The document discusses advancements in 3D integration technologies using through-silicon vias (TSV). It notes that existing metrology tools are insufficient for characterizing TSVs and that optical scatterometry and interferometric techniques show promise but require further development. The document also discusses how hybrid photonic integration could enable terabit communication but will require optical testing and characterization.
Nanoimprint Lithography head points:
Approaches: thermal and UV NIL
Properties of NIL
Overview. of NIL
Thermal NIL resists.
Residual layer after NIL.
NIL for large features (more difficult than small one).
Room temperature NIL, reverse NIL, inking.
NIL of bulk resist (polymer sheet, pellets).
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Thanking-You
Preeti Choudhary
New Application Of Nanowires for Implantable Medical Devicesbrandypearson
Investigative research project proposal for Nanoscience graduate course. Explores potential use of growth of titatium oxide on implantable medical devices for improved bio-compatibility and anchoring within the body.
Plenary lecture given by Prof. Kenneth Gonsalves (ITT Mandi, India) on September 12, 2017 in Gramado (Brazil) during the XVI B-MRS Meeting. Acknowledgment: ITT Mandi.
Nanoimprint Lithography head points:
Approaches: thermal and UV NIL
Properties of NIL
Overview. of NIL
Thermal NIL resists.
Residual layer after NIL.
NIL for large features (more difficult than small one).
Room temperature NIL, reverse NIL, inking.
NIL of bulk resist (polymer sheet, pellets).
https://www.linkedin.com/in/preeti-choudhary-266414182/
https://www.instagram.com/chaudharypreeti1997/
https://www.facebook.com/profile.php?id=100013419194533
https://twitter.com/preetic27018281
Please like, share, comment and follow.
stay connected
If any query then contact:
chaudharypreeti1997@gmail.com
Thanking-You
Preeti Choudhary
New Application Of Nanowires for Implantable Medical Devicesbrandypearson
Investigative research project proposal for Nanoscience graduate course. Explores potential use of growth of titatium oxide on implantable medical devices for improved bio-compatibility and anchoring within the body.
Plenary lecture given by Prof. Kenneth Gonsalves (ITT Mandi, India) on September 12, 2017 in Gramado (Brazil) during the XVI B-MRS Meeting. Acknowledgment: ITT Mandi.
Different types of Nanolithography technique.
Types: Electron beam lithography, Photolithography, electron-beam writing, ion- lithography, X-ray lithography, and related images, concepts and graphical views.
I hope this presentation helpful for you.
https://www.linkedin.com/in/preeti-choudhary-266414182/
https://www.instagram.com/chaudharypreeti1997/
https://www.facebook.com/profile.php?id=100013419194533
https://twitter.com/preetic27018281
Please like, share, comment and follow.
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If any query then contact:
chaudharypreeti1997@gmail.com
Thanking-You
Preeti Choudhary
This presentation includes basis of lithography i.e. (photo-lithography e-beam lithography) in nano-lithography includes (AFM, Soft, NIL and DPN lithography)
This project targets the development of novel pocket X-ray sources and X-ray direct detectors that will be combined in a distributed network to solve important tasks, for example in the field of security, by ensuring reliable and real-time monitoring of failure sensitive parts in large manufacturing plants or in public transportation.
The miniaturized X-ray sources are based on multi-wall carbon nanotube (CNT) cold electron emitters and advanced microsystems technology. The electron field emission properties of CNTs, with their high current densities, make them prime candidates for cold emitter cathodes. Using CNT cold electron emitters will make it possible to miniaturize the whole X-ray source. Additionally, as opposed to classical thermionic emission, field electron emission of the CNT is voltage-controlled which allows for high modulation frequencies up to GHz level. The X-ray direct detectors in turn are based on crystalline germanium absorption layers grown directly on a CMOS sensor chip yielding high resolution and high sensitivity X-ray detectors. Single photon detection will allow for a significant improvement of contrast for applications in security, health care and nondestructive testing.
