The document outlines various fabrication equipment and processes used in microelectronics, including molecular beam epitaxy, chemical vapor deposition, and reactive ion etching. It details the steps involved in manufacturing printed circuit boards and integrated circuits, emphasizing the importance of each step in ensuring quality and functionality. Additionally, references to academic lectures and textbooks are provided for further reading on the topic.

1. GLIMPSES
AJAL.A.J

2. Fabrication Equipment
Molecular Beam Epitaxy
(MBE)

3. Fabrication Equipment
Photoresist Spinner Bake-out Ovens

4. Fabrication Equipment
Mask Aligner Reactive Ion Etching (RIE)

5. Fabrication Equipment
Chemical Vapor Deposition
(CVD)
Plasma Quest Sputter

6. Fabrication Equipment
Plasma Sputter Perkin-Elmer MBE

8. Aligned Wafer-Bonding System

13. PCB Manufacture
Types of PCB's
single-side, double-side and multi-layer
Which type to use ?
(a) Circuit complexity
(b) Available space
(c) Cost
Typical PCB
insulated substrate
copper connections
protective covering

14. Packaging
Dual Inline Package and its lead-frame
Steps in Lead Frame Manufacture:
(1) Cut copper strips
(2) Clean in a chemical bath
(3) laminate a layer of photoresist
(4) Expose photoresist through mask
(5) Develop and etch
(6) Remove lamination
(7) Plate internal regions with gold/silver
Dual Inline Package and its lead-frame
Steps in Lead Frame Manufacture:
(1) Cut copper strips
(2) Clean in a chemical bath
(3) laminate a layer of photoresist
(4) Expose photoresist through mask
(5) Develop and etch
(6) Remove lamination
(7) Plate internal regions with gold/silver
- Make leadframe
- Die attachment (chip bonded to leadframe using epoxy)
- Wire bonding (ultrasonic welding)
- Encapsulation (moisture resistant coating)
- Molding (plastic package)
- Marking (chip number, co. name, marked on package [laser, silkscreen])
- DTFS: deflash, trim the leadframe, form the leads, singulate (cut dambars)
- Leadfinishing: electroplating the leads

16. Integrated Circuit (IC) Manufacture
- Slicing the Silicon ingot
- Fabrication of IC’s (Lithography, Sputtering, diffused junction, …)
- Testing each IC on the slice
[source: www.towajapan.co.jp]
- Dicing (cutting each chip out with a diamond saw)
- Packaging

17. Images of the CLEAN ROOM MONITORING
UNIT

18. Schematic of Ion Beam Sculpting Apparatus

19. Sculpting of Nanopores:
Sputtering versus Lateral Mass Transport

20. Fabrication Equipment
Probe Station Scanning Electron
Microscope (SEM)

21. We’re all searchers now…search
smarter, not harder ? ( AJAL.A.J )

22. The ultimate passion of searching…

24. References
• Carter, Ronald. “Lecture 9 – EE 5342” UTA
• Cheung, Nathan “ Lecture 17 – EE 143” UC Berkeley
• http: //et.nmso.edu/ETCLASSES/vlsi/files/CRYSTAL.HTM
• Hastings, Alan “The Art of Analog Layout”, Prentice Hall, New
Jersey, 2001
• Campbell, Stephen A. , “The Science and Engineering of
Microelectronic Fabrication”, Oxford University Press, New York,
2001
• Alvarez, Antonio, “BiCMOS Technology and Applications”, Prentice
Hall, New Jersey, 2001

25. The End