SlideShare a Scribd company logo
1 of 28
Download to read offline
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 1
22 bd Benoni Goullin
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Everspin EMD3D256M Memory
256Mb Spin Transfer Torque MRAM
SP20543 - Memory report by Belinda Dube
Physical analysis done by Nicolas Radufe
June 2020 - Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile & Supply Chain 9
Physical Analysis 16
o Summary of the Physical Analysis 17
o STT MRAM Memory Package 19
✓ Module Views
✓ Module Cross-Section
✓ Module Patents
o STT MRAM Memory Die 25
✓ STT MRAM Memory Die View & Dimensions
✓ STT MRAM Memory Delayering
✓ STT MRAM Memory Die Process
✓ STT MRAM Memory Die Cross-Section
✓ STT MRAM Memory Die Process Characteristic
STT MRAM Memory Manufacturing Process 47
o STT MRAM Memory Die Front-End Process & Fabrication Unit
o Manufacturing Process Steps
o Final Test & Packaging Fabrication unit
o Summary of the main parts
Cost Analysis 56
o Summary of the cost analysis 57
o Yields Explanation & Hypotheses 59
o STT MRAM Memory 62
✓ STT MRAM Memory Front-End Cost
✓ STT MRAM Memory Probe Test, Thinning & Dicing
✓ STT MRAM Memory Wafer Cost
✓ STT MRAM Memory Die Cost
o Packaged STT MRAM Memory 66
✓ Packaging Cost
✓ Components Cost
Selling price 68
Feedbacks 73
SystemPlus Consulting services 75
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 3
Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
o Glossary
o Datasheet
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of
Everspin’s EMD3D256M STTMRAM.
Amongst multiple emerging NVM technologies, spin transfer torque magneto resistive RAM (STT-MRAM) has shown significant potential
and market growth driven by low latency storage applications. In 2018 MRAM Market recorded a Revenue of $44 million dollars.
Compound annual growth rate of MRAM market is estimated at 85% between 2018 and 2024.
Magnetoelectronic memories have been employed in numerous information devices because of their nonvolatile characteristics, high
speed and low power consumption. Their high endurance characteristic has made the STT MRAM Memory a good competitor in the
memory industry and promises to pick up significant market shares in the next few years.
Everspin’s STT MRAM component has a compact structure integrating numerous layers that include ferromagnetic material and
antiferromagnetic material forming a magnetic tunnel junction. Different resistive states created in the MRAM memory cell allow read
and write functions. A dielectric layer is coupled between two magnetic materials. A complex fabrication method is used to deposit and
pattern the thin layers that form the STT MRAM memory cell.
Everspin Technologies leads the (STT-) MRAM market. The 256Mb STT MRAM memory uses a 40 nm technology node. The memory is
manufactured along with the CMOS Transistors.
System Plus Consulting presents a deep analysis of Everspin’s EMD3256M STT MRAM Memory. The report includes an analysis of the
package and the dies, the MRAM memory cell and focusing on the layered material that make up the MRAM Cell memory. It also
features a cost analysis and a price estimation of the component; this cost analysis integrates the manufacture of the CMOS transistors
and the MRAM Memory cells. The manufacturing process steps are detailed including the supply chain. The results of manufacturing
cost are used to determine the cost per Mb for Everspin’s STT MRAM Memory.
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 4
Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
o Glossary
o Datasheet
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
The reverse costing analysis is conducted in 3 phases:
Teardown
analysis
Package is analyzed and measured
The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin
out, die marking
Setup of the manufacturing process.
Costing
analysis
Setup of the manufacturing environment
Cost simulation of the process steps
Selling price
analysis
Supply chain analysis
Analysis of the selling price
Executive Summary
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 5
PHYSICAL
ANALYSIS
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 6
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Overview
o Package Assembly
o Views & Dimensions
o Cross-Section
o Opening
o Memory Die
o Views & Dimensions
o Die Cross-section
o Delayering
o Die Process
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Package Opening- Wire Bonding
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 7
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Overview
o Package Assembly
o Views & Dimensions
o Cross-Section
o Opening
o Memory Die
o Views & Dimensions
o Die Cross-section
o Delayering
o Die Process
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Die Cross-Section – Substrate Thickness
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 8
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Overview
o Package Assembly
o Views & Dimensions
o Cross-Section
o Opening
o Memory Die
o Views & Dimensions
o Die Cross-section
o Delayering
o Die Process
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Die Cross-Section – Metal Layers
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 9
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Overview
o Package Assembly
o Views & Dimensions
o Cross-Section
o Opening
o Memory Die
o Views & Dimensions
o Die Cross-section
o Delayering
o Die Process
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Die Cross-Section - SEM View
©2020 by System Plus Consulting
Die Cross-Section – MRAM Cells
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 10
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Overview
o Package Assembly
o Views & Dimensions
o Cross-Section
o Opening
o Memory Die
o Views & Dimensions
o Die Cross-section
o Delayering
o Die Process
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Die Cross-Section – MRAM Cells
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 11
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Overview
o Package Assembly
o Views & Dimensions
o Cross-Section
o Opening
o Memory Die
o Views & Dimensions
o Die Cross-section
o Delayering
o Die Process
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Die Cross-Section – MRAM Cells
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 12
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Overview
o Package Assembly
o Views & Dimensions
o Cross-Section
o Opening
o Memory Die
o Views & Dimensions
o Die Cross-section
o Delayering
o Die Process
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Die Cross-Section – MRAM Cells
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 13
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Overview
o Package Assembly
o Views & Dimensions
o Cross-Section
o Opening
o Memory Die
o Views & Dimensions
o Die Cross-section
o Delayering
o Die Process
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Die Process – Memory Cells
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 14
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Overview
o Package Assembly
o Views & Dimensions
o Cross-Section
o Opening
o Memory Die
o Views & Dimensions
o Die Cross-section
o Delayering
o Die Process
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Die Overview
©2020 by System Plus Consulting
Die Process – Memory Cells
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 15
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Overview
o Package Assembly
o Views & Dimensions
o Cross-Section
o Opening
o Memory Die
o Views & Dimensions
o Die Cross-section
o Delayering
o Die Process
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Die Delayering – Memory Cell Density
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 16
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Overview
o Package Assembly
o Views & Dimensions
o Cross-Section
o Opening
o Memory Die
o Views & Dimensions
o Die Cross-section
o Delayering
o Die Process
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Die Process – Memory Cell Size
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 17
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
o Memory Front-End Process
o Memory Fabrication Unit
o Manufacturing Steps
o Final Test & Assembly Unit
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
STT MRAM Memory Process Steps
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 18
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
o Memory Front-End Process
o Memory Fabrication Unit
o Manufacturing Steps
o Final Test & Assembly Unit
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
STT MRAM Memory Process Steps
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 19
C O S T
ANALYSIS
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 20
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o Memory Wafer Cost
o Memory Die Cost
o Memory Package Cost
o Component Cost
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
STT MRAM Memory- CMOS & Metal Layers Front-End Cost
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 21
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o Memory Wafer Cost
o Memory Die Cost
o Memory Package Cost
o Component Cost
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
STT MRAM Memory Cells Front-End Cost
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 22
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o Memory Wafer Cost
o Memory Die Cost
o Memory Package Cost
o Component Cost
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Component Cost
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 23
SELLING
P R I C E
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 24
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
o Definition of Prices
o Manufacturer Financials
o Component Price
o STT MRAM Price/Mb
Feedbacks
Related Reports
About System Plus
STT MRAM Memory Component Price
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 25
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
MEMORY REPORTS
• Emerging Non-Volatile Memory 2020
• MRAM Technology and Business 2019
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
MEMORY REPORTS
• Intel Optane 128GB DIMM
• 3D NAND Memory Comparison 2019
• LPDDR4 Memory Comparison 2019
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 26
COMPANY
SERVICES
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 27
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
o Company services
o Contact
Business Models Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>60 reports per year)
Costing Tools
Trainings
©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 28
Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
o Company services
o Contact
Contact
Headquarters
22 bd Benoni Goullin
44200 Nantes
FRANCE
+33 2 40 18 09 16
sales@systemplus.fr
Europe Sales Office
Lizzie LEVENEZ
Frankfurt am Main
GERMANY
+49 151 23 54 41 82
llevenez@systemplus.fr
www.systemplus.fr
NANTES
Headquarter
FRANKFURT/MAIN
Europe Sales Office
LYON
YOLE HQ
TOKYO
YOLE KK
GREATER CHINA
YOLE
CORNELIUS
YOLE Inc.
KOREA
YOLE
Asia Sales Office
Takashi ONOZAWA
Tokyo
JAPAN
T : +81 804 371 4887
onozawa@yole.fr
Mavis WANG
TAIWAN
T :+886 979 336 809
CN: +8613661566824
wang@yole.fr
America Sales Office
Steve LAFERRIERE
WESTERN US
T : +1 310 600 8267
laferriere@yole.fr
Chris YOUMAN
EASTERN US & CANADA
T : +1 919 607 9839
chris.youman@yole.fr

