Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Développement

© 2018
SAMPLE
Fan-Out
Packaging 2019
Technologies & Market Trends
From Technologies to Markets

Biography & contact
2©2019 | www.yole.fr | Fan-Out Packaging: Technologies & Market Trends | SAMPLE
ABOUT THE AUTHOR
Favier Shoo, Market &Technology Analyst,Semiconductor & Software Division
Favier Shoo is a Technology and Market Analyst in the Semiconductor & Software division at Yole
Développement, part of Yole Group of Companies. Favier is engaged in the development of technology &
market reports as well as the production of custom consulting.
After spending 7 years at Applied Materials as a Customer-Application-Technologist in advanced packaging
marketspace, Favier had developed a deep understanding of the supply chain and core business values. Being
knowledgeable in this field, Favier had given trainings and held numerous technical review sessions with
industry players. In addition, he had obtained 2 patents.
Prior to that, Favier had worked at REC Solar as a Manufacturing Engineer to maximize production capacity.
Favier holds a Bachelor in Materials Engineering (Hons) and a Minor in Entrepreneurship from Nanyang
Technological University (NTU) (Singapore). Favier was also the co-founder of a startup company where he
formulated business goals, revenue models and marketing plans.
Contact: shoo@yole.fr

COMPANIES CITED IN THE REPORT
3D-Plus, 3M, AGC,Amkor,Analog Devices,Akrometrix,Apple,Applied Materials,ASE,ASM,A*Star,Aurora semiconductors, Besi,
Boschmann, Brewer Science, Broadcom, Bosch, Camtek, Corning, Dialog Semiconductor, Dow, Evatec, EVGroup, Fico Molding,
Freescale (NXP), Fujifilm, HD microsystems, Henkel, Hi Silicon, Huawei, Huatian, Hitachi chemicals, Hoya, Ibiden, IME, Infineon,
Intel, ITRI, JSR, Lintec, Mediatek, Medtronic, Mitsui Chemicals, Nagase ChemteX, Nanium (Amkor), Nanometrics, Nepes, Nitto
Denko, Nokia, NXP, Plan Optik AG, PTI, Oerlikon (Evatec), Platform Specialty Products, Qualcomm, Rudolph Technologies,
Samsung, SEMCO, Semsysco, SEMPRIUS, Shinko Electric, SPIL, STATS ChipPAC (JCET), STMicroelectronics, Schott, Screen, SPTS
Technologies (Orbotech), Shin-Etsu, Sumitomo, SÜSS MicroTec AG,TEL-NEXX,TSMC,TOK,Toray Chemical,Towa, Unimicron,
UnitySC, Ultratech, ULVAC, Ushio, UTAC,Yamada and more… Wafer test & Functional test

REPORT SCOPE
The main objectives of this report are the following:
• To identify and describe which technologies can be classified as ‘Fan-Out’
• To update the business status of Fan-Out technologies markets
• To analyze key market drivers, benefits and challenges of Fan-Out packages by application
• To describe the different existing technologies, their trends and roadmaps
• To analyze supply chain and Fan-Out landscape
• To provide a market forecast for the coming years, and estimate future trends
The Fan-Out markets are studied from the following angles:
• State-of-the-art technologies and trends
• End-user applications and drivers
• Market value
• Industrial supply chain & value chain

©2019 | www.yole.fr | Fan-Out Packaging: Technologies & Market Trends | SAMPLE 5
REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology

REPORT METHODOLOGY
Technology analysis methodology Information collection

WHO SHOULD BE INTERESTED IN THIS REPORT
Equipment & material suppliers:
To identify new business opportunities and prospects
To understand the differentiated value of your products and technologies
To identify technology trends, challenges and precise requirements
To evaluate your Fan-Out Packaging technologies’ market potential
To position your company in the market
To monitor and benchmark your competitors
OSATs, IDMs & Foundries:
To understand technology trends related to Fan-Out Packaging platforms
To spot new opportunities and define diversification strategies
To understand the overall Fan-Out Packaging market
To monitor and benchmark potential competitors
To understand the supply chains involved in Fan-Out Packaging
R&D organizations:
To evaluate the potential of future technologies and products
Identify market needs for new applications
To understand the bottle necks of the Fan-Out Packaging technology and
direct their resources to solve the technical issues
To identify the best candidates for technology transfers
To identify the partners for consortia
Financial & Strategic investors:
To identify new business opportunities and prospects
To understand the market potential of Fan-Out Packaging
To understand which players will benefit from Fan-Out Packaging adoption
To understand the players that are investing in the Fan-Out Packaging business
OEMs & Integrators:
To understand technology trends in Fan-Out Packaging platforms
To spot new opportunities and define diversification strategies
To understand the overall Fan-Out Packaging market
To monitor and benchmark potential competitors
To understand the supply chains including the equipment / material suppliers

TABLE OF CONTENTS
Introduction 5
o Report Scope and Objectives
o Companies cited in this report
o Glossary
What’s new since our last report? 11
Executive summary 17
Advanced Packaging trends 62
Overview of FO Packaging 80
o FO Introduction & Package level Definition
o Drivers: Differentiation & Benefits
Cost Analysis 103
o DifferentTypes of FO | Compare with other Packages |Yield-Cost
Technologies and Products 116
o Segmentation
o Fan-Out PackagingTechnologies available and expected
o Technology Roadmaps
o Challenges and Limitations
Fan-Out Panel Level Packaging 214
o Panel-trends and motivations
o Reality of Panel penetration
Supply Chain Status and Analysis 232
o Players and positioning within the supply chain
o Activity and Progression:
• Business models evolution | Positioning of Key Players
Commercialization Status and Analysis 256
o Type of products and markets of interest
o Which type of Fan-Out for which application?
• Telecom products,APE, Automotive, MEMS, HPC, etc…
o Stories:
• Manufacturing capabilities
• Opportunities and Challenges
Market Value and Forecasts 312
o Revenues (per end-markets, per applications)
o Volumes (in wafers, in packages)
Conclusions 328
Appendix / Company presentation 333

