The Presentation is directly taken from the Journal Design & Fabrication Of Electrostatic Inkjet Head using Silicon Micromachining Technology. Better you read the Journal first and try to understand.
The document discusses various laser micromachining techniques including pyrolytic and photolytic processing. It describes the fundamentals of lasers including stimulated emission and different laser types such as solid state, diode, and Ti-sapphire lasers. The effects of nanosecond, picosecond, and femtosecond laser pulses on material processing are examined for applications such as microfabrication.
The document provides information about various topics including MEMS, NC machines, and CNC machines. It discusses:
1) MEMS involves integrating microsensors, microactuators, and microelectronics on a silicon chip to sense and react to the environment. Fabrication methods for MEMS like bulk micromachining and surface micromachining are also described.
2) NC machines have programs fed via tape while CNC machines are interfaced with computers, allowing for easier programming changes.
3) CNC machines evolved from early NC machines which were modified machine tools. CNC machines have computer control, memory storage, and closed-loop feedback to provide high accuracy and repeatability for machining.
This document discusses various micro machining techniques including photolithography, etching, LIGA, and mechanical micromachining. Photolithography uses light and photoresist to selectively expose patterns on a wafer. Etching is used to chemically remove layers and can be wet or dry. LIGA allows for high aspect ratio metal structures using X-ray lithography and electroplating. Mechanical micromachining removes material at the micro/nano scale. Micro machining is needed for miniature features, complex 3D parts, and nano-level surface finishes in industries like aerospace.
This document discusses laser induced plasma micro machining (LIPMM), a tool-less, multi-material micro manufacturing process. LIPMM uses ultra short pulsed lasers to generate localized plasma near the workpiece surface through dielectric breakdown. The plasma absorbs laser energy and transfers it to the workpiece through thermal and mechanical interactions, removing material. LIPMM can machine materials like ceramics, glass, and polymers, and offers advantages over micro-EDM and laser ablation like higher resolution, consistency, and ability to machine transparent materials. Key factors that affect the LIPMM process include laser parameters, dielectric properties, and machining setup configuration.
Micro machining involves removing material at the micro/nano scale to create small features and high precision surfaces. Key techniques include photolithography, which uses light passing through masks to pattern photoresist, and various etching methods like wet, dry, and plasma etching to remove material. Other important microfabrication processes are bulk micromachining, which etches the silicon substrate, surface micromachining which builds structures in layers, and LIGA which uses X-rays to create high aspect ratio metal parts through electroplating. These micro machining techniques enable manufacturing of complex micro-scale parts for applications like MEMS devices and biomedical tools.
Micro machining and classification, and Electro chemical micro machining Elec...Mustafa Memon
A detail description of Micro machining, its classification
Electro chemical micro machining
Electric Discharge Micro machining
micro turning
their resource and application
By Muhammad Mustafa memon
BE Qucest larkana
ME MUET jamshoro
The document discusses micromachining, which refers to machining processes that remove small amounts of material to achieve high geometric accuracy at the micro level. Key points include:
- Micromachining is used to manufacture micro-structures and parts 1-500 micrometers in size.
- There is a growing demand for miniaturized products, driving increased use of micromachining.
- Micromachining techniques include bulk micromachining, surface micromachining, LIGA, and laser micromachining.
- Micromachining has applications in fields like biotechnology, medical devices, optics, and sensors.
This document discusses recent trends in non-conventional micromachining techniques. It describes several methods such as electrochemical micro-machining (EMM), micro-electrodischarge machining (MEDM), laser micro-machining (LMM), ultrasonic micro-machining (USM), and chemical micro-machining (CMM). For each method, it explains the basic principles, micro-machining processes, applications for micro components, and potential for future development at the nanoscale. The document also explores emerging nanomachining techniques using tools like atomic force microscopes and various top-down and bottom-up fabrication processes.
The document discusses various laser micromachining techniques including pyrolytic and photolytic processing. It describes the fundamentals of lasers including stimulated emission and different laser types such as solid state, diode, and Ti-sapphire lasers. The effects of nanosecond, picosecond, and femtosecond laser pulses on material processing are examined for applications such as microfabrication.
The document provides information about various topics including MEMS, NC machines, and CNC machines. It discusses:
1) MEMS involves integrating microsensors, microactuators, and microelectronics on a silicon chip to sense and react to the environment. Fabrication methods for MEMS like bulk micromachining and surface micromachining are also described.
2) NC machines have programs fed via tape while CNC machines are interfaced with computers, allowing for easier programming changes.
3) CNC machines evolved from early NC machines which were modified machine tools. CNC machines have computer control, memory storage, and closed-loop feedback to provide high accuracy and repeatability for machining.
This document discusses various micro machining techniques including photolithography, etching, LIGA, and mechanical micromachining. Photolithography uses light and photoresist to selectively expose patterns on a wafer. Etching is used to chemically remove layers and can be wet or dry. LIGA allows for high aspect ratio metal structures using X-ray lithography and electroplating. Mechanical micromachining removes material at the micro/nano scale. Micro machining is needed for miniature features, complex 3D parts, and nano-level surface finishes in industries like aerospace.
This document discusses laser induced plasma micro machining (LIPMM), a tool-less, multi-material micro manufacturing process. LIPMM uses ultra short pulsed lasers to generate localized plasma near the workpiece surface through dielectric breakdown. The plasma absorbs laser energy and transfers it to the workpiece through thermal and mechanical interactions, removing material. LIPMM can machine materials like ceramics, glass, and polymers, and offers advantages over micro-EDM and laser ablation like higher resolution, consistency, and ability to machine transparent materials. Key factors that affect the LIPMM process include laser parameters, dielectric properties, and machining setup configuration.
Micro machining involves removing material at the micro/nano scale to create small features and high precision surfaces. Key techniques include photolithography, which uses light passing through masks to pattern photoresist, and various etching methods like wet, dry, and plasma etching to remove material. Other important microfabrication processes are bulk micromachining, which etches the silicon substrate, surface micromachining which builds structures in layers, and LIGA which uses X-rays to create high aspect ratio metal parts through electroplating. These micro machining techniques enable manufacturing of complex micro-scale parts for applications like MEMS devices and biomedical tools.
Micro machining and classification, and Electro chemical micro machining Elec...Mustafa Memon
A detail description of Micro machining, its classification
Electro chemical micro machining
Electric Discharge Micro machining
micro turning
their resource and application
By Muhammad Mustafa memon
BE Qucest larkana
ME MUET jamshoro
The document discusses micromachining, which refers to machining processes that remove small amounts of material to achieve high geometric accuracy at the micro level. Key points include:
- Micromachining is used to manufacture micro-structures and parts 1-500 micrometers in size.
- There is a growing demand for miniaturized products, driving increased use of micromachining.
