The document discusses a packageless assembly technology called μPOST that allows die to be directly assembled and tested at the wafer level onto circuit boards. Key benefits of μPOST include saving wafer real estate by allowing for higher density connections, reducing costs by enabling wafer-level testing and assembly directly onto boards without packaging, and speeding prototyping by allowing devices to be assembled onto boards within a day of wafer availability. μPOST connections are also shown to outperform conventional solder ball connections in terms of force distribution and reliability.
250um loose tube vs. 900um tight buffered fiberAngelina Li
Choosing the right fiber-optic cable has become more challenging than ever. Factors like the advent
of new cable designs, suppliers, changes in fiber specifications, and the many claims of cable
performance can confuse even the most seasoned network designers.
250um loose tube vs. 900um tight buffered fiberAngelina Li
Choosing the right fiber-optic cable has become more challenging than ever. Factors like the advent
of new cable designs, suppliers, changes in fiber specifications, and the many claims of cable
performance can confuse even the most seasoned network designers.
This report discusses about different types of tools that are required for cutting stones.
This is a study project that was done in 5th semester of B.Tech. for subject Manufacturing Process and Metallurgy.
Description:
The 6NPM is a very high efficiency, (101.8 dB 1watt / 1 meter) 6-inch midrange speaker with incredibly linear frequency response characteristics and ultra low harmonic distortion artifacts. The 6NPM has extremely high sound quality. The 6NPM uses a lightweight paper pulp, specifically developed for this application. This unique cone provides the ideal weight to strength ratio.
At the core of the 6NPM is it’s voice coil technology featuring edge wounded aluminum ribbon wire. Unique lightweight and very short former provides the ideal transfer of power between the voice coil and the cone assembly and assists in reducing the distortion artifacts. By combining this material with the state of the art adhesives, the 6FPM delivers incredible performance. The magnetic circuit design is optimized to generate the minimum amount of flux modulation, providing exceptional stability. The neodymium magnet is in a direct contact with the CNC exposed aluminum section of the basket, hold in place by our thermal transfer adhesives. This design dramatically improves the heat transfer. The 6NPM is ideal for use in both sealed and vented enclosure designs. The most suitable applications are in high quality professional audio, as line array systems, 3-way designs, where extreme SPL outputs are desired. The 6NPM can be horn loaded or used in directly radiated midrange applications.
BTC: Bottom Termination Component or Biggest Technical Challenge?Cheryl Tulkoff
Bottom termination components (BTCs) are everywhere.
Despite the fact that these package types have been around since the mid ‘90s and have penetrated into almost every product market, companies still struggle to achieve the high yields the packages promise.
This presentation highlights the biggest mistakes and best practices to help conquer the BTC DEMInS: Design, Environment, Manufacturing, Inspection, and Stress.
Traditionally, cables have been sealed using cable glands or compounds; however, Roxtec - a next-generation, certified, well-proven, modular-based sealing system offers substantial cost savings and flexibility compared to the old cable glands.
This report discusses about different types of tools that are required for cutting stones.
This is a study project that was done in 5th semester of B.Tech. for subject Manufacturing Process and Metallurgy.
Description:
The 6NPM is a very high efficiency, (101.8 dB 1watt / 1 meter) 6-inch midrange speaker with incredibly linear frequency response characteristics and ultra low harmonic distortion artifacts. The 6NPM has extremely high sound quality. The 6NPM uses a lightweight paper pulp, specifically developed for this application. This unique cone provides the ideal weight to strength ratio.
At the core of the 6NPM is it’s voice coil technology featuring edge wounded aluminum ribbon wire. Unique lightweight and very short former provides the ideal transfer of power between the voice coil and the cone assembly and assists in reducing the distortion artifacts. By combining this material with the state of the art adhesives, the 6FPM delivers incredible performance. The magnetic circuit design is optimized to generate the minimum amount of flux modulation, providing exceptional stability. The neodymium magnet is in a direct contact with the CNC exposed aluminum section of the basket, hold in place by our thermal transfer adhesives. This design dramatically improves the heat transfer. The 6NPM is ideal for use in both sealed and vented enclosure designs. The most suitable applications are in high quality professional audio, as line array systems, 3-way designs, where extreme SPL outputs are desired. The 6NPM can be horn loaded or used in directly radiated midrange applications.
BTC: Bottom Termination Component or Biggest Technical Challenge?Cheryl Tulkoff
Bottom termination components (BTCs) are everywhere.