EMBEDDED PACKAGING TECHNOLOGIES
Embedded packaging technologies with connections
fanned out of IC surface
Embedding in organic laminate Embedding in epoxy mold compound
chip-first:CF
chip-last:CL
FACE UP: FU
FACE DOWN: FD
Process type
Lamination around
the chip
Cavity dig in
substrate
Interconnections type RDL
Foundry
BEOL + RDL
Advanced
Substrate
Chip orientation
Encapsulator type
CF / CLCF / CL CL
FU / FD FU / FD
Chip placing
Embedded Die
Fan-Out Packaging
(Focus of the report)
Flip-Chip

Smaller footprint and
thinner package than
Flip-Chip BGA
Lower thermal
resistance compared
to Flip-Chip BGA
Simplified supply chain
and manufacturing
infrastructure
No laminate substrate
required
No restriction in bump
pitch
Shorter
interconnections
Fan-Out zone
adaptable to customer
needs
FAN-OUT KEY DIFFERENTIATORS
Fan-Out
provides
several
advantages.
Mold Chip
And others such as:
• Better board level reliability
compared toWLCSP
• RoHS an REACH compliant
package
• Excellent electrical
performance
• High degree of package design
freedom
• Reliable, miniaturized high
performance package

FAN-OUT PACKAGING PRINCIPLE
01
Tape lamination
Carrier
02
Pick and place
Carrier with foil and chips
03
Wafer-level molding
Molding with liquid mold compound
04 Carrier removal (de-bonding)
Reconstituted waferbackside after molding
05
StandardWLP process
(Passivation, pattern, RDL, bonding)
WLP Fan-Out wafer
Fan-Out: Dies embedded in mold compound. No advanced substrate needed to fan out of chip surface.
eWLB example (chip-first face-down)Source: Infineon
06
Dicing
After singulation

High Yield:
99%
Medium Yield:
90%
Low Yield:
70%
$0,00
$0,01
$0,02
$0,03
$0,04
$0,05
$0,06
$0,07
$0,08
$0,09
$0,10
Core FOWLP: 1 Die-Pkg
Low-End: 1xRDL 100 I/O
Reconstituted 200mm wafer
698 Pkg / wafer
Core FOPLP: 2 Die-Pkg
Mid-End: 3xRDL 500 I/O
Reconstituted 415x510mm panel
2276 Pkg / panel
Core FOWLP: 3 Die-Pkg
Mid-End: 4xRDL 500 I/O
237 Pkg / wafer
HD FOWLP: 1 Die-Pkg
High-End: 3xRDL 1500 I/O
277 Pkg / wafer
Cost-Yield Behaviour of different FOTechnologies
Cost per Die Area ($/mm2)
FAN-OUT PACKAGING: COST ANALYSIS OF DIFFERENT TECHNOLOGIES
200mm
FOWLP is not
cost effective
due to smaller
carrier size
which limits die
area per
carrier.
Core FOPLP is
a cheaper
solution as
compared to
Core FOWLP.
This is due to
FOPLP ability
to have more
die areas in a
panel carrier.
HD FOWLP
cost can be
lower than
Core FOWLP.
Cost = Package Manufacturing Cost + Package Yield Lost Cost. Estimations based on System Plus Consulting Model
Die cost is assumed to be similar regardless of the number or type of dies in a package

FAN-OUT PACKAGING: *WAFERVOLUME DISTRIBUTION IN 2017 & 2018
Others
2018
*Volume units are in 300mm wafer equivalent.
*Total wafer volume includes 200mm, 300mm, 330mm and Panels.
*Volume splits are based on annual capacity.
2017
Others
14%
9%
8%
4%
65%
*1,621,218

WHAT’S NEW IN TECHNOLOGY SINCE 2017?
New Technologies available:
• HVM of Gen-2 inFO (Integrated Fan-Out) PoP for Apple’s iPhone APE
• Successfully qualification of Gen-3 inFO for Apple’s iPhone latest APE
• Qualification of inFO-oS (on Substrate) for HPC device
Exciting developments for new applications:
• inFO-AiP (Antenna-in-Package) for mmWave application (5G etc.)
• inFO-MS (Memory on Substrate) for Data Server application (Cloud etc.)
• inFO aggressive roadmaps to go sub-microns in RDL L/S resolution
New Panel-Level Fan-Out Packaging Capabilities:
• HVM production by SEMCO
• LVM production by PTI
Provided analysis on PTI’s “all-in” approach for FOPLP technology
• Why FOPLP make sense for PTI?
• What is PTI Architectural Strategy?

FAN-OUT PACKAGING: RF CHIP AND ANTENNA IN PACKAGE
Technology inFO-AiP eWLB PoP eWLB F2F Mold-on-Mold
Schematics
Application
Wireless HD and WiGig:
mmWave
>60 GHz applications Radar: 77 GHz Transceiver 60 GHz WLAN
Technology
Highlights
Creative designs to address transmission requirements with various Fan-Out PackagingTechnologies

FAN-OUT TECHNOLOGY ROADMAPS
How is Fan-Out Technology evolving moving forward?

FAN-OUT COST EVOLUTION:TRENDS FOR CARRIERS
Carriers in production and forecasts
Cost
reduction
pressure
drives
carrier size
and carrier
type
thinking.
2009 - 2013 2015 2016 2017 ≥ 20192018
Panels
Wafers
– NEPES started production in 2017
– PTI & SEMCO to go in production in 2018
– Other players in R&D /development stage
- PTI, SEMCO & NEPES in production in 2018
?
- Only STATS ChipPAC in 330 mm production so far
- 450mm may appear at TSMC but only if direct competition uses
panel (not the case yet).
- Most of FO production is done on 300mm
wafers and will remain this way for several
years
- 330mm wafer size allows cost reduction
but requires investment
- Going to panel requires high investment,
long time and is worthwhile only if volume
is following.
200mm
300mm
330mm

FAN-OUT COST EVOLUTION: MARKET TRENDS FOR CARRIERS
Panel will
progressively
take volumes of
production
shares but in a
limited path.
Yole Développement January 2019