- Micromachining techniques include bulk micromachining, surface micromachining, LIGA, and laser micromachining.
- Micromachining has applications in fields like biotechnology, medical devices, optics, and sensors.
This document discusses recent trends in non-conventional micromachining techniques. It describes several methods such as electrochemical micro-machining (EMM), micro-electrodischarge machining (MEDM), laser micro-machining (LMM), ultrasonic micro-machining (USM), and chemical micro-machining (CMM). For each method, it explains the basic principles, micro-machining processes, applications for micro components, and potential for future development at the nanoscale. The document also explores emerging nanomachining techniques using tools like atomic force microscopes and various top-down and bottom-up fabrication processes.
This document discusses electron beam micromachining (EBM), which uses a focused beam of high-velocity electrons to remove material from a workpiece through melting and vaporization. It describes the mechanism of material removal in EBM, where an electron beam generates a stream of electrons that heat the workpiece surface intensely. EBM can drill small holes, cut contours and slots, and is used in industries like aerospace, medical, and electronics. Some advantages are its ability to machine both conductive and non-conductive materials with no contact and very low tool wear. However, it requires vacuum and has high costs.
Micro manufacturing involves processes used to fabricate micro components or create micro features on parts. Some key micro manufacturing processes include diamond turning, laser welding, and micro drilling. Diamond turning can machine microgrooves as small as 2.5 μm wide by 1.6 μm deep. Laser beam welding comes in two types: surface heating and through transmission infrared welding. Nano manufacturing deals with even smaller scales down to 1 nanometer. Approaches include top-down methods like focused beam lithography and nanoimprint lithography as well as bottom-up methods such as chemical vapor deposition and dip pen lithography. These techniques have applications in precision manufacturing of devices used in areas like semiconductor fabrication, medical devices, and more.
The document discusses various types of grinding processes including conventional grinding, micro grinding, ultra precision grinding, and piezoelectric nano grinding. Conventional grinding includes surface grinding, cylindrical grinding, internal grinding, and centerless grinding. Micro grinding uses a nickel coated ceramic tool with microscale diamond particles to machine at the nanoscale. Ultra precision grinding can achieve mirror finishes with dimensional accuracy of a few micrometers and surface roughness of 5nm. Piezoelectric nano grinding uses the piezoelectric effect to remove small fragments of material from a substrate for applications such as biomedical devices.
Micromolding and micromilling are specialized microfabrication techniques. Micromolding uses injection molding machines capable of high injection speeds and pressures to mold parts weighing 0.001-0.1 grams. It requires intricate tooling and specialized extraction of tiny parts. Micromilling uses single crystal diamond or tungsten carbide tools to mill complex 3D structures and micro-features with surface roughnesses below 1 micron. Both techniques are used to fabricate parts for medical devices, microfluidics, and other micro-applications. Key challenges include demolding of tiny structures and achieving high aspect ratio micro-features.
Microfabrication involves creating miniature structures and parts that are not visible to the naked eye and are between 1 micrometer and 1000 micrometers in size. Key microfabrication methods include micro machining and advanced nano finishing processes. Micro machining involves material removal at the micro/nano scale using processes like magnetic abrasive finishing, magnetorheological finishing, and diamond turning. These processes allow for high precision manufacturing of parts for applications like optics and microelectronics.
This document discusses laser micromachining, including its working principle, types, applications, advantages, disadvantages, and safety considerations. Laser micromachining uses focused laser beams to cut, drill, or modify small features less than 1 mm in size. It has applications in manufacturing integrated chips and microelectromechanical systems. The technique offers advantages like contactless machining, flexibility, and precision, but high equipment costs and safety hazards from high intensity light.
Nanofinishing techniques have been developed to achieve surface finishes on the nanometer scale for applications in electronics, optics, and other industries. Some key nanofinishing processes include magnetic abrasive finishing, magnetorheological finishing, elastic emission machining, magnetic float polishing, and ion beam machining. These processes use techniques such as magnetic fields, abrasives, and ion bombardment to remove material from surfaces at the atomic level and achieve roughness in the range of 0.1 to 7.6 nm. Nanofinishing enables high-precision machining for applications such as medical devices and computer components.
Measurement techniques in micro machining PDF by badebhau4@gmail.comEr. Bade Bhausaheb
This document discusses various measurement techniques used in micro machining. It begins by explaining the need for developing new measurement techniques capable of accurately measuring micro-scale features between 0.1 to 100 μm. It then categorizes measuring systems as either dimensional or topographic and describes examples in each category. Key techniques discussed include optical microscopes, electron microscopes like SEM, interferometers, profilometers, scanning probe microscopes and laser-based systems. The document provides details on operating principles, applications, accuracy and resolution limits of these micro-measurement techniques.
Micromachining is used to fabricate micro-components between 1 to 500 μm in size. It involves removing material at the micro/nano level through techniques like photolithography, etching, LIGA, and mechanical micromachining. Photolithography uses light to transfer patterns to photoresist, while etching chemically removes layers. LIGA involves x-ray lithography, electroplating, and molding to produce high aspect ratio parts. Bulk machining etches the silicon substrate, while surface machining builds structures by depositing and etching layers on the substrate. Micromachining enables the miniaturization of devices and production of complex micro-scale parts with high precision and surface finishes.
Laser polishing is a non-contact surface finishing process that uses laser irradiation to smooth surfaces. There are two main methods - macro polishing using continuous wave lasers to re-melt surface layers 10-80 micrometers thick, and micro polishing using pulsed lasers to re-melt layers 0.5-5 micrometers thick. Factors like initial roughness, material properties, and laser parameters affect the final roughness. Laser polishing provides advantages over conventional methods like being automated, selective, and producing less waste. Applications include polishing glass, medical devices, and creating glossy surface designs.
This document discusses several advanced nano finishing processes including abrasive flow machining, chemo mechanical polishing, magnetic abrasive finishing, magneto rheological finishing, and magneto rheological abrasive flow finishing. It provides details on the working principles, process parameters, advantages, limitations and applications of abrasive flow machining and chemo mechanical polishing. Abrasive flow machining uses a semisolid abrasive media to remove small amounts of material from surfaces. Chemo mechanical polishing combines chemical etching with mechanical polishing to smooth and planarize surfaces.
RECENT TRENDS IN NON-TRADITIONAL MACHINING PROCESSESravikumarmrk
This document discusses various hybrid and non-traditional machining processes. It describes electrochemical spark machining (ECSM) which is a hybrid process that combines ECM and EDM, allowing it to machine both conductive and non-conductive materials. The document outlines the principle, material removal mechanisms, and process parameters of ECSM. It also summarizes electric discharge diamond grinding (EDDG) and discusses its basic configuration, parameters, advantages, and applications. Finally, the document provides an overview of recent trends in micro-machining including various advanced mechanical and thermal micro-machining processes.