Nanotechnology and its Economic FeasibilityJeffrey Funk
These slides apply the concepts from my course (Analyzing Hi-Tech Opportunities) to the field of nano-technology. Like the reductions in the feature sizes of transistors and metal lines on ICs (integrated circuits), in the micro-fluidic channels on bio-electronic ICs, and in the features of MEMS (micro-electronic mechanical systems), many physical phenomena become pronounced as the feature size decreases. Carbon nano-tubes, grapheme, quantum dots, nano-particles, and nano-fibers are examples of materials that benefit from small sizes. On the other hand, reductions in costs must be addressed through increases in the scale of production equipment and the creation of better processes; similar things occurred with other technologies such as displays and lighting.
Analysis Of Carbon Nanotubes And Quantum Dots In A Photovoltaic Device Slide ...M. Faisal Halim
Francis' presentation to Louis Stokes Association for Minority Participation. Since I co-authored this work I think I have the right to a copy. I was the graduate student Francis was working with.
Nanotechnology & its Nanowires Application (By-Saquib Khan)SAQUIB KHAN
Appropriate presentation for Nanotechnology & Nanowires Application. along with Nanowiresbattery.
By- SAQUIB KHAN
B.TECH.MECHANICAL ENGG.(First Year)
INTEGRAL UNIVERSITY
Lucknow
This presentation is a simple explain of Nano-springs which introduce this Nano-materials easily. You can use this PPTx File to present in your class and seminars as well. We prepare this file to present in Tabriz University of Medical Sciences when We were MSc Medical Nanotechnology student. It will be useful for you too.
Different types of Nanolithography technique.
Types: Electron beam lithography, Photolithography, electron-beam writing, ion- lithography, X-ray lithography, and related images, concepts and graphical views.
I hope this presentation helpful for you.
https://www.linkedin.com/in/preeti-choudhary-266414182/
https://www.instagram.com/chaudharypreeti1997/
https://www.facebook.com/profile.php?id=100013419194533
https://twitter.com/preetic27018281
Please like, share, comment and follow.
stay connected
If any query then contact:
chaudharypreeti1997@gmail.com
Thanking-You
Preeti Choudhary
This presentation includes basis of lithography i.e. (photo-lithography e-beam lithography) in nano-lithography includes (AFM, Soft, NIL and DPN lithography)
This project targets the development of novel pocket X-ray sources and X-ray direct detectors that will be combined in a distributed network to solve important tasks, for example in the field of security, by ensuring reliable and real-time monitoring of failure sensitive parts in large manufacturing plants or in public transportation.
The miniaturized X-ray sources are based on multi-wall carbon nanotube (CNT) cold electron emitters and advanced microsystems technology. The electron field emission properties of CNTs, with their high current densities, make them prime candidates for cold emitter cathodes. Using CNT cold electron emitters will make it possible to miniaturize the whole X-ray source. Additionally, as opposed to classical thermionic emission, field electron emission of the CNT is voltage-controlled which allows for high modulation frequencies up to GHz level. The X-ray direct detectors in turn are based on crystalline germanium absorption layers grown directly on a CMOS sensor chip yielding high resolution and high sensitivity X-ray detectors. Single photon detection will allow for a significant improvement of contrast for applications in security, health care and nondestructive testing.
Nanotechnology and its Economic FeasibilityJeffrey Funk
These slides apply the concepts from my course (Analyzing Hi-Tech Opportunities) to the field of nano-technology. Like the reductions in the feature sizes of transistors and metal lines on ICs (integrated circuits), in the micro-fluidic channels on bio-electronic ICs, and in the features of MEMS (micro-electronic mechanical systems), many physical phenomena become pronounced as the feature size decreases. Carbon nano-tubes, grapheme, quantum dots, nano-particles, and nano-fibers are examples of materials that benefit from small sizes. On the other hand, reductions in costs must be addressed through increases in the scale of production equipment and the creation of better processes; similar things occurred with other technologies such as displays and lighting.
Analysis Of Carbon Nanotubes And Quantum Dots In A Photovoltaic Device Slide ...M. Faisal Halim
Francis' presentation to Louis Stokes Association for Minority Participation. Since I co-authored this work I think I have the right to a copy. I was the graduate student Francis was working with.