PACKAGING SUPPLY CHAIN ANALYSIS
Wafer-Level-Packages are changing the standard Front-End/Back-End supply chain
With packages done at wafer-level, players dedicated to front-end with wafer equipment are now able to go further in the
manufacturing chain.
With the same objective of enlarging their scope of action, OSATs can go further in their processing steps, since ‘package’ can
start earlier in the manufacturing chain and at the wafer-level.
A ‘middle-end’ zone in between front-end and back-end, where bumping and packaging can be executed on the wafer-level,
can be reached by OSATs,WLP Houses and IDMs.
Front-End
Wafer manufacturing
‘Middle-end’
Back-End
Assembly & test
Business
Business
Etch
Implant
CVDPVD
CMP
Wafer test
TSV
Bumping
RDL / wiring C2W
C2C / C2S
Underfill
Molding Final test
Handling BGA
Dicing
Inspection
Cleaning
Thinning
Inspection W2W
Source: STATS ChipPAC

MEMS
CMOS Image Sensors
Display Drivers
Codec
DC-DC
Wifi
BB
PMU/PMIC
RF
Application
Processors
(APE) + BB
APE+DRAM
GPU,CPU+Memory
(Wide IO, etc…)
High Bandwith Memories
FPGA
Processors+Memories
FAN-OUT PACKAGING APPLICATION: *LANDSCAPE OF KEY PLAYERS
Area of focus from standard, high-end to high-performance applications
IO count
10000
1000
100
2x2 5x5 10x10 15x15 20x20 >20x20 >>20x20
Package size
(mm x mm)
Core Fan-Out
Standard Devices: RF, PMU, BB etc.
High-Density Fan-Out:
High-End: Mobile APE etc.
Ultra High-Density Fan-Out:
High-Performance: HPC, networking, etc.
*Includes production, qualification and device-level demonstration. Does not include early stage engineering or R&D.

WHAT ARE THE LATEST DEVELOPMENTS FROM KEY PLAYERS?

FAN-OUT PACKAGING SUPPLY-CHAIN: DIFFERENT BUSINESS MODELS
Types of Companies OSATs Foundries IDMs R&D labs
TechnologyStatus
Assessment
(Internal or through
partnership)**
Production Ready
–
Demo Sampling
LVM
Production
–
HVM
*Non-exhaustive list of players
**Some companies are developing FOWLP internally and some others like Global
Foundries are pushing for improvement of the technologies with external partners
(OSATs or R&D labs).

FAN-OUT MARKET: BUSINESS MODEL EVOLUTION
100%
$244 M*
2015
OSAT only
65%
35%
$847 M*
2017
Foundry Impact
2019
IDM Entry
10%
71%
19%
$3,864 M*
2024
Foundry vs IDM
CAGR +51%
CAGR +23%
CAGR +19%
6%
65%
28%
$1,584 M*
*Total Market Value based on revenue
OSAT Foundry IDM

ADVANCED SUBSTRATEVS FAN-OUT TECHNOLOGIES
The Analyst’s Point of View on APE Packaging Solutions
Advanced Substrate Fan-Out
*APE volumes by packaging solution for mobile market only

FAN-OUT ACTIVITY MARKET FORECAST
Fan-Out
Packaging
continues to
strive in this
new digital age
driven by
Mega-Trends
Yole Développement January 2019*Core FO: Low-End to Mid-End devices
*HD FO: High-End to High-Performance devices

FAN-OUT PACKAGING: MORE MARKET FORECAST SLIDES
Market forecasts with different levels of breakdown…

FAN-OUT PACKAGING MARKET
The Analyst’s Point of View (4/4)
We asked this question in our 2017 report…
And it is still valid and debatable today…
China players are still at infant stage in FO Packaging
manufacturing. Cost reduction game can be even more
aggressive with China economic-of-scale. On hindsight, the
knowledge, performance and yield have to established first.
Numerous analysts are expecting
extremely high market growth. In Core
FO, players are investing in capacity and
looking at panel solution for cost
reduction. Overcapacity is a real risk
without new demands.
>50% of the market is comprised of the
HD market which is not accessible
market to players apart fromTSMC and
Samsung for the next coming 2 years.
Industry is no longer overexcited about Fan-
Out packaging since TSMC/Apple buzz…
FO potential is high and growth is steady
but it will not be a $10B market in just few
years.Is there a
Fan-Out
Bubble?

RELATED REPORTS
Discover more related reports within our bundles here.

