The document outlines the electronic manufacturing process, emphasizing design, materials preparation, assembly, testing, and packaging. It highlights the importance of project management, quality control, and the need for effective workflows across various phases of production. Additionally, it discusses strategies for managing costs, lead times, and potential manufacturing challenges.

1. 1
Electronic
Manufacturing Eric Pan
seeed.cc
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2. Eric Pan
Maker, Biker
Founder of Seeed

3. 3
Chapter 0
Overview
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4. Today’s Sharing
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5. HOW?
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6. 6
Electronics
Firmware
Mechanics
Enclosure
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7. Design  Prepare  Produce  Package
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8. Cost * Quality * Schedule
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9. Quality
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Expectations

10. Schedule
ALL shall arrive on time.
But,
- Supply chain is very dynamic
- Production line has queue
- Problems are unexpected
Project Management is
Serious.
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Cost
BOM
Manufacturing
Engineering
Marketing
Certification
Logistics
Defects
Management
Mistakes, Mistakes, Mistakes,
Tooling

12. 12
Chapter 1
Design from manufacture
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13. Be Responsible For what you started.

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https://en.wikipedia.org/wiki/Design_for_X
Development phase
Design for short time to market
Design for reliability
Design for test
Design for safety
Design for quality
Design against corrosion damage
Design for minimum risk
Production-operations phase
Design to cost
Design to standards
Design for assembly
Design for manufacturability
Design for logistics
Design for postponement
Design for Electronic Assemblies
Design for Low-Quantity Production
Use phase
Design for user-friendliness
Design for ergonomics
Design for aesthetics
Design for serviceability
Design for maintainability
Design for repair-reuse-recyclability
Disposal phase
Design for Environment
Design for recycling
Design for Remanufacturing)
Design for X

15. 15
Hardware
Orchestra
Software
Band
Unarmed to the new field.

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https://en.wikipedia.org/wiki/Design_for_X
Development phase
Design for short time to market
Design for reliability
Design for test
Design for safety
Design for quality
Design against corrosion damage
Design for minimum risk
Production-operations phase
Design to cost
Design to standards
Design for assembly
Design for manufacturability
Design for logistics
Design for postponement
Design for Electronic Assemblies
Design for Low-Quantity Production
Use phase
Design for user-friendliness
Design for ergonomics
Design for aesthetics
Design for serviceability
Design for maintainability
Design for repair-reuse-recyclability
Disposal phase
Design for Environment
Design for recycling
Design for Remanufacturing)
Design for X

17. 17
Design FROM
Manufacturing
700+ popular components
Open testing/Open process/Open
manufacturing capability/Open schedule
3D printer/Laser
cutting/CNC/Automated SMT
line/flexible cell line/Tools
500+ different kinds of module for
MCU/Sensors/Shield/Prototyping/To
ols/Wearables…
Open Parts Library for
Supply Chain
Open Source Hardware for
Prototyping
Open Manufacturing for Process
Distributed Manufacturing
as a Service
1
2 3
4

18. Design based on Open Hardware
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20. 20p.seeed.cc
Beginner
Professional
Expensive Free
More
Free,
Cloud based
Collaborative
CAD tools

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PCB Design process

22. 22
Chapter 2
Prepare the materials
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23. Materials and Risks
• Printed Circuit Board / Stencils ★ ★ (quality)
• Active/Passive Components ★ ★ ★ (lead time/ quality)
• Standard Mechanic Components ★
• Standard Accessories ★
• Package ★ ★ (quality)
• Customized parts ★ ★ ★ ★ (lead time/ tolerance)
• Injection Molding ★ ★ ★ ★ ★ (lead time/ tolerance)

24. Bill of Materials template

25. BOM DFM hints
• Don’t assume people knows
• Always have Plan B
• Leave no room for ambiguity
• Consider availability in long run
• Consider lead time, in worst scenario
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26. PCB
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27. • PCB board house use Gerber file for production.
Gerber files should be with standard file extensions:
GTO-- Top Silkscreen
GTS-- Top Soldermask
GTL-- Top Copper
GBL-- Bottom Copper
GBS-- Bottom Soldermask
GBO-- Bottom Silkscreen
GML/GKO/GBR*-- Board Outline*
TXT-- Routing and Drill
PCB into production
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29. Other way to manufacture PCB
PCB desktop
Printer/miller
Homebrew PCB
Voltera OtherMill 29p.seeed.cc

30. PCB DFM hint
• Follow supplier process spec, leave some buffer if possible
• Polarized component must be marked.
• Designator for each components.
• Silkscreen must be clear. 6mil width, 40mil height.
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31. Stencils for mass production
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32. Active/Passive components
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33. example: Espruino
20 days
from PO to Shipping 4k pcs
(Normal Priority)
100 popular components consists ~30% of BOMs
Sharing the library = Sharing the Supply Chain
Cost, Lead time, Quality, and Knowledges
Components DFM hint

