SPICE MODEL of TPCA8014 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8014 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of a TOSHIBA TPCA8104 power MOSFET. It includes:
1) Details of the MOSFET components and manufacturer.
2) Descriptions of the PSpice model used and its parameters.
3) Simulation results and comparisons to measurements for key characteristics like transconductance, capacitance, switching times and more.
4) Circuit diagrams used to simulate and evaluate the MOSFET performance.
SPICE MODEL of TPC8110 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8110 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCM8001-H (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCM8001-H (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8110 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8110 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8005-H (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8005-H (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8004-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8004-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ652 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ652 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ652 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ652 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8014 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of a TOSHIBA TPCA8104 power MOSFET. It includes:
1) Details of the MOSFET components and manufacturer.
2) Descriptions of the PSpice model used and its parameters.
3) Simulation results and comparisons to measurements for key characteristics like transconductance, capacitance, switching times and more.
4) Circuit diagrams used to simulate and evaluate the MOSFET performance.
SPICE MODEL of TPC8110 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8110 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCM8001-H (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCM8001-H (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8110 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8110 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8005-H (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8005-H (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8004-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8004-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ652 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ652 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ652 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ652 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8004-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This 3 sentence summary provides the key components and modeling parameters of the TPCA8004-H power MOSFET:
The document reports on the modeling of the TPCA8004-H power MOSFET manufactured by Toshiba, including its body diode and ESD protection diode. It details the model parameters, simulation results comparing measurements and simulations, and characteristic performance curves for the MOSFET, body diode and protection diode such as transconductance, capacitance, switching time and reverse recovery.
SPICE MODEL of TPC6108 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC6108 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8A02-H (Professional+ZDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8A02-H (Professional+ZDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ655 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ655 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8028 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8028 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4065-DL-E (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4065-DL-E (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2417 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2417 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4065-DL-E (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4065-DL-E (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J15FS (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J15FS (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ655 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ655 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8011-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8011-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2916 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2916 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ334 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ334 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8003-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8003-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8003-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8003-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ448 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ448 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC6107 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC6107 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ657 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ657 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3843 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3843 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3703 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3703 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
The document discusses optimizing the distribution network from a distribution center (DC) in Dankuni to 22 stores in Kolkata, India for Spencer's Retail Ltd. It aims to improve utilization of the company's 10 trucks, which are currently 98% utilized, by optimizing routes and vehicle scheduling to increase kilometers driven above the monthly minimum commitment without increasing capital or labor costs. The objective is to analyze Spencer's logistics operations in Kolkata and propose an optimized route structure and distribution plan to improve operational efficiency.
SPICE MODEL of TPCA8004-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This 3 sentence summary provides the key components and modeling parameters of the TPCA8004-H power MOSFET:
The document reports on the modeling of the TPCA8004-H power MOSFET manufactured by Toshiba, including its body diode and ESD protection diode. It details the model parameters, simulation results comparing measurements and simulations, and characteristic performance curves for the MOSFET, body diode and protection diode such as transconductance, capacitance, switching time and reverse recovery.
SPICE MODEL of TPC6108 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC6108 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8A02-H (Professional+ZDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8A02-H (Professional+ZDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ655 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ655 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8028 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8028 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4065-DL-E (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4065-DL-E (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2417 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2417 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4065-DL-E (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4065-DL-E (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J15FS (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J15FS (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ655 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ655 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8011-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8011-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2916 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2916 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ334 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ334 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8003-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8003-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8003-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8003-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ448 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ448 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC6107 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC6107 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ657 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ657 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3843 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3843 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3703 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3703 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
The document discusses optimizing the distribution network from a distribution center (DC) in Dankuni to 22 stores in Kolkata, India for Spencer's Retail Ltd. It aims to improve utilization of the company's 10 trucks, which are currently 98% utilized, by optimizing routes and vehicle scheduling to increase kilometers driven above the monthly minimum commitment without increasing capital or labor costs. The objective is to analyze Spencer's logistics operations in Kolkata and propose an optimized route structure and distribution plan to improve operational efficiency.
GWMG held a technology metals summit on April 22, 2013 to present information on its fully integrated rare earth business. Key points include:
- GWMG plans to become a sustainable producer of critical rare earths through mining at its Steenkampskraal project in South Africa and downstream alloy manufacturing.
- A preliminary economic assessment for the Steenkampskraal project estimates an after-tax IRR of 66% and NPV of $555 million using a 10% discount rate.
- GWMG owns Less Common Metals, a producer of rare earth alloys, and plans metal making at LCM to further integrate the supply chain.
