μm at feeds less than 0.1 mm/rev while reducing specific cutting energy by 20% compared to conventional machining. LAM also produced more uniform surface hardness and lower residual stress variations than conventional machining.
The document discusses excimer laser machining, which uses ultraviolet laser light to machine materials with high accuracy up to 45nm. Excimer lasers work by exciting gas molecules to produce photons. This process vaporizes or chips away material without causing heating. Excimer laser machining can be used to fabricate 3D polymer structures and machine inorganic dielectrics by applying different masking techniques at micrometer resolution. However, excimer lasers are expensive to operate and maintain due to the high performance electronics and toxic gas requirements. Potential applications include machining of piston rings, automotive and spacecraft bodies, industrial catalysts, and refractive eye surgery.
Reducing Helium Use for GMAW on Nickel Based Alloys - QuickViewMATHESON
This document discusses reducing the use of helium in gas metal arc welding (GMAW) applications on nickel-based alloys. It notes that helium is a non-renewable resource with an unpredictable supply and fluctuating prices. While helium creates a hot arc useful for thicker materials, it also has disadvantages like inconsistent welds and heat-related damage. The document promotes using Matheson Select shielding gas mixtures that can reduce helium use by up to 90% while improving weld quality and expanding the usable voltage range. It presents the mixture as a single setup solution for short circuit, spray arc, and pulsed spray welding of stainless steels, Inconel, Hastelloy, and Mon
This document provides information about lasers and their use in ophthalmology. It begins with definitions of laser and its acronym. It then discusses the history and development of lasers from 1917 to present. The key properties and mechanisms of laser light production are described. Common types of ophthalmic lasers and their applications are outlined, including Nd:YAG, excimer, and diode lasers used for conditions like glaucoma, refractive error correction, and retinal diseases. The laser-tissue interaction mechanisms of thermal, photochemical and ionizing effects are summarized. The document concludes with sections on laser instrumentation and delivery systems and specific laser procedures in ophthalmology.
Working of Laser beam machining process. Its one kind of non traditional or advanced manufacturing process.Production of laser beam and with the use of lasers how can material can be removed is to be explained over here...
Microfabrication involves creating miniature structures and parts that are not visible to the naked eye and are between 1 micrometer and 1000 micrometers in size. Key microfabrication methods include micro machining and advanced nano finishing processes. Micro machining involves material removal at the micro/nano scale using processes like magnetic abrasive finishing, magnetorheological finishing, and diamond turning. These processes allow for high precision manufacturing of parts for applications like optics and microelectronics.
Influence of Magnetic Flux Controllers on Induction Heating SystemsFluxtrol Inc.
1. The document discusses the use of magnetic flux controllers in induction heating systems and their effects on improving coil efficiency and heat pattern control.
2. It provides examples of induction coils enhanced with magnetic flux controllers for applications like camshaft sintering and hardening.
3. Computer simulations are shown to accurately predict the performance benefits of magnetic flux controllers on induction heating processes.
ASM 2001 Influence of Magnetic Flux Controllers on Induction Heating SystemsFluxtrol Inc.
1) The document discusses the use of magnetic flux controllers in induction heating systems and their effects on improving coil efficiency and heat pattern control.
2) It provides examples of induction coils that have been improved through the addition of magnetic flux controllers and materials commonly used for these controllers like laminations, ferrites, and magnetodielectric materials.
3) Computer simulations are shown to accurately predict the performance benefits of magnetic flux controllers on induction heating processes.
Benjamin Mehlmann - Fraunhofer InstituteThemadagen
This document discusses laser micro joining processes and applications in research and development. It outlines laser beam sources and beam manipulation strategies used for micro joining applications in energy storage, electronics, and lightweight construction. Current approaches in research include welding copper with spatial and temporal power modulation to increase weld depth and quality. Developments aim to enable precision melt engineering through dynamic beam manipulation and modeling of laser micro joining processes.
OPTIMIZATION OF WIRE EDM PARAMETERS TO ACHIEVE A FINE SURFACE FINISHIjripublishers Ijri
Wire Cut Electric Discharge Machining process with a thin wire as an electrode transforms electrical energy to thermal
energy for cutting materials. WEDM is considered as a unique adoption of the conventional EDM process, which uses
an electrode to initialize the sparking process. However, WEDM utilizes a continuously travelling wire electrode made of
thin copper, brass or tungsten of diameter 0.05-0.30 mm, which is capable of achieving very small corner radii. The wire
is kept in tension using a mechanical tensioning device reducing the tendency of producing inaccurate parts. During
the WEDM process, the material is eroded ahead of the wire and there is no direct contact between the work piece and
the wire, eliminating the mechanical stresses during machining.