1) Micromachining involves fabrication of micro-components sized 1-500 micrometers. Common processes include etching, LIGA, EDM, and various types of lithography.
2) Etching can be isotropic or anisotropic, wet or dry. Bulk micromachining uses anisotropic etching of silicon while surface micromachining layers materials like polysilicon.
3) LIGA uses X-ray lithography combined with electroforming or molding to create high aspect ratio microstructures. EDM can machine any conductive material including complex 3D shapes.
The document discusses magneto rheological finishing (MRF), a fine finishing process that uses magneto rheological fluid to remove material from brittle materials. MRF was developed in 1988 and commercialized in 1996. It relies on carbonyl iron particles and abrasives in a carrier fluid that form chains when exposed to a magnetic field, allowing for controlled removal of material. The document outlines the components of MR fluid, parameters that affect the polishing forces and material removal rate, advantages, and applications for finishing optical lenses and other precision surfaces to nanometer levels of smoothness without damage.
CHEMICAL MACHINING - NON TRADITIONAL MACHININGSajal Tiwari
The chemical machining processes include those wherein material removal is accomplished by a chemical reaction, sometimes assisted by electrical or thermal energy applications. This group includes chemical milling, photochemical machining, and thermo-chemical machining.
Chemical machining is a nontraditional machining process that removes metal from a workpiece by immersing it in a chemical solution. The process involves masking areas of the workpiece to be protected, then etching away the exposed material with an acidic or alkaline solution. Chemical machining can produce complex parts with close tolerances and is used for applications such as MEMS and semiconductor devices that require micro-scale features. The key steps of chemical machining include cleaning the workpiece, applying a photoresist mask, exposing the mask to create the desired pattern, etching, and removing the mask.
Stabilization of emulsion via electrostaticLing Ling Ng
This document discusses the stabilization of emulsions via electrostatic forces. It defines emulsions as dispersions of one liquid in another immiscible liquid, and describes the electrical double layer that forms around dispersed droplets consisting of surface charges and layers of counterions. The document outlines DLVO theory, which states that emulsion stability is determined by a balance between attractive van der Waals forces and repulsive electrostatic forces. It also discusses how zeta potential measurement relates to stability, and how pH and ionic strength can affect zeta potential and thus the stability of emulsions.
Innovative MEMS technologies are spearheading the inkjet printing industry’s transformation.
From technology push to market pull, inkjet printing is entering a new era
Inkjet printing, which offers a flexible, cost-effective solution for printing personal documents, is still largely associated with home and small office printing. In parallel, large & wide format printing for CAD and graphic arts applications considers inkjet printing as its technology-of-choice for single prints and very small print runs. The democratization of digital applications in the early 2000s, spurred on by greater home internet usage and the appearance of digital cameras (which dramatically impacted the photo business), has influenced OEM printer manufacturers to develop high-quality, high-resolution printheads. MEMS technologies represent an attractive solution for creating a higher native density of nozzles-per-printheads at an acceptable manufacturing cost via mass production.
Office printing is one of the sectors that has recently benefited from MEMS printhead performance, competing with entry-level to mid-end laser printers. Moreover, the digital revolution is also gaining momentum in new sectors. For years, commercial and industrial applications have used analog printing solutions like flexography, offset printing, and screen-printing due to their high-volume production capacity and associated lower cost. However, these techniques are restrictive due to the use of a master, and not compatible with short runs < 4000m² printing surface. Today’s industrial and commercial applications require more diversity, as well as more instant service customization. Digital printing, specifically inkjet printing, is the solution to penetrating the three trillion square meters (m²) industrial market.
This document discusses electron beam micromachining (EBM), which uses a focused beam of high-velocity electrons to remove material from a workpiece through melting and vaporization. It describes the mechanism of material removal in EBM, where an electron beam generates a stream of electrons that heat the workpiece surface intensely. EBM can drill small holes, cut contours and slots, and is used in industries like aerospace, medical, and electronics. Some advantages are its ability to machine both conductive and non-conductive materials with no contact and very low tool wear. However, it requires vacuum and has high costs.
Micro manufacturing involves processes used to fabricate micro components or create micro features on parts. Some key micro manufacturing processes include diamond turning, laser welding, and micro drilling. Diamond turning can machine microgrooves as small as 2.5 μm wide by 1.6 μm deep. Laser beam welding comes in two types: surface heating and through transmission infrared welding. Nano manufacturing deals with even smaller scales down to 1 nanometer. Approaches include top-down methods like focused beam lithography and nanoimprint lithography as well as bottom-up methods such as chemical vapor deposition and dip pen lithography. These techniques have applications in precision manufacturing of devices used in areas like semiconductor fabrication, medical devices, and more.
The document discusses various types of grinding processes including conventional grinding, micro grinding, ultra precision grinding, and piezoelectric nano grinding. Conventional grinding includes surface grinding, cylindrical grinding, internal grinding, and centerless grinding. Micro grinding uses a nickel coated ceramic tool with microscale diamond particles to machine at the nanoscale. Ultra precision grinding can achieve mirror finishes with dimensional accuracy of a few micrometers and surface roughness of 5nm. Piezoelectric nano grinding uses the piezoelectric effect to remove small fragments of material from a substrate for applications such as biomedical devices.
Micromolding and micromilling are specialized microfabrication techniques. Micromolding uses injection molding machines capable of high injection speeds and pressures to mold parts weighing 0.001-0.1 grams. It requires intricate tooling and specialized extraction of tiny parts. Micromilling uses single crystal diamond or tungsten carbide tools to mill complex 3D structures and micro-features with surface roughnesses below 1 micron. Both techniques are used to fabricate parts for medical devices, microfluidics, and other micro-applications. Key challenges include demolding of tiny structures and achieving high aspect ratio micro-features.
Microfabrication involves creating miniature structures and parts that are not visible to the naked eye and are between 1 micrometer and 1000 micrometers in size. Key microfabrication methods include micro machining and advanced nano finishing processes. Micro machining involves material removal at the micro/nano scale using processes like magnetic abrasive finishing, magnetorheological finishing, and diamond turning. These processes allow for high precision manufacturing of parts for applications like optics and microelectronics.
This document discusses laser micromachining, including its working principle, types, applications, advantages, disadvantages, and safety considerations. Laser micromachining uses focused laser beams to cut, drill, or modify small features less than 1 mm in size. It has applications in manufacturing integrated chips and microelectromechanical systems. The technique offers advantages like contactless machining, flexibility, and precision, but high equipment costs and safety hazards from high intensity light.