TSMC has further extended its lead in the “High-
Density Fan-Out” (HD FO) market, with gen-2
integratedFan-Out(inFO)High-VolumeManufacturing
(HVM) production and successful qualification of
gen-3 inFO for Apple’s iPhone application processor
engine (APE). TSMC understands that industry
technologies and applications are undergoing
unprecedented change in a new, digital mega-trend-
driven era. Consequently, exciting technological
developments exist to address these new demands.
TSMC has commenced risk-production of inFO-oS
(on substrate) for HPC qualifications. Moreover,
the company is developing inFO-AiP (antenna-in-
package) for mmWave applications (5G, etc.), and
inFO-MS (memory-on-substrate) for data-server
applications (i.e. cloud). TSMC is also creating a
new market segment called ultra-high-density Fan-
Out (UDH FO), with a very aggressive sub-micron
L/S roadmap and >1500 I/O.
In the “core” Fan-Out (Core FO) market, SEMCO
and Powertech Technology Inc. (PTI) have stolen
the limelight by rolling out Fan-Out panel-level-
packaging (FOPLP) volume production for the
first time in Fan-Out packaging history. SEMCO
utilized embedded package-level-packaging (ePLP)
technology in the Samsung Galaxy smartwatch for
the consumer market, for a multi-die FO package
consisting of APE + Power Management Integrated
Circuit (PMIC) with ~500 I/O. PTI successfully
commenced FOPLP PMIC in Low Volume
Manufacturing (LVM) for MediaTek’s automotive
radar application.
For packaging houses to remain attractive for
key fabless players like Qualcomm and MediaTek,
cost-reduction is necessary. To this end, SEMCO,
PTI, ASE/Deca, and Nepes have invested in Fan-
Out at panel-level by leveraging existing facilities
and capabilities to achieve economy-of-scale
production. Currently, only SEMCO and PTI have
been able to kick-start production because the yield
for panel-level processing requires optimization
and new technology qualification for HVM.
FAN-OUT PACKAGING: TECHNOLOGIES AND MARKET
TRENDS 2019
Market & Technology report - January 2019
SIGNIFICANT NEW DEVELOPMENTS IN A DYNAMIC FAN-OUT LANDSCAPE
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
WHAT’S NEW
• Overview of the latest technologies:
available and in-development
• Comparison of different Fan-Out
packaging platforms and associated
costs
• Commercialization status update
with market adoption for new
applications, updated forecasts,
and potential-analysis update, by
technology
• Updated strategy analysis for main
players and new entrants, including
TSMC, SEMCO/Samsung, PTI,
Amkor, JCET Group, ASE, and
Deca, …
• Analysis of key players’ FOPLP
technology and strategy
• Fan-Out-on-panel status update:
volume and market forecasts
2017 - 2023, player-by-player status
and analysis
• Updated market volume, market
size, and market forecasts 2017 -
2023
KEY FEATURES
• Market forecasts in volume (units
and wafers) and revenue, split by
application and end-market
• Drivers and challenges for Fan-Out
packaging
• Product/technology description
and analysis, by player
• Fan-Out-on-panel status,
evolution, and technology
roadmap
• Detailed supply chain explanation
• Commercialization status with
strategy analysis, by player
• Analysis of Fan-Out potential
and penetration rationales, by
application
(Yole Développement, January 2019)
FAN-OUT PACKAGING: BUSINESS MODEL EVOLUTION
Currently, all key OSAT/foundry/IDM players have
Fan-Out packaging solutions in the market. The
Fan-Out landscape remains dynamic, with more
opportunities to maximize performance at a
lower cost - hence the adoption of Fan-Out by
various business models. In a mega-trends-driven
era, Fan-Out platforms are increasingly viewed as
one of the top options amongst leading package
technologies.
In 2015, the Fan-Out market was small and
consisted mostly of standard devices like Baseband
(BB), RF, and Power Management Unit (PMU).
But after TSMC’s 2016 game-changer with inFO
for Apple’s iPhone APE, market value increased
3.5x by 2017. Thus the HD FO market segment
was created, reducing the market-share ratio of
OSATs.
inFO-AP
inFO-oS
inFO-AiP
inFO-MS
Potential
End-Customers*
Potential
End-Customers*
Potential
End-Customers*
What’s next?
HD FO
HD FO
HD FO
HD FO
ePLP PoP
HD FOPLP
ePLP PoP
Core FO
HD FO
Core FO
FOPLP
HD FOPLP
FOPLP
Core FO
HD FO
Core FO
TSMC: the HD Fan-Out leader SEMCO: the next biggest Fan-Out contender PTI: potential OSAT leader in Fan-Out
Today
What’s next?
Today
What’s next?
Today
*Potential and non-exhaustive list of companies
Fan-Out packaging: latest milestones and developments

FAN-OUT PACKAGING: TECHNOLOGIES AND MARKET TRENDS 2019
Fan-Out packaging: business model evolution
and total market value from 2015 to 2024
100%
$244 M
2015
OSAT only
65%
35%
$847 M
2017
Foundry impact
2019
IDM entry
10%
71%
19%
$3,864 M
2024
FoundryvsIDM
CAGR +51%
CAGR +23%
CAGR +19%
6%
65%
28%
$1,584 M
STRONG GROWTH IN A MARKET THAT IS MORE FRAGMENTED THAN EVER
The core FO market confirmed its stability in 2018,
with significant new entrants joining via FOPLP.
Although FOWLP players are the default choice due
to a long history of established qualifications, mid-
end devices may be too costly for FOWLP players.
Hence, FOPLP players will emerge as a cost-effective
options for the core market’s new demands. We
foresee fabless being “spoiled” by FOPLP margins, and
beginning to demand the same benefits for existing
business. Moving forward, a price war between
FOWLP and FOPLP is inevitable.
HD FO growth has never been bigger, due to TSMC
possibly doubling its capacity in order to acquire
new business in the coming years. Also, SEMCO/
Samsung has already confirmed FOPLP with APE, and
it will not be long before this is rolled out in Samsung
smartphones to challenge TSMC for Apple’s APE
business.
Key fabless players like Qualcomm and MediaTek
will continue to push packaging houses for Fan-Out
solutions at lower cost, especially in higher-end
devices. PTI is the only potential option for achieving
this, and in the process could reach a new milestone
with high-end memory Fan-Out packaging. This being
said, it will be hard to achieve and hence may only
materialize much later, in 2022.
Will Fan-Out packaging continue to cannibalize and
put flip-chip, advanced substrate, and interposer
Sincethen,SEMCO/Samsung(IDM)hasjoinedtheFan-
Out packaging market as a new entrant and expanded
it into the consumer market. Moving forward, TSMC
is betting on inFO to secure new high-end packaging
projects in mobile, HPC, and networking. While
SEMCO/Samsung continues to gain ground on TSMC
in the HD FO market and generate value in core FO,
OSATs will keep competing for business - but under
price pressure from fabless. In this scenario, PTI
may emerge as a Fan-Out packaging leader due to
FOPLP’s cost-effectiveness and a possible HD FOPLP
breakthrough for multi-die with logic + memory, etc.
Fan-Out packaging market value is expected to grow
at a 19% CAGR from 2019 - 2024, reaching a market
size of $3.8B. Meanwhile, the love-hate relationships
and politics surrounding OSATs, IDMs, and foundries
will continue to unfold. Any big change in Fan-Out
strategy will have a ripple effect on the entire supply
chain.
Fan-Out market value evolution's forecast between 2018 and 2024:
HD Fan-Out vs. Core Fan-Out
HD Fan-Out: high-end to high-performance devices
2018
$981 M
$487 M
$495 M
$1,423 M
CAGR +19%
$2,442 M
CAGR +30%
2024
$3,864 M
Total Fan-Out market value
CAGR +25%
Core Fan-Out: low-end to mid-end devices

