Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED Applications_2015 Report by Yole Developpement

June © 2015
From Technologies to Market
Photolithography
for Advanced
Packaging, MEMS
& LEDs
Report
From Technologies to Market

2
Biography & contact
ABOUT THE AUTHORS
Amandine PIZZAGALLI,Market &Technology Analyst,Equipment and Materials for Advanced Packaging
ClaireTROADEC, Market &Technology Analyst,MEMS and Semiconductor Manufacturing
Amandine is in charge of equipment & material fields for the Advanced Packaging & Manufacturing team at Yole Développement
after graduating as an engineer in Electronics, with a specialization in Semiconductors and Nano Electronics Technologies. She
worked in the past for Air Liquide with an emphasis on CVD and ALD processes for semiconductor applications.
Contact: pizzagalli@yole.fr
©2015 | www.yole.fr | Photolithography for Adv. Packaging, MEMS and LEDs
Claire Troadec has been a member of the MEMS manufacturing team at Yole Développement since 2013. She graduated from
INSA Rennes in France with an engineering degree in microelectronics and material sciences. She then joined NXP
Semiconductors, and worked for 7 years as a CMOS process integration engineer at the IMEC R&D facility. During this time, she
oversaw the isolation and performance boost of CMOS technology node devices from 90 nm down to 45 nm. She has authored
or co-authored seven US patents and nine international publications in the semiconductor field and before joining Yole
Développement managed her own distribution and e-commerce company.
Contact: troadec@yole.fr
Jérôme AZEMAR,Market &Technology Analyst, Advanced Packaging Manufacturing
Jérôme Azémar is a member of the Advanced Packaging & Manufacturing team. Upon graduating from INSA Toulouse with a
master’s in Microelectronics and Applied Physics, he joined ASML and worked in Veldhoven for three years as an Application
Support Engineer, specializing in immersion scanners. During this time he acquired Photolithography skills which he then
honed over a two year stint as a Process Engineer at STMicroelectronics. While with ST he developed new processes, co-
authored an international publication and worked on metrology structures embedded on reticules before joining Yole
Développement in 2013.
Contact: azemar@yole.fr

3
TABLE OF CONTENTS
1/2
• Introduction, Definitions & Methodology
• Glossary
• Companies Cited in this Report
• Definitions, Limitations & Methodology
• Who Should be Interested in this Report?
• EXECUTIVE SUMMARY
 2014-2020 Forecasts Breakdown by application
o Lithography equipment market forecasts provided both in $M,
Munits with associated growth rates
o Volume shipment by application (packaging platform vs MEMS)
o Volume shipment by technology
 Overall Market Share: breakdown by MEMS,AP & LEDs
 Major suppliers positioning (by techno, by application)
• PART 1: CURRENT LITHOGRAPHY EQUIPMENT & MATERIALS
 Geographical mapping of the players
 Major suppliers positioning
 Technology overview (MA, Projection steppers, scanners)
 ADVANCED PACKAGING
o Equipment
 Current lithography technologies used
 Future or potential technologies used
 Current status
 Technical specification required
 Challenges
 Unmet needs by process step
 Technology trends
 2014–2020 market forecast in $M and units
 Equipment and materials suppliers involved in lithography
 Market share in 2014
 Case studies: cost structure examples and process steps
o Photoresist materials
 Current materials technologies used
 Trends
 Challenges
 Key technical specifications
 Market share in 2014
 Breakdown by material supplier
 Breakdown by type of photoresist:positive vs negative; spin
vs dry

4
TABLE OF CONTENTS
2/2
• Unmet needs by process step
• Technology trends
• 2014–2020 market forecast in $M and units
• Equipment & materials suppliers involved in lithography
• Market share in 2014
• Case studies: cost structure examples & process steps
o Photoresist materials overview
• PART II: DISRUPTIVETECHNOLOGIES
 Technology overview
o Laser direct imaging
o Laser ablation
o Nanoimprint lithography
 Geographical mapping of the players
 Major suppliers positioning
• PART III: LITHOGRAPHY COMPETITIVE LANDSCAPE SCENARIOS
ANDTRENDS
• Conclusions & Perspectives
• Company presentation
 MEMS
o Equipment
• Current lithography technologies used
• Future or potential technologies used
• Current status
• Technical specification required
• Challenges
• Unmet needs by process step
• Technology trends
• 2014–2020 market forecast in $M and units
• Equipment and materials suppliers involved in lithography
• Market share in 2014
• Case studies: cost structure examples and process steps
o Photoresist materials overview
 LEDS
o Equipment
• Current lithography technologies used
• Future or potential technologies used
• Current status
• Technical specification required
• Challenges