The document provides instructions for submitting papers to the ENTCS (Electronic Notes in Theoretical Computer Science) macro package. It explains that the paper must be formatted using either the entcsmacro.sty or prentcsmacro.sty style files. It also provides information on formatting the frontmatter, using environments like theorems and lemmas, adding references, and producing a PDF file.
El documento presenta una lista de los métodos filosóficos más importantes, incluyendo el método mayéutico/dialéctico de Sócrates, el método ontológico de Aristóteles y Santo Tomás de Aquino, el método racionalista de Descartes, el método empírico de Hume, el método trascendental de Kant, el análisis lingüístico de Wittgenstein, el método fenomenológico de Husserl y el método hermenéutico de Nietzsche. Además, plantea
La Revolución Rusa de 1917 derrocó al régimen zarista y estableció el primer estado socialista del mundo bajo el liderazgo de los bolcheviques. La revolución comenzó en febrero cuando manifestaciones masivas forzaron la abdicación del Zar Nicolás II, pero el gobierno provisional burgués que lo reemplazó fracasó en abordar los problemas del país. En octubre, los bolcheviques liderados por Lenin tomaron el control a través de los soviets y establecieron el poder del proletariado, nacionalizando la
SPICE MODEL of TPCA8014-H (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of a power MOSFET component. It includes:
1) Details of the MOSFET model parameters and equations used in the PSpice simulation.
2) Simulation results that compare measurements and simulations of key MOSFET characteristics like transconductance, capacitance, switching times.
3) The evaluation circuits used to extract the characteristics are also shown.
SPICE MODEL of TK30A06J3 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK30A06J3 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ527 (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a power MOSFET. It includes:
1) Details of the MOSFET components and manufacturer.
2) Descriptions of the MOSFET model used in the PSpice simulation software.
3) Results of simulations validating the MOSFET model against measurements, including transconductance, voltage-current characteristics, capacitances, switching times and reverse recovery characteristics of the body diode.
3) The simulations show good agreement with measurements, validating the accuracy of the MOSFET model.
SPICE MODEL of TPC8029 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a TPC8029 power MOSFET. It includes:
1) Details of the MOSFET model parameters and equations used in the Pspice simulation.
2) Simulation results and comparisons to measurement data for key MOSFET characteristics like transconductance, Vgs-Id, output characteristics, and switching times.
3) The model for the internal body diode and simulation results for forward and reverse recovery characteristics compared to measurements.
4) A diagram showing the relationship between reverse recovery times trj and trb.
SPICE MODEL of 2SJ656 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ656 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ656 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ656 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8002 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8002 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8107 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8107 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ527 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ527 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8011-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8011-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8001-H (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8001-H (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK30A06J3 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK30A06J3 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3435 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3435 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3905 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3905 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3435 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3435 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8032-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8032-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8117 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling parameters and simulation results for a TPC8117 power MOSFET manufactured by Toshiba. It includes MOSFET and body diode SPICE models and simulations validating the models, comparing measurement and simulation results for key characteristics like transconductance, capacitance, switching times and reverse recovery. The simulations show good agreement with measurements, validating the accuracy of the models.
SPICE MODEL of 2SJ495 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ495 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8032-H (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8032-H (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8107 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a Toshiba TPC8107 power MOSFET. It includes:
1. Details of the MOSFET components and manufacturer.
2. Equivalent circuit diagrams and descriptions of the MOSFET model parameters.
3. Simulation results graphs comparing measurements and simulations of key MOSFET characteristics like transconductance, drain current, gate charge, switching times and more.
4. Evaluation circuits and simulation settings used to generate the results.
5. Tables comparing measurement and simulation data with percent error calculations.
The report demonstrates accurate modeling of the MOSFET's electrical behavior through PSpice simulation versus real-world measurements
Similar to SPICE MODEL of TPCA8014 (Standard+BDS Model) in SPICE PARK (20)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Tsuyoshi Horigome
This document provides an inventory update of 6,747 parts at Spice Park as of April 2024. It lists the part numbers, manufacturers, and quantities of various semiconductor components, including 1,697 Schottky rectifier diodes from 29 different manufacturers. It also includes details on passive components, batteries, mechanical parts, motors, and lamps in the inventory.
The document provides an inventory update from April 2024 of the Spice Park collection which contains 6,747 electronic components. It includes tables listing the types of semiconductor components, passive parts, batteries, mechanical parts, motors, and lamps in the collection along with their manufacturer and quantities. One of the semiconductor components, the general purpose rectifier diode, is broken down into a more detailed table with 116 entries providing part numbers, manufacturers, thermal ratings, and remarks.