More Related Content

Similar to Everspin EMD3D256M STTMRAM Memory

Hamamatsu C12880MA Micro-spectrometer
Hamamatsu C12880MA Micro-spectrometerHamamatsu C12880MA Micro-spectrometer
Hamamatsu C12880MA Micro-spectrometersystem_plus
 
Broadcom AFEM8200 MBHB PAMiD
Broadcom AFEM8200 MBHB PAMiDBroadcom AFEM8200 MBHB PAMiD
Broadcom AFEM8200 MBHB PAMiDsystem_plus
 
Qorvo QPF4006 39GHz GaN MMIC Front End Module
Qorvo QPF4006 39GHz GaN MMIC Front End ModuleQorvo QPF4006 39GHz GaN MMIC Front End Module
Qorvo QPF4006 39GHz GaN MMIC Front End Modulesystem_plus
 
GOM Verification Of Finite Element Simulations
GOM Verification Of Finite Element SimulationsGOM Verification Of Finite Element Simulations
GOM Verification Of Finite Element Simulationstrilionqualitysystems
 
EPC2045 100V GaN-on-Silicon Transistor 2017 teardown reverse costing report p...
EPC2045 100V GaN-on-Silicon Transistor 2017 teardown reverse costing report p...EPC2045 100V GaN-on-Silicon Transistor 2017 teardown reverse costing report p...
EPC2045 100V GaN-on-Silicon Transistor 2017 teardown reverse costing report p...Yole Developpement
 
ROHM 1700V SiC MOSFET SCT2H12NZGC11 Discrete 2017 teardown reverse costing re...
ROHM 1700V SiC MOSFET SCT2H12NZGC11 Discrete 2017 teardown reverse costing re...ROHM 1700V SiC MOSFET SCT2H12NZGC11 Discrete 2017 teardown reverse costing re...
ROHM 1700V SiC MOSFET SCT2H12NZGC11 Discrete 2017 teardown reverse costing re...Yole Developpement
 
Safran Colibrys VS1000 Series - teardown reverse costing report published by ...
Safran Colibrys VS1000 Series - teardown reverse costing report published by ...Safran Colibrys VS1000 Series - teardown reverse costing report published by ...
Safran Colibrys VS1000 Series - teardown reverse costing report published by ...Yole Developpement
 
Tesla UBQ01B0 FSD Chip
Tesla UBQ01B0 FSD ChipTesla UBQ01B0 FSD Chip
Tesla UBQ01B0 FSD Chipsystem_plus
 
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...system_plus
 
Texas Instruments’ LMG5200 GaN Power Stage - 2018 teardown reverse costing re...
Texas Instruments’ LMG5200 GaN Power Stage - 2018 teardown reverse costing re...Texas Instruments’ LMG5200 GaN Power Stage - 2018 teardown reverse costing re...
Texas Instruments’ LMG5200 GaN Power Stage - 2018 teardown reverse costing re...system_plus
 
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...Yole Developpement
 
Peraso X710 Chipset 60GHz Outdoor Wireless Broadband Solution
Peraso X710 Chipset 60GHz Outdoor  Wireless Broadband SolutionPeraso X710 Chipset 60GHz Outdoor  Wireless Broadband Solution
Peraso X710 Chipset 60GHz Outdoor Wireless Broadband Solutionsystem_plus
 
2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...
2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...
2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...Yole Developpement
 
