09.50 dhr van der zon
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The document discusses technologies for high density integration of semiconductor systems and packaging, including 3D stacking. It notes the market drivers for increased functionality and performance while reducing costs. Key technologies discussed include 3D through-silicon vias, smaller components, pick and place assembly, and new alignment concepts that aim to achieve placement accuracy of less than 4 microns in a scalable way with minimal calibration.
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In today's technology-driven business, High-Speed Digital (HDI) has become more and more in demand. Bringing with it the demand for electrical and thermal performance, along with sequential lamination. To achieve this demand, the performance and reliability of the material have become much more important.
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09.50 dhr van der zon
- 1. Ben van der Zon BlueBird Back-end electonics assembly and packaging Acive Positionning “ Less is Better”
- 2. Background High Density Integration of semiconductor systems ambient intelligence Autonomous smart systems: more functionality per mm cube Improved performance More than Moore: Beyond a few atomic diameters ? more functionality per mm square More Moore:
- 4. Background High Density Integration of semiconductor systems Source: University of California
- 6. Background High Density Integration of semiconductor elements: 3D-TSV TSV creation Carrier bonding Placing Collective bonding Molding Singulation Cleaning Wafer thinning Dicing Picking Inspection TSV filling
- 8. Cost of ownership 0,00 10,00 20,00 30,00 40,00 50,00 60,00 70,00 80,00 B1 Carrier wafer bonding B2 Thinning B3.1 Application resist B3.2 Patterning B3.3 Development B3.4 DRIE etching B4 TSV filling B5 UBM & bumping B6 Waferprobing B7 Dicing B8 Pick, carrier de-bonding B9 Inspection B10 Place B11 Die bonding B12 Dicing B13 Flip chip or die bonding B14 Encapsulation B15 Singulation B16 End inspection & test B17 Marking B18 Packing Cost of Ownership [$/wafer] Cost of Ownership = 300 $ Cost of Ownership = 150 $
- 10. Pick & Place state-of-the-Art
- 16. P&P topologies
- 17. Fluid selfassembly Tolley et al