Nanofinishing techniques have been developed to achieve surface finishes on the nanometer scale for applications in electronics, optics, and other industries. Some key nanofinishing processes include magnetic abrasive finishing, magnetorheological finishing, elastic emission machining, magnetic float polishing, and ion beam machining. These processes use techniques such as magnetic fields, abrasives, and ion bombardment to remove material from surfaces at the atomic level and achieve roughness in the range of 0.1 to 7.6 nm. Nanofinishing enables high-precision machining for applications such as medical devices and computer components.
Measurement techniques in micro machining PDF by badebhau4@gmail.comEr. Bade Bhausaheb
This document discusses various measurement techniques used in micro machining. It begins by explaining the need for developing new measurement techniques capable of accurately measuring micro-scale features between 0.1 to 100 μm. It then categorizes measuring systems as either dimensional or topographic and describes examples in each category. Key techniques discussed include optical microscopes, electron microscopes like SEM, interferometers, profilometers, scanning probe microscopes and laser-based systems. The document provides details on operating principles, applications, accuracy and resolution limits of these micro-measurement techniques.
Micromachining is used to fabricate micro-components between 1 to 500 μm in size. It involves removing material at the micro/nano level through techniques like photolithography, etching, LIGA, and mechanical micromachining. Photolithography uses light to transfer patterns to photoresist, while etching chemically removes layers. LIGA involves x-ray lithography, electroplating, and molding to produce high aspect ratio parts. Bulk machining etches the silicon substrate, while surface machining builds structures by depositing and etching layers on the substrate. Micromachining enables the miniaturization of devices and production of complex micro-scale parts with high precision and surface finishes.
Laser polishing is a non-contact surface finishing process that uses laser irradiation to smooth surfaces. There are two main methods - macro polishing using continuous wave lasers to re-melt surface layers 10-80 micrometers thick, and micro polishing using pulsed lasers to re-melt layers 0.5-5 micrometers thick. Factors like initial roughness, material properties, and laser parameters affect the final roughness. Laser polishing provides advantages over conventional methods like being automated, selective, and producing less waste. Applications include polishing glass, medical devices, and creating glossy surface designs.
This document discusses several advanced nano finishing processes including abrasive flow machining, chemo mechanical polishing, magnetic abrasive finishing, magneto rheological finishing, and magneto rheological abrasive flow finishing. It provides details on the working principles, process parameters, advantages, limitations and applications of abrasive flow machining and chemo mechanical polishing. Abrasive flow machining uses a semisolid abrasive media to remove small amounts of material from surfaces. Chemo mechanical polishing combines chemical etching with mechanical polishing to smooth and planarize surfaces.
RECENT TRENDS IN NON-TRADITIONAL MACHINING PROCESSESravikumarmrk
This document discusses various hybrid and non-traditional machining processes. It describes electrochemical spark machining (ECSM) which is a hybrid process that combines ECM and EDM, allowing it to machine both conductive and non-conductive materials. The document outlines the principle, material removal mechanisms, and process parameters of ECSM. It also summarizes electric discharge diamond grinding (EDDG) and discusses its basic configuration, parameters, advantages, and applications. Finally, the document provides an overview of recent trends in micro-machining including various advanced mechanical and thermal micro-machining processes.
1) Micromachining involves fabrication of micro-components sized 1-500 micrometers. Common processes include etching, LIGA, EDM, and various types of lithography.
2) Etching can be isotropic or anisotropic, wet or dry. Bulk micromachining uses anisotropic etching of silicon while surface micromachining layers materials like polysilicon.
3) LIGA uses X-ray lithography combined with electroforming or molding to create high aspect ratio microstructures. EDM can machine any conductive material including complex 3D shapes.
The document discusses magneto rheological finishing (MRF), a fine finishing process that uses magneto rheological fluid to remove material from brittle materials. MRF was developed in 1988 and commercialized in 1996. It relies on carbonyl iron particles and abrasives in a carrier fluid that form chains when exposed to a magnetic field, allowing for controlled removal of material. The document outlines the components of MR fluid, parameters that affect the polishing forces and material removal rate, advantages, and applications for finishing optical lenses and other precision surfaces to nanometer levels of smoothness without damage.
CHEMICAL MACHINING - NON TRADITIONAL MACHININGSajal Tiwari
The chemical machining processes include those wherein material removal is accomplished by a chemical reaction, sometimes assisted by electrical or thermal energy applications. This group includes chemical milling, photochemical machining, and thermo-chemical machining.
Chemical machining is a nontraditional machining process that removes metal from a workpiece by immersing it in a chemical solution. The process involves masking areas of the workpiece to be protected, then etching away the exposed material with an acidic or alkaline solution. Chemical machining can produce complex parts with close tolerances and is used for applications such as MEMS and semiconductor devices that require micro-scale features. The key steps of chemical machining include cleaning the workpiece, applying a photoresist mask, exposing the mask to create the desired pattern, etching, and removing the mask.
Stabilization of emulsion via electrostaticLing Ling Ng
This document discusses the stabilization of emulsions via electrostatic forces. It defines emulsions as dispersions of one liquid in another immiscible liquid, and describes the electrical double layer that forms around dispersed droplets consisting of surface charges and layers of counterions. The document outlines DLVO theory, which states that emulsion stability is determined by a balance between attractive van der Waals forces and repulsive electrostatic forces. It also discusses how zeta potential measurement relates to stability, and how pH and ionic strength can affect zeta potential and thus the stability of emulsions.
Innovative MEMS technologies are spearheading the inkjet printing industry’s transformation.
From technology push to market pull, inkjet printing is entering a new era
Inkjet printing, which offers a flexible, cost-effective solution for printing personal documents, is still largely associated with home and small office printing. In parallel, large & wide format printing for CAD and graphic arts applications considers inkjet printing as its technology-of-choice for single prints and very small print runs. The democratization of digital applications in the early 2000s, spurred on by greater home internet usage and the appearance of digital cameras (which dramatically impacted the photo business), has influenced OEM printer manufacturers to develop high-quality, high-resolution printheads. MEMS technologies represent an attractive solution for creating a higher native density of nozzles-per-printheads at an acceptable manufacturing cost via mass production.
Office printing is one of the sectors that has recently benefited from MEMS printhead performance, competing with entry-level to mid-end laser printers. Moreover, the digital revolution is also gaining momentum in new sectors. For years, commercial and industrial applications have used analog printing solutions like flexography, offset printing, and screen-printing due to their high-volume production capacity and associated lower cost. However, these techniques are restrictive due to the use of a master, and not compatible with short runs < 4000m² printing surface. Today’s industrial and commercial applications require more diversity, as well as more instant service customization. Digital printing, specifically inkjet printing, is the solution to penetrating the three trillion square meters (m²) industrial market.