5
REPORT OBJECTIVES (1/2)
• We have decided to make a technology and market report on the lithography technology for the
following reasons:
• Growing interest for lithography has been noticed in the industry
• Competitive market which attracts new entrants in the lithography business
• The objectives of the reports are :
• Provide an overview of the lithography technologies
• Description of the key lithography applications
• Who are the current and future industrial users in each application
• Provide market data and forecasts on lithography equipment and materials for lithography technologies
• Identify the lithography solutions and equipment suppliers supporting Advanced Packaging, MEMS &
LEDs markets
• Determine the competing landscape for each segment mentioned above

6
REPORT OBJECTIVES (2/2)
• Assess the market for lithography tools
• Production forecast 2014-2020 in number of tools and in revenue
• Production forecast 2014-2020 by lithography method
• Players roadmap, expected year for market entry
• Analyze the lithography techniques (mask aligner, stepper, projection scanner, laser ablation, laser direct
imaging) trends
• Global lithography technologies and materials used for lithography trends
• Manufacturing challenges related to each lithography method
• Provide an overview of the technological trends for lithography tools and materials solutions for
lithography
• The following applications, where lithography processes are also required, are not included:
• Power devices (IGBT, MOSFET…)

7
WHO SHOULD BE INTERESTED IN THIS REPORT?
• Equipment & material suppliers:
• Identify new business opportunities and prospects
• Understand the differentiated value of your
products and technologies in this market
• Identify technology trends, challenges and precise
requirements related to lithography
• Evaluate your lithography technologies’ market
potential
• Position your company in the market
• Monitor and benchmark your competitors
• IDMs, CMOS foundries and OSAT players:
• Understand technology trends related to
lithography technologies when used in Advanced
Packaging, MEMS and LED devices
• Spot new opportunities and define diversification
strategies
• R&D organizations and investors:
• Evaluate market potential of future
technologies and products for new applicative
markets
• Identify the best candidates for technology
transfer
• Monitor the global activity and consolidation
currently occurring in the semiconductor
equipment and material business in order to
identify new partners and targets, and make
the right decisions before committing to one
particular supplier

8
COMPANIES CITED IN THE REPORT (NON-EXHAUSTIVE LIST)
ASML, Canon, Dongjin Semichem Co., Dow Corning Corporation, Dow Electronic Materials, Eulitha, Enthone (Cookson
Electronics), EVG Group, Hefel Advantools Semiconductor co, Ltd, HD Micro/Dupont, Heidelberg Instruments, JSR Micro, Limata,
SUSS MicroTech, JSR Micro, Merck/AZ Em, Micronic Mydata, Molecular imprint, Nikon, Obducat, Orbotech, ORC, Rudolph,
Shanghai Micro Electronics Equipment Co. Ltd. (SMEE), SCREEN,Tokyo Ohka Kogyo Co., LTD. (TOK), Shin-Etsu MicroSi,
Ultratech, USHIO,Visitech, and many more…

9
SCOPE OF THE REPORT
Indiquer appli
final market
Resolution
(µm)
10 µm1 µm0.01 µm 0.1 µm
Mainstream Front-End
(Logic+Memories)
> $400B
Advanced Packaging
>$9B
MEMS
>$11B
LEDs
>$14B
2014 Market size
($B)
Small
Large
Focus of the report

10
OVERVIEW OF LITHOGRAPHY TECHNOLOGIES
• There are 5 main available technologies that could be used in the Advanced Packaging, MEMS devices
and LED applications :
• Today, patterning is performed by various photolithography solutions such as: Mask aligner, Projection
stepper & scanner.
• Laser direct imaging and Laser ablation could be alternative solution to the lithography technologies used today
Patterning in
Advanced
Packaging is
required for
Via
formation,
bumping
process and
RDL
Lithography technologies
for Advanced Packaging,
MEMS & LEDs
Mask aligner Projection
Stepper
Scanner
Laser direct imaging Laser ablation NanoImprint
(NIL)
on production
on production
Ready for
production
Qualification on
FO WLP
Ready for production
Disruptive technologies
on production

11
STRONG COMPETITION INTHE LITHOGRAPHY AREA: HOW CAN NEW EQUIPMENT
VENDORS ENTERTHE MARKET AND BECOME SUCCESSFUL?
Advanced Packaging (all advanced
packaging platforms included)
MEMS devices LED devices
EQUIPMENTSUPPLIERS
Mask aligner
Projection
(Stepper &
scanner)
Laser ablation
Laser direct
Imaging
NIL
Stepper
NIL
Full-field
NIL
DTL

