We designed and manufactured Auto Insertion machine in Shenzhen China, and provide SMT equipments, spare parts services support.
Please email: jasonwu@smthelp.com
Introduction to Surface Mount TechnologyABDUL MUNAFF
Surface Mount Technology (SMT) refers to a specific type of electronics assembly where electronic components are attached to the surface of a substrate (typically a printed circuit board).
SMT is a modern alternative to traditional thru-hole technology where components are attached to substrates by leads that passed through holes in the PCB.
Surface Mount components require less space so SMT is helpful in product miniaturization.
SMT Overview
SMT V/S THROUGH HOLE
Basic SMT process flow
Equipments used SMT Assembly
Through Hole Assembly & Soldering
ELECTROSTATIC DISCHARGE
RoHS
Introduction to Surface Mount TechnologyABDUL MUNAFF
Surface Mount Technology (SMT) refers to a specific type of electronics assembly where electronic components are attached to the surface of a substrate (typically a printed circuit board).
SMT is a modern alternative to traditional thru-hole technology where components are attached to substrates by leads that passed through holes in the PCB.
Surface Mount components require less space so SMT is helpful in product miniaturization.
SMT Overview
SMT V/S THROUGH HOLE
Basic SMT process flow
Equipments used SMT Assembly
Through Hole Assembly & Soldering
ELECTROSTATIC DISCHARGE
RoHS
This training is very necessary to them who are working in Electronics manufacturing because Soldering process is the Heart of Electronics Industry, that's why this training is very important to employees.
How to find defects in SMT electronics manufacturingBill Cardoso
This presentation covers several examples of defects found in today's SMT electronics manufacturing lines. Learn how x-rays can be used to find these defects, and most importantly, diagnose your manufacturing line.
All x-ray images taken with TruView X-Ray Inspection systems.
- Where Are Defects Introduced in the SMT production line?
- Solder Paste Application Defects
- Component Placement Defects
- Reflow Oven Defects
- Statistical Process Control
PowerPoint presentation supporting the oral presentation of Kyle Anderson from AGI, Inc. Presentation given to Christian technicians in India at a worship conference.
PCBA Assembly Process Flow / PCB Assembly Manufacturing introduces the basic manufacturing process of PCBA / PCB assembly in different condition of component.It is about PCBA manufacture production.
We provide totally solution for LED lighting SMT PCB assembly.
Worldwide Installation and on site support.
Factory (machine and lighting assembly) training.
Project Report on SMT and through-hole technologylakshya bhardwaj
SMT and Through-hole technology and their assembly line, different types of Soldering, ESD protection, Conformal coating, etc, all about PCB Production
This presentation is all about the working of Surface mount technology department of electronics industry. This is my personal experience at iljin electronics pvt. ltd. during my internship.
This training is very necessary to them who are working in Electronics manufacturing because Soldering process is the Heart of Electronics Industry, that's why this training is very important to employees.
How to find defects in SMT electronics manufacturingBill Cardoso
This presentation covers several examples of defects found in today's SMT electronics manufacturing lines. Learn how x-rays can be used to find these defects, and most importantly, diagnose your manufacturing line.
All x-ray images taken with TruView X-Ray Inspection systems.
- Where Are Defects Introduced in the SMT production line?
- Solder Paste Application Defects
- Component Placement Defects
- Reflow Oven Defects
- Statistical Process Control
PowerPoint presentation supporting the oral presentation of Kyle Anderson from AGI, Inc. Presentation given to Christian technicians in India at a worship conference.
PCBA Assembly Process Flow / PCB Assembly Manufacturing introduces the basic manufacturing process of PCBA / PCB assembly in different condition of component.It is about PCBA manufacture production.
We provide totally solution for LED lighting SMT PCB assembly.
Worldwide Installation and on site support.
Factory (machine and lighting assembly) training.
Project Report on SMT and through-hole technologylakshya bhardwaj
SMT and Through-hole technology and their assembly line, different types of Soldering, ESD protection, Conformal coating, etc, all about PCB Production
This presentation is all about the working of Surface mount technology department of electronics industry. This is my personal experience at iljin electronics pvt. ltd. during my internship.
CSS is not so easy as many people think, so this presentation is a guide to properly write your CSS code. You'll see about browser's process reflow and repaint, layout, advanced selectors, new units and some useful examples.
The basic purpose of the Process Control Project in the Reflow Oven Operation is to determine which are the main variables of the reflow profile that have significant influence on the output (defect rate, failures, quality of the solder joints, etc.) and determine and implement a process control for them.
Another objective of this project is to find some results or general highlights that can be used as a reference for other EMS factories to have a better process control for reflow.
Finally, this project will help to Engineering team in EMS Monterrey to understand better why process control is required to improve the quality of our products.
Machine range: We are a one-stop SMT solution company, providing all SMT production, inspection and rework machines, spare-parts, consumables etc. All main-line manufacturing production equipment like wave solder, reflow ovens, printers, p&p, PCB conveyors/handling, AOI, SPI, Conformal coating, dispensing, selective soldering, PCBA cleaner etc. Replacement parts like conveyor fingers for different wave solder systems, p&p feeders and nozzles etc, consumable material like glues, solder wire etc. This will save customers a significant amount of time. Three different suppliers for one single item would be compared, as opposed to capitalizing on the mass investigation into the market completed before we present our machines and recommend to our customers.50% cost saving for your current purchasing .If you have any need.please feel free to contact me .email:shaoyong@smthelp.com whatsapp:+86 13760481664 Skype:sy332366
Updated Company Presentation from ITAR Registered / AS9100 Certified Saturn Electronics Corporation includes newly developed advanced technologies to include Metal Core / Aluminum Circuit Boards--featured in free LED MCPCB keychain available on web site.
Lead Free Pcb RoHs Compliant Design, Fabrication, and Assembly Cost ReductionDomestic PCB Fabrication
Lead Free Cost Reduction webinar dealing with RoHS compliant laminates and final finishes pertaining to PCB manufacturing to included design, fabrication