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Tsuyoshi Horigome
The document provides an inventory update from March 2024 of parts in the Spice Park warehouse. It lists 6,725 total parts across various categories including semiconductors, passive parts, batteries, mechanical parts, motors, and lamps. The semiconductor section lists 652 general purpose rectifier diodes from 18 different manufacturers with quantities ranging from 2 to 145 pieces.
This document provides an inventory list of parts at Spice Park as of March 2024. It contains 3 sections - Semiconductor parts (diodes, transistors, ICs etc.), Passive parts (capacitors, resistors etc.), and Battery parts. For Semiconductor parts, it lists 36 different part types and provides the quantity of each part. It then provides further details of Diode/General Purpose Rectifiers, listing the manufacturer and quantity of 652 individual part numbers.
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Tsuyoshi Horigome
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 total pieces of electronic components and parts. It lists 36 categories of semiconductor devices, 11 categories of passive parts, 10 types of batteries, 5 mechanical parts, DC motors, lamps, and power supplies. It provides the most detailed listing for solar cells, with 1,003 total pieces from 51 manufacturers listed with part numbers.
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 electronic components. It lists the components by type (e.g. semiconductor), part number, manufacturer, thermal rating, and quantity on hand. For example, it shows that there are 621 general purpose rectifier diodes from manufacturers such as Fairchild, Fuji, Intersil, Rohm, Shindengen, and Toshiba. The detailed four-page section provides further information on the first item, general purpose rectifier diodes, including 152 individual part numbers and specifications.
This document discusses circuit simulations using LTspice. It describes driving a circuit simulation by inserting a 250 ohm resistor between the output terminals. It also describes simulating a 1 channel bridge circuit where the DUT1 and DUT2 resistors are both set to 100 ohms and the input voltage is set to either 1V or 5V.
This document discusses parametric sweeps of external and internal resistance values Rg for circuit simulation in LTspice. It also references outputting a waveform similar to a report on fall time characteristics for a device modeling report with customer Samsung.
Full-RAG: A modern architecture for hyper-personalizationZilliz
Mike Del Balso, CEO & Co-Founder at Tecton, presents "Full RAG," a novel approach to AI recommendation systems, aiming to push beyond the limitations of traditional models through a deep integration of contextual insights and real-time data, leveraging the Retrieval-Augmented Generation architecture. This talk will outline Full RAG's potential to significantly enhance personalization, address engineering challenges such as data management and model training, and introduce data enrichment with reranking as a key solution. Attendees will gain crucial insights into the importance of hyperpersonalization in AI, the capabilities of Full RAG for advanced personalization, and strategies for managing complex data integrations for deploying cutting-edge AI solutions.
In the rapidly evolving landscape of technologies, XML continues to play a vital role in structuring, storing, and transporting data across diverse systems. The recent advancements in artificial intelligence (AI) present new methodologies for enhancing XML development workflows, introducing efficiency, automation, and intelligent capabilities. This presentation will outline the scope and perspective of utilizing AI in XML development. The potential benefits and the possible pitfalls will be highlighted, providing a balanced view of the subject.
We will explore the capabilities of AI in understanding XML markup languages and autonomously creating structured XML content. Additionally, we will examine the capacity of AI to enrich plain text with appropriate XML markup. Practical examples and methodological guidelines will be provided to elucidate how AI can be effectively prompted to interpret and generate accurate XML markup.
Further emphasis will be placed on the role of AI in developing XSLT, or schemas such as XSD and Schematron. We will address the techniques and strategies adopted to create prompts for generating code, explaining code, or refactoring the code, and the results achieved.
The discussion will extend to how AI can be used to transform XML content. In particular, the focus will be on the use of AI XPath extension functions in XSLT, Schematron, Schematron Quick Fixes, or for XML content refactoring.
The presentation aims to deliver a comprehensive overview of AI usage in XML development, providing attendees with the necessary knowledge to make informed decisions. Whether you’re at the early stages of adopting AI or considering integrating it in advanced XML development, this presentation will cover all levels of expertise.
By highlighting the potential advantages and challenges of integrating AI with XML development tools and languages, the presentation seeks to inspire thoughtful conversation around the future of XML development. We’ll not only delve into the technical aspects of AI-powered XML development but also discuss practical implications and possible future directions.
Communications Mining Series - Zero to Hero - Session 1DianaGray10
This session provides introduction to UiPath Communication Mining, importance and platform overview. You will acquire a good understand of the phases in Communication Mining as we go over the platform with you. Topics covered:
• Communication Mining Overview
• Why is it important?
