Photonic integrated circuits (PICs) integrate optical and electronic components onto a single chip using materials like lithium niobate, gallium arsenide, and indium phosphide. PICs can be classified as either hybrid or monolithic. They aim to bring fiber optic networks directly to subscribers by enabling high data transmission rates over long distances with minimal loss, noise, voltage, and power requirements. Key components in PICs include lasers, photodetectors, waveguides, power splitters, and optical amplifiers.

1. Course: Photonic Integrated Circuit
Course Coordinator: Arpan Deyasi
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Arpan Deyasi, RCCIIT, India

2. Photonic Integrated Circuit
Integrated circuits with optic and electronic
components
made by photolithography and other new forms of
integration
Materials used
• Lithium Niobate
• Gallium Arsenide
• Indium Phosphide
• Silica on Silicon
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Arpan Deyasi, RCCIIT, India

3. A circuit, or group of interconnected circuits, consisting of
miniature solid-state optical components on
semiconductor or dielectric substrates
Photonic Integrated Circuit
Classified as either hybrid or monolithic
Optoelectronic integrated circuits refers to the integration
of electric and optical components and optical
interconnection
Optoelectronic devices makes electrons and photons to
perform single function. These devices are capable of
converting optical to electric form and vice versa
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Arpan Deyasi, RCCIIT, India

4. Objective of PIC
bring fiber systems to home and individual subscribers
in the form of telephone links and broadcast cable TV.
In order to extend optoelectronic technologies to
subscriber, the systems need the development of lasers
with precise frequency control and tenability and
wavelength-selective detectors and receivers.
Data transmission rates of several tens of Gbps will be
attained by these circuits and systems
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Arpan Deyasi, RCCIIT, India

5. Why optical spectra?
Fiber Optics have
[i] Minimal loss
[ii] Minimal noise
[iii] Lower Voltage and Power input
[iv] Higher data transfer rate
[v] Higher speed
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Arpan Deyasi, RCCIIT, India

6. Comparison between photon and electron
Photon
Small interaction between photons
Propagate outside the medium and for longer distances
Electron
Larger interaction between electrons
Propagate only inside or on the material
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Arpan Deyasi, RCCIIT, India

7. Smart Pixel Arrays in PIC
Diffractive element arrays
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Arpan Deyasi, RCCIIT, India

8. What are the components inside it?
 Lasers
 Photodetectors
 Waveguides
 Power Splitters
 Optical Amplifiers
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Arpan Deyasi, RCCIIT, India

9. Problem with PIC’s so far ……………..
 requires a variety of integration techniques and materials
 larger feature size
 lower Integration density
 expensive
 software is not powerful for testing purpose
None of these technologies is fully developed, but
limited hybrid integration is available
commercially
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Arpan Deyasi, RCCIIT, India

10. Applications of PIC
 Fiber-Optic communications
 Biomedical engineering
 Photonic computing
 Big data computing
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Arpan Deyasi, RCCIIT, India