Panasonic 600 V GaN HEMT PGA26E19BA 2017 teardown reverse costing report publ...
Panasonic 600 V GaN HEMT PGA26E19BA 2017 teardown reverse costing report publ...Panasonic 600 V GaN HEMT PGA26E19BA 2017 teardown reverse costing report publ...
Panasonic 600 V GaN HEMT PGA26E19BA 2017 teardown reverse costing report publ...Yole Developpement
 
Maxim Integrated MAX21100 6-Axis MEMS IMU teardown reverse costing report pub...
Maxim Integrated MAX21100 6-Axis MEMS IMU teardown reverse costing report pub...Maxim Integrated MAX21100 6-Axis MEMS IMU teardown reverse costing report pub...
Maxim Integrated MAX21100 6-Axis MEMS IMU teardown reverse costing report pub...Yole Developpement
 
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...Yole Developpement
 
Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...
Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...
Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...Yole Developpement
 
Infineon FF400R07A01E3 Double Side Cooled IGBT Module - 2018 teardown reverse...
Infineon FF400R07A01E3 Double Side Cooled IGBT Module - 2018 teardown reverse...Infineon FF400R07A01E3 Double Side Cooled IGBT Module - 2018 teardown reverse...
Infineon FF400R07A01E3 Double Side Cooled IGBT Module - 2018 teardown reverse...system_plus
 
STMicroelectronics 1200V SiC MOSFET STC30N120 - teardown reverse costing repo...
STMicroelectronics 1200V SiC MOSFET STC30N120 - teardown reverse costing repo...STMicroelectronics 1200V SiC MOSFET STC30N120 - teardown reverse costing repo...
STMicroelectronics 1200V SiC MOSFET STC30N120 - teardown reverse costing repo...Yole Developpement
 
PAM-COMPOSITES_IACMI_November2015.pdf
PAM-COMPOSITES_IACMI_November2015.pdfPAM-COMPOSITES_IACMI_November2015.pdf
PAM-COMPOSITES_IACMI_November2015.pdfhalilyldrm13
 

Similar to Everspin EMD3D256M STTMRAM Memory (20)

Hamamatsu C12880MA Micro-spectrometer
Hamamatsu C12880MA Micro-spectrometerHamamatsu C12880MA Micro-spectrometer
Hamamatsu C12880MA Micro-spectrometer
 
Broadcom AFEM8200 MBHB PAMiD
Broadcom AFEM8200 MBHB PAMiDBroadcom AFEM8200 MBHB PAMiD
Broadcom AFEM8200 MBHB PAMiD
 
Qorvo QPF4006 39GHz GaN MMIC Front End Module
Qorvo QPF4006 39GHz GaN MMIC Front End ModuleQorvo QPF4006 39GHz GaN MMIC Front End Module
Qorvo QPF4006 39GHz GaN MMIC Front End Module
 
GOM Verification Of Finite Element Simulations
GOM Verification Of Finite Element SimulationsGOM Verification Of Finite Element Simulations
GOM Verification Of Finite Element Simulations
 
EPC2045 100V GaN-on-Silicon Transistor 2017 teardown reverse costing report p...
EPC2045 100V GaN-on-Silicon Transistor 2017 teardown reverse costing report p...EPC2045 100V GaN-on-Silicon Transistor 2017 teardown reverse costing report p...
EPC2045 100V GaN-on-Silicon Transistor 2017 teardown reverse costing report p...
 
ROHM 1700V SiC MOSFET SCT2H12NZGC11 Discrete 2017 teardown reverse costing re...
ROHM 1700V SiC MOSFET SCT2H12NZGC11 Discrete 2017 teardown reverse costing re...ROHM 1700V SiC MOSFET SCT2H12NZGC11 Discrete 2017 teardown reverse costing re...
ROHM 1700V SiC MOSFET SCT2H12NZGC11 Discrete 2017 teardown reverse costing re...
 
Safran Colibrys VS1000 Series - teardown reverse costing report published by ...
Safran Colibrys VS1000 Series - teardown reverse costing report published by ...Safran Colibrys VS1000 Series - teardown reverse costing report published by ...
Safran Colibrys VS1000 Series - teardown reverse costing report published by ...
 
Tesla UBQ01B0 FSD Chip
Tesla UBQ01B0 FSD ChipTesla UBQ01B0 FSD Chip
Tesla UBQ01B0 FSD Chip
 
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...
ZF S-Cam 4 – Forward Automotive Mono and Tri Camera for Advanced Driver Assis...
 
Texas Instruments’ LMG5200 GaN Power Stage - 2018 teardown reverse costing re...
Texas Instruments’ LMG5200 GaN Power Stage - 2018 teardown reverse costing re...Texas Instruments’ LMG5200 GaN Power Stage - 2018 teardown reverse costing re...
Texas Instruments’ LMG5200 GaN Power Stage - 2018 teardown reverse costing re...
 
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...
 
Peraso X710 Chipset 60GHz Outdoor Wireless Broadband Solution
Peraso X710 Chipset 60GHz Outdoor  Wireless Broadband SolutionPeraso X710 Chipset 60GHz Outdoor  Wireless Broadband Solution
Peraso X710 Chipset 60GHz Outdoor Wireless Broadband Solution
 
2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...
2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...
2-Axis Gyroscopes for Optical Image Stabilization: STMicroelectronics L2G2IS ...
 
Panasonic 600 V GaN HEMT PGA26E19BA 2017 teardown reverse costing report publ...
Panasonic 600 V GaN HEMT PGA26E19BA 2017 teardown reverse costing report publ...Panasonic 600 V GaN HEMT PGA26E19BA 2017 teardown reverse costing report publ...
Panasonic 600 V GaN HEMT PGA26E19BA 2017 teardown reverse costing report publ...
 
Maxim Integrated MAX21100 6-Axis MEMS IMU teardown reverse costing report pub...
Maxim Integrated MAX21100 6-Axis MEMS IMU teardown reverse costing report pub...Maxim Integrated MAX21100 6-Axis MEMS IMU teardown reverse costing report pub...
Maxim Integrated MAX21100 6-Axis MEMS IMU teardown reverse costing report pub...
 
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...
Autoliv’s 3rd Generation Automotive Night Vision Camera with FLIR’s ISC0901 M...
 
Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...
Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...
Bosch Sensortec BMX055 9-Axis MEMS IMU teardown reverse costing report publis...
 