• How can it help today’s business and the benefits
• Phases in Communication Mining
• Demo on Platform overview
• Q/A
In his public lecture, Christian Timmerer provides insights into the fascinating history of video streaming, starting from its humble beginnings before YouTube to the groundbreaking technologies that now dominate platforms like Netflix and ORF ON. Timmerer also presents provocative contributions of his own that have significantly influenced the industry. He concludes by looking at future challenges and invites the audience to join in a discussion.
Let's Integrate MuleSoft RPA, COMPOSER, APM with AWS IDP along with Slackshyamraj55
Discover the seamless integration of RPA (Robotic Process Automation), COMPOSER, and APM with AWS IDP enhanced with Slack notifications. Explore how these technologies converge to streamline workflows, optimize performance, and ensure secure access, all while leveraging the power of AWS IDP and real-time communication via Slack notifications.
A tale of scale & speed: How the US Navy is enabling software delivery from l...sonjaschweigert1
Rapid and secure feature delivery is a goal across every application team and every branch of the DoD. The Navy’s DevSecOps platform, Party Barge, has achieved:
- Reduction in onboarding time from 5 weeks to 1 day
- Improved developer experience and productivity through actionable findings and reduction of false positives
- Maintenance of superior security standards and inherent policy enforcement with Authorization to Operate (ATO)
Development teams can ship efficiently and ensure applications are cyber ready for Navy Authorizing Officials (AOs). In this webinar, Sigma Defense and Anchore will give attendees a look behind the scenes and demo secure pipeline automation and security artifacts that speed up application ATO and time to production.
We will cover:
- How to remove silos in DevSecOps
- How to build efficient development pipeline roles and component templates
- How to deliver security artifacts that matter for ATO’s (SBOMs, vulnerability reports, and policy evidence)
- How to streamline operations with automated policy checks on container images
Unlock the Future of Search with MongoDB Atlas_ Vector Search Unleashed.pdfMalak Abu Hammad
Discover how MongoDB Atlas and vector search technology can revolutionize your application's search capabilities. This comprehensive presentation covers:
* What is Vector Search?
* Importance and benefits of vector search
* Practical use cases across various industries
* Step-by-step implementation guide
* Live demos with code snippets
* Enhancing LLM capabilities with vector search
* Best practices and optimization strategies
Perfect for developers, AI enthusiasts, and tech leaders. Learn how to leverage MongoDB Atlas to deliver highly relevant, context-aware search results, transforming your data retrieval process. Stay ahead in tech innovation and maximize the potential of your applications.
#MongoDB #VectorSearch #AI #SemanticSearch #TechInnovation #DataScience #LLM #MachineLearning #SearchTechnology
GraphSummit Singapore | The Art of the Possible with Graph - Q2 2024Neo4j
Neha Bajwa, Vice President of Product Marketing, Neo4j
Join us as we explore breakthrough innovations enabled by interconnected data and AI. Discover firsthand how organizations use relationships in data to uncover contextual insights and solve our most pressing challenges – from optimizing supply chains, detecting fraud, and improving customer experiences to accelerating drug discoveries.
UiPath Test Automation using UiPath Test Suite series, part 6DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 6. In this session, we will cover Test Automation with generative AI and Open AI.
UiPath Test Automation with generative AI and Open AI webinar offers an in-depth exploration of leveraging cutting-edge technologies for test automation within the UiPath platform. Attendees will delve into the integration of generative AI, a test automation solution, with Open AI advanced natural language processing capabilities.
Throughout the session, participants will discover how this synergy empowers testers to automate repetitive tasks, enhance testing accuracy, and expedite the software testing life cycle. Topics covered include the seamless integration process, practical use cases, and the benefits of harnessing AI-driven automation for UiPath testing initiatives. By attending this webinar, testers, and automation professionals can gain valuable insights into harnessing the power of AI to optimize their test automation workflows within the UiPath ecosystem, ultimately driving efficiency and quality in software development processes.
What will you get from this session?
1. Insights into integrating generative AI.
2. Understanding how this integration enhances test automation within the UiPath platform
3. Practical demonstrations
4. Exploration of real-world use cases illustrating the benefits of AI-driven test automation for UiPath
Topics covered:
What is generative AI
Test Automation with generative AI and Open AI.