Nanotechnology & its Nanowires Application (By-Saquib Khan)SAQUIB KHAN
Appropriate presentation for Nanotechnology & Nanowires Application. along with Nanowiresbattery.
By- SAQUIB KHAN
B.TECH.MECHANICAL ENGG.(First Year)
INTEGRAL UNIVERSITY
Lucknow
This presentation is a simple explain of Nano-springs which introduce this Nano-materials easily. You can use this PPTx File to present in your class and seminars as well. We prepare this file to present in Tabriz University of Medical Sciences when We were MSc Medical Nanotechnology student. It will be useful for you too.
This Presentation is based on our Research work carried out in GNDU Amritsar and DAVIET, Jallandhar. We fabricated Ion track filters; nanowires and some Exotic Patterns for the first time in India using simple Techniques.
Dr. Gernot S. Pomrenke presents an overview of his program, Photonics and Optoelectronics, at the AFOSR 2013 Spring Review. At this review, Program Officers from AFOSR Technical Divisions will present briefings that highlight basic research programs beneficial to the Air Force.
Instructions you are to read the assigned paper and prep.docxjaggernaoma
Instructions::::
you are to read the assigned paper and prepare the following:
· Summary (2 pages, 11 font size, double space)
· Discuss space-division multiplexing
· What it is
· The feasibility and potential future direction
· Implication of Shannon’s theorem in the achievement of high bit rate
· What can be considered the best technology for higher bit rate in optical fiber?
10 C O M M U N I C AT I O N S O F T H E A C M | O C T O B E R 2 0 1 6 | V O L . 5 9 | N O . 1 0
news
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tens of kilometers before it must be de-
tected and retransmitted. In ensuing
years the bit rate increased steadily,
driven both by faster transmitters and
receivers and by fiber designs that min-
imized the spread of the pulses.
As the pace of improvements began
to slow, researchers realized they could
send more information through fiber
by combining light of slightly differ-
ent wavelengths, each carrying its own
S
I N C E O P T I C A L F I B E R S were
first deployed for commu-
nications in the 1970s, the
number of bits per second
a single fiber can carry has
grown by the astonishing factor of 10
million, permitting an enormous in-
crease in total data traffic, including
cellular phone calls that spend most of
their lives as bits traveling in fiber.
The exponential growth resembles
Moore’s Law for integrated circuits.
Technology journalist Jeff Hecht has
proposed calling the fiber version
“Keck’s Law” after Corning researcher
Donald Keck, whose improvements in
glass transparency in the early 1970s
helped launch the revolution. The sim-
plicity of these “laws,” however, ob-
scures the repeated waves of innovation
that sustain them, and both laws seem
to be approaching fundamental limits.
Fiber researchers have some cards to
play, though. Moreover, if necessary the
industry can install more fibers, similar
to the way multiple processors took the
pressure off saturating clock rates.
However, the new solutions may not
yield the same energy and cost savings
that have helped finance the telecom-
munication explosion.
Optical fiber became practical when
researchers learned how to purify ma-
terials and fabricate fibers with extraor-
dinary transparency, by embedding
a higher refractive-index core to trap
the light deep within a much larger
cladding. Subsequent improvements
reduced losses to their current levels,
about 0.2 dB/km for light wavelengths
(infrared “colors”) near 1.55 μm. A la-
ser beam that is turned on and off to
encode bits can transmit voice or data
Optical Fibers
Getting Full
Exploring ways to push more data through
a fiber one-tenth the thickness of the average human hair.
Science | DOI:10.1145/2983268 Don Monroe
http://dx.doi.org/10.1145/2983268
O C T O B E R 2 0 1 6 | V O L . 5 9 | N O . 1 0 | C O M M U N I C AT I O N S O F T H E A C M 11
news
Nonlinear Shannon L.
Welcome to WIPAC Monthly the magazine brought to you by the LinkedIn Group Water Industry Process Automation & Control.