This document summarizes a study on the effect of water pressure on a low voltage water mist induction charging system. The study investigated the relationship between water pressure (0.05 MPa and 0.10 MPa) and the water mist separation region, current, and charge-to-mass. It found that higher water pressure resulted in a larger separation region and changes in current and charge-to-mass with the electrode-nozzle distance. The conclusions recommend further studies using higher voltages and pressures to generate finer water droplets.
The document discusses the selection, use, maintenance, and calibration of backpack sprayers. It recommends buying high-quality equipment and performing regular maintenance. Proper use includes not overpressurizing the sprayer and storing it properly. Calibration involves measuring the amount of water and chemical needed to treat a set area. Maintaining and calibrating the sprayer properly helps ensure successful application.
ppt on summer training at hindustan copper limitedmahi bagriya
Hindustan Copper Limited operates several copper mining and processing units across India. The document describes a seminar presentation on a summer internship at HCL's Khetri Copper Complex in Rajasthan. It outlines the various operations at Khetri including mining copper ore via ropeway, grinding the ore, froth flotation concentration processes, and production processes. It also discusses support functions like the compressor house and repairs shop. The internship provided valuable experience in mining operations, time management skills, and industry networking.
Digital Printing for the Packaging Industry by Justin Hayward CIRJustin Hayward
Don't miss the boat - waves of digital innovation | market trends and drivers fishbone diagram | new survey data | patent holders | product tech suppliers | markets growth digital vs analogue | evidence for market pull & activity | perceived barriers to adoption relatives | Customer DMUs | Strategy Logic
High pressure water jetting and the necessary safetyggurquhart
The document discusses high pressure water jetting, including its definition as using high pressure water to remove unwanted material from surfaces. It can be used for cleaning, surface preparation before coatings, controlled demolition of concrete without damage, and more. Safety is crucial as it operates at over 25,000 PSI and can cut concrete - only trained operators should use protective equipment like steel-toed boots and face shields. High pressure water jetting is environmentally friendly compared to other removal methods.
Trend Alert: The Evolving Role of Production InkjetMark Bohan
Production inkjet is evolving from the production of transactional document and books to a broad range of applications, including packaging. Its growth will be driving significant changes in the industry, including grabbing market share from offset and cut sheet digital applications. Managers need to understand the applications and the business case for implementing a production inkjet solution. Join an in-depth evaluation of how and why high-speed inkjet is creating new business opportunities.
Ionic liquids are salts that are liquid at or near room temperature rather than solid, due to their large organic cations and anions. Ionic liquid films are made of an ionic liquid sandwiched between two electrodes. They allow ions to move freely and create an electric double layer, enabling large electron modulation. Analysis of the capacitance of ionic liquid films allows the thickness of the electric double layer and properties like permittivity to be determined through simple circuit models.
Electrochemical micromachining (EMM) is a non-traditional machining process that uses electrical and chemical energy for precision micro-machining of conductive materials. EMM involves anodic dissolution of workpiece material in an electrolyte solution between a tool electrode and workpiece electrode. EMM allows for machining of complex micro-scale geometries without thermal or mechanical stresses. The document describes the fundamentals, process parameters, applications and a demonstration EMM setup developed for micro-fabrication.
Emerging Trends of Industrial Inkjet PrintingDean Hornsby
The document summarizes emerging trends in industrial inkjet printing. It discusses various inkjet technologies like drop on demand and continuous inkjet printing. It outlines considerations for inkjet inks like colorants, resins, and solvents. The document also explores future developments and both traditional and emerging applications of inkjet printing like industrial marking, biomedical uses, electronics, and 3D printing. It provides examples of emerging markets for inkjet like industrial grayscale printing, printing using robots, and applications involving aroma jetting.
Evaporation effects on jetting performanceRobert Cornell
This document discusses evaporation effects on inkjet performance and image quality. It summarizes that as nozzles sit idle, water evaporation causes large localized viscosity variations in the inkjet ejector. This has a negative impact on jetting performance and print quality. The document then goes into detail explaining the multi-physics involved, including heat and mass convection/diffusion at the ink-air interface, and how this affects the transient viscosity fields and ultimately jetting and image quality. Models are used to predict and understand these relationships and tradeoffs between ink formulation, environmental effects, and ejector design.
Micromachined Electro-Mechanical Systems, also called microfabricated Systems, have evoked great interest in the scientific and engineering communities. This is primarily due to several substantive advantages that MEMS offer: orders of magnitude smaller size, better performance than other solutions, possibilities for batch fabrication and cost-effective integration with electronics, virtually zero dc power consumption and potentially large reduction in power consumption, etc.
This Seminar would give an introduction to these exciting developments and the technology and design approaches for the realization of these integrated systems. It would be followed with an introduction to the design of microsensors, such as the pressure sensor and the accelerometer, which began the MEMS revolution.
A systematic approach is developed to select manufacturing Process Chains for the generic elements of a MEMS device. A database of MEMS Process Chains and their attendant process attributes is developed from the existing literature, and used to construct Process Attribute charts. The performance requirements of MEMS beams and trenches are translated into the same set of Process Attributes. This allows for a screening of the Process Chains to obtain a list of candidate manufacturing methods.
I begin with a quick introduction to MEMS technology, micron scale and show that silicon is eminently suited for micromechanical devices and therefore the possibility of integrating MEMS with VLSI electronics. Smart cell phones and wireless enabled devices are poised to become commercial engines for the next generation of MEMS, since MEMS provide not only better functionality with smaller chip area, but also alternative transceiver architectures for improved functionality, performance and reliability.
The application domains cover microsensors and actuators for physical quantities, of which MEMS for automobile & consumer electronics forms a large segment; microfabricated subsystems for communications and computer systems.
This document provides information on ink jet printing of textiles. It discusses various aspects of ink jet printing technology including printhead technologies like piezo and thermal drop-on-demand, resolutions, ink types, printer classifications and examples. It summarizes key elements of ink jet printing like the printhead, fabric feed system, ink, fabric, software and pre/post-treatment processes.
Electrostatic Sprayer for Agricultural ApplicationBholuram Gurjar
Electrostatic sprayer for agricultural application
In order to protect food and fibre crops against insect, disease and weed pests, usage of agricultural chemicals such as insecticides, fungicides and herbicide is essential. Entomological studies have established that in numerous cases, smaller droplets of pesticide spray provide greater biological efficacy per unit mass of pesticide than do the larger droplets for achieving insect control but drift was the major problem. Thus, the recent concept of spraying is to spray the target pest more efficiently by selecting optimum droplet size and density for maximum retention and coverage. Some cases in rather old data, 95% of the chemical applied can be wasted to the ground or at most 50% of mass transfer onto the desired plant. Electrostatic spraying would offer a possible solution to those environmental problems; by reducing spray drift and improving coverage of chemical to target plant. These application areas broadly include ground equipment for spraying plants of row crops, orchards and greenhouse, even aircraft spraying.
