Dig deep into Hikvision’s AI-powered thermal network camera for security applications. More information: https://www.systemplus.fr/reverse-costing-reports/hikvision-intelligent-thermal-network-camera-ds-2td2166-15-v1/

1. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 1
22 Bd Benoni Goullin
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
HikvisionIntelligent Thermal NetworkCamera(DS-2TD2166-15V1)
Dig deep into Hikvision’s AI-powered thermal network camera for
security applications
SP20574 - SYSTEM report by Benjamin PUSSAT
Cost Analysis : Benjamin Pussat, David Le Gac, Florian Rousseau
Laboratory : Youssef El Gmili, Véronique Le Troadec, Nicolas Radufe
December 2020 – Sample

2. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Main Chipset
o Supply Chain
o Specifications
o Block Diagram
o Reverse Costing Methodology
Company Profile 15
o Hikvision
Teardown Analysis 21
o Views and Dimensions of the System
o System Opening
o Electronic Boards
✓ Top Side – High Resolution photos
✓ Top Side – PCB markings
✓ Top Side – Main components markings
✓ Top Side – Main components identification
✓ Top Side – Other components markings
✓ Top Side – Other components identification
✓ Bottom Side – High Resolution photos
✓ Bottom Side – PCB markings
✓ Bottom Side – Main components markings
✓ Bottom Side – Main components identification
✓ Bottom Side – Other components markings
✓ Bottom Side – Other components identification
o xxxxxxxxx 17µm Microbolometer
o Lens Module
Cost Analysis 156
o Accessing the BOM
o PCB Cost
o ICs Cost
o Mechanicals Cost
o BOM Cost – Main Electronic Board
o BOM Cost - Mechanicals
o Material Cost Breakdown by Sub-Assembly
o Material Cost Breakdown by Component Category
o Accessing the Added Value (AV) cost
o Electronic Board Manufacturing Flow
o Details of the Main Electronic Board AV Cost
o Details of the System Assembly AV Cost
o Added-Value Cost Breakdown
o Manufacturing Cost Breakdown
Estimated Manufacturer Price Analysis 209
o Estimation of the Manufacturer Price
Feedbacks 200
System Plus Consulting Services 214

3. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 3
Overview / Introduction
o Executive Summary
o Block Diagram
o Reverse Costing
Methodology
o Glossary
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the DS-2TD2166-15 V1
Thermal Network Camera supplied by Hikvision (website).
For the calculations, for each reference, we estimate the following parameters :
Manufacturing quantity : 100,000 units
Manufacturing years: 2020
Manufacturing country : China
Manufacturer Reference Description
IRAY RTD6171MR Microbolometer 640x512 pixel (17µm Pitch) 60Hz (Analog Output), SMD
INTEL 5CEFA4U19I7N IC, FPGA Cyclone V 550MHz 224I/O, FBGA484
MICRON MT41K128M16JT-125:K TR IC, SDRAM 2Gb (128Mx16) 800MHz 13.75ns, TFBGA96
MAXIM MAX1978ETM+T IC, Temperature Controller for Peltier Module, TQFN48
HISILICON HI3519 V111 IC, SoC for Professional HD IP Camera, BGA523
MOVIDIUS MA2450 IC, Vision Processor Unit 2x32Bit RISC Proc. 4Gb LPDDR3, BGA270
SAMSUNG K4A8G165WB-BCRC IC, DDR4 DRAM 8Gb (512Mx16) 2400Mbps, FBGA96
Main Chipset
The main chipset summarizes the main integrated circuit functions found in the system.

4. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 4
Overview / Introduction
o Executive Summary
o Block Diagram
o Reverse Costing
Methodology
o Glossary
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Specifications – DS-2TD2166-15 V1 Camera
Source : Hikvision.com

5. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 5
Overview / Introduction
o Executive Summary
o Block Diagram
o Reverse Costing
Methodology
o Glossary
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Block Diagram - HiSilicon Hi3519 Overview
Image Signal Processing

6. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 6
Overview / Introduction
o Executive Summary
o Block Diagram
o Reverse Costing
Methodology
o Glossary
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
RTD6171MR
Microblometer
Block Diagram (1/2)
Peltier Module
Infrared
Light
5CEFA4U19I7N
FPGA Cyclone V
550MHz 224I/O
MT41K128M16JT-125:K
SDRAM 2Gb 800MHz
MT25QL256ABA1EW9-0SIT :K
Flash NOR 256Mb 133MHz
Crystal Unit
27MHz
Crystal Unit
50MHz
REF5025IDGKR
Precision Voltage
Reference 2.5V
0.05% 3ppm/°C
SP3232EEN-L
RS232 Transceiver
Board 7
Board 2
Board 1Board 3
TMP75AIDRG4
9-12Bit
Temperature Sensor
LT3042IDD
Linear Regulator
20V 200mA
LT3042IDD
Dual ADC 14-Bit
25Mps
LT1994IMS8
Differential
Amplifier 70MHz
ADS1112IDGSR
ADC 16-Bit
With On Board
Reference
LT3042IDD
Linear Regulator
20V 200mA
NTC/PTC
Thermistor
AD8605ARTZ-REEL
General Purpose
Amplifier
MAX1978ETM+T
Temperature
Controller for Peltier
Module
Signal Conditioning/Amplifying
Data To Board 4 (SoC)
AD5645RBRUZ
Quad 14-Bit DAC
with On-Chip
Reference
TCR2EF18
LDO Regulator 1.8V
200mA
DC Power
From Board 4
Heat
Resistor
LensModule
Power
From Board 4
Shutter
AnalogOutput
DRV8837DSGR
H-bridge Driver
1.8A
The block diagram of the Thermal Network Camera is estimated in the following schematics:

7. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 7
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Electronic components (ASIC/ASSP)
Supplier : N/A
PCBs
Manufacturing Country : China
PCBs manufacturer(s) : SUN & LYNN,
SUZHOU CIRCUIT, CCTC, JXPCB,
OWNLON, PCBGALAXY
Mechanicals (Plastics/Metal)
Manuf. country : China
Mechanicals manufacturer: N/A
PCB assembly & tests
Assembly country : China
Product assembler : Hikvision
Final product assembly
Assembly country : China
Product assembler : Hikvision
Final product functional test
Assembly country : China
Product tester : Hikvision
- In order to deliver a manufacturing price, we propose a simplified supply chain as below. For each section, assumptions about manufacturer or
manufacturing country can be made if no information about manufacturing is founded (PCB, mechanicals, etc).
Supply chain
Electronic components (General)
Suppliers : Intel / HiSilicon / Micron /
Samsung Analog Devices / Texas
Instruments / Hirose / - Confirmed information (S+C)
- Not confirmed information (S+C)
- No information
COLOR LEGEND :
N/A - Not Applicable
Packaged Microbolometer
Manuf. country : China
Microbolometer manufacturer: Iray
Die Supplier : Raytron

8. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 8
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
o Views & Dimensions
o System Opening
o Electronic Board
o Microbolometer
o Lens Module
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Global View
Global views of the Thermal Network Camera
Total Weight: 1910 g

9. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 9
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
o Views & Dimensions
o System Opening
o Electronic Board
o Microbolometer
o Lens Module
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Views and Dimensions Total Weight: 1910 g
105mm
323mm
105mm

10. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 10
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
o Views & Dimensions
o System Opening
o Electronic Board
o Microbolometer
o Lens Module
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
System Opening
System disassembly

11. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 11
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
o Views & Dimensions
o System Opening
o Electronic Board
o Microbolometer
o Lens Module
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Electronic Board 1 – Top Side – Angled View – High Resolution Photo
PCB Characteristics :
Material : FR4 Layers number : 4 Dimensions : 40mm x 40mm
Total Thickness : 1.45mm External copper thickness : 35µm(+10µm) Internal copper thickness : 35µm
Finishing : HASL Lead Free Drilling holes number : 213 Drilling diameters : 300µm / 1mm / 2.4mm

12. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 12
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
o Views & Dimensions
o System Opening
o Electronic Board
o Microbolometer
o Lens Module
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
INTEL
5CEFA4U19I7N
IC, FPGA Cyclone V 550MHz
224I/O,
FBGA484
Datasheet
DIODES INC
AP2822CKBTR-G1
IC, High-Side Power Switch
1.5A,
SOT23-5
Datasheet
HIROSE
DF12(5.0)-50DP-0.5V(86)
Connector Header Board-to-
Board 50-Position 0.5mm
Pitch, SMD
Datasheet
MICRON
MT41K128M16JT-125:K TR
IC, SDRAM 2Gb (128Mx16)
800MHz 13.75ns,
TFBGA96
Datasheet
MICRON
MT25QL256ABA1EW9-0SIT TR
IC, Flash NOR Memory 256Mb
(32Mx8) 133MHz SPI,
WFDFN8
Datasheet
Electronic Board 2 – Top Side – Main Components Identification

13. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 13
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
o Views & Dimensions
o System Opening
o Electronic Board
o Microbolometer
o Lens Module
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Electronic Board 7 – Top Side – Angled View – High Resolution Photo

14. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 14
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
o Views & Dimensions
o System Opening
o Electronic Board
o Microbolometer
o Lens Module
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
RTD6171MR 17µm Microbolometer - Disassembly
Microbolometer Die (Vanadium Oxyde)
+
ROIC Dis (Silicon)
Germanium Window
with Filters (both Sides)
25x23.5x1.2mm
Getter
Thermoelectric Cooler
18.4x18x3.5mm
Package

15. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 15
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
o Views & Dimensions
o System Opening
o Electronic Board
o Microbolometer
o Lens Module
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Lens Module – EDX Analysis – Lens 1 & Aluminum Case
Germanium
Aluminum

16. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 16
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o Mechanicals Cost
o BOM Cost – Electronics
o BOM Cost – Mechanicals
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
PCB Cost – Electronic Board 4
Copper foils 0.1256$ 23.3%
Prepregs 0.1198$ 22.3%
Cores 0.2660$ 49.4%
Material overheads 0.0269$ 5.0%
Total substrate cost 0.5383$ 30.8%
Lamination 0.0295$ 3.3%
Mechanical drilling 0.1606$ 18.2%
Desmear 0.0059$ 0.7%
V-Scoring 0.0120$ 1.4%
Routing 0.0154$ 1.7%
Imaging 0.2597$ 29.4%
PTH metalization 0.1882$ 21.3%
Soldermask 0.0376$ 4.3%
Finishing 0.1187$ 13.4%
Electrical tests 0.0292$ 3.3%
AVI 0.0108$ 1.2%
Visual inspections 0.0078$ 0.9%
Final Quality Control 0.0034$ 0.4%
Packing 0.0042$ 0.5%
Total Process Costs 0.8830$ 50.5%
Quantity factor 1.07
Total Manufacturing Cost 1.5208$ 87.0%
Warranty -$
Indirect OH 0.0304$ 1.7%
Direct OH -$
SG&A 0.0456$ 2.6%
Profit 0.1521$ 8.7%
Estimated Price 1.75$ per board
2020
Cost
Substrate costs
Process costs
Selling price
2020
Cost
2020
Cost

17. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 17
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o Mechanicals Cost
o BOM Cost – Electronics
o BOM Cost – Mechanicals
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
The circuit includes 1 Silicon die assembled into the package.
Die + parts of the substrate.
(X-Ray top view)
Component opening
(Top view)
Die + parts of the substrate.
(X-Ray side view)
Estimation of the cost of the HISILICON HI3519 V111

18. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 18
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o Mechanicals Cost
o BOM Cost – Electronics
o BOM Cost – Mechanicals
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Estimation of the Main blocks: Digital, Analog, SRAM, ROM.
Estimation of the Technology: CMOS 28nm, 10 Metal layers, 2 Polysilicon layers.
Lithography steps : 46
Wafer fab unit: TSMC Fab 15 – wafers 300mm, located in Taichung, Taiwan.
Note : a specific and complete analysis of the technology of the dies should confirm these hypothesis but a such analysis is not included in this report.
Die dimensions: 6.13mm x6.07mm = 37.21mm²
Pad number : 1424
Die markings
Estimation of the cost of the HISILICON HI3519 V111

19. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 19
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o Mechanicals Cost
o BOM Cost – Electronics
o BOM Cost – Mechanicals
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Estimation of the cost of the HISILICON HI3519 V111

20. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 20
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o Mechanicals Cost
o BOM Cost – Electronics
o BOM Cost – Mechanicals
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
BOM Cost – Electronic Board Board 1
Electronic Board 1
Quantity: 100 000
Date: 2020 TOTAL PURCHASING COST PER ARTICLE: 6.86$
Part reference Article qty Description Package Pin nb Manufacturer Datasheet Side Unit cost Total cost
B4B-ZR-SM4-TFT(LF)(SN) 1 unit Connector Header Wire-to-Board 4-Position 1.5mm Pitch SMDSMD 4 JST http://www.jst-mfg.com/product/pdf/eng/eZH.pdf1 0.1634$ 0.1634$
BM04B-GHS-TBT(LF)(SN)(N) 1 unit Connector Header Wire-to-Board 4-Position 1.5mm Pitch SMDSMD 2 JST http://www.jst-mfg.com/product/pdf/eng/eGH.pdf1 0.1193$ 0.1193$
CAPACITOR MLCC 0402 10% 15 unit Capacitor Ceramic 0402 10% 0402 2 1 0.0010$ 0.0150$
CAPACITOR MLCC 0603 10% 2 unit Capacitor Ceramic 0603 10% 0603 2 1 0.0015$ 0.0030$
CAPACITOR MLCC 0805 10% 7 unit Capacitor MLCC 0805 10% 0805 2 1 0.0030$ 0.0210$
CAPACITOR MLCC 1206 10% 7 unit Capacitor Ceramic 1206 10% 1206 2 1 0.0055$ 0.0385$
DS-2TD2166-15 V1 - PCB1 1 unit PCB FR4 40x40x1.4mm 4-Layer (35µm INT / 35µm EXT) HASL LF Finishing 0 0.2600$ 0.2600$
FH12-36S-0.5SH(55) 1 unit Connector FFC 36-Position 0.5mm Pitch R/A SMD SMD 2 HIROSE https://www.hirose.com/product/document?clcode=&pro1 0.8736$ 0.8736$
FH19C-8S-0.5SH(10) 1 unit Connector FFC 8-Position 0.5mm Pitch R/A SMD SMD 8 HIROSE https://media.digikey.com/pdf/Data Sheets/Hirose PDFs1 0.3775$ 0.3775$
FIXED INDUCTOR 3X3X1.3MM SMD 2 unit Fixed Inductor 3x3x1.3mm SMD SMD 2 1 0.0801$ 0.1602$
MMCX-R-PC(40) 1 unit Connector MMCX Receptacle 50 Ohm TH TH 5 HIROSE https://www.hirose.com/product/document?clcode=CL031 1.0540$ 1.0540$
MP2161GJ-Z 2 unit IC, Step-Down Converter 6V 2A, SOT23-8 SOT23-8 8 MONOLITHIC POWER SYSTEMShttps://www.monolithicpower.com/en/documentview/p1 0.2817$ 0.5634$
MPQ2314GJ-Z 1 unit IC, Step-Down Converter 24V 2A, SOT23-8 SOT23-8 8 MONOLITHIC POWER SYSTEMShttps://www.monolithicpower.com/en/documentview/p1 0.7134$ 0.7134$
MS0420-3R3M 1 unit Fixed Inductor 3.3µH 20% 2.5A SMD SMD 2 COILMX https://datasheet.lcsc.com/szlcsc/1912111437_COILMX-M1 0.1078$ 0.1078$
RESISTOR CHIP 0402 5% 14 unit Resistor Chip 0402 5% 0402 2 1 0.0008$ 0.0112$
RESISTOR CHIP 0603 5% 5 unit Resistor Chip 0603 5% 0603 2 1 0.0008$ 0.0040$
SMBJ6.0CA 1 unit Diode TVS Bidirectional 6V 10.3V SMB SMB (DO-214AA) 2 BOURNS https://www.bourns.com/docs/Product-Datasheets/SMB1 0.0605$ 0.0605$
SRN5040TA-100M 2 unit Fixed Inductor 10µH 10% 2.2A SMD SMD 2 BOURNS https://www.bourns.com/docs/Product-Datasheets/SRN51 0.1303$ 0.2606$
SS1P4-M3/85A 1 unit Diode Schottky 40V 1A DO-220AA DO-220AA 2 VISHAY https://www.vishay.com/docs/88935/ss1p3.pdf1 0.4492$ 0.4492$
TPS563209DDCR 1 unit IC, Step-Down Regulator 17V 3A, SOT23-6 SOT23-6 6 TEXAS INSTRUMENTS http://www.ti.com/lit/ds/symlink/tps563209.pdf1 0.1283$ 0.1283$
TPS61170DRVR 1 unit IC, High-Voltage Boost Converter 18V 2A, WDFN6 WDFN6 6 TEXAS INSTRUMENTS http://www.ti.com/lit/ds/symlink/tps61170.pdf1 0.5727$ 0.5727$
CAPACITOR MLCC 0402 10% 8 unit Capacitor Ceramic 0402 10% 0402 2 2 0.0010$ 0.0080$
CAPACITOR MLCC 0603 10% 7 unit Capacitor Ceramic 0603 10% 0603 2 2 0.0015$ 0.0105$
CAPACITOR MLCC 0805 10% 2 unit Capacitor MLCC 0805 10% 0805 2 2 0.0030$ 0.0060$
CAPACITOR MLCC 1206 10% 4 unit Capacitor Ceramic 1206 10% 1206 2 2 0.0055$ 0.0220$
DF12-50DS-0.5V(86) 1 unit Connector Receptacle Board-to-Board 50-Position 0.5mm Pitch, SMDSMD 50 HIROSE https://www.hirose.com/product/document?clcode=CL052 0.4522$ 0.4522$
DMP3098L-7 1 unit Transistor MOSFET P-Channel 30V 3.8A SOT23 SOT23 3 DIODES INC https://www.diodes.com/assets/Datasheets/ds31447.pd2 0.0462$ 0.0462$
P6SMB18CA 1 unit Diode TVS 15.3V 25.5V SMB SMB (DO-214AA) 2 BOURNS https://www.bourns.com/docs/Product-Datasheets/P6SM2 0.0839$ 0.0839$
RESISTOR CHIP 0402 5% 13 unit Resistor Chip 0402 5% 0402 2 2 0.0008$ 0.0104$
SP3232EEN-L 1 unit IC, RS-232 Transceiver 3.0V to 5V, SO16 SO16 16 MAXLINEAR https://www.maxlinear.com/ds/sp3222e_sp3232e.pdf2 0.2655$ 0.2655$

21. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 21
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o Mechanicals Cost
o BOM Cost – Electronics
o BOM Cost – Mechanicals
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Material Cost Breakdown by Component Categories (Details)
M à J
IC | Analog/Power/Regulator IC
3%
IC | FPGA
2%
IC | Generic Processor
2%
IC | Memory
2%
IC | Sensor
38%
Misc | Mechanics
50%
Material Cost Breakdown
Level 2-Component
Category
Items
count
Total cost %
Discretes 5 0.0355$ 0.0%
Discretes | Diode 36 2.8055$ 0.4%
Discretes | LED 4 0.0764$ 0.0%
Discretes | Transistor 14 0.9050$ 0.1%
IC | Analog/Power/Regulator IC49 26.5755$ 3.4%
IC | Communication IC 3 1.6991$ 0.2%
IC | FPGA 1 18.5000$ 2.4%
IC | Generic Processor 3 16.5121$ 2.1%
IC | Memory 5 13.3235$ 1.7%
IC | Opto-Electronics 2 0.1378$ 0.0%
IC | Sensor 4 295.8247$ 37.8%
Misc 1 0.6000$ 0.1%
Misc | Battery 1 0.7473$ 0.1%
Misc | Mechanics 72 389.6586$ 49.8%
Misc | Paste 1 0.2080$ 0.0%
Misc | Relay 2 0.6942$ 0.1%
Passive 4 0.2588$ 0.0%
Passive | Capacitor 768 2.9939$ 0.4%
Passive | Crystal/Oscillator 7 0.7162$ 0.1%
Passive | Fuse 1 0.0536$ 0.0%
Passive | Inductor 26 3.1345$ 0.4%
Passive | Resistor 501 1.6157$ 0.2%
Passive | Transformer 2 0.4800$ 0.1%
PCB 9 4.1890$ 0.5%
TOTAL 1521 $ 781.74 100%

22. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 22
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o Mechanicals Cost
o BOM Cost – Electronics
o BOM Cost – Mechanicals
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Step n° Step name Step Code Inline step? Side Auto/Manual Step Time (s) Equipment number Equip. Price (USD) Remark
1 Material preparation MP No - M 30s / reference 1 5,000
2 Storage buffer SB Yes - - 5s / board 1 20,000
3 PCB Cleaning C Yes - A 7s / panel 1 20,000
4 Stencil printing SP Yes 2 A 17.6s / panel 1 75,000
5 Solder paste inspection SPI Yes 2 A 10.1s / panel 1 110,000
6 Pick and place SMT x4 P&P Yes 2 A 45k SMT/hour 4 450,000 x4
7 Automated optical inspection AOI Yes 2 A 11.8s / panel 1 170,000
8 Reflow RF Yes 2 A 240s Cycle 1 125,000
9 Automated optical inspection AOI Yes 2 A 11.8s / panel 1 170,000
10 Storage buffer SB Yes - - 5s / board - 20,000
11 Automated X-Ray Inspection AXI No 2 A 37s / panel 1 400,000
12 Storage buffer SB Yes - - 5s / board 1 - Same machine as step n°2
13 PCB Cleaning C Yes - A 7s / panel 1 - Same machine as step n°3
14 Stencil printing SP Yes 1 A 17.6s / panel - - Same machine as step n°4
15 Solder paste inspection SPI Yes 1 A 10.1s / panel 1 - Same machine as step n°5
16 Pick and place SMT x4 P&P Yes 1 A 45k SMT/hour 4 - Same machines as step n°6
17 Automated optical inspection AOI Yes 1 A 11.8s / panel - - Same machine as step n°7
18 Reflow RF Yes 1 A 240s Cycle - - Same machine as step n°8
19 Automated optical inspection AOI Yes 1 A 11.8s / panel - - Same machine as step n°9
20 Storage buffer SB Yes - - 5s / board 1 - Same machine as step n°10
21 Automated X-Ray Inspection AXI No 1 A 37s / panel 1 - Same machine as step n°11
22 In-situ test ICT No 1+2 A 45.7s / panel 1 200,000
23 Storage buffer SB Yes - - 5s / board 1 20,000
24 Automatic THT Insertion ATI Yes 1 A 45s / panel 1 200,000
25 Selective Wave Soldering SWS Yes 1 A 240s Cycle 1 180,000
26 Automated optical inspection AOI Yes 1 A 11.8s / panel 1 170,000
27 Storage buffer SB Yes - - 5s / board 1 20,000
28 Depaneling DP No 1+2 A 25s / panel 1 120,000
29 Functional test FCT No 1+2 A 25s / board 1 300,000
30 Board conditioning BC No - M 5s / board 1 3,000
Panel size : 4 Boards Total equipment price : $ 4,128,000
Details of Electronic Board 4 Added-Value (AV) Cost
Details of the Electronic Board assembly process.

23. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 23
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
o Assessing the BOM
o PCB Cost
o IC Cost
o Mechanicals Cost
o BOM Cost – Electronics
o BOM Cost – Mechanicals
o Material Cost Breakdown
o Added-Value Cost
o Manufacturing Cost
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Added-Value Cost Breakdown
The Total Assembly Cost, including the calibration and functional tests, is estimated to
$5.70.
The System assembly+tests represent 45% of the Total Added Value Cost
System
44%
Electronic Board
3
6%
Electronic Board
1
4%
Electronic Board
2
8%
Electronic Board
4
26%
Electronic Board
5
2%
Electronic Board
6
8%
Electronic Board
7
2%
Assembly Cost Breakdown
System
Electronic Board 3
Electronic Board 1
Electronic Board 2
Electronic Board 4
Electronic Board 5
Electronic Board 6
Electronic Board 7 Microbolometer
Lens Module / Mechanicals
Power Supply/RS232 TRX
FPGA/SDRAM/Flash NOR
Main DC Power Supplies/DRAM/Vision CPU/HD Camera CPU/Ethernet PHY/RS3232 TRX
Micro SD Card Connector
AC/DC Conversion
Microbolometer
Peltier/Analog Measurement Microbolometer
Microbolometer
Microbolometer
AI / Power Supply
AI / Power Supply
Ai / Power Supply
Name Fonction Main Block
Microbolometer
ASSEMBLY
COST
%
2.54$ 45%
0.21$ 4%
0.48$ 8%
0.34$ 6%
1.47$ 26%
0.10$ 2%
0.44$ 8%
0.11$ 2%
5.70$ 100%TOTAL
Electronic Board 6
Electronic Board 7
Electronic Board 4
Electronic Board 5
Electronic Board 2
Electronic Board 1
Electronic Board 3
SP20574 - SYSTEM - Hikvision DS-2TD2166-15
V1 Thermal Network Camera
System

24. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 24
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
o Financial Ratios
o Manufacturer Price
Feedbacks
Related Reports
About System Plus
Estimation of the Manufacturer Price
The bill of material (BOM) cost is estimated to $781.74 for the system.
To this, we must add some scrap costs and component supplying costs to obtain the total
material cost of $828.65.
The assembly cost is estimated to $5.70, so the manufacturing cost is $834.35.
With estimated costs of R&D, G&A and Profit, the average manufacturer price of Hikvision
can be estimated at $1574.25 when using the estimated economic parameters of
Hikvision.
M à J
M à J
Scrap Supplying R&D G&A Profit
1.00% 5.00% 10.00% 16.00% 21.00%
2020 100 000 China $781.74 $7.82 $39.09 $828.65 $5.70 $834.35 $157.43 $251.88 $330.59 $1 574.25
Estimated
Manufacturer
Price
HikVision
Year
Annual
Quantity
Manufacturing
Location
Material
Cost
Total Material
Cost
Assembly
Cost
Manufacturing
Cost

25. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 25
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
IMAGING
• Thermal Imagers and Detectors 2020
• Cameras and Computing for Surveillance and Security 2020
• Status of CMOS Image Sensor Industry 2020
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
IMAGING
• IRay Technology 12µm and 17µm Thermal Sensors
• FLIR Boson – a small, innovative, low power, smart
thermal camera core

26. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 26
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
o Company services
o Contact
Business Models Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>60 reports per year)
Costing Tools
Trainings

27. ©2020 by System Plus Consulting | SP20574 Hikvision Intelligent Thermal Network Camera (DS-2TD2166-15 V1) | Sample 27
Overview / Introduction
Company Profile & Supply
Chain
Teardown Analysis
Cost Analysis
Manufacturer Price Analysis
Feedbacks
Related Reports
About System Plus
o Company services
o Contact
Contact
www.systemplus.fr
NANTES
Headquarters
FRANKFURT/MAIN
Europe Sales Office
LYON
YOLE HQ
TOKYO
YOLE KK
GREATER CHINA
YOLE
KOREA
YOLE
Headquarters
22 bd Benoni Goullin
44200 Nantes
FRANCE
+33 2 40 18 09 16
sales@systemplus.fr
Europe Sales Office
Lizzie LEVENEZ
Frankfurt am Main
GERMANY
+49 151 23 54 41 82
llevenez@systemplus.fr
Asia Sales Office
Takashi ONOZAWA
Tokyo
JAPAN
T : +81 804 371 4887
onozawa@yole.fr
Mavis WANG
TAIWAN
T :+886 979 336 809
CN: +8613661566824
wang@yole.fr
America Sales Office
Steve LAFERRIERE
WESTERN US
T : +1 310 600 8267
laferriere@yole.fr
Chris YOUMAN
EASTERN US & CANADA
T : +1 919 607 9839
chris.youman@yole.fr
CORNELIUS
YOLE Inc.