Infineon FF400R07A01E3 Double Side Cooled IGBT Module - 2018 teardown reverse...
Infineon FF400R07A01E3 Double Side Cooled IGBT Module - 2018 teardown reverse...Infineon FF400R07A01E3 Double Side Cooled IGBT Module - 2018 teardown reverse...
Infineon FF400R07A01E3 Double Side Cooled IGBT Module - 2018 teardown reverse...
 
STMicroelectronics 1200V SiC MOSFET STC30N120 - teardown reverse costing repo...
STMicroelectronics 1200V SiC MOSFET STC30N120 - teardown reverse costing repo...STMicroelectronics 1200V SiC MOSFET STC30N120 - teardown reverse costing repo...
STMicroelectronics 1200V SiC MOSFET STC30N120 - teardown reverse costing repo...
 
PAM-COMPOSITES_IACMI_November2015.pdf
PAM-COMPOSITES_IACMI_November2015.pdfPAM-COMPOSITES_IACMI_November2015.pdf
PAM-COMPOSITES_IACMI_November2015.pdf
 

More from system_plus

SPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE Inverter
SPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE InverterSPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE Inverter
SPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE Invertersystem_plus
 
SP20569 - IRay T3S Thermal Camera for Smartphone
SP20569 - IRay T3S Thermal Camera for SmartphoneSP20569 - IRay T3S Thermal Camera for Smartphone
SP20569 - IRay T3S Thermal Camera for Smartphonesystem_plus
 
RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset
RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G ChipsetRF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset
RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipsetsystem_plus
 
RF Front-End Module Comparison 2021 – Vol. 1 – Focus on Apple
RF Front-End Module Comparison 2021 – Vol. 1 – Focus on AppleRF Front-End Module Comparison 2021 – Vol. 1 – Focus on Apple
RF Front-End Module Comparison 2021 – Vol. 1 – Focus on Applesystem_plus
 
Apple iPhone 12 series mmWave 5G Chipset and Antenna
Apple iPhone 12 series mmWave 5G Chipset and AntennaApple iPhone 12 series mmWave 5G Chipset and Antenna
Apple iPhone 12 series mmWave 5G Chipset and Antennasystem_plus
 
NVIDIA A100 ampere GPU
NVIDIA A100 ampere GPUNVIDIA A100 ampere GPU
NVIDIA A100 ampere GPUsystem_plus
 
InnoLight’s 400G QSFP-DD Optical Transceiver
InnoLight’s 400G QSFP-DD Optical TransceiverInnoLight’s 400G QSFP-DD Optical Transceiver
InnoLight’s 400G QSFP-DD Optical Transceiversystem_plus
 
EPC2152 half bridge Monolithic GaN IC
EPC2152 half bridge Monolithic GaN ICEPC2152 half bridge Monolithic GaN IC
EPC2152 half bridge Monolithic GaN ICsystem_plus
 
Microsoft - Holographic Lens from Hololens 2
Microsoft - Holographic Lens from Hololens 2Microsoft - Holographic Lens from Hololens 2
Microsoft - Holographic Lens from Hololens 2system_plus
 
ams’ NanEye Mini Camera
ams’ NanEye Mini Cameraams’ NanEye Mini Camera
ams’ NanEye Mini Camerasystem_plus
 
Axis P1375-E Network Camera
Axis P1375-E Network CameraAxis P1375-E Network Camera
Axis P1375-E Network Camerasystem_plus
 
Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1)
Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1)Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1)
Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1)system_plus
 
Safran Colibrys MS1010 and MEMSIC MXA2500M High-End Accelerometers
Safran Colibrys MS1010 and MEMSIC MXA2500M High-End AccelerometersSafran Colibrys MS1010 and MEMSIC MXA2500M High-End Accelerometers
Safran Colibrys MS1010 and MEMSIC MXA2500M High-End Accelerometerssystem_plus
 
Sensonor STIM318 Inertial Measurement Unit (IMU)
Sensonor STIM318 Inertial Measurement Unit (IMU)Sensonor STIM318 Inertial Measurement Unit (IMU)
Sensonor STIM318 Inertial Measurement Unit (IMU)system_plus
 
Hamamatsu Photodiode and Laser in Livox’s Horizon LiDAR
Hamamatsu Photodiode and Laser in Livox’s Horizon LiDARHamamatsu Photodiode and Laser in Livox’s Horizon LiDAR
Hamamatsu Photodiode and Laser in Livox’s Horizon LiDARsystem_plus
 
Spectral Engines Nirone Sensor X
Spectral Engines Nirone Sensor XSpectral Engines Nirone Sensor X
Spectral Engines Nirone Sensor Xsystem_plus
 
Mediatek Autus R10 (MT2706) 77/79 GHz eWLB/AiP Radar Chipset
Mediatek Autus R10 (MT2706) 77/79 GHz eWLB/AiP Radar ChipsetMediatek Autus R10 (MT2706) 77/79 GHz eWLB/AiP Radar Chipset
Mediatek Autus R10 (MT2706) 77/79 GHz eWLB/AiP Radar Chipsetsystem_plus
 
Goodix’s Ultra-Thin Optical In-Display Fingerprint
Goodix’s Ultra-Thin Optical In-Display FingerprintGoodix’s Ultra-Thin Optical In-Display Fingerprint
Goodix’s Ultra-Thin Optical In-Display Fingerprintsystem_plus
 
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 SeriesBroadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Seriessystem_plus
 
Advanced System-in-Package Technology in Apple’s AirPods Pro
Advanced System-in-Package Technology in Apple’s AirPods ProAdvanced System-in-Package Technology in Apple’s AirPods Pro
Advanced System-in-Package Technology in Apple’s AirPods Prosystem_plus
 

More from system_plus (20)

SPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE Inverter
SPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE InverterSPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE Inverter
SPR21610 - Vitesco Technologies Power Module in Jaguar I-PACE Inverter
 
SP20569 - IRay T3S Thermal Camera for Smartphone
SP20569 - IRay T3S Thermal Camera for SmartphoneSP20569 - IRay T3S Thermal Camera for Smartphone
SP20569 - IRay T3S Thermal Camera for Smartphone
 
RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset
RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G ChipsetRF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset
RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset
 
RF Front-End Module Comparison 2021 – Vol. 1 – Focus on Apple
RF Front-End Module Comparison 2021 – Vol. 1 – Focus on AppleRF Front-End Module Comparison 2021 – Vol. 1 – Focus on Apple
RF Front-End Module Comparison 2021 – Vol. 1 – Focus on Apple
 