Despite the fact that these package types have been around since the mid ‘90s and have penetrated into almost every product market, companies still struggle to achieve the high yields the packages promise.
This presentation highlights the biggest mistakes and best practices to help conquer the BTC DEMInS: Design, Environment, Manufacturing, Inspection, and Stress.
Traditionally, cables have been sealed using cable glands or compounds; however, Roxtec - a next-generation, certified, well-proven, modular-based sealing system offers substantial cost savings and flexibility compared to the old cable glands.
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Então, passe por este SlideShare e veja como incrementar seu marketing no Instagram!
This presentation was given on Wednesday, September 15th 2004, at an event in Heraklion Crete for celebrating the 4 years from the establishment of Virtual Trip Ltd - Which actually had been the first greek student startup in the ICT sector
MedicinMan wishes all Healthcare especially customer-facing field sales professionals a New Year filled with New Learning. Get your January issue focused on Front-line Managers by registering your email ID on http://www.medicinman.net
Great articles by industry veterans - Hariram; MD of Galderma; Jolly Mathews; ex Novartis; Prof Vivek Hattangadi; Aparna Sharma ex HR Head of UCB Pharma; Dr. Hemant Mittal and William Fernandes
Large-Span Group is big stated owned corporation established over 30 years and has certificated by BV, TUV, SGS inspection. As one of the most famous manufacturers in China, we have committed ourselves to developing and producing high quality products, professional suggestions and good services for customers all over the world.
Analog Mixed-Signal Design in FinFET Processes Design World
While industry pundits have forecasted the end of analog design in the next leading edge process, the reality is that the practice is still going strong, and there’s no end in sight. Not only are teams still designing data converters, PLLs, filters, and other analog goodies in the latest processes (including FinFET), but design teams are reaching higher levels of performance than they did in yesterday’s processes. The new processes have, without a doubt, changed the task of analog design, and the designer’s toolkit has had to undergo a major revision. Many of our old techniques have become a lot less relevant, and today’s designer needs to have a good handle on a broad set of new techniques.
Some of the changes are a result of designers targeting processes for very digital applications (supply voltages of 0.8V and less). Others are a result of the size of the devices (matching of small devices is poor, matching of very small devices is worse). Changes are also a result of the new fabrication techniques that must be used to make the devices (unit-sized devices and no mixing of different device types - resistor and I/O device ghettos are required). Of course, there’s great news: the transistors are wonderfully fast and the digital is almost free.
View this webinar to:
-Gain an understanding of the challenges of analog design in the new world of leading-edge processes
-Learn about design techniques that take advantage of the characteristics of today’s design reality
IC Socket and interconnect technologies such as embedded wire on elastomer, spring pin, stamped pin, silver particle elastomer, diamond particle interconnect enable testing of IC devices
2. Summary on µPOST1 Removes many aspects of die to board assembly Die can be assembled directly onto copper based circuit boards Allows die to be fully tested at the wafer level with minimal cost Known good die program with board level build savings possible Save wafer real-estate For example 400 connections 2.5x2.5mm with 100µm spacing Enable for increased connections within existing die geometry Save on prototype/bring-up costs A device can be mounted onto a bring up board, within one day Further overall savings are possible Overall component height down to 0.2mm. Devices can be attached to yielded SMT boards 1. Micro-Precision-Optimised-Shaped-Termination , µPOST is pronounced Micro POST
3. µPOST formationuses a standard thermo-sonic bonding tool 1) Starts as normal, with ball formed on end of wire 3) Wire breaks as capillary rises, ready for new ball formation, whilst performing 100% connection pull test 2) Ball is attached & ultrasonically extruded into the capillary to form the characteristic µPOST shape
4. Save Wafer Real Estate The patented µPOST technology allows die to be designed with asymmetric sub 150µm area array pads. A typical die with 400 external connections…. 3.5x3.5mm with peripheral wire bond pads 4.5x4.5mm with 200µm full array solder bump 2.5x2.5mm with 100µm full array µPOST