12©2015 | www.yole.fr | About Yole Développement
OVERVIEW OF THE EQUIPMENTVENDORS INVOLVED IN THE PACKAGING AREA
*SUSS provides Projection scanner which is in-between mask
aligner and projection stepper
Major competitors for steppers
Major competitors for Mask
aligners*
Internal re-use or re-sale

13
LITHOGRAPHY EQUIPMENT TECHNOLOGY
Price vs Resolution capabilities
Top-tiers vs
specialized
equipment
vendors
Price ($M)
Resolution (µm)
$1M
$2M
$3M
$4M
1 µm 2 µm 3 µm 4 µm
Laser ablation

14
Current solutions
Type of lithography
technologies
Mask aligner
Projection Laser
direct
imaging
Laser
ablation
Stepper Scanner
3D IC & 2.5D interposer
FO WLP
WLCSP
Flip Chip wafer
bumping on BGA
3D WLP (CMOS Image
Sensors)
Embedded die
FO WLP Panel
Organic/Glass panel
interposer
LITHOGRAPHY TECHNOLOGIES TRENDS IN ADVANCED PACKAGING
Disruptive technologies/Future solutions
Mask
aligner
Projection Laser
direct
imaging
Laser
ablation
NIL
Stepper Scanner

15
LITHOGRAPHY EQUIPMENT TECHNOLOGY
Price vs Resolution capabilities
l
Throughput (Wafer/hour)
Resolution (µm)
20
50
80
100
Stepper
~50-60
Laser
ablation
~20 to 100
(depending
on the
material
type)
1 µm 2 µm 3 µm 4 µm
Laser Direct
Imaging
~70 to 90
Scanner
Wafer
~75
Mask Aligner
~100

16
KEY LITHOGRAPHY CHALLENGES BY ADVANCED PACKAGING PLATFORM
With their own
characteristics
MEMS
PCB
Fan-Out
WLP
Package
FO WLP challenges
• Warpage
• Overlay issue due to die shift
3DIC
with
TSV
3D IC withTSV
• Resolution: < 2µm
• IR alignment
Flip-Chip
Flip Chip
• Sidewall coverage
• bump pitches reduced, very thick
resist required
Embedded Devices
Embedded die challenges
• Line width/spacing limited today
• Die placement accuracy
• Die shift issues
3-D WLP 3D WLP
• No specific concerns in
the lithography process
steps
WLCSP challenges
• Resolution
• Challenging to go down to
2µm L/S
• Vertical sidewalls
• Dielectric processing

17
0
50
100
150
200
250
2014 2015 2016 2017 2018 2019 2020
Toolshipmentforecast(inunits)
Projection Systems market forecast
(in unit of production tools)
Breakdown by application field
Advanced Packaging MEMS devices LED devices
Yole Developpement © July 2015
LITHOGRAPHY EQUIPMENT MARKET FORECAST
Number of production tools
Advanced
Packaging
represents
around a third
of the
projection
systems
shipped in
2014 and has
the highest
CAGR (10%)
©2015 | www.yole.fr | Photolithography for Adv. Packaging, MEMS & LEDs

18
PHOTORESIST FOR ADVANCED PACKAGING
Breakdown per equipment supplier
Ultratech is
leading the
lithography
market for
Advanced
Packaging
Yole Developpement © June 2015

19
PHOTORESIST FOR ADVANCED PACKAGING
Breakdown per material supplier
JSR is leading
the
photoresist
market for
Advanced
Packaging

20
PROFILES OF COMPANIES ADDRESSING THE MEMS MARKET
2 main profiles
serving the MEMS
projection system
market:
Mainstream Front
End players with
internal re-use or
re-sale equipment
Niche market
players with
dedicated new
MEMS equipment
Mainstream
Front End
2014 Revenue ($M)
>$100M
Niche
markets
> $150M
> $1B
> $10B
Mainly internal re-use or re-sale base
New equipment base

21
MEMS PROJECTION SYSTEMS TAM
For new equipment in Units
We estimate
the total
available
market to be
42 tools in
2014.This
would
represent a
9% CAGR2015-
2020
C

INVOLVEMENT OF THE FE AND BE EQUIPMENT SUPPLIERS
• Requirements especially in the Advanced Packaging have driven the adoption of equipment coming from Front-
End and Back-End area
migration for equipment suppliers towards Middle-End space
FE
Wafer manufacturing
++ More suitable for achieving
aggressive features
-- Expensive
BE
Assembly &Test
++ Lower cost
-- Scaling issues
Specialized equipment
vendors already involved
in the Packaging area

Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED Applications_2015 Report by Yole Developpement

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