Apple iPhone 12 series mmWave 5G Chipset and Antenna
Apple iPhone 12 series mmWave 5G Chipset and AntennaApple iPhone 12 series mmWave 5G Chipset and Antenna
Apple iPhone 12 series mmWave 5G Chipset and Antenna
 
NVIDIA A100 ampere GPU
NVIDIA A100 ampere GPUNVIDIA A100 ampere GPU
NVIDIA A100 ampere GPU
 
InnoLight’s 400G QSFP-DD Optical Transceiver
InnoLight’s 400G QSFP-DD Optical TransceiverInnoLight’s 400G QSFP-DD Optical Transceiver
InnoLight’s 400G QSFP-DD Optical Transceiver
 
EPC2152 half bridge Monolithic GaN IC
EPC2152 half bridge Monolithic GaN ICEPC2152 half bridge Monolithic GaN IC
EPC2152 half bridge Monolithic GaN IC
 
Microsoft - Holographic Lens from Hololens 2
Microsoft - Holographic Lens from Hololens 2Microsoft - Holographic Lens from Hololens 2
Microsoft - Holographic Lens from Hololens 2
 
ams’ NanEye Mini Camera
ams’ NanEye Mini Cameraams’ NanEye Mini Camera
ams’ NanEye Mini Camera
 
Axis P1375-E Network Camera
Axis P1375-E Network CameraAxis P1375-E Network Camera
Axis P1375-E Network Camera
 
Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1)
Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1)Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1)
Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1)
 
Safran Colibrys MS1010 and MEMSIC MXA2500M High-End Accelerometers
Safran Colibrys MS1010 and MEMSIC MXA2500M High-End AccelerometersSafran Colibrys MS1010 and MEMSIC MXA2500M High-End Accelerometers
Safran Colibrys MS1010 and MEMSIC MXA2500M High-End Accelerometers
 
Sensonor STIM318 Inertial Measurement Unit (IMU)
Sensonor STIM318 Inertial Measurement Unit (IMU)Sensonor STIM318 Inertial Measurement Unit (IMU)
Sensonor STIM318 Inertial Measurement Unit (IMU)
 
Hamamatsu Photodiode and Laser in Livox’s Horizon LiDAR
Hamamatsu Photodiode and Laser in Livox’s Horizon LiDARHamamatsu Photodiode and Laser in Livox’s Horizon LiDAR
Hamamatsu Photodiode and Laser in Livox’s Horizon LiDAR
 
Spectral Engines Nirone Sensor X
Spectral Engines Nirone Sensor XSpectral Engines Nirone Sensor X
Spectral Engines Nirone Sensor X
 
Mediatek Autus R10 (MT2706) 77/79 GHz eWLB/AiP Radar Chipset
Mediatek Autus R10 (MT2706) 77/79 GHz eWLB/AiP Radar ChipsetMediatek Autus R10 (MT2706) 77/79 GHz eWLB/AiP Radar Chipset
Mediatek Autus R10 (MT2706) 77/79 GHz eWLB/AiP Radar Chipset
 
Goodix’s Ultra-Thin Optical In-Display Fingerprint
Goodix’s Ultra-Thin Optical In-Display FingerprintGoodix’s Ultra-Thin Optical In-Display Fingerprint
Goodix’s Ultra-Thin Optical In-Display Fingerprint
 
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 SeriesBroadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series
Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series
 
Advanced System-in-Package Technology in Apple’s AirPods Pro
Advanced System-in-Package Technology in Apple’s AirPods ProAdvanced System-in-Package Technology in Apple’s AirPods Pro
Advanced System-in-Package Technology in Apple’s AirPods Pro
 

Recently uploaded

08448380779 Call Girls In Diplomatic Enclave Women Seeking Men
08448380779 Call Girls In Diplomatic Enclave Women Seeking Men08448380779 Call Girls In Diplomatic Enclave Women Seeking Men
08448380779 Call Girls In Diplomatic Enclave Women Seeking MenDelhi Call girls
 
08448380779 Call Girls In Civil Lines Women Seeking Men
08448380779 Call Girls In Civil Lines Women Seeking Men08448380779 Call Girls In Civil Lines Women Seeking Men
08448380779 Call Girls In Civil Lines Women Seeking MenDelhi Call girls
 
Transcript: #StandardsGoals for 2024: What’s new for BISAC - Tech Forum 2024
Transcript: #StandardsGoals for 2024: What’s new for BISAC - Tech Forum 2024Transcript: #StandardsGoals for 2024: What’s new for BISAC - Tech Forum 2024
Transcript: #StandardsGoals for 2024: What’s new for BISAC - Tech Forum 2024BookNet Canada
 
Beyond Boundaries: Leveraging No-Code Solutions for Industry Innovation
Beyond Boundaries: Leveraging No-Code Solutions for Industry InnovationBeyond Boundaries: Leveraging No-Code Solutions for Industry Innovation
Beyond Boundaries: Leveraging No-Code Solutions for Industry InnovationSafe Software
 
Benefits Of Flutter Compared To Other Frameworks
Benefits Of Flutter Compared To Other FrameworksBenefits Of Flutter Compared To Other Frameworks
Benefits Of Flutter Compared To Other FrameworksSoftradix Technologies
 
CloudStudio User manual (basic edition):
CloudStudio User manual (basic edition):CloudStudio User manual (basic edition):
CloudStudio User manual (basic edition):comworks
 
Next-generation AAM aircraft unveiled by Supernal, S-A2
Next-generation AAM aircraft unveiled by Supernal, S-A2Next-generation AAM aircraft unveiled by Supernal, S-A2
Next-generation AAM aircraft unveiled by Supernal, S-A2Hyundai Motor Group
 
Snow Chain-Integrated Tire for a Safe Drive on Winter Roads
Snow Chain-Integrated Tire for a Safe Drive on Winter RoadsSnow Chain-Integrated Tire for a Safe Drive on Winter Roads
Snow Chain-Integrated Tire for a Safe Drive on Winter RoadsHyundai Motor Group
 
AI as an Interface for Commercial Buildings
AI as an Interface for Commercial BuildingsAI as an Interface for Commercial Buildings
AI as an Interface for Commercial BuildingsMemoori
 
