The document provides a teardown analysis and comparison of the Apple iPhone 5S and Samsung Galaxy S5 smartphones. Key components identified in each phone include the application processors (Apple A7 and Qualcomm Snapdragon 801 respectively), memory (LPDDR3 DRAM and multi-level cell NAND flash), cellular modems, WiFi/Bluetooth chips, and various RF components. Microscopic analysis was performed to examine the design of the processors, memory, and other chips. Both phones use advanced manufacturing processes for their application processors and memory.

1. CHIPWORKS CONFIDENTIAL
All content © 2013, Chipworks Inc. All rights reserved.
Inside Today’s Systems & Chips: A
Survey of the Past Year
Dick James, Senior Fellow/Technology Analyst,
Chipworks

2. CHIPWORKS CONFIDENTIAL
All content © 2013, Chipworks Inc. All rights reserved.
Outline
2
◆Chipworks Inc.
◆Apple’s iPhone 5S
◆Samsung Galaxy S5
◆Design win tracking
◆Patents & patent landscapes
◆Summary & conclusions

3. CHIPWORKS CONFIDENTIAL
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3

4. CHIPWORKS CONFIDENTIAL
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YES!!!
◆ RE is actually protected by the USA Semiconductor Chip
Protection Act:
Title 17. Copy rights
Chapter 9. Protection of Semiconductor Chip Products
906. Limitations on exclusive rights; reverse engineering; first
(a) Notwithstanding the provisions of section 905, it is not an
infringement of the exclusive rights of the owner of a mask for –
(1) A person to reproduce the mask work solely for the purpose of
teaching, analyzing, or evaluating the concepts or techniques
embodied in the mask work or the circuitry. Logic flow, or
organization used in the mask work; or
(2) A person who performs the analysis or evaluation described in
paragraph (1) to incorporate the results of such conduct in an
original mask work which is made to be distributed
Reverse Engineering - Is it legal?

5. CHIPWORKS CONFIDENTIAL
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Apple iPhone 5s
LTE/WCDMA/CDMA/GSM
Smartphone

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6
Teardown
Apple iPhone 5S LTE/WCDMA/CDMA/GSM Smartphone

7. CHIPWORKS CONFIDENTIAL
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7
Baseband Processor (Qualcomm)
MDM9615M
Digital Compass
(Asahi Kasei)
AKM8963
M7 Co-Processor (NXP)
LPC18A1
A7 Application Processor (Samsung)
+ 8 Gb LPDDR3 SDRAM (SK Hynix)
H9CKNNN8KTMRKR
PCB #1 Display Side
Diversity Down-conversion Mixer
(Skyworks) SKY73614
Duplexer Banks (Murata)
LTE/WCDMA/CDMA/GSM Transceiver
+ GPS (Qualcomm) WTR1605L
Filter (Murata)
Apple iPhone 5S LTE/WCDMA/CDMA/GSM Smartphone

8. CHIPWORKS CONFIDENTIAL
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8
GSM PA (Skyworks)
SKY77493
LTE/WCDMA PA
(RFMD) RF3763
LTE PA (Skyworks)
SKY77496
LTE/WCDMA/CDMA PA
(Avago) AFEM-7925
LTE/CDMA PA
(Skyworks) SKY77572
LTE/WCDMA/CDMA PA
(TriQuint) TQF6414
PCB #2 Battery Side
WLAN + Bluetooth
(TDK) 339S0209
Antenna Switch
(RFMD) RF1112
Gyroscope
(STM) B352
Touch Panel Controller
(Broadcom) BCM5976
Touch Panel Controller
(TI) 343S0645
TI 65730A0P
128 Gb NAND Flash Memory
(Toshiba) THGBX2G7B2JLA01
Accelerometer
(Bosch) 1ED LP
Audio Codec (Cirrus
Logic) 338S1201
Power Management
(Qualcomm) PM8018
Display Interface
(NXP) NXP1610A1
Class D Audio Amplifier
(Cirrus Logic) 338S1202
Power Management
(Dialog) 338S1216
Apple iPhone 5S LTE/WCDMA/CDMA/GSM Smartphone