This document summarizes a study on the effect of process parameters on the strength of resistance spot welded aluminum alloy A5052 sheets with cover plates. The researchers welded 1mm thick aluminum alloy sheets using resistance spot welding with cold-rolled steel cover plates. They investigated the effect of welding current, time, and electrode force on nugget diameter, tensile-shear strength, and failure mode. Increasing welding current and time increased nugget diameter and strength, while increasing electrode force decreased nugget diameter and strength. Hardness was lowest in the nugget region compared to the base metal. Interfacial failure occurred for smaller nuggets and nugget pullout failure for larger nuggets
A Study on Weld Quality Characteristics of Pulsed Current Micro Plasma Arc We...drboon
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Optimizing Fusion Zone Grain Size and Ultimate Tensile Strength of Pulsed Cur...drboon
Pulsed Current Micro Plasma Arc welding (PCMPAW) process is an important joining process widely used in sheet metal fabrication industries. The paper focuses on developing mathematical models to predict grain size and ultimate tensile strength of pulsed current micro plasma arc welded Inconel 625 nickel alloy using Response Surface Method (RSM). The experiments were carried out based on Central Composite Design (CCD) with 31 combinations of experiments. The adequacy of the models is checked by Analysis of Variance (ANOVA) technique. Hooke and Jeeves method is used to minimize grain size and maximize the ultimate tensile strength.
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IRJET - Evaluate the Residual Stress Formation of DP600 During RSWIRJET Journal
This study evaluated residual stress formation in DP600 dual phase steel sheets during resistance spot welding (RSW) at different pressures and currents. Samples of DP600 steel were resistance spot welded at pressures of 3.5, 4.5, and 5.5 bar and currents of 4, 6, and 8 kA. Microstructure, hardness, and residual stress of the welded samples were then examined. Results showed that hardness was highest in the weld region due to martensite formation from the high cooling rates of RSW. Hardness increased with higher clamping pressure and current. Residual stress measurements found compressive residual stresses in the specimens, with the highest stresses found in the 5 kA-6 bar samples.
Weiber's Fiber Optic Equipment or Fiber Fusion Splicer are ideal equipment for research and general
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UNIT 2 THERMAL AND ELECTRICAL ENERGY BASED PROCESSES.pptxDineshKumar4165
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REVIEW ON EFFECTS OF PROCESS PARAMETERS IN WIRE CUT EDMIRJET Journal
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PCB Manufacturer, Domestic Circuit Board Production and Prototype
Si Laser Micro Machining
1. Estimation of Temperature
Distribution in Silicon during Micro
Laser Assisted Machining
Presented by
Kamlesh Suthar
John Patten*
Western Michigan University
Manufacturing Engineering Department
Kalamazoo, MI-49008, USA
Lei Dong Hisham Abdel-Aal
Condor USA, Inc. Department of General Engineering
8318 Pineville-Matthews Road, Suite 276 University of Wisconsin at Platteville
Charlotte, NC-28226 Platteville, WI- 53818, USA
2. Outline
Objective
Analytical Finite Element
Experimental work
Modeling Analysis
• Tool • Point heat • Gaussian Profile
Modification source heat source
• Measurement of • Plane Heat
laser power source
• Characterization • Gaussian Beam
Laser Heat
• AFM
Source
• Thermal
imaging
Summary
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MSEC-2008 ASME Conference, Evanston, IL
3. Motivation
• Semiconductor and ceramic materials are
highly brittle and plastic deformation at room
temperature is difficult and they prone to
fracture during machining
• Brittleness has detrimental effect on tool
• Therefore, the challenge is to develop a cost
effective machining process which can
produce ultra fine surface finish
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MSEC-2008 ASME Conference, Evanston, IL
4. Objective
• Silicon is highly brittle at room temperature and the
hardness is the function of temperature
• High Pressure Phase Transformation (HPPT) is one
of the process mechanisms involved in ductile
machining of semiconductors and ceramics.
• Preferentially heat the HPPT material to increase
ductility through thermal softening
– Reduce tool wear
– Minimize surface and subsurface damage.
• Thermal Softening temperature for silicon is 600-
800 oC
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6. Schematic of -LAM of Silicon
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7. Diamond Tip Attachment
250 um
90 Conical Tip
5 μm radius
Attachment was done at Digital Optical Company (Charlotte, NC) by Jay Matthews
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8. Deliverable Power After Attachment
of Diamond & Laser Parameter
Laser (0~400mw,1480nm) Power Loss
IR Laser
Power After the Attachment Power Before the Attachment
Wavelength 1480nm
400
Laser Power
(max) 400mW
350
Power at
Diamond Tip 140mW
Output Laser Power (mw)
300
Photon energy ~0.9 eV
250 Transitivity of Si-
II 80-90 %
200
Absorbance in
Si-II 10.0 %
150
Diamond tool
100
5-6 μm
Diameter of tip
900-1200
Thermal
50
conductivity W/m/K
0
Silicon
0 500 1000 1500
Specific heat 0.7J/g/K
2.33 g/cm3
Laser Driving Current (mA) Density
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9. IR Softens Metallic Silicon
Indent depths at different laser power
Fiber
Weights
Scratch and stay test (load 25mN)
Si Wafer
Scratching Speed Test (Load 25mN)
Speed1: 0.305 mm/sec; Speed 2: 0.002 mm/sec; Speed 3:.0002mm/sec
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18. Estimation of Physical
properties of Si-II and their use in
modeling
Thermal
1. Analytical modeling
Temperature Conductivity of
The thermo-physical properties are
(K) metallic Si-II
taken at intermediate temperature.