In this month's edition, along with this month's industry news to celebrate the 13 years since the group was created we have articles including
A case study of the used of Advanced Process Control at the Wastewater Treatment works at Lleida in Spain
A look back on an article on smart wastewater networks in order to see how the industry has measured up in the interim around the adoption of Digital Transformation in the Water Industry.
NUMERICAL SIMULATIONS OF HEAT AND MASS TRANSFER IN CONDENSING HEAT EXCHANGERS...ssuser7dcef0
Power plants release a large amount of water vapor into the
atmosphere through the stack. The flue gas can be a potential
source for obtaining much needed cooling water for a power
plant. If a power plant could recover and reuse a portion of this
moisture, it could reduce its total cooling water intake
requirement. One of the most practical way to recover water
from flue gas is to use a condensing heat exchanger. The power
plant could also recover latent heat due to condensation as well
as sensible heat due to lowering the flue gas exit temperature.
Additionally, harmful acids released from the stack can be
reduced in a condensing heat exchanger by acid condensation. reduced in a condensing heat exchanger by acid condensation.
Condensation of vapors in flue gas is a complicated
phenomenon since heat and mass transfer of water vapor and
various acids simultaneously occur in the presence of noncondensable
gases such as nitrogen and oxygen. Design of a
condenser depends on the knowledge and understanding of the
heat and mass transfer processes. A computer program for
numerical simulations of water (H2O) and sulfuric acid (H2SO4)
condensation in a flue gas condensing heat exchanger was
developed using MATLAB. Governing equations based on
mass and energy balances for the system were derived to
predict variables such as flue gas exit temperature, cooling
water outlet temperature, mole fraction and condensation rates
of water and sulfuric acid vapors. The equations were solved
using an iterative solution technique with calculations of heat
and mass transfer coefficients and physical properties.
We have compiled the most important slides from each speaker's presentation. This year’s compilation, available for free, captures the key insights and contributions shared during the DfMAy 2024 conference.
About
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
• Remote control: Parallel or serial interface.
• Compatible with MAFI CCR system.
• Compatible with IDM8000 CCR.
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
• Easy in configuration using DIP switches.
Technical Specifications
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
Key Features
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
• Remote control: Parallel or serial interface
• Compatible with MAFI CCR system
• Copatiable with IDM8000 CCR
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
Application
• Remote control: Parallel or serial interface.
• Compatible with MAFI CCR system.
• Compatible with IDM8000 CCR.
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
• Easy in configuration using DIP switches.
Using recycled concrete aggregates (RCA) for pavements is crucial to achieving sustainability. Implementing RCA for new pavement can minimize carbon footprint, conserve natural resources, reduce harmful emissions, and lower life cycle costs. Compared to natural aggregate (NA), RCA pavement has fewer comprehensive studies and sustainability assessments.
6th International Conference on Machine Learning & Applications (CMLA 2024)ClaraZara1
6th International Conference on Machine Learning & Applications (CMLA 2024) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications of on Machine Learning & Applications.
2. Advancements in Lithography
Evolution of Packaging
Advanced Packaging
TSV trends
Monolithic 3DI Manufacturing
3D integration with TSV – challenges
Existing metrology tools – discussion on a few
Holographic technique - proposal
Opportunities for 3D integration with optical
interconnects
Metrology for optical interconnects
3. Photolithography: Small mask feature (d)-> Large Lens
Multiple lithography steps
Pitch halving-quartering etc.
-> costly
2D moving ahead to
1x nm scales.
Waiting for High
Power EUV
Vertical dimension making up
Lack of 2D scaling
Source: Sam Shivashankar, YouTube- nanolearning
Rayleigh Criteria-> 𝑘1 can’t go below 0.3 !
-> use small 𝜆, 𝐿𝑎𝑟𝑔𝑒𝑟 𝑁𝐴 -> hitting limits
6. Current common packaging
Developing, TSV approach:
More interconnects and shorter
Interconnects -> Higher bit rate
Disadvantages of thinner longer wire interconnect:
1. Insufficient bandwidth, slow rise/fall pulse
2. Skin effect, Dielectric loss
3. Cross-talk
4. Low Bit-rate (B) between memory and CPU → Memory wall
Bit-rate 𝐵 𝛼 𝐴/𝑙2
David Miller, Opt. Inter., 1997, Proc IEEE June 2000
Currently CPUs are faster but memory to CPU Bit-transfer rate is
slow. We want higher performance…
8. In monolithic approach active layers and devices on them are built
sequentially in bottom up approach on top of a wafer.