An inductive electrostatic sprayer was designed by Weidong, et al. The test result showed that the charge-to-mass ratio could reach 0.951 mC/ Kg when electrostatic voltage was 20 kV and working pressure was 0.25 to 0.4 MPa. The particle size distribution of charged droplets were more concentrated than that of uncharged droplets, the axial velocity of charged droplets was faster than that of uncharged droplets, and the velocity distribution uniformity was also improved. The average deposition rate under charging conditions was 14% higher than that in uncharged conditions. Moreover, the deposit rate of the back of the leaf was evident.
Previously designed and constructed electrostatic sprayer was evaluated in order to quantify the charging of droplets (Maynagh, et al). Liquid atomization was achieved by using an ultrasonic nozzle. The maximum flow rate of nozzle was 25 ml/ minute and vibration frequency was about 30 kHz. The induction method was used for charging the output droplets. The independent parameters in this study included: voltage at four levels of 1.5, 3, 5 and 7 kV; air flow speed at six levels of 14, 14.9, 17, 20.2, 21.6 and 23 ms-1; charging electrode radius in two levels of 10 and 15 mm, horizontal distance between the electrode and nozzle tip at four levels of 1.5, 6, 10 and 15 mm; and liquid flow rate at three levels of 5, 12 and 25 ml/ minutes. The maximum charging occurred at 5 ml/ min flow rate, voltage of 7 kV, air flow speed of 23 ms-1 and the resulting current was 0.24 μA. On dividing the electrical current by the liquid flow rate and changing the scale, the mean charge to mass ratio was 1.032 μC g-1.
References
Jai W; Xue F; Qui B. (2013). Design and Performance of Inductive Electrostatic Sprayer. Journal of Applied Sciences, Engineering and Technology 5(21): 5102-5106.
Maynagh B. M; Ghobadian B; Jahannama M. R. and Hashjin T. T. (2009). Effect of
From almost zero to a multi-billion dollar market in three years!
Apple introduced the iPhone 5s in 2013, after acquiring Authentec a year earlier. Since then, fingerprint sensors have been massively adopted, and the volumes of sensors shipped into the consumer market have grown incredibly. At first, the sensors were a convenience and protection feature for unlocking phones. However, they are now shifting into a security feature for online identification and mobile payment in an increasing number of smartphones.
From 23 million units in 2013, 689 million fingerprint sensors for smartphones were sold in 2016. This is an incredible 210% compound annual growth rate (CAGR) between 2013 and 2016! The 2016-2022 timeframe will see a more reasonable, but still impressive, 19% CAGR.
Fingerprint sensing is becoming a mandatory feature on every smartphone, adding a lot of value. However such an increase in volume is always followed by strong cost pressure, and this is what has happened over the last three years. The average cost of a fingerprint sensor has decreased from around $5 in 2013 to $3 in 2016, and even less for low-end technologies. And the pressure hasn’t gone away. Current technologies have now reached maturity, and are threatened by new technologies, which need lower cost to gain momentum. This is the case for ultrasonic detection, for instance.
For more information please visit our website: http://www.i-micronews.com/reports.html
Wire electrical discharge machining uses a thin electrically charged wire as an electrode to cut conductive materials precisely through controlled electrical sparks. During the process, hundreds of thousands of sparks per second melt and vaporize tiny amounts of material from both the wire and workpiece. The wire is continuously advanced and small debris is flushed away by a dielectric fluid, allowing complex shapes to be cut without physical contact between the wire and workpiece. This results in parts with an excellent surface finish and no burrs.
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Wire electrical discharge machining uses a thin electrically charged wire as an electrode to cut conductive materials precisely through controlled electrical sparks. During the process, hundreds of thousands of sparks per second melt and vaporize tiny amounts of material from both the wire and workpiece. The wire is continuously advanced and small debris is flushed away by a dielectric fluid, allowing complex shapes to be cut without physical contact between the wire and workpiece. This results in parts with an excellent surface finish and no burrs.
Wire electrical discharge machining (EDM) is a non-traditional machining process that uses electricity to cut any conductive material precisely and accurately with a thin, electrically charged copper or brass wire as an electrode. During the wire EDM process, the wire carries one side of an electrical charge and the workpiece carries the other side of the charge. When the wire gets close to the part, the attraction of electrical charges creates a controlled spark, melting and vaporizing microscopic particles of material. Plasma arc cutting (PAC) uses a plasma torch to direct a high-velocity jet of hot plasma from an ionized gas to cut electrically conductive materials. PAC systems operate on either a non-transferred arc mode or transferred arc
Wire electrical discharge machining uses a thin electrically charged wire as an electrode to cut conductive materials precisely through controlled electrical sparks. During the process, hundreds of thousands of sparks per second melt and vaporize tiny amounts of material from both the wire and workpiece. The wire is continuously advanced and small debris is flushed away by a dielectric fluid, allowing complex shapes to be cut without physical contact between the wire and workpiece. This results in parts with an excellent surface finish and no burrs.
Spark generation in Electrochemical discharge machining(ECDM) of non-conducti...Akhil R
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This document provides an overview of advanced machining processes including chemical machining, electrochemical machining, electrical discharge machining, laser beam machining, water jet machining, and abrasive jet machining. It describes the basic mechanisms and capabilities of each process. Examples are given of complex parts that can be manufactured using these processes like biomedical implants, turbine blades, and microscopic gears. Nanofabrication techniques are also discussed for producing extremely small features at the micro and nanoscale.
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Scanning electron micronscope - Its applicability in the field of ayurveda (Rassashastra) to find find out the size of the bhasma particle its distribution and view 3D crystalline structure view of bhasmas. The resoluton in scanning electron microscope is greater hence views better images of bhasmas. SEM is most commonly used in the field of rasashastra. SEM analysis very much useful in nanomedicine for viewing the particle sizes in greater resolutions. SEM analysis is a step in standisation of ayurvedic bhasmas. Apart ffrom bhasma pariksha vidhis in ayurveda this novel instrument applicability on in the field of rasashastra helps to find the exact size of the particle.
electrochemical discharge machining.
also known as electrochemical spark machining.
we covert normal drilling machine in electrochemical spark machining and perform drilling operation on the work piece and create a macrohole in a quartz glass. the results are shown in the ppt.
we created this project under the head of department of mechanical engineering ER. Rakesh sigh sir and ER.mudit tyagi sir from mtech department from noida institute of engineering and technology, greater noida.
Fabrication of micro-features and micro-tools using electrochemical micromach...Sayan Mallick
Advanced machining process for electrically conductive materials.
In this setup a sewing needle with 47 μm tip diameter as a tool.
The fabrication of micro-tools
is done on a different setup.
Variations of wire diameter and the material removal rate with time are studied.