5. Save Test NRE The µPOST technology allows die to be FULLY TESTED at the wafer level, using a simple pressure contact onto a multilayer board. Transmission line effects minimised to enable operational speed testing while containing costs Remove probe cards costs for 400 I/O die are around……. $20k and not suitable for hi-speed, analogue or hi-power. Pyramid and flex probe cards cost even more
6. Outperform BGA with µPOST Solder balls have a low height and a large radius Typically 100µm (h) x 100µm (w) on a 250µm pitch µPOST have superior height to radius For example 100µm (h) x 65µm (w) on a 100µm pitch Provides improved tolerance to mismatched Coeff. Thermal Expansion Improved mechanical and electrical characteristics with less cost Height( L ) Radius( r ) Force For a given displacement: A contact Half Height will receive 8 x Force A contact double Radius will receive 16 x Force Displacement The Euler-Bernoulli Beam Equation states Displacement equals (Force x L3 )/3(E x r4)
7. FEA Results The gold column stretches, in response to the strain, diffusing shear stress away from the attachment area Provide for a more reliable connection than lead free solder or tin Important in devices subject to mechanical shock during use (i.e cell phones) Displacement 23.5 µm Stress 131N/mm2
8. Save Assembly Costs µPOSTed die can be assembled directly onto copper based circuit boards. Simple, low cost, reliable connections Can be made using standard Ultrasonic or Thermosonic Can use conductive or non-conductive adhesive Can use a hot air gun Typical 400 I/O die would require FBGA technology Design charges ~$10k Lead Time 6 to 8 weeks Assembly Charges ~$1/unit @ 1M/month
9. Comparing BGA and µPOSTAssembly Wafers In Wafers In Mount on frame Dice Wafer Pick off frame Die Attach Wire bond Transfer mold Part mark Ball Attach Singulate Test Bake & Pack Screen Print Pick & Place Reflow Solder Final Test 1. Bond µPOSTs 2. Test 3. Mount on Frame 4. Dice Wafer 5. Pick off Frame 6. Tin coat Board 7. Apply glue 8. Hot Place Die 9. Final Test Boards Out Boards Out
10. Save on Prototype costs As soon as Wafers are available, a device can be µPOSTed and mounted onto a bring up board, easily within one day. Mounted using standard equipment Heated pick & place or pick & place and bake Typical Engineering lot for standard assembly…. $2k adder to standard assembly charge Min lot size ~ 50 units Lead time 3 days plus freight times
11. Further savings Overall component height down to 0.2mm. Mobile and handheld growth with high pin-count, high functionality devices can benefit Pre-underfill can be applied at wafer level. Superior to imbedded chip on board, significantly less handling Rapid attach to circuit board with support via pre-underfill Devices can be attached to yielded SMT boards using localised heating. After passive and SMD reflow the µPOST devices can be attached Possible development of test head and heated pick and place Allows for complete system test before device is committed to be attached No need for subsequent liquid encapsulation (‘glob top’) Speeding the assembly line and reducing operational costs Less raw materials, Pb free process. Less gold than BGA, no die attach material, no expensive laminate, no plastic encapsulation, no solder balls.
12. Conclusion Save wafer real-estate Save test NRE Save assembly costs Save on prototype/bring-up costs Further overall savings are possible with minimal development Contact Jim Palmer at jim.palmer@semidice.co.uk for further information
13. The COB technology provides an attractive alternative to packaging, saving on cost and time to market. We are keen on the µPOST technology for these obvious benefits as well as providing improved RF performance. We are looking forward to see the wide adoption of the technology by board assemblers”. EbrahimBusherhri, Lime Micro, http://www.limemicro.com/ “Micropost interconnect technology has the potential to both shave time off the critical package design/NPI schedule, and offer a rapid route to the benefits of minimum size packaging.” Mike Warren, Frontier Silicon, http://www.frontier-silicon.com/ What the customers say …
Editor's Notes
Save wafer real-estateMore connections per die geometry due to improved pin densityEnables greater pin-out, better CTE tolerance and less transmission line effectsSave test NREWafer level die testing facilitating known good die program improving yieldTurn your die into a probe head and pressure contact to board a fully functional system testSave assembly costsDie can be mounted directly to the circuit boardUses standard pick & place, benefits of imbedded with none of the costsSave on prototype/bring-up costsA device can be uPost processed and mounted onto a bring up board within one dayRapid die to operational bring up board, 400 µPOST’s attached in around 10 minutesFurther overall savings possibleFunctional die per wafer increased, less handling, better imbedding solutionsDie could be tested in-circuit of complete system before final attachmentNext StepContact SemiDice to understand further how you can For instance we can provide a BGA de-process to enable early µPOST samples