W/cm/K
300 0.0025
2. FEM formulation
400 0004
Thermo physical properties of si-I
500 0.0055
and Si-II are taken as function
600 0.0075
700 0.0125 of Temperature
800 0.0165
900 0.025
•MatLab is used for programming analytical model
•COMSOL 3.4 is used for FEA
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MSEC-2008 ASME Conference, Evanston, IL
19. Analytical Modeling
1. Moving point heat source ( scratch test)
2 2 2
x y z
t
2 q (1 r) d 4t
T e
3 3
2 2
Cp 4 0
:Thermal Diffusivity (cm2/s)
r : Reflectivity
Ρ : Density (g/cm3)
k : Thermal Conductivity
W/cm/K
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MSEC-2008 ASME Conference, Evanston, IL
20. Analytical Modeling….
2. Moving Plane Heat Source
t
2 2
v u
Xv 4a
2 q (1 r )v d 2a
2a
T e e
3 3
2 2
16 k 0
:Thermal Diffusivity (cm2/s)
r : Reflectivity
Ρ : Density (g/cm3)
k : Thermal Conductivity
W/cm/K
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MSEC-2008 ASME Conference, Evanston, IL
21. Analytical Modeling….
3. Gaussian Beam profile Moving Plane
with Laser as heating source (scratch test)
2
2
x y
I x, y I o exp
Gaussian Profile rx ry
Q1 r
Temperature T ( x, y, z ) f ( u ) du
3
k
2
Profile 0
2
2
Temperature X V u 2 2
Y Z
ex p 2 2
1
2
u u
u
function f (u ) 1
2
1
2 2
u u
Non-dimensional
parameter 1
2
2t
2
x v q
y z r u
Y Z
X V Q 2
r
r r r
r r 4
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22. 3. Gaussian Beam profile Moving Plane…….
Temperature Profile
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24. Summary
• Thermal images: the absorptivity of the Si-II is
different than the Si-I and therefore the
temperature rise occurs is due to HPPT
• The temperature rise for the stationary point heat
source is 778oC.
• For the moving plane heat source T at 0.0002
mm/sec, is 468oC,
• The COMSOL result, for a stationary heat source
temperature rise of 631oC. The COMSOL results
are in good agreement with the previous estimated
temperature
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25. Future Work
• Numerical Analysis of the Moving laser with
varying laser power with varying absorption
with the depth.
• Investigate the possibility of other
wavelength.
• Machining using chemical etching
• Investigation of acoustic emission of the
machining process
25
26. References
[1] Abdel-Aal, H. A., Y. Reyes, et al. (2006). quot;Extending electrical resistivity measurements in micro-scratching of silicon to
determine thermal conductivity of the metallic phase Si-II.quot; Materials Characterization 57(4-5): 281-289.
[2] Carslaw, H. S. and J. C. Jeager (1953). Conduction of Heat in Solids. Clarendon, UK, Oxford.
[3] Dong, L. (2006). In-situ detection and heating of high pressure metallic phase of silicon during scratching. United
States -- North Carolina, The University of North Carolina at Charlotte., PhD Dissertation, Mechanical Engineering
Dept.
[4] Hanfland, M., M. Alouani, et al. (1988). quot;Optical properties of metallic silicon.quot; Physical Review B 38(18): 12864.
[5] Hou, Z. B. and R. Komanduri (2000). quot;General solutions for stationary/moving plane heat source problems in
manufacturing and tribology.quot; International Journal of Heat and Mass Transfer 43(10): 1679-1698.
[6] Komanduri, R. and Z. Hou (2000). quot;Thermal analysis of the arc welding process: Part I. General solutions.quot;
Metallurgical and Materials Transactions B 31(6): 1353-1370.
[7] Komanduri, R. and Z. B. Hou (2001). quot;Analysis of heat partition and temperature distribution in sliding systems.quot;
Wear 251(1-12): 925-938.
[8] Lide, D. R. (2003-2004). CRC Handbook of Chemistry and Physics, Student Edition, CRC Press.
[9] Moody, J. E. and R. H. Hendel (1982). quot;Temperature profiles induced by a scanning cw laser beam.quot; Journal of Applied
Physics 53(6): 4364-4371.
[10] Trefilov, V.I., Milman, Y.V., “Sbornik Voprosyi Fiziki metallov i metallo-vedeniya”, Vol. 17, Izd. Akad. Nauk Ukr.SSR, 45
(1963).
[11] Palik, E.D., Handbook of Optical Constants of Solids. 1st ed, ed. E.D. Palik. 1997: Academic Press. 3224.Moody, J..
[12] Engineering, E. & C. Complex Index of Refraction Look-up Utility. 2008 [cited 2008 June 15, 2008]; Available from:
http://www.ee.byu.edu/photonics/opticalconstants.phtml.
[13] Trefilove, V.I., Milman, Y. V., “Sbornik Voprosyi Fiziki Metallov I metallo-vedeniya”, Vol. 17,Izd. Akad. Nauk Ukr.
SSR, 45 (1963).
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27. Thank you
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