Pros: The vertical interconnects are formed between layers rather than
chips, using vias in the 𝑛𝑚 rather than 𝜇𝑚 range.
Cons: High quality active layer isolation need to be formed between each
active layers.
2. Crystallinity of upper layers is often imperfect.
3. This approach works only if polycrystalline silicon could be used for
making devices.
Reference: 3D Integration for VLSI Systems
Chuan Seng Tan, Kuan-Neng Chen, Steven J. Koester
Better way : Stack chips with devices
9. 1. Temporary bonding needed before forming via, for thinning by CMP and debonding and
bonding again is a very complex and delicate process.
2. Thermal management issue:
• Stacking of memory chips alone does not produce heat issues, but integration with logic
Chip will have issues as neighboring memory chip will get high heat from adjacent
Logic chip.
• Copper via might help themselves will conduct out some heat but may not be enough.
• Low cost thermally aware via design is necessary
3. Copper reacts with Si, so passivation layer must be formed in the via walls before
filling in via with Cu, which is challenging
4. Stress is another issue:
Thermal expansively: Cu - 16.7ppm/C
W – 6-8 ppm/C
Si – 2.6 ppm/C
-> Stress development on wafer when TSVs expands.
10. • Thinned wafer/die handling and bow
management
• Si wafer cracking
• Supply of micro-bump between stacks.
• Defect visibility, measurement sensitivity and
identification
• Complexity of the system, hidden structures
• Design Test etc.
Reliable non-destructive
metrology is needed
11. Excellent tool for distinguishing and
quantifying crystallinity of silicon
surface
Crystalline silicon
has very sharp peaks, such as the
one centered at ~ 520 cm-1
Also, Micro-Raman spectroscopy:
useful to detect local stress on surface
12. Thesis: Keshab Raj Paudel, University of Missouri
𝑋𝑃𝑆, 𝑈𝑃𝑆: 𝐸 𝐵 = ℎ𝜈 − 𝐸 𝐾 − 𝑊
𝐴𝐸𝑆: 𝐾. 𝐸. = (𝐸 𝐾−𝐸𝐿1) − 𝐸23
Wide scan of 10nm Au nanoparticle on
Silicon surface
Angle resolved method:
-> Sensitive to nm scale layers
Chemical analysis of surface
Quantitative analysis
13. Dissertation: Keshab Raj Paudel, University of Missouri
Very sensitive and fast compared to
dispersive IR absorption technique.
Great for surface chemical analysis.
Observation of Si-O bands are very intense.
C-H, C-C etc. modes characterize/identify
materials on Silicon wafer
Natural Diamond
14. Source: OLYMPUS
3D Metrology using IR Microscopy
A non-destructive imaging technique
• In-line monitoring of the 3D bonding process:
• Overlay alignment offset monitoring
• Tracking process variations
• Post bond defect inspection and review
Confocal NIR microscopy using
interferometry looks further
Promising and is among already available
technologies and offers has new
possibilities
Limit: Can see only up to 𝟖𝟎𝟎 𝝁𝒎 inside
15. David Bernard, John Tingay et. al. "THE X-RAY METROLOGY OF TSVS AND
WAFER BUMPS” - Nordson DAGE, Feb 3, 2015
Oblique view x-ray image of 10 x 100 μm TSVs.
The lighter areas within the TSVs are voids.
X-ray image of 50 μm
diameter wafer bumps.
Top-down image.
Computer Tomography
16. Can limit X-ray beam from
0.1𝜇𝑚 𝑡𝑜 100𝜇𝑚 for higher resolution X − ray imaging
Working: Total External Reflection,
Critical incident angle,
𝜃𝑐 𝑟𝑎𝑑𝑖𝑎𝑛 = 002 ∗ 𝜌 (
𝑔
𝑐𝑚3)/𝐸(𝑘𝑒𝑉)
Ref.: X-Ray Spectrometry: Recent Technological Advances
edited by Kouichi Tsuji, Jasna Injuk, René Van Grieken
Higher resolution than standard techniques
17. Ultrasonic transducer to scan the wafer for defects that
modify the reflection of sound waves.
