A proposal for using a higher resolution camera to detect the position of an 80 micron wire embedded on an RFID inlay. Bonding with 1 mm tip on 1.2 mm space on every side of the the chip. More details can be found here : https://elmalla.info/project/25-installing-the-german-eid-machinery by Python & Computer science tutor in Malaysia

1. Machine Vision Systems
Ahmed Elmalla, System Design
Nen Fong, Graphic Simulation
Control Department
XYTEC Solutions, Kulim Jan 2010

2. 08/02/2023 2
Vision System Project Goals
● Reduce Damaged Chips.
● Reduce Bonding rejects.
● Increase Yield.
● Reduce Human
Resources.

3. 08/02/2023 3
GPO Vision System Concept
+
+
Chip
+
Bond Tip
+
Vision system
acquires center of the
wire as reference.
Center of
Bond Tip
Vision Tolerance ±117µm
Vision Tolerance ±117µm
Actual wire
Location could be
within ±117µm

4. 08/02/2023 4
Vision System Components
● Low Resolution Smart
Camera.
● Tele centric Lens for
accurate
measurements.
● Custom illumination for
reduced Glare.

5. 08/02/2023 5
GPO Vision System Capability
RM 18,200 (Euro 3640)
COST (Whole System):
Smart Camera
Image Processing :
100
Communication Speed (MB) :
± 0.300 mm
Depth of Field (DOF) :
77 ms
Processing Speed :
37µm
Resolution (SRM) :
±117µm
Tolerance :

6. 08/02/2023 6
ECE Bonding Process Challenges
● Floating or Tilted Chips.
Reason: PVC 100 micron layer is
deformed after the Embedding
process.
● Shiny wires (Hard to
detect).
● Risk of False bonding.
Reason: Large bonding region,
and high vision system tolerance.

7. 08/02/2023 7
ECE Project Draft Spec
Bond Tip
1000 µm
950 µm
25 µm
200 µm
Up to 7
possible Wire
Positions
Die

8. 08/02/2023 8
ECE Bonding Scenario 1
Bond Tip
+
+ +
+
Vision
Tolerance
±117µm
Bonding
Region
Successful Bond
as the Vision
Tolerance are
within Bonding
Region.
Next Page
Actual Wire
might be here
Actual Wire
might be here

9. 08/02/2023 9
ECE Bonding Scenario 2
Bond Tip
+
+ +
+
Bonding
Region
Vision
Tolerance
±117µm
Successful Bond
as the Vision
Tolerance are
within Bonding
Region.
Actual Wire
might be here

10. 08/02/2023 10
ECE Bonding Scenario 3
Bond Tip
+
+ +
+
Bonding
Region
Vision
Tolerance
±117µm
Machine still
bond as the wire
still within Vision
Tolerance and
creates false
bonding.
Actual Wire
might be here

11. 08/02/2023 11
Proposed Vision System
● High Resolution
Camera (Basler :
1392 Pixel ).
● Lens with higher
Depth of Field
(Edmund : +/- 3.3
mm).

12. 08/02/2023 12
Proposed ECE Bonding Scenario
+
Bond Tip
+
+
+
Bonding
Region
Vision
Tolerance
±57µm
+
+ +
Bonding will be
accurately within
then the bonding
region

13. 08/02/2023 13
Proposed Vision Processing
● Upper Picture: Chips in tilted
conditions.
● Right Picture: Vision Pro (PC
based Solution) was able
recognize all the chips.

14. 08/02/2023 14
Proposed Vision System Capability
PC Based Vision Library
Image Processing :
RM 38,000 (Euro 7600)
COST (Whole System):
1000 MB
Communication Speed :
± 3.3 mm
Depth of Field (DOF):
25 ms
Processing Speed :
23 µm
Resolution (SRM) :
± 57 µm
Tolerance :

15. 08/02/2023 15
GPO & Proposed System Comparison
PC Based Vision Library
Smart Camera
Image Processing :
RM 38,300 (Euro 7660)
RM 18,200 ( Euro 3640)
COST (Whole System):
1000 MB
100 MB
Communication Speed :
± 3.3 mm
± 0.300 mm
Depth of Field (DOF):
25 ms
77 ms
Processing Speed :
23 µm
37 µm
Resolution (SRM) :
± 57 µm
± 117 µm
Tolerance :
ECE V. System
GPO V. System

16. 08/02/2023 16
Image Processing Capability Comparison
YES
NO
Multiple Image Tasks
Unlimited
Limited
Processing Power
YES
NO
Complex Algorithms
YES
NO
Complex Images
PC Based Vision Library
Smart Camera
Image Processing
ECE V. System
GPO V. System

17. 08/02/2023 17
What IF Scenario (ECE used GPO Vision System )
● Expected High number of false chip
rejects (Chips with No BOND status).
Cause: Vision system can’t recognize the chip.
● Increase risk of damaged Chips, Wire
not within Bonding Region.
Cause: Vision system can recognize the wire only within +/-
100 micron tolerance.