34. Standard Accessories
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35. Package
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36. Customized Parts
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37. Injection Molding
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38. 38
Chapter 3
Assembly
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39. Assembly and Test Process
Y
Y
Y
Stencil print paste
SMT
SMT Assembly
DIP Assembly
PCB incoming inspection
Print quality check
QC check before
reflow Owen
Assembly quality check
Functional check
Assembly quality check
IQC check
Clean
Inform Engineer improve
I PQC confirm
Repairing
Adjustment
Inform engineer improve
Remove components
FQC
Repairing
Y
Y
Y
Y
N
N
N
N
N
N
N
N
Y
Inform engineer improve
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Solder Paste Screen Printing

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Pick and Place  Reflow  QC

42. 40℃
130℃
200℃
217℃
230℃
0℃
PH1
PH2
PH3
PH4
Peak value 240 ℃±5℃
Sec
Temp(℃)
IMG 2
42
SMT Reflow Soldering
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 Preheat Zone：
Preheat PCB and components, in order to achieve thermal
equilibrium for soldering
Thermal soak zone：
In the thermal soak, typically a 60 to 120 second exposure for
removal of solder paste volatiles and activation of the fluxes,
where the flux components begin oxide reduction on component
leads and pad.
Reflow zone：
It is the part of the process where the maximum temperature is
reached. Components will be stick to the pads.
Cooling zone：
The last zone is a cooling zone to gradually cool the processed
board and solidify the solder joints

43. 1) Tomb stoning
Causes:
Components don’t match the dimension of the actual design
Solutions:
Make sure the design of the pad matches the package of the components
2) Pseudo Soldering
Causes:
a. pitch of the pad does not match the component’s dimension
b. Through-hole pads
Solutions:
a. design from actual package
b. avoid via hole of the pad
1.SMT issues

44. 1.SMT issues
3) Wrong-placed components
Causes:
No marks of the pads
Solutions:
a. Mark the PCB
b. Mark the Polar components’ pad
4) Mismatch between the design and pads, delaying the
manufacturing process
Causes:
Mismatch between the design and pads
Solution:
Rational design
OPL design

45. SMT DFM hints
• Compassion for machines
• Align same components in order
• Leave adequate spacing for thermal parts
• Leave enough margin to PCB edge
• Avoid double side placement if possible
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46. 46p.seeed.cc
Through Hole Soldering

47. Semi Auto Through Hole Soldering
Temperature should set 300℃+-10℃, Flux spraying evenly for
3-4 seconds, dry for 2-4 seconds, move the PCB into the tin
surface for 3-4 seconds, then move it to the cooing zone.
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48. Automatic Soldering
48
According to the
components, the temp
should set about 380℃-
405
And select different
solder iron to ensure
the quality
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49. 49p.seeed.cc

50. 1) Components can’t be Wave soldered
Causes and Solutions:
Design from Wave-soldering, improve manufacturing
efficiency
2) Components can’t be soldered by hand
Causes:
Wrong Through-Hole dimension
Solutions:
Design from Through-hole Manufacturing
2. Through-Hole Soldering

51. 2. Through-Hole Soldering
3)Short distance between two components
Causes and Solutions:
Ensure Standard distance between two through-holes
4)Tilted parts after wave-soldering
Causes and Solutions:
Design from the wave-soldering standard

52. • Keep space for each components, 0.5mm at least.
• Ensure space is able for manual soldering, repairing and
verifying.
• Avoid, if you can
Through Hole DFM hints
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53. 53
Chapter 4
Test and Package
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54. Basically,

55. Verification before mass production

56. • PCB inspection systems ★ usually done by supplier
• ICT In circuit test ★★★★ common for simple projects
• Functional testing ★★ for complex circuits/IC/RF
• JTAG Boundary scan testing ★★ for complex logic systems
• Combinational test ★★★ a combination of tests
Test method and priorities
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57. Be a good killer of defects,
• No under-kill
• Fewer overkill
• Fast
• Easy
• Cheap
• Duplicable
A good test plan:
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58. Test jig for small scale manufacturing
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58
Test Jig Underhood

59. 59p.seeed.cc
Packaging with SOP

60. 3. PCB Testing Process
1)Can’t make test jig
Causes:
No test feasibility plan before design
Solutions:
Consider test plan before design
2) No test plan
Solutions:
Provide test plan before new product introduction

61. 1) Unable or difficult to assembly.
Causes:
Do not verify the mechanical part after designing.
Solutions:
Should consider tolerance, and verify the mechanical part.
4. Assembly Process