MARKET TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
3D-Plus, 3M, AGC, Amkor, Analog Devices, Akrometrix, Apple, Applied Materials, ASE,
ASM, A*Star, Aurora Semiconductors, Besi, Boschmann, Brewer Science, Broadcom, Bosch,
Camtek, Corning, Dialog Semiconductor, Dow, Evatec, EVGroup, Fico Molding, Freescale
(NXP), Fujifilm, HD Microsystems, Henkel, Hi Silicon, Huawei, Huatian, Hitachi Chemicals,
Hoya, Ibiden, IME, Infineon, Intel, ITRI, JSR, Lintec, Mediatek, Medtronic, Mitsui Chemicals,
Nagase ChemteX, Nanium (Amkor), Nanometrics, Nepes, Nitto Denko, Nokia, NXP,
Plan Optik AG, Oerlikon (Evatec), Platform Specialty Products PTI, Qualcomm, Rudolph
Technologies, Samsung, SEMCO, Semsysco, SEMPRIUS, Shinko Electric, SPIL, STATSChipPAC
(JCET), STMicroelectronics, Schott, Screen, SPTS Technologies (Orbotech), Shin-Etsu,
Sumitomo, SÜSS MicroTec AG, TEL-NEXX, TSMC, TOK, Toray Chemical, Towa, Unimicron,
UnitySC, Ultratech, ULVAC, Ushio, UTAC, Yamada, and more...
Find more
details about
this report here:
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Favier Shoo is a
Technology and Market
Analyst in the Semiconductor Software
division at Yole Développement, part
of Yole Group of Companies. Favier is
engaged in the development of technology
market reports as well as the production
of custom consulting.
After spending 7 years at Applied Materials
as a Customer-Application-Technologist
in advanced packaging marketspace, Favier
had developed a deep understanding of
the supply chain and core business values.
Being knowledgeable in this field, Favier had
given trainings and held numerous technical
review sessions with industry players. In
addition, he had obtained 2 patents.
Prior to that, Favier had worked at REC
Solar as a Manufacturing Engineer to
maximize production capacity.
Favier holds a Bachelor in Materials
Engineering (Hons) and a Minor in
Entrepreneurship from Nanyang
TechnologicalUniversity(NTU)(Singapore).
Favier was also the co-founder of a startup
company where he formulated business
goals, revenue models and marketing plans.
AUTHOR

Introduction 5
Report scope and objectives
Companies cited in this report
Glossary
What’s new since our last report? 11
Executive summary 17
Advanced packaging trends 62
Overview of FO packaging 80
FO - introduction and package-level definition
Drivers - differentiation and benefits
Cost analysis 103
Different types of FO, comparaison with other
packages and yield-cost
Technologies and products 116
Segmentation
Fan-Out packaging technologies: available and
expected
Technology roadmaps
Challenges and limitations
Fan-Out panel-level packaging 214
Panel trends and motivations
Reality of panel penetration
Supply chain status and analysis 232
Players and their positioning within the supply
chain
Activity and progression: Business model
evolution and positioning of key players
Commercialization status and analysis 256
Product types, and markets of interest
Which type of Fan-Out for which application?
Stories on manufacturing capabilities and
opportunities and challenges
Market value and forecasts 313
Revenue (per end-market, per application)
Volume (in wafers and packages)
Conclusions 329
Appendix/Company presentation 334
TABLE OF CONTENTS (complete content on i-Micronews.com)
OBJECTIVES OF THE REPORT
• Identify and describe technologies classifiable as “Fan-Out”
• Update the business status of Fan-Out technology markets
• Analyze, by application, the key market drivers, benefits, and challenges for Fan-Out packages
• Describe the different existing technologies, including their trends and roadmaps
• Review the Fan-Out supply chain and landscape
• Provide a market forecast for the coming years, and a prediction of future trends
manufacturers out of business? Fan-Out
packaging’s key benefit is the ability to integrate
dies together flexibly, and at thinner dimensions.
Fan-Out can displace 2.5D interposers with fine
L/S Fan-Out packaging on substrate. It can also
displace flip-chip and advanced substrate. Such is
the potential of Fan-Out packaging technology,
and it is already underway in the APE business via
TSMC’s inFO-APE and SEMO’s FOPLP.

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Fan-Out Packaging: Technologies and Market Trends 2019
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YOLE DEVELOPPEMENT – FIELDS OF EXPERTISE
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o Over the course of more than 20 years, Yole Développement has grown to become a group of companies. Together with System Plus Consulting and KnowMade, we now
provide marketing, technology and strategy consulting, media and corporate finance services, reverse costing, structure, process and cost analysis services and well as
intellectual property (IP) and patent analysis. Together, our group of companies is collaborating ever closer and therefore will offer, in 2019, a collection of over 125 reports
and 10 new monitors. Combining respective expertise and methodologies from the three companies, they cover:
o If you are looking for:
• An analysis of your product market and technology
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Our reports and monitors are for you!
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identify trends, challenges, emerging markets, and competitive environments. They turn that information into results and give you a complete picture of your industry’s
landscape. In the past 20 years, we have worked on more than 2,000 projects, interacting with technology professionals and high-level opinion makers from the main
players of their industries and realized more than 5,000 interviews per year.
WHAT TO EXPECT IN 2019?
In 2019 we will extend our offering with a new ‘monitor’ product which provides more updates on your industry during the year. The Yole Group of Companies is also building
on and expanding its investigations of the memory industry. Moreover, in parallel, the Yole Group reaffirms its commitment to a new collection of reports mixing software and
hardware and is increasing its involvement in displays, radio-frequency (RF) technology, advanced substrates, batteries and compound semiconductors. Discover our 2019
program right now, and ensure you get a true vision of the industry. Stay tuned!
REPORTS COLLECTION
www.i-Micronews.com
• MEMS Sensors
• RF devices technologies
• Medical technologies
• Semiconductor Manufacturing
• Advanced packaging
• Memory
• Batteries and energy management
• Power electronics
• Compound semiconductors
• Solid state lighting
• Displays
• Software
• Imaging
• Photonics