Excels at finding voids and cracks,
Cons: Wafer needs to be immersed in a sound-conducting
liquid, usually distilled water.
This requires a cleaning step after the sonic scan is
generated, while limiting application to wafers which will
not be contaminated by immersion.
Relatively coarse with lateral resolution.
SEMICONDUCTOR International , August 2009
Acoustic image of a crack at
the bond interface in an Au-Si
bonded wafer pair.
18. Phase difference:
Γ =
2𝜋 𝑛1 𝑥1 − 𝑛2 𝑥2
𝜆
Light source
To spectrometer
Non-destructive method
Based on spectral reflectometry
Several theoretical models (common: Rigorous Coupled Wave Theory)
Highly promising
Source: IBM, ECTC 2014
19. Top CD and Depth
High Precision Allows Effective Control of Etch Rate and Uniformity
Source: IBM, ECTC 2014
20. Marvin B. Klein, W.E. Moerner et al., Optics Communications 162, 1999. 79–84
O. Ostroverkhova, W.E. Moerner et al., Chemical Reviews, Vol. 104, No. 7, 3267-3314, 2004
Schematic diagram of a laser ultrasonic receiver based on two-wave mixing
PR material: PVK:7-DCST:BBP:C60
Major Advantage: Insensitive to fluctuations in the frequency of the laser
Minimum detectable displacement: 𝜹𝒍𝒊𝒎
𝒊𝒅𝒆𝒂𝒍
= 𝟐. 𝟕 × 𝟏𝟎−𝟖
𝒏𝒎
Varieties of PR materials developed thus far.
Inexpensive experimental set up for R&D
Dynamic hologram
Strong ties with related people
22. Driving factors:
High density, multi-wavelength low-power photonics connectors ->
Enabler for Tbps applications
High density photonics in 3DI-> Extreme 3D
Source: Emerging Technologies and Market Trends of Silicon
Photonics – S.Bernabé ECTC 2014
23. Knots and bolts for optical interconnects
1. Lasers
2. Waveguides – Si, cladded with SiO2
3. Ring resonators
4. Diode detectors (MSM, PIN III-V detectors)
5. Optical amplifiers ( e.g.. Erbium booster)
Challenges: Metrology again
1. Laser mode validation using external mode analysis tools such as scanning FB
Interferometer (which are commercially available, I have experience on such tools)
2. Pulse analysis using high speed spectrum analyzers ( e.t. Tektronix spectrum analyzer)
Check for stretch effect and intensity loss. Bit Error Rate (BER).
3. Test against micro bends and loss. – Challenging when waveguides are in the bulk of 3D
Geometry (good thing is that Si is transparent to IR), easier only in 2D geometry
25. Speed becomes infinite in ENZ media.
Or
Waves inside ENZ materials have very long
wavelength and essentially
have a uniform phase throughout the
propagation distance.
Connect the two waveguides by an ENZ material, the coupling is better if the channel
is narrower !
Metal clad waveguides near their cutoff frequency can mimic the ENZ material in the sense
that the effective mode index can approach zero.
Science, Vol. 340 no. 6130 pp. 286-287, 2013
𝚫 × 𝑬 = 𝒊𝝎𝝁𝑯
𝚫 × 𝑯 = 𝟎
𝚫 𝟐
𝑬 =
𝟏
𝒄 𝟐 (𝝏 𝟐
𝑬/𝝏𝒕 𝟐
)
26. 3DI manufacturing: rapidly developing and
promising with TSV
Existing metrology tools: not sufficient for TSV
technology
Optical scatterometry: several variants/models,
need further development
Interferometric technique with PR materials:
Promising opportunity for metrology development
Hybrid photonic integration: Progressing and it is
the future of high speed integration -> careful
optical studies/tests needed