62. 1) Uncertain packaging
Causes and Solutions:
Customer do not have packaging nearly production. IT should be prepared in the
designing stage.
2) Unreasonable packaging method
Causes:
Unable to pack according to the packaging method
Solutions:
Should confirm Packaging method beforehand
5. Packaging

63. Assembly and Test hints
• Try to involve less process
• SOP (standard operation procedure) is critical
• Invent when there is no other choices
• Don’t expect Pilot run will expose every error
• Wherever might be problem, there will be problem.
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64. 64
Chapter 5
Takeaways
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65. 65
Setup
7-42 days
Manufacturing
3-15 days
Engineering
1-30 days
• Unclear BOM
• Process Tolerance
• Inadequate Test Plan
• Long Lead Time Components
• Consistency Problem
• Supply Chain Complexity
• Unexpected Error
• Low Yield
• Uncontrollable Assembly Time
Prototype Product
manufacture
Key Phrases and Risks

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Maker Supplier

67. 5 simple tips for indie products
• 1. Balance Cost, Quality, Schedule
• 2. Consider overall cost
• 3. Use the popular components
• 4. Involve fewer processes
• 5. Use only SMD components if possible.
More info can check the link
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68. 68
Chapter 6
Practice
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69. Let’s redefine hat

70. Cost = How many basic material per hat
Volume = How many hats manufactured
Consistency = Same among the batch
Promise = Final Deliver matches Pitch
Votes = Peer to Peer vote for favourite
Team
Score =
x
x
x
x

71. Basic Components
20 pcs A4 paper, 1*Adhesive tape,
Shared components
Anything you can find(legally)
Equipment
1*Scissors, 1*Stapler, 2*Colors pens,

72. Design – Pitch – Manufacture – Deliver
DESIGN
15 min
PITCH
2 min
MANUFACTURE
20 min
DELIVER
5 min

73. DESIGN
15 min
Objectives:
Design and make the 1st hat
Optional:
Define Roles
Outstanding
Choose materials wisely
Think how to make more later
Find a popular lighthouse user
Prepare to Pitch

74. PITCH
2 min
Objectives:
Sell your design to backers
Optional:
AWESOME!

75. MANUFACTURE
20 min
Objectives:
Manufacture more hats!
Optional:
Collect enough material
Prepare a operation procedure
Optimize the process
Apply Quality Control

76. Objectives:
Show us the results!
Optional:
A moving story
Improvement (downgrade) applied
Share your hints
DELIVER
5 min

77. A free fusion PCB coupon for the submitter
A free fusion PCBA coupon for the winner
Share your result photo/thoughts
via twitter @seeedstudio #fusion, to
win

78. Diving by sport in touch UK, from Pinterest
Good Luck
To the mass
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79. This work is created under CC BY 3.0
All rights of contents not listed is belong to its original authors.
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Disclaimer:
This material is still in beta stage, not all contents cited are properly listed in the reference. Also we didn’t cover
full spectrum of electronic manufacturing but sharing most common practices.
Video:
PCB
https://www.youtube.com/watch?v=sFMFmrCur08&list=PLpH_4mf13-
A17zy-k0oiaTNSXBisxqxyR&index=1
Stencil
https://www.youtube.com/watch?v=ya8N4RWNo_s&list=PLpH_4mf13-
A17zy-k0oiaTNSXBisxqxyR&index=3
Jet Print
https://www.youtube.com/watch?v=Voe-z0qCEvY
SMT
https://www.youtube.com/watch?v=6e4AMTmURVw&list=PLpH_4mf1
3-A17zy-k0oiaTNSXBisxqxyR&index=4
Semi Automatic DIP soldering
https://www.youtube.com/watch?v=PSOaUNxIDZ8
Automatic DIP soldering
https://www.youtube.com/watch?v=fmvFO3rfw7M
Packaging
https://www.youtube.com/watch?v=mrZOSpGZliQ&feature=youtu.be
Reference
• http://www.protel.net/
• http://www.cadsoftusa.com/
• http://www.altium.com/
• https://123d.circuits.io/
• http://kicad-pcb.org/
• https://upverter.com/
• https://easyeda.com/
• http://www.techtimes.com/articles/114088/2015120
7/independent-analysis-kickstarter-project-
fulfillment-finds-9-percent-campaigns-fail.htm
• http://www.instructables.com/id/Making-A-
Customized-Circuit-Board-Made-Easy/
• http://voltera.io/images/printRender.png
• https://othermachine.co/
• http://electronicdesign.com/embedded/engineer-s-
guide-high-quality-pcb-design
• https://www.youtube.com/watch?v=PSOaUNxIDZ8
• http://www.radio-
electronics.com/info/t_and_m/ate/automatic-test-
equipment-basics.php