SIEMENS: RAPUNZEL – A Tale About Knowledge Graph
SIEMENS: RAPUNZEL – A Tale About Knowledge GraphSIEMENS: RAPUNZEL – A Tale About Knowledge Graph
SIEMENS: RAPUNZEL – A Tale About Knowledge GraphNeo4j
 
Artificial intelligence in the post-deep learning era
Artificial intelligence in the post-deep learning eraArtificial intelligence in the post-deep learning era
Artificial intelligence in the post-deep learning eraDeakin University
 
Injustice - Developers Among Us (SciFiDevCon 2024)
Injustice - Developers Among Us (SciFiDevCon 2024)Injustice - Developers Among Us (SciFiDevCon 2024)
Injustice - Developers Among Us (SciFiDevCon 2024)Allon Mureinik
 
Unblocking The Main Thread Solving ANRs and Frozen Frames
Unblocking The Main Thread Solving ANRs and Frozen FramesUnblocking The Main Thread Solving ANRs and Frozen Frames
Unblocking The Main Thread Solving ANRs and Frozen FramesSinan KOZAK
 
WhatsApp 9892124323 ✓Call Girls In Kalyan ( Mumbai ) secure service
WhatsApp 9892124323 ✓Call Girls In Kalyan ( Mumbai ) secure serviceWhatsApp 9892124323 ✓Call Girls In Kalyan ( Mumbai ) secure service
WhatsApp 9892124323 ✓Call Girls In Kalyan ( Mumbai ) secure servicePooja Nehwal
 
Install Stable Diffusion in windows machine
Install Stable Diffusion in windows machineInstall Stable Diffusion in windows machine
Install Stable Diffusion in windows machinePadma Pradeep
 
Slack Application Development 101 Slides
Slack Application Development 101 SlidesSlack Application Development 101 Slides
Slack Application Development 101 Slidespraypatel2
 
Integration and Automation in Practice: CI/CD in Mule Integration and Automat...
Integration and Automation in Practice: CI/CD in Mule Integration and Automat...Integration and Automation in Practice: CI/CD in Mule Integration and Automat...
Integration and Automation in Practice: CI/CD in Mule Integration and Automat...Patryk Bandurski
 
Tech-Forward - Achieving Business Readiness For Copilot in Microsoft 365
Tech-Forward - Achieving Business Readiness For Copilot in Microsoft 365Tech-Forward - Achieving Business Readiness For Copilot in Microsoft 365
Tech-Forward - Achieving Business Readiness For Copilot in Microsoft 3652toLead Limited
 
08448380779 Call Girls In Greater Kailash - I Women Seeking Men
08448380779 Call Girls In Greater Kailash - I Women Seeking Men08448380779 Call Girls In Greater Kailash - I Women Seeking Men
08448380779 Call Girls In Greater Kailash - I Women Seeking MenDelhi Call girls
 
IAC 2024 - IA Fast Track to Search Focused AI Solutions
IAC 2024 - IA Fast Track to Search Focused AI SolutionsIAC 2024 - IA Fast Track to Search Focused AI Solutions
IAC 2024 - IA Fast Track to Search Focused AI SolutionsEnterprise Knowledge
 

Recently uploaded (20)

08448380779 Call Girls In Diplomatic Enclave Women Seeking Men
08448380779 Call Girls In Diplomatic Enclave Women Seeking Men08448380779 Call Girls In Diplomatic Enclave Women Seeking Men
08448380779 Call Girls In Diplomatic Enclave Women Seeking Men
 
08448380779 Call Girls In Civil Lines Women Seeking Men
08448380779 Call Girls In Civil Lines Women Seeking Men08448380779 Call Girls In Civil Lines Women Seeking Men
08448380779 Call Girls In Civil Lines Women Seeking Men
 
Transcript: #StandardsGoals for 2024: What’s new for BISAC - Tech Forum 2024
Transcript: #StandardsGoals for 2024: What’s new for BISAC - Tech Forum 2024Transcript: #StandardsGoals for 2024: What’s new for BISAC - Tech Forum 2024
Transcript: #StandardsGoals for 2024: What’s new for BISAC - Tech Forum 2024
 
Beyond Boundaries: Leveraging No-Code Solutions for Industry Innovation
Beyond Boundaries: Leveraging No-Code Solutions for Industry InnovationBeyond Boundaries: Leveraging No-Code Solutions for Industry Innovation
Beyond Boundaries: Leveraging No-Code Solutions for Industry Innovation
 
Benefits Of Flutter Compared To Other Frameworks
Benefits Of Flutter Compared To Other FrameworksBenefits Of Flutter Compared To Other Frameworks
Benefits Of Flutter Compared To Other Frameworks
 
CloudStudio User manual (basic edition):
CloudStudio User manual (basic edition):CloudStudio User manual (basic edition):
CloudStudio User manual (basic edition):
 
Next-generation AAM aircraft unveiled by Supernal, S-A2
Next-generation AAM aircraft unveiled by Supernal, S-A2Next-generation AAM aircraft unveiled by Supernal, S-A2
Next-generation AAM aircraft unveiled by Supernal, S-A2
 
Snow Chain-Integrated Tire for a Safe Drive on Winter Roads
Snow Chain-Integrated Tire for a Safe Drive on Winter RoadsSnow Chain-Integrated Tire for a Safe Drive on Winter Roads
Snow Chain-Integrated Tire for a Safe Drive on Winter Roads
 
AI as an Interface for Commercial Buildings
AI as an Interface for Commercial BuildingsAI as an Interface for Commercial Buildings
AI as an Interface for Commercial Buildings
 
SIEMENS: RAPUNZEL – A Tale About Knowledge Graph
SIEMENS: RAPUNZEL – A Tale About Knowledge GraphSIEMENS: RAPUNZEL – A Tale About Knowledge Graph
SIEMENS: RAPUNZEL – A Tale About Knowledge Graph
 
Artificial intelligence in the post-deep learning era
Artificial intelligence in the post-deep learning eraArtificial intelligence in the post-deep learning era
Artificial intelligence in the post-deep learning era
 
Injustice - Developers Among Us (SciFiDevCon 2024)
Injustice - Developers Among Us (SciFiDevCon 2024)Injustice - Developers Among Us (SciFiDevCon 2024)
Injustice - Developers Among Us (SciFiDevCon 2024)
 