The document provides information on the integrated circuit fabrication process. It discusses how cleanrooms are used to fabricate circuits without impurities. The lithography process is described, which uses masks and photoresist to pattern layers on the wafer. Doping is achieved through diffusion or ion implantation to introduce impurities into the silicon substrate in a controlled manner. Key steps like oxidation, etching, and metallization are also outlined. The document provides a high-level overview of the major processes involved in IC fabrication.
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Electron beam machining (EBM) is a high-energy beam process invented in 1952 that uses an electron beam to remove material. Electrons are generated and accelerated to high velocities, focusing the beam into a small spot to intensely heat and melt or vaporize material. The process occurs inside a vacuum chamber to prevent electron scattering. Key parameters that control the machining include accelerating voltage, beam current, pulse duration and spot size. EBM can drill small, high aspect ratio holes and cut intricate shapes in a wide range of materials.
OES is the reference analysis technique for elemental analysis of solid metallic samples . that uses the light emitted of an excited element and (PMT) convert the light in an electrical signal. that can be read by the instrument computer and the software
Electron beam machining by Himanshu VaidHimanshu Vaid
Electron beam machining (EBM) is a thermal process that uses a focused beam of high-velocity electrons to perform high-speed drilling and cutting. It works by melting and rapidly vaporizing materials using the intense heat from electrons. The process requires specialized equipment that generates an electron beam through thermionic emission, accelerates the electrons, focuses the beam using electromagnetic lenses, and performs beam deflection inside a vacuum chamber to machine a workpiece. EBM can drill very small, high-aspect ratio holes at high speeds in almost any material without mechanical forces. However, it has high capital costs and requires regular maintenance of the vacuum systems.
This document describes the design and fabrication of a miniaturized optical chopper for use in infrared analysis systems. Microelectromechanical systems (MEMS) technology is used to create an optical chopper that is much smaller than conventional bulk choppers. The chopper consists of a solenoid, permanent magnet, and thin polydimethylsiloxane membrane. Applying a current to the solenoid causes the magnet to vibrate vertically on the membrane through electromagnetic attraction and repulsion, chopping infrared light passing through. The chopper was fabricated using microfabrication techniques and can operate at frequencies up to 200 Hz, providing faster switching than bulk choppers in a much smaller package suitable for portable infrared analysis applications.
The document provides an overview of integrated circuit fabrication processes. It discusses the basic steps including wafer production, epitaxial growth, etching, masking, doping, diffusion, implantation, and metallization. It also describes the fabrication processes for MOSFETs including NMOS, PMOS and CMOS. BiCMOS fabrication is also summarized, which combines BJT and CMOS processes to achieve high speed and low power benefits.
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Quality Function Deployment (QFD) Seminar PresentationOrange Slides
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Odoo provides an option for creating a module by using a single line command. By using this command the user can make a whole structure of a module. It is very easy for a beginner to make a module. There is no need to make each file manually. This slide will show how to create a module using the scaffold method.
How to Make a Field Mandatory in Odoo 17Celine George
In Odoo, making a field required can be done through both Python code and XML views. When you set the required attribute to True in Python code, it makes the field required across all views where it's used. Conversely, when you set the required attribute in XML views, it makes the field required only in the context of that particular view.
A workshop hosted by the South African Journal of Science aimed at postgraduate students and early career researchers with little or no experience in writing and publishing journal articles.
This presentation includes basic of PCOS their pathology and treatment and also Ayurveda correlation of PCOS and Ayurvedic line of treatment mentioned in classics.
A review of the growth of the Israel Genealogy Research Association Database Collection for the last 12 months. Our collection is now passed the 3 million mark and still growing. See which archives have contributed the most. See the different types of records we have, and which years have had records added. You can also see what we have for the future.
Executive Directors Chat Leveraging AI for Diversity, Equity, and InclusionTechSoup
Let’s explore the intersection of technology and equity in the final session of our DEI series. Discover how AI tools, like ChatGPT, can be used to support and enhance your nonprofit's DEI initiatives. Participants will gain insights into practical AI applications and get tips for leveraging technology to advance their DEI goals.
ISO/IEC 27001, ISO/IEC 42001, and GDPR: Best Practices for Implementation and...PECB
Denis is a dynamic and results-driven Chief Information Officer (CIO) with a distinguished career spanning information systems analysis and technical project management. With a proven track record of spearheading the design and delivery of cutting-edge Information Management solutions, he has consistently elevated business operations, streamlined reporting functions, and maximized process efficiency.
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Date: May 29, 2024
Tags: Information Security, ISO/IEC 27001, ISO/IEC 42001, Artificial Intelligence, GDPR
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This presentation was provided by Steph Pollock of The American Psychological Association’s Journals Program, and Damita Snow, of The American Society of Civil Engineers (ASCE), for the initial session of NISO's 2024 Training Series "DEIA in the Scholarly Landscape." Session One: 'Setting Expectations: a DEIA Primer,' was held June 6, 2024.
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How to Setup Warehouse & Location in Odoo 17 InventoryCeline George
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3. INTRODUCTION
• Ink-jet printing technique is very attractive for forming micro-size
patterns for flat panel displays (FPDS),
• Printing circuit board (PCB),
• Semiconductor,
• Biological,
• Optical,
• Sensor devices
• due to its low temperature process, direct writing, and rapid
photolithography process
3
4. • The inkjet printing mechanisms has been used are
• Thermal method
• Piezoelectric method
• Electrostatic method
INTRODUCTION Cont..
4
5. • Thermal and piezoelectric inkjet printing are based on pushing
out the liquid in a chamber through a nozzle by actuators, such
as thermal bubble and piezoelectric actuators.
• Thermal bubble actuator has the heat problem when the array
of nozzle make in a large area
• Piezoelectric actuator is difficult to make droplet smaller than
nozzle size . The head consisting of piezoelectric or a heater
element has the disadvantage of the complex structure
INTRODUCTION Cont..
5
6. • Electrostatic inkjet are based on protruding through an orifice
induced by an electric field forms a meniscus called the Taylor
cone.
• Also it can separate from the meniscus tip as fine droplets
much smaller than the orifice diameter.
• Electrostatic inkjet has a greater advantage than piezoelectric
inkjet and thermal inkjet in the ability to eject fine droplets and
in the simplicity of structure
INTRODUCTION Cont..
6
7. SCOPE
This paper discusses about the design and fabrication of
optimized geometry structure of Electrostatic Inkjet Head.
7
8. Objective
To design and fabricate inkjet heads to achieve an effective
micro dripping ejection, to provide concentrated electric force
on nozzle and pole tip.