9. CHIPWORKS CONFIDENTIAL
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9
Power Amp
TQF6414 (TriQuint)
AFEM-7925 (Avago)
SKY77572 (Skyworks)
Digital TV
ABB
MDM9615M
(Qualcomm)
Audio
338S1201
(Cirrus Logic)
DBB
MDM9615M
(Qualcomm)
APP
A7
(Samsung)
WCDMA
WTR1605L
(Qualcomm)
GSM
WTR1605L
(Qualcomm)
Bluetooth
339S0209
(Murata)
Power Mgmt
PM8018 (Qualcomm)
338S1216 (Dialog)
Antenna SW
RF1112
(Murata)
NFC/RFIC
Power Amp
TQF6414
(TriQuint)
Power Amp
SKY77493
(Skyworks)
Speaker
Headphone
Microphone
LCD/OLED
Camera
WLAN
339S0209
(TDK)
GPS
WTR1605L
(Qualcomm)
Battery
Vibrator
Camera ISP
A7
(Samsung)
Flash Memory
THGBX2G7B2JLA01
(Toshiba)
Display Controller
A7
(Samsung)
DRAM
H9CKNNN8KTMRKR
(SK Hynix)
T/P Controller
BCM5976 (Broadcom)
343S0645 (TI)
LTE
WTR1605L
(Qualcomm)
Keypad
MicroSD
SIM
Sensors
Block Diagram
Apple iPhone 5S LTE/WCDMA/CDMA/GSM Smartphone

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10
Backlight: ON
Front Light: OFF
0.075
0.056
0.023
Apple iPhone 5S LTE/WCDMA/CDMA/GSM Smartphone
88 mm
49 mm
100 mm
Main Display Detail – Pixels

11. CHIPWORKS CONFIDENTIAL
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11
Unit: millimeter otherwise specified
Camera Module Size: 8.66 x 7.93 x 5.63
Camera Module Marking: AW34 5399
0791 s673
Sensor Diagonal Size: 5.58
Sensor Manufacturer: Sony
Sensor Board Thickness: 0.68
Apple iPhone 5S LTE/WCDMA/CDMA/GSM Smartphone
8 Mp CMOS Camera

12. CHIPWORKS CONFIDENTIAL
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◆ Samsung 28-nm HKMG process (Common Platform)
◆ Gate-first HKMG process, e-SiGe channel
◆ Minimum gate length observed ~38 nm
◆ SRAM cell area 0.12 µm2
12
Apple iPhone 5S LTE/WCDMA/CDMA/GSM Smartphone
Floorplan showing
some of the major
functional blocks
APL0698 A7 Application Processor
PMOS transistor
SRAM cell

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13
A7
Hynix 16 GB
NAND flash
Cross-section through iPhone 5s motherboard
Apple A7 PoP
Hynix 16GB NAND flash
Apple A7 Package-on-Package
A7
A7
SDRAM
SDRAM
Apple iPhone 5S LTE/WCDMA/CDMA/GSM Smartphone

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14
bond pad
control circuit
bitline control circuit
wordline
bitline
cell array cell array
wordline drivers
Polysilicon (poly) level
Top metal level – die size ~130mm2
Plan-view SEM of poly level
Plan-view TEM of wordlines
Toshiba 64-Gb, 19-nm NAND Flash
Apple iPhone 5S LTE/WCDMA/CDMA/GSM Smartphone

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Apple iPhone 5S LTE/WCDMA/CDMA/GSM Smartphone
Fingerprint Sensor
Front
Back

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16
Apple iPhone 5S LTE/WCDMA/CDMA/GSM Smartphone
Fingerprint Sensor
Package Cross Section Optical Image
Floorplan
TSMC 180-nm process

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Apple iPhone 5S LTE/WCDMA/CDMA/GSM Smartphone
Cellular #1
GPS/Cellular #2
WLAN/Bluetooth
Antennas

18. CHIPWORKS CONFIDENTIAL
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Samsung SM-G900S (Galaxy S5)
LTE/WCDMA/GSM Smartphone

19. Samsung SM-G900S LTE/WCDMA/GSM Smartphone
Teardown
19
touch panel
and display PCB #1
rear cover
rear panel
center panel
PCB #2