Unblocking The Main Thread Solving ANRs and Frozen Frames
Unblocking The Main Thread Solving ANRs and Frozen FramesUnblocking The Main Thread Solving ANRs and Frozen Frames
Unblocking The Main Thread Solving ANRs and Frozen Frames
 
WhatsApp 9892124323 ✓Call Girls In Kalyan ( Mumbai ) secure service
WhatsApp 9892124323 ✓Call Girls In Kalyan ( Mumbai ) secure serviceWhatsApp 9892124323 ✓Call Girls In Kalyan ( Mumbai ) secure service
WhatsApp 9892124323 ✓Call Girls In Kalyan ( Mumbai ) secure service
 
Install Stable Diffusion in windows machine
Install Stable Diffusion in windows machineInstall Stable Diffusion in windows machine
Install Stable Diffusion in windows machine
 
Slack Application Development 101 Slides
Slack Application Development 101 SlidesSlack Application Development 101 Slides
Slack Application Development 101 Slides
 
Integration and Automation in Practice: CI/CD in Mule Integration and Automat...
Integration and Automation in Practice: CI/CD in Mule Integration and Automat...Integration and Automation in Practice: CI/CD in Mule Integration and Automat...
Integration and Automation in Practice: CI/CD in Mule Integration and Automat...
 
Tech-Forward - Achieving Business Readiness For Copilot in Microsoft 365
Tech-Forward - Achieving Business Readiness For Copilot in Microsoft 365Tech-Forward - Achieving Business Readiness For Copilot in Microsoft 365
Tech-Forward - Achieving Business Readiness For Copilot in Microsoft 365
 
08448380779 Call Girls In Greater Kailash - I Women Seeking Men
08448380779 Call Girls In Greater Kailash - I Women Seeking Men08448380779 Call Girls In Greater Kailash - I Women Seeking Men
08448380779 Call Girls In Greater Kailash - I Women Seeking Men
 
IAC 2024 - IA Fast Track to Search Focused AI Solutions
IAC 2024 - IA Fast Track to Search Focused AI SolutionsIAC 2024 - IA Fast Track to Search Focused AI Solutions
IAC 2024 - IA Fast Track to Search Focused AI Solutions
 

