Wetwares is a new technology for integrated circuit fabrication that uses liquid electrolyte for cooling. This provides better temperature control and reliability than traditional air cooling methods. Two examples are 3C technology, which embeds microchannels directly onto chips for liquid cooling, and IBM's "electronic blood" concept which circulates electrolyte fluids similar to the human circulatory system. Wetwares aims to miniaturize computers by replicating the brain's efficient density and could enable petaflop computers to fit on desktops by 2060 by challenging Moore's Law limits.

1. WETWARES
The technology, its
applications and future
prospects
VISHAL ANAND
RAJESH ROSHAN

2. The structure of this presentation
o Introduction to the topic.
o Characterization
o Description of same
o Concept Involved
o Inspiration
o Advantages
o Application Today and Tomorrow
o Conclusion

3. INTRODUCTION
So What areWetwares ?

4. What is Wetwares?
• Wetwares is the newest technology for Integrated
Circuits fabrication which uses liquid electrolyte for
cooling providing better temperature control and
improved reliability of our various hardwares.

5. Characterisation
WETWARES
3C TECHNOLOGY
ELECTRONIC BLOOD TECH.

6. 3C TECHNOLOGY
• 3C technology stands for Complementary Cooling Chip.
In this process a chip containing liquid cooling micro-channels
are prepared which are attached to the back of
the conventional integrated chip packages.
• One of the approaches allows a simple monolithic
fabrication of cooling channels directly onto integrated
circuits using a CMOS-compatible technique.

7. Continued…...
Researcher Bing
Dang,of Georgia
tech university
holds a silicon
wafer containing
chips with
embedded
microchannels
and a printed
circuit board
containing two
microfluidic
chips.

8. PRESENT BULKY COOLING SYSTEM

9. FUTURE IS HERE !!!!!

10. HOW ITS BETTER
 By integrating the cooling microchannels
directly into the chip, we can eliminate a lot of
the thermal interface issues that are of great
concern.
 Conventional cooling techniques, which depend
on heat sinks on the backs of ICs to transfer heat
into streams of forced air, will be unable to meet
the needs of future power-hungry devices –
especially 3D multi-chip modules that will pack
more processing power into less space.

11. Drawbacks
 IC is connected electronically – using a
conventional automated process known as flip-chip
bonding at a temperature around 400 to 700
celsius which can potential damage the host chip.

12. ELECTRONIC BLOOD
Parallel to the 3C technology
IBM is working on similar
concept but in an advanced &
scientific way ,where they are
preparing Integrated chips
replicating brain structure and
its working.

13. Inspiration behind the technology
• The engineers wanted to fit a supercomputer inside a
sugarcube but to do that they needed a paradigam shift
in electronics – they needed to replicate the human brain
as it is 10,000 times more efficient and dense than any
computer today.
• That’s possible because it uses only one efficient
network of capillaries and blood vessels to transport heat
and energy.

14. • The liquid-cooling system not only keeps the computer's
chips at operating temperatures, but also delivers power,
similar to the human circulatory system that transports
heat as well as energy. It could be used to process power
that's densely packed into 3D space (pictured) rather than
spread out across flat circuit boards

15. HOW IT WORKS
• IBM’s system, known as ‘redox flow’, moves an
electrolyte ‘blood’ which carries power in and takes heat
out.
• Two liquids called electrolytes, each with oppositely
charged electrical ions, will circulate through the system
to distribute power.
• The fluid-based power supply works similar to a battery:
Using central electrodes to charge the fluid – the
electrolyte – and discharging electrodes directly in the
chip stack.
• The electrolytes will travel through ever-smaller
tubes,going down to about the width of a human hair,
where they will pass their power to conventional
electrical wires

16. A PROTOTYPE OF BRAIN ARCHITECTURE
IBM announced a new
programming
architecture for chips
inspired by mind.
It’s said the model is
tailored for a new class
of distributed, highly
interconnected,
parallel, large-scale
cognitive computing
systems.

17. PROGRESS MADE SO FAR
Current test chips have been built by IBM researchers using
vanadium redox flow chemistry, which relies on the
electrochemical discharge of vanadium in different
oxidation states

18. ADVANTAGES
• IT will lead to compactness of computers,reducing their
sizes manyfold.
• IT would increase the processing speed of the computer
• IT would process data more consuming very less power
• IT would increase the efficiency and lifetime of the
integrated circuits .
• IT can ultimately lead to failure of the “MOORE’S LAW”

19. TECHNOLOGY CHALLENGING THE MOORE’S LAW

20. VISION OF FUTURE
• If we combine our understanding of the brain with
CMOS (complementary metal–oxide–semiconductor)
devices, we can quickly create biomorphic computers,
which benefit from the best of nature and technology.
• By 2060, IBM envisions a one petaflop computer- which
takes up half a football field today- to fit on a desktop.
• chips could pave the way for smart sensor networks
that mimic the brain’s capacity for perception, action,
and thought.

21. SOURCES
The following sources have been
indispensable throughout the making of
this presentation:
1. IEEE spectrum website
2. Wikipedia page on electronic blood
3. Howstuffworks.com
4. Pennstate student resources
5. Ramesh Raskar, Greg Welch,
Henry Fuchs Spatially Augmented
Reality
6. Rosen, Kenneth. "Contact Lenses
Can Display Your Text Messages“
7. Graham, M., Zook, M., and
Boulton, A. “COmaputer in urban
places: contested content and the
duplicity of code

22. Web reference for more.
• http://www.arcane-technologies.com/en/
• en.wikipedia.org/wiki/wetwares
• http://www.bannerblog.com.IBM/news/2009/06/35_a
wesomeexamples.php
• http://www.howstuffworks.com/electronic blood.htm
• http://www.ariser.info/
• http://www.dailymail.co.uk