20. Samsung SM-G900S LTE/WCDMA/GSM Smartphone
PCB #1 Display Side
20
WLAN + Bluetooth (Samsung)
4452M3 309G4
Heart rate monitor (Maxim)
Proximity/light/gesture sensor
(mnf. unknown)
Barometer (STM) 408H
LED
MEMS (STM) ST 32A M409
MSM8974AC baseband/application
processor (Qualcomm Snapdragon
801) and 2 GB LPDDR3 SDRAM
(Samsung) K3QF2F20DA
Power management SoC (Maxim)
MAX77804K
Battery controller (Maxim)
MAX77826
32 GB NAND Flash memory
(Samsung) KLMBG4GEAC
Synchronous buck converter
(ON Semi)
LTE/WCDMA/GSM power amplifier
(Avago) ACPM-7617
Envelope tracker (Qualcomm)
QFE1101
LTE power amplifier (Avago) ACPM-7007
Filter (Murata) DN WD
WCDMA Band 1 SAW duplexer
(Epcos) B8518

21. Samsung SM-G900S LTE/WCDMA/GSM Smartphone
PCB #1 Battery Side
21
Antenna switch (Murata) SWCP GRG28
LTE/WCDMA/GSM + GPS receiver
(Qualcomm) WFR1620
LTE/WCDMA/GSM transmitter (Qualcomm)
WTR1625L
Microphone (Knowles Acoustics) S1209 1158
Digital TV (Silicon Motion) FC8080
NFC controller (NXP) NXP47803
LED flash
IR sensor (mnf. unknown)
Audio codec (Qualcomm) WCD9320
Accelerometer and gyroscope (Invensense)
MPU-6500
Voice processor (Audience) eS704
MHL transmitter (Silicon Image) Sil8240
Sensor hub (STM)
FPGA (Lattice) LP1K9D
Power management (Qualcomm) PMC8974

22. Samsung SM-G900S LTE/WCDMA/GSM Smartphone
PCB #2 Battery Side – Key Components
22
Microphone (Knowles Acoustics) S1219
5156
Antenna controller (RFMD)
RF1119
Cypress CY8C20075 CapSense Controller

23. Samsung SM-G900S LTE/WCDMA/GSM Smartphone
Block Diagram
23
Power Amp
ACPM-7617
ACPM-7007
(Avago)
Digital TV
FC8080
(Silicon Motion)
ABB
MSM8974AC
(Qualcomm)
Audio
PART NUMBER
(Mnf.)
DBB
MSM8974AC
(Qualcomm)
APP
MSM8974AC
(Qualcomm)
WCDMA
WTR1625L
WFR1620
(Qualcomm)
GSM
WTR1625L
WFR1620
(Qualcomm)
Bluetooth
4452M3
309G4
(Samsung)
Power Mgmt
PMC8974 (Qualcomm)
MAX77804 (Maxim)
Antenna SW
SWCP
GRG28
(Murata)
NFC
NXP47803
(NXP)
Power Amp
ACPM-7617
(Avago)
Power Amp
ACPM-7617
(Avago)
Speaker
Headphone
Microphone
LCD/OLED
Camera
WLAN
4452M3
309G4
(Samsung)
GPS
WFR1620
(Qualcomm)
Battery
Vibrator
Camera ISP
MSM8974AC
(Qualcomm)
Flash Memory
KLMBG4GEAC-B001
(Samsung)
Display Controller
MSM8974AC
(Qualcomm)
DRAM
K3QF2F20DA-QGCK
(Samsung)
T/P Controller
S5001A
(Synaptics)
LTE
WTR1625L
WFR1620
(Qualcomm)
Keypad
MicroSD
SIM
Sensors

24. Samsung SM-G900S LTE/WCDMA/GSM Smartphone
Main Display Detail – Pixels
24

25. Samsung SM-G900S LTE/WCDMA/GSM Smartphone
16 MP CMOS Camera
25

26. Samsung SM-G900S LTE/WCDMA/GSM Smartphone 26
bitline
W/TiN wordline
capacitors
◆ Samsung 4-Gbit DDR3 SDRAM
images shown (26-nm process)
◆ Al + Cu + W metals
◆ Two SiN support layers in capacitor
stack
◆ W/TiN BWL, tox ~4 – 6 nm
◆ BL is W/WN/W/TiN/WSi/polySi stack
◆ Capacitor height ~1.6 µm
Samsung 2 GB LPDDR3 SDRAM K3QF2F20DA

27. Samsung SM-G900S LTE/WCDMA/GSM Smartphone 27
Samsung 64 Gb K9GCGD8U0A NAND Flash memory
◆ Die size ~142 mm2, Al + Cu + W metals
◆ Tunnel ox ~6.8 nm, ~13 nm NONON IPD
◆ WL pitch ~42 nm, BL ~44 nm, cell size
~0.0018 µm2.
◆ FG ~24 nm long x ~18 nm wide, ~58 nm high
◆ W on control gate, air gaps between wordlines & M3
W