Everspin EMD3D256M STTMRAM Memory

  • 1. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 1 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr Everspin EMD3D256M Memory 256Mb Spin Transfer Torque MRAM SP20543 - Memory report by Belinda Dube Physical analysis done by Nicolas Radufe June 2020 - Sample REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
  • 2. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 2 Table of Contents Overview / Introduction 4 o Executive Summary o Reverse Costing Methodology Company Profile & Supply Chain 9 Physical Analysis 16 o Summary of the Physical Analysis 17 o STT MRAM Memory Package 19 ✓ Module Views ✓ Module Cross-Section ✓ Module Patents o STT MRAM Memory Die 25 ✓ STT MRAM Memory Die View & Dimensions ✓ STT MRAM Memory Delayering ✓ STT MRAM Memory Die Process ✓ STT MRAM Memory Die Cross-Section ✓ STT MRAM Memory Die Process Characteristic STT MRAM Memory Manufacturing Process 47 o STT MRAM Memory Die Front-End Process & Fabrication Unit o Manufacturing Process Steps o Final Test & Packaging Fabrication unit o Summary of the main parts Cost Analysis 56 o Summary of the cost analysis 57 o Yields Explanation & Hypotheses 59 o STT MRAM Memory 62 ✓ STT MRAM Memory Front-End Cost ✓ STT MRAM Memory Probe Test, Thinning & Dicing ✓ STT MRAM Memory Wafer Cost ✓ STT MRAM Memory Die Cost o Packaged STT MRAM Memory 66 ✓ Packaging Cost ✓ Components Cost Selling price 68 Feedbacks 73 SystemPlus Consulting services 75
  • 3. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 3 Overview / Introduction o Executive Summary o Reverse Costing Methodology o Glossary o Datasheet Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Cost Comparison Selling Price Analysis Feedbacks Related Reports About System Plus Executive Summary This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of Everspin’s EMD3D256M STTMRAM. Amongst multiple emerging NVM technologies, spin transfer torque magneto resistive RAM (STT-MRAM) has shown significant potential and market growth driven by low latency storage applications. In 2018 MRAM Market recorded a Revenue of $44 million dollars. Compound annual growth rate of MRAM market is estimated at 85% between 2018 and 2024. Magnetoelectronic memories have been employed in numerous information devices because of their nonvolatile characteristics, high speed and low power consumption. Their high endurance characteristic has made the STT MRAM Memory a good competitor in the memory industry and promises to pick up significant market shares in the next few years. Everspin’s STT MRAM component has a compact structure integrating numerous layers that include ferromagnetic material and antiferromagnetic material forming a magnetic tunnel junction. Different resistive states created in the MRAM memory cell allow read and write functions. A dielectric layer is coupled between two magnetic materials. A complex fabrication method is used to deposit and pattern the thin layers that form the STT MRAM memory cell. Everspin Technologies leads the (STT-) MRAM market. The 256Mb STT MRAM memory uses a 40 nm technology node. The memory is manufactured along with the CMOS Transistors. System Plus Consulting presents a deep analysis of Everspin’s EMD3256M STT MRAM Memory. The report includes an analysis of the package and the dies, the MRAM memory cell and focusing on the layered material that make up the MRAM Cell memory. It also features a cost analysis and a price estimation of the component; this cost analysis integrates the manufacture of the CMOS transistors and the MRAM Memory cells. The manufacturing process steps are detailed including the supply chain. The results of manufacturing cost are used to determine the cost per Mb for Everspin’s STT MRAM Memory.
  • 4. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 4 Overview / Introduction o Executive Summary o Reverse Costing Methodology o Glossary o Datasheet Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Cost Comparison Selling Price Analysis Feedbacks Related Reports About System Plus The reverse costing analysis is conducted in 3 phases: Teardown analysis Package is analyzed and measured The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking Setup of the manufacturing process. Costing analysis Setup of the manufacturing environment Cost simulation of the process steps Selling price analysis Supply chain analysis Analysis of the selling price Executive Summary
  • 5. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 5 PHYSICAL ANALYSIS
  • 6. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 6 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Overview o Package Assembly o Views & Dimensions o Cross-Section o Opening o Memory Die o Views & Dimensions o Die Cross-section o Delayering o Die Process Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks Related Reports About System Plus Package Opening- Wire Bonding
  • 7. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 7 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Overview o Package Assembly o Views & Dimensions o Cross-Section o Opening o Memory Die o Views & Dimensions o Die Cross-section o Delayering o Die Process Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks Related Reports About System Plus Die Cross-Section – Substrate Thickness
  • 8. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 8 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Overview o Package Assembly o Views & Dimensions o Cross-Section o Opening o Memory Die o Views & Dimensions o Die Cross-section o Delayering o Die Process Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks Related Reports About System Plus Die Cross-Section – Metal Layers
  • 9. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 9 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Overview o Package Assembly o Views & Dimensions o Cross-Section o Opening o Memory Die o Views & Dimensions o Die Cross-section o Delayering o Die Process Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks Related Reports About System Plus Die Cross-Section - SEM View ©2020 by System Plus Consulting Die Cross-Section – MRAM Cells
  • 10. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 10 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Overview o Package Assembly o Views & Dimensions o Cross-Section o Opening o Memory Die o Views & Dimensions o Die Cross-section o Delayering o Die Process Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks Related Reports About System Plus Die Cross-Section – MRAM Cells
  • 11. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 11 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Overview o Package Assembly o Views & Dimensions o Cross-Section o Opening o Memory Die o Views & Dimensions o Die Cross-section o Delayering o Die Process Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks Related Reports About System Plus Die Cross-Section – MRAM Cells
  • 12. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 12 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Overview o Package Assembly o Views & Dimensions o Cross-Section o Opening o Memory Die o Views & Dimensions o Die Cross-section o Delayering o Die Process Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks Related Reports About System Plus Die Cross-Section – MRAM Cells
  • 13. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 13 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Overview o Package Assembly o Views & Dimensions o Cross-Section o Opening o Memory Die o Views & Dimensions o Die Cross-section o Delayering o Die Process Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks Related Reports About System Plus Die Process – Memory Cells
  • 14. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 14 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Overview o Package Assembly o Views & Dimensions o Cross-Section o Opening o Memory Die o Views & Dimensions o Die Cross-section o Delayering o Die Process Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks Related Reports About System Plus Die Overview ©2020 by System Plus Consulting Die Process – Memory Cells
  • 15. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 15 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Overview o Package Assembly o Views & Dimensions o Cross-Section o Opening o Memory Die o Views & Dimensions o Die Cross-section o Delayering o Die Process Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks Related Reports About System Plus Die Delayering – Memory Cell Density
  • 16. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 16 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Overview o Package Assembly o Views & Dimensions o Cross-Section o Opening o Memory Die o Views & Dimensions o Die Cross-section o Delayering o Die Process Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks Related Reports About System Plus Die Process – Memory Cell Size
  • 17. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 17 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow o Memory Front-End Process o Memory Fabrication Unit o Manufacturing Steps o Final Test & Assembly Unit Cost Analysis Cost Comparison Selling Price Analysis Feedbacks Related Reports About System Plus STT MRAM Memory Process Steps
  • 18. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 18 Overview / Introduction Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow o Memory Front-End Process o Memory Fabrication Unit o Manufacturing Steps o Final Test & Assembly Unit Cost Analysis Cost Comparison Selling Price Analysis Feedbacks Related Reports About System Plus STT MRAM Memory Process Steps
  • 19. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 19 C O S T ANALYSIS
  • 20. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 20 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o Memory Wafer Cost o Memory Die Cost o Memory Package Cost o Component Cost Cost Comparison Selling Price Analysis Feedbacks Related Reports About System Plus STT MRAM Memory- CMOS & Metal Layers Front-End Cost
  • 21. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 21 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o Memory Wafer Cost o Memory Die Cost o Memory Package Cost o Component Cost Cost Comparison Selling Price Analysis Feedbacks Related Reports About System Plus STT MRAM Memory Cells Front-End Cost
  • 22. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 22 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o Memory Wafer Cost o Memory Die Cost o Memory Package Cost o Component Cost Cost Comparison Selling Price Analysis Feedbacks Related Reports About System Plus Component Cost
  • 23. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 23 SELLING P R I C E
  • 24. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 24 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Cost Comparison Selling Price Analysis o Definition of Prices o Manufacturer Financials o Component Price o STT MRAM Price/Mb Feedbacks Related Reports About System Plus STT MRAM Memory Component Price
  • 25. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 25 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Cost Comparison Selling Price Analysis Feedbacks Related Reports About System Plus REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING Related Reports MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT MEMORY REPORTS • Emerging Non-Volatile Memory 2020 • MRAM Technology and Business 2019 REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MEMORY REPORTS • Intel Optane 128GB DIMM • 3D NAND Memory Comparison 2019 • LPDDR4 Memory Comparison 2019
  • 26. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 26 COMPANY SERVICES
  • 27. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 27 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Cost Comparison Selling Price Analysis Feedbacks Related Reports About System Plus o Company services o Contact Business Models Fields of Expertise Custom Analyses (>130 analyses per year) Reports (>60 reports per year) Costing Tools Trainings
  • 28. ©2020 by System Plus Consulting | SP20543 Everspin EMD3D256M STTMRAM Memory |Sample 28 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Cost Comparison Selling Price Analysis Feedbacks Related Reports About System Plus o Company services o Contact Contact Headquarters 22 bd Benoni Goullin 44200 Nantes FRANCE +33 2 40 18 09 16 sales@systemplus.fr Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY +49 151 23 54 41 82 llevenez@systemplus.fr www.systemplus.fr NANTES Headquarter FRANKFURT/MAIN Europe Sales Office LYON YOLE HQ TOKYO YOLE KK GREATER CHINA YOLE CORNELIUS YOLE Inc. KOREA YOLE Asia Sales Office Takashi ONOZAWA Tokyo JAPAN T : +81 804 371 4887 onozawa@yole.fr Mavis WANG TAIWAN T :+886 979 336 809 CN: +8613661566824 wang@yole.fr America Sales Office Steve LAFERRIERE WESTERN US T : +1 310 600 8267 laferriere@yole.fr Chris YOUMAN EASTERN US & CANADA T : +1 919 607 9839 chris.youman@yole.fr