OUR 2019 REPORTS COLLECTION (1/4)
18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
Market –Technology – Strategy – byYole Développement
Yole Développement (Yole) offers market reports including quantitative market forecasts,
technology trends, company strategy evaluation and indepth application analyses. Yole will
publish more than 55 reports in 2019, with our partner PISEO contributing to some of
the lighting reports.
Reverse Costing® – Structure, Process and Cost Analysis – by
System Plus Consulting
The Reverse Costing® report developed by System Plus Consulting provides full
teardowns, including detailed photos, precise measurements, material analyses,
manufacturing process flows, supply chain evaluations, manufacturing cost analyses and
selling price estimations. The reports listed below are comparisons of several analyzed
components from System Plus Consulting. More reports are however available, and over
60 reports will be released in 2019.The complete list is available at www.systemplus.fr.
Patent Reports – by KnowMade
More than describing the status of the IP situation, these analyses provide a missing link
between patented technologies and market, technological and business trends. They offer
an understanding of the competitive landscape and technology developments from a
patent perspective. They include key insights into key IP players, key patents and future
technology trends. For 2019 KnowMade will release over 15 reports.
The markets targeted are :
• Mobile Consumer
• Automotive Transportation
• Medical
• Industrial
• Telecom Infrastructure
• Defense Aerospace
• Linked reports are dealing with the same topic to provide
• a more detailed analysis.

MEMS SENSORS
o MARKET ANDTECHNOLOGY REPORT
• Status of the MEMS Industry 2019 - Update
• Status of the Audio Industry 2019 - New
• Uncooled Infrared Imagers and Detectors 2019 – Update
• Consumer Biometrics:Technologies and MarketTrends 2018
• MEMS Pressure Sensor Market and Technologies 2018
• Gas Particle Sensors 2018
o STRUCTURE, PROCESS COST REPORT
• MEMS Sensors Comparison 2019
• MEMS Pressure Sensor Comparison 2018
• Particle Sensors Comparison 2019
• Miniaturized Gas Sensors Comparison 2018
o PATENT REPORT
• MEMS Foundry Business Portfolio 2019 - New
• Miniaturized Gas Sensors 2019 - New
PHOTONIC AND OPTOELECTRONICS
• Photonic Integrated Circuit 2019 - New
• LiDARs for Automotive and Industrial Applications 2019 - Update
• Silicon Photonics 2018
o PATENT REPORT
• Silicon Photonics for Data Centers: Optical Transceiver 2019 - New
• LiDAR for Automotive 2018
RF DEVICES ANDTECHNOLOGIES
• RF GaN Market:Applications, Players,Technology,
and Substrates 2019 - Update
• 5G’s Impact on RF Front-End Module and Connectivity
for Cell Phones 2019 - Update
• Radar andV2X Market Technology for Automotive 2019 - Update
• Advanced RF Antenna Market Technology 2019 - New
• RF Standards and Technologies for Connected Objects 2018
• RF Front-End Module Comparison 2019 - Update
• Automotive Radar RF Chipset Comparison 2018
o PATENT REPORT
• Antenna for 5GWireless Communications 2019 - New
• RF Front End Modules for Cellphones 2018
• RF Filter for 5G Wireless Communications: Materials and Technologies 2019
• RF GaN : Materials, Devices and Modules 2018
Update : 2018 version still available

IMAGING
• Status of the CIS Industry 2019:Technology
and Foundry Business - Update
• Imaging for Automotive 2019 - Update
• NeuromorphicTechnologies for Sensing 2019 - Update
• Status of the CCM and WLO Industry 2019 - Update
• MachineVision for Industry and Automation 2018
• Sensors for RoboticVehicles 2018
• Compact Camera Modules Comparison 2019
• CMOS Image Sensors Comparison 2019
o PATENT REPORT
• Facial Gesture Recognition Technlogies in Mobile Devices 2019 - New
• Apple iPhone X Proximity Sensor Flood Illuminator 2018
MEDICAL IMAGING AND BIOPHOTONICS
• X-Ray Flat Panel Detectors for Military, Industrial
and Medical Applications 2019 - New
• Microscopy Life Science Cameras: Market and Technology Analysis 2019
• Ultrasound technologies for Medical, Industrial
and Consumer Applications 2018
o PATENT REPORT
• Optical Coherence Tomography Medical Imaging 2018
MICROFLUIDICS
• Status of the Microfluidics Industry 2019 - Update
• Next Generation Sequencing DNA Synthesis - Technology,
Consumables Manufacturing and MarketTrends 2019 - New
• Organ-on-a-Chip Market Technology Landscape 2019 - Update
• Point-of-Need Testing Application of MicrofluidicTechnologies 2018
• Liquid Biopsy: from Isolation to Downstream Applications 2018
• Chinese Microfluidics Industry 2018
o PATENT REPORT
• Microfluidic ManufacturingTechnologies 2019 – New
INKJET AND ACCURATE DISPENSING
• Inkjet Printheads - Dispensing Technologies
Market Landscape 2019 - Update
• Emerging Printing Technologies
for Microsystem Manufacturing 2019 - New
• Piezoelectric Materials from Bulk to Thin Film 2019 - New
• Inkjet Functional and Additive Manufacturing for Electronics 2018
• Piezoelectric Materials from Bulk to Thin Film Comparison 2019