UiPath integration with generative AI
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Maruthi Prithivirajan, Head of ASEAN & IN Solution Architecture, Neo4j
Get an inside look at the latest Neo4j innovations that enable relationship-driven intelligence at scale. Learn more about the newest cloud integrations and product enhancements that make Neo4j an essential choice for developers building apps with interconnected data and generative AI.
Threats to mobile devices are more prevalent and increasing in scope and complexity. Users of mobile devices desire to take full advantage of the features
available on those devices, but many of the features provide convenience and capability but sacrifice security. This best practices guide outlines steps the users can take to better protect personal devices and information.
Removing Uninteresting Bytes in Software FuzzingAftab Hussain
Imagine a world where software fuzzing, the process of mutating bytes in test seeds to uncover hidden and erroneous program behaviors, becomes faster and more effective. A lot depends on the initial seeds, which can significantly dictate the trajectory of a fuzzing campaign, particularly in terms of how long it takes to uncover interesting behaviour in your code. We introduce DIAR, a technique designed to speedup fuzzing campaigns by pinpointing and eliminating those uninteresting bytes in the seeds. Picture this: instead of wasting valuable resources on meaningless mutations in large, bloated seeds, DIAR removes the unnecessary bytes, streamlining the entire process.
In this work, we equipped AFL, a popular fuzzer, with DIAR and examined two critical Linux libraries -- Libxml's xmllint, a tool for parsing xml documents, and Binutil's readelf, an essential debugging and security analysis command-line tool used to display detailed information about ELF (Executable and Linkable Format). Our preliminary results show that AFL+DIAR does not only discover new paths more quickly but also achieves higher coverage overall. This work thus showcases how starting with lean and optimized seeds can lead to faster, more comprehensive fuzzing campaigns -- and DIAR helps you find such seeds.
- These are slides of the talk given at IEEE International Conference on Software Testing Verification and Validation Workshop, ICSTW 2022.
UiPath Test Automation using UiPath Test Suite series, part 5DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 5. In this session, we will cover CI/CD with devops.
Topics covered:
CI/CD with in UiPath
End-to-end overview of CI/CD pipeline with Azure devops
Speaker:
Lyndsey Byblow, Test Suite Sales Engineer @ UiPath, Inc.
Unlocking Productivity: Leveraging the Potential of Copilot in Microsoft 365, a presentation by Christoforos Vlachos, Senior Solutions Manager – Modern Workplace, Uni Systems
“An Outlook of the Ongoing and Future Relationship between Blockchain Technologies and Process-aware Information Systems.” Invited talk at the joint workshop on Blockchain for Information Systems (BC4IS) and Blockchain for Trusted Data Sharing (B4TDS), co-located with with the 36th International Conference on Advanced Information Systems Engineering (CAiSE), 3 June 2024, Limassol, Cyprus.
SPICE MODEL of TPCA8014 (Standard+BDS Model) in SPICE PARK
1. Device Modeling Report
COMPONENTS: Power MOSFET (Model Parameters)
PART NUMBER: TPCA8104
MANUFACTURER: TOSHIBA
Body Diode (Model parameters) / ESD Protection Diode
Bee Technologies Inc.
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
2. MOSFET MODEL
PSpice model
Model description
parameter
LEVEL
L Channel Length
W Channel Width
KP Transconductance
RS Source Ohmic Resistance
RD Ohmic Drain Resistance
VTO Zero-bias Threshold Voltage
RDS Drain-Source Shunt Resistance
TOX Gate Oxide Thickness
CGSO Zero-bias Gate-Source Capacitance
CGDO Zero-bias Gate-Drain Capacitance
CBD Zero-bias Bulk-Drain Junction Capacitance
MJ Bulk Junction Grading Coefficient
PB Bulk Junction Potential
FC Bulk Junction Forward-bias Capacitance Coefficient
RG Gate Ohmic Resistance
IS Bulk Junction Saturation Current
N Bulk Junction Emission Coefficient
RB Bulk Series Resistance
PHI Surface Inversion Potential
GAMMA Body-effect Parameter
DELTA Width effect on Threshold Voltage
ETA Static Feedback on Threshold Voltage
THETA Mobility Modulation
KAPPA Saturation Field Factor
VMAX Maximum Drift Velocity of Carriers
XJ Metallurgical Junction Depth
UO Surface Mobility
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006
14. Reverse Recovery Characteristic Reference
Trj=14(ns)
Trb=69(ns)
Conditions:Ifwd=lrev=0.2(A),Rl=50
Example
Relation between trj and trb
All Rights Reserved Copyright (c) Bee Technologies Inc. 2006