28. Samsung SM-G900S LTE/WCDMA/GSM Smartphone
Touch Panel & Fingerprint Sensor
28
Touch panel controller
(Synaptics) S5001A
Fingerprint scanner
(Synaptics/Validity)

29. Samsung SM-G900S LTE/WCDMA/GSM Smartphone
Antennas
29
WLAN/BT/DTV
Cellular #2/GPS
Cellular #1
WLAN/BT/DTV
Cellular #1

30. Samsung SM-G900S LTE/WCDMA/GSM Smartphone 30
Design Win Tracking – WiFi Parts
◆ Limited sample so far in 2014, BUT:
◆ Broadcom losing ground, Qualcomm, Murata, Mediatek, Skyworks gaining
◆ Mediatek up >300%

31. Samsung SM-G900S LTE/WCDMA/GSM Smartphone 31
Source: IFIclaims.com
Patents and Patent Landscape
◆ Patent assignees for 2013
◆ IBM head of the pack, as always
◆ Samsung gaining ground but still
2nd
◆ Apple still quite a way behind at
13th
◆ Intel 18th

32. Samsung SM-G900S LTE/WCDMA/GSM Smartphone 32
Patents and Patent Landscapes
MOVEMENT
VIDEO
IMAGE
CAMERA
PIXEL
LIGHT
TOUCHPAD
GUI
TOUCH
APPS
TOUCH
APPS APPS
DATABASE
SAAS
CLOUD
DATABASE
MESSAGING
MOBILE
KEYS
STORAGE TRANSACTIONS
SIRI
AUDIO
TIMING
RADIO
CHANNELS
CELLS
DESIGN
POWER
BATTERY
SHIELD
BOARD
CONNECT
◆ Each dot represents a
patent
◆ Topographical peaks
represent key concepts
within Apple’s portfolio
◆ Concepts with a high
density of dots are being
heavily patented by Apple
Apple’s Patent Landscape
Apple Granted Patents by Technology

33. Samsung SM-G900S LTE/WCDMA/GSM Smartphone 33
GUI
TOUCH
SOFTWARE
CLOUD
MOBILE
DESIGN
SIRI
Apple Granted Patents by Technology
RADIO
◆ A quick look at Apple’s 13,000
patents broken down by issue date
and type/origin – shows a healthy
purchasing of legacy patents, and
aggressive pursuit of design
patents which they have used
successfully in litigations
◆ Major recent increase in total # of
patents issued yearly indicates
Apple’s strategic decision to
pursue many patents regarding
their product releases since 2003
Apple’s Patent Landscape
Patents and Patent Landscapes

34. Samsung SM-G900S LTE/WCDMA/GSM Smartphone 34
Circuit
Process
Package
◆ 2004 – 2011 patents only
◆ Each dot is a patent
publication
◆ Circuit related patents
clustered on the left
region generally relate to
memory, power, imaging
◆ Process and packaging
patents clustered to the
right relate to
semiconductors,
fabrication, LEDs
memory
semiconductor
devices
packaging
fabrication
LED
power
imaging
Patents and Patent Landscapes
Samsung Electronics Patent Landscape

35. Samsung SM-G900S LTE/WCDMA/GSM Smartphone 35
Patents and Patent Landscapes
Samsung Electronics Patent Landscape
◆ More recent patents
and applications from
2011-2013 time frame
show a similar
distribution
◆ Appearance of
advanced technologies
observed

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36
Summary and Conclusions
◆ Quick reviews of Apple’s iPhone 5s and Samsung Galaxy S5
◆ RE lets us see BOMs, systems, circuit, process and market
info – and examine patent use when required
◆ Technology enables applications which drive technology which
enables applications.. right across the spectrum – APUs,
graphics, screens, PMICs, RF, etc., etc…
◆ We’re into 2x-nm processes for logic, DRAM, 1x for flash –
HKMG, double patterning, air gap dielectrics are here and in
consumer goods
◆ 3D stacks are slowly becoming reality
◆ In this industry we’re forever pushing the boundaries, and you
guys keep us RE types forever challenged!

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37
Acknowledgements
I would like to thank Chipworks’ laboratory staff and
process analysts for all the hard work of analyzing
these complex devices. They do a great job!
Thank you for your attention!