BIOTECHNOLOGIES
• CRISPR-Cas9 Technology: From Lab to Industries 2018
o PATENT REPORT
• Personalized Medicine 2019 – New
BIOMEMS MEDICAL MICROSYSTEMS
• Medical Wearables: Market Technology Analysis 2019 - New
• Neurotechnologies and Brain Computer Interface 2018
• BioMEMS Non-Invasive Sensors: Microsystems for Life Sciences
Healthcare 2018
o PATENT REPORT
• 3D Cell Printing 2019 - New
• CirculatingTumor Cells Isolation 2019 - New
• Nanopore Sequencing 2019 - New
SOFTWARE AND COMPUTING
• Hardware and Software for Artificial Intelligence (AI)
in Automotive Applications 2019 - New
• Hardware and Software for Artificial Intelligence (AI)
in Consumer Applications 2019 - Update
• From Image Processing to Deep Learning 2019 - Update
• xPU (Processing Units) for Cryptocurrency, Blockchain, HPC
and Gaming 2019 – New
MEMORY
• Status of the Memory Business 2019 - New
• MRAM Technology and Business 2019 - New
• Emerging NonVolatile Memory 2018
• Memory Comparison 2019
o PATENT REPORT
• Magnetoresistive Random-Access Memory (MRAM) 2019 - New
• 3D Non-Volatile Memory 2018
ADVANCED PACKAGING
• Fan Out PackagingTechnologies and MarketTrends 2019 - Update
• 3D TSV Integration and Monolithic Business Update 2019 - Update
• Advanced RF SiP for Cellphones 2019 - Update
• Status of Advanced Packaging 2019 - Update
• Status of Advanced Substrates 2019 - Update
• Panel Level PackagingTrends 2019 - Update
• RF System-in-Package Materials for 5G 2019 - New
• System in Package (SiP) Technology and Market Trends 2019 - New
• Trends in Automotive Packaging 2018
• Thin-Film Integrated Passive Devices 2018
• Advanced RF SiP for Cellphones Comparison 2019

SEMICONDUCTOR MANUFACTURING
• Nano Imprint Lithography 2019 - New
• Equipment and Materials for Fan Out Packaging 2019 - Update
• Equipment for More than Moore:Thin Film Deposition
Etching 2019 - New
• Wafer Starts for More Than Moore Applications 2018
• Polymeric Materials atWafer-Level
for Advanced Packaging 2018
• Bonding and Lithography Equipment Market
for More than Moore Devices 2018
• Wafer Bonding Comparison 2018
o PATENT REPORT
• Hybrid Bonding for 3D Stack 2019 – New
SOLID STATE LIGHTING
• Status of the Solid State Light Source Industry 2019 - New
• Edge Emitting Lasers (EELS) 2019 - New
• Light Shaping Technologies 2019 - New
• Automotive Advanced Front Lighting Systems 2019 - New
• VCSELs - Technology, Industry and MarketTrends 2019 - Update
• IR LEDs and Laser Diodes – Technology,Applications,
and Industry Trends 2018
• Automotive Lighting 2018:Technology, Industry and MarketTrends
• UV LEDs - Technology, Manufacturing and ApplicationTrends 2018
• LiFi:Technology, Industry and MarketTrends 2018
• VCSEL Comparison 2019
o PATENT REPORT
• VCSELs 2018
DISPLAY
• Next Generation 3D Display 2019 - New
• Next Generation Human Machine Interaction (HMI)in Displays 2019 - New
• Micro-and Mini-LED Displays 2019 - Update
• QD and Wide Color gamut (WCG)
Display Technologies 2019 - Update
• Displays OpticalVision Systems forVR,AR MR 2018
o PATENT REPORT
• MicroLED Displays : Intellectual Property Landscape 2018

POWER ELECTRONICS
• Power SiC: Materials, Devices and Applications 2019 - Update
• Power Electronics for EV/HEV and e-mobility:
Market, Innovations and Trends 2019 - Update
• Status of the Power Electronics Industry 2019 - Update
• Discrete Power Packaging : Material Market
and Technology Trends 2019 - New
• Status of the Power ICs Industry 2019 - Update
• Status of the Passive Components for the Power Electronics
Industry 2019 - Update
• Status of the Inverter Industry 2019 - Update
• Status of the Power Module Packaging Industry 2019 - Update
• Wireless Charging Market Expectations
and Technology Trends 2018
• Power GaN 2018: Epitaxy, Devices,Applications
and Technology Trends
• Automotive Power Module Packaging Comparison 2018
• GaN-on-Silicon Transistor Comparison 2019
• SiC Transistor Comparison 2019
o PATENT REPORT
• Power SiC : Materials, Devices and Modules 2019 - New
• Power GaN : Materials, Devices and Modules 2019 – Update
BATTERY ENERGY MANAGEMENT
• Status of the Rechargeable Li-ion Battery Industry 2019 - New
• Li-ion Battery Packs for Automotive and Stationary Storage
Applications 2019 - Update
o PATENT REPORT
• Battery Energy Density Increase: Materials
and EmergingTechnologies 2019 - New
• Solid-State Batteries 2019 - New
• Status of the Battery Patents 2018
COMPOUND SEMI.
• Emerging Compound Semiconductor
Market Technology Trends 2019 - New
• Status of the Compound Semiconductor Industry 2019 - New
• InP Materials, Devices and Applications 2019 - New
• GaAsWafer and Epiwafer Market: RF, Photonics,
LED and PV Applications 2018
o PATENT REPORT
• GaN-on-Silicon Substrate: Materials, Devices
and Applications 2019 - Update

OUR 2019 MONITORS COLLECTION (1/2)
Get the most updated overview of your market to monitor your strategy
Yole Développement, System Plus Consulting and KnowMade, all part of the Yole Group of Companies, are launching a collection of 10 monitors in 2019. The monitors aim to
provide updated market, technology and patent data as well dedicated quarterly analyses of the evolution in your industry over the previous 12 months. Furthermore, you can
benefit from direct access to the analyst for an on-demand QA and discussion session regarding trend analyses, forecasts and breaking news.
Topics covered will be compact camera modules (CCMs), advanced packaging, compound semiconductors, microfluidics, batteries, RF and memory.
MARKET MONITOR byYole Développement
A FULL PACKAGE:
The monitors will provide the evolution of the market in units, wafer area and revenues.
They will also offer insights into what is driving the business and a close look at what is
happening will also be covered in it.
The following deliverables will be included in the monitors:
• An Excel database with all historical and forecast data
• A PDF slide deck with graphs and comments/analyses covering the expected
evolutions
o ADVANCED PACKAGING – NEW
This monitor will provide the evolution of the advanced packaging platforms. It will
cover Fan-Out Wafer Level Packaging (WLP), Fan-Out Panel Level Packaging (PLP),
Wafer-Level Chip Scale Packaging (WLCSP), Flip Chip packaging platforms, and 2.5D
and 3D Through Silicon Via (TSV) integration. Frequency: Quarterly, starting from Q3
2019
o COMPOUND SEMI. – NEW
This monitor will describe how the compound semiconductor industry is evolving. It
will offer a close look at GaAs, InP, SiC, GaN and other compounds of interest
providing wafer volumes, revenues, application breakdowns and momentum.
Frequency: Quarterly, starting from Q3 2019
o CAMERA MODULE – NEW
This monitor will provide the evolution of the imaging industry, with a close look at
image sensor, camera module, lens and VCM. Volumes, revenues and momentum of
companies like Sony, Samsung, Omnivision and OnSemi will thus be analysed.
Frequency: Quarterly, starting from Q3 2019
o MEMORY – UPDATE
For the memory industry you can have access to a quaterly monitor, as well as an
additional service, a monthly pricing. Both services can be bought seprately:
• DRAM Service: Including a quarterly monitor and monthly pricing.
• NAND Service: Including a quarterly monitor and monthly pricing.
REVERSETECHNOLOGY MONITOR by System Plus Consulting
o SMARTPHONES – NEW
To stay updated on the latest components, packaging and silicon chip choices of the smartphone makers, System Plus Consulting has created its first Smartphone Reverse
Technology monitor. This year, get access to the packaging and silicon content database of at least 20 different flagship smartphones – more than five per quarter. Starting at the
beginning of 2019, the monitor will include an Excel database report for each phone and a quarterly comparison.