DESIGN & SIMULATION
8
9. • They designed and fabricated the following electrostatic
inkjet heads,
• electrostatic inkjet heads, hole type
• electrostatic inkjet heads, Pole type
Hole type Inkjet Head Pole type inkjet head
DESIGN & SIMULATION
9
10. • This structure consists of
1. Reservoir,
2. Nozzle
3. Conductive pole to concentrate electric field.
DESIGN & SIMULATION Cont…..
Hole type Inkjet Head
Hole type Inkjet Head
10
11. Schematic of the proposed Pole type inkjet head
electrostatic inkjet head.
1. This structure consists of glass electrode part
2. Nozzle part with a reservoir.
Fig. 3. The structure of the proposed pole type electrostatic inkjet
head.
11
12. Δ .Є Δ.Ф = -þ
Ē= - ΔФWhere
• Ē -electric field vector
•-Ф- electric potential
• Є- permittivity
• þ - charge density
• Micro droplet is formed from the liquid meniscus due the
induced electric field.
• The electric field is obtained by solving the following
governing equations. (These equations are solved by FEM
method)
DESIGN & SIMULATION Cont…
12
13. • The inkjet head utilizes electrostatic forces that act between
electrode and nozzle tip.
• The electrostatic forces are created when a voltage is applied
electrode and head bottom.
• The surface of the inkjet head becomes wet with liquid after
applying an electric field.
• Then charged liquid is separated from the inkjet head tip as
fine droplets.
Mechanism of Spray formation
13
14. • When the force induced by an electric field on the inkjet head
tip is stronger than the resultant force of
• surface tension,
• ink viscosity and
• conductivity,
• The meniscus called Taylor cone is generated and fine droplets
is separated from the head by Coulomb force.
Mechanism of Spray formation Cont..
14
15. Need For Simulation
• In order to verify effect of geometry shape, we simulate
electric field intensity according to the head structure.
15
18. Result of the Electric field simulation of the hole type inkjet head
Electric field simulation of the hole type inkjet head showed
the following results
• The electric field strength increases linearly with increasing
height of the micro nozzle.
• Also, as the height of the nozzle increases, the electric field
along the periphery of the meniscus can be more concentrated.
18
19. • In order to find optimal structure and demonstrate
concentration of electrostatic force at the pole edge, pole type
inkjet head is simulated using FEMLAB.
19
20. Result of the electric field simulation used the DI water as the liquid
solution.
20
21. Result of the Electric field simulation of the hole type inkjet head
• The structure of the nozzle inner diameter = 80 μm
• Thickness, 20 μm
• Pole diameter are, and 40 μm,
• The pole height is 50 μm.
As the result, the concentration of electrostatic force was shown
at the conductive pole edge.
21
22. FABRICATION
• Electrostatic inkjet head consist of 2 layers
• Glass top layer
• Silicon bottom layer.
• Fabrication is done using
• thermal-oxidation
• silicon micromachining technique .
22
23. Fabrication process Cont…
• SiO₂ layer on silicon wafer.
• Oxide(deep Si etch mask)
patterning and deep Si etching.
• Reservoir patterning on the
bottom silicon wafer.
23
24. • Deep Si etching.
• Deep Si etching for pole
formation.
• SiO₂ removal by HF solution.
Fabrication process Cont…
24
25. Fig. 7. Fabrication Process : (a) SiO2 layer on silicon wafer, (b)
Oxide(deep Si etch mask) patterning and deep Si etching, (c)
reservoir patterning on the bottom silicon wafer, (d) Deep Si
etching, (e) Deep Si etching for pole formation, (f) SiO2 removal
by the HF solution.
25
29. • This system consists of
• The head system,
• High speed camera,
• Micro syringe pump,
• Power,
• Computer
EXPERIMENTAL SET UP Cont….
29
30. • To visualize droplet ejection. high speed camera (IDT XS-4)
with a micro-zoom lens and a halogen lamp was used
• The high speed camera can image 5000 frames per second at a
512 x 512 resolution with a micro-zoom lens and a LED light
source were used.
• .
EXPERIMENTAL SET UP Cont….
30
31. • A high voltage power supply (maximum voltage of 3.0 kV)
was used with a relay switch to control electrostatic field.
• The liquid have been supplied to the nozzle with constant
velocity by micro syringe pump and the voltage has been
provided to the upper electrode
EXPERIMENTAL SET UP Cont….
31
32. • The jetting mode depends on
• the applied voltage,
• the flow rate,
• liquid properties such as
• Electric conductivity,
• surface tension,
• and viscosity.
EXPERIMENTAL SET UP Cont….
32
33. • To make an experiment on the micro ejection of the
electrostatic inkjet head, the conductive liquid of the mixture
of D2O, SDS, and micelle-suspended Carbon Nano Tube (5
%wt SWNT) solution is used as ink.
• The outer diameter of the nozzle is 50 μm
• The gap between the upper electrode
• The nozzle orifice is set about 800 μm.
• The constant flow rate by a micro pump is kept at
0.1 μl/min.
EXPERIMENTAL SET UP Cont….
33
34. Results
• When flow rate is made constant at 0.1µl/min and 1.7KV is
supplied, a droplet 80µm is obtained.
Fig. 12. Images taken with high-speed camera showing eve
micro ejection from nozzle of inkjet head.
34
35. • When flow rate is made constant at 0.1µl/min and the supplied
voltage is kept at 2.5 kV. The droplet diameter ejected from the
nozzle tip is measured about 10 μm.
Results Cont……
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36. Conclusion
• This paper discussed about the design and fabrication of the
following electrostatic inkjet heads.
• electrostatic inkjet heads hole type
• electrostatic inkjet pole type
• It was fabricated using thick-thermal oxidation and silicon
micromachining technique such as
• the deep reactive ion etching (DRIE)
• chemical wet etching process.
• The fabrication process used is very simple and reproducible..
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37. REFERENCES
• Design and Fabrication of Electrostatic Inkjet Head using Silicon Micromachining
Technology Youngmin Kim*, Sanguk Son*, Jaeyong Choi*, Doyoung Byun**, and Sukhan
Lee* JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, VOL.8,
NO.2, JUNE, 2008
• Yuji Ishida, Kazunori Hakiai, Akiyoshi Baba and Tanemasa Asano, “Electrostatic Inkjet
Patterning Using Si Needle Prepared by Anodization,” Japanese Journal of Applied
Physics, Vol. 44, No. 7B, pp. 5786-5790, July 2005.
• S. Lee, D. Byun, S. J. Han, S. U. Son, Y. J. Kim, H. S. Ko, “Electrostatic Droplet
Formation and Ejection of Colloid,” MHS, July 31, 2004.
• S.U.Son, Y.M.Kim, J.Y.Choi, S.H.Lee, H.S.Ko, and D.Y.Byun, “Fabrication of MEMS
Inkjet Head for Drop-on-Demand Ejection of Electrostatic Force Method,” Trans. KIEE.
Vol.56. August, 2007.
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