OUR 2019 MONITORS COLLECTION (2/2)
Get the most updated overview of your market to monitor your strategy
PATENT MONITOR by KnowMade
A FULL PACKAGE:
Starting at the beginning of the year, the KnowMade monitors include the following
deliverables:
• An Excel file including the monthly IP database of:
• New patent applications
• Newly granted patents
• Expired or abandoned patents
• Transfer of IP rights through re-assignment and licensing
• Patent litigation and opposition
• Quarterly report including a PDF slide deck with the key facts figures of the
quarter: IP trends over the three last months, with a close look to key IP players and
key patented technologies.
o GaN for Power RF Electronics
Wafers and epiwafers, GaN-on-SiC, silicon, sapphire or diamond, semiconductor
devices such as transistors, and diodes, devices and applications including converters,
rectifiers, switches, amplifiers, filters, and Monolothic Microwave Integrated Circuits
(MMICs), packaging, modules and systems.
o GaN for Optoelectronics Photonics
Wafers and epiwafers, GaN-on-sapphire, SiC or silicon; semiconductor devices such
as LEDs and lasers; and applications including lighting, display, visible communication,
photonics, packaging, modules and systems.
o Li-ion Batteries
Anodes made of lithium metal, silicon, and lithium titanate (LTO); cathodes made of
Lithium Iron Phosphate (LFP), Nickel-Manganese-Cobalt (NMC), Lithium Nickel
Cobalt Aluminium Oxide (NCA), Lithium Nickel Metal Dioxide (LiNiMO2), Lithium
Metal Phosphate (LiMPO4), and Lithium Metal Tetroxide (LiMO4); electrolytes
including liquid, polymer/gel, and solid inorganics; ceramic and other separators;
battery cells including thin film/microbattery, flexible, cylindrical and prismatic; and
battery packs and systems.
o Post Li-ion Batteries
Battery technologies including redox-flow batteries, sodium-ion, lithiumsulfur, lithium-
air, and magnesium-ion, and their supply chains, including electrodes, electrolytes,
battery cells and battery packs/systems.
o Solid-State Batteries
Supply chain including electrodes, battery cells, battery packs/systems and
electrolytes, including polymer, inorganic and inorganic/polymer, inorganic materials,
including argyrodites, LIthium Super Ionic CONductor, (LISICONs), Thio-LISICONs,
sulfide glasses, oxide glasses, perovskites, anti-perovskites and garnets.
o RF Acoustic Wave Filters
Including Surface Acoustic Wave (SAW), Temperature Compensated (TC)- SAW, Bulk
Acoustic Wave- Free-standing Bulk Acoustic Resonator (BAWFBAR), BAW-Solidly-
Mounted Resonator (BAW-SMR), and Packaging.
o RF Power Amplifiers
Including Low Noise Amplifiers, Doherty Amplifiers, Packaging, and Millimeter-Wave
technology.
o RF Front-End Modules
o Microfluidics
From components to chips and systems, including all applications.

MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
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Benefit from the i-Micronews.com
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Several key events planned for
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Contact: CamilleVeyrier (veyrier@yole.fr), Marketing Communication Director

CONTACT INFORMATION
o CONSULTING AND SPECIFICANALYSIS, REPORT
BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director forWestern US
Canada
Email: laferriere@yole.fr – + 1 310 600-8267
• Troy Blanchette, Senior Sales Director for Eastern US
Canada
Email: troy.blanchette@yole.fr – +1 704 859-0453
• Japan Rest of Asia:
• Takashi Onozawa, General Manager,Asia Business
Development (India ROA)
Email: onozawa@yole.fr - +81 34405-9204
• Miho Othake, Account Manager (Japan)
Email: ohtake@yole.fr - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Korea Singapore)
Email: oshiba@yole.fr - +81-80-3577-3042
• Greater China: Mavis Wang, Director of Greater China Business
Development
Email: wang@yole.fr - +886 979 336 809
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• RoW: Jean-Christophe Eloy, CEO President,Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnership withWoodside
Capital Partners)
• Jean-Christophe Eloy, CEO President
Email: eloy@yole.fr - +33 4 72 83 01 80
• Ivan Donaldson,VP of Financial Market Development
Email: ivan.donaldson@yole.fr - +1 208 850 3914
o CUSTOM PROJECT SERVICES
• Jérome Azémar,Technical Project Development Director
Email: azemar@yole.fr - +33 6 27 68 69 33
o GENERAL
• CamilleVeyrier, Director, Marketing Communication
Email: veyrier@yole.fr - +33 472 83 01 01
• Sandrine Leroy, Director, Public Relations
Email: leroy@yole.fr - +33 4 72 83 01 89 / +33 6 33 11 61 55
• Email: info@yole.fr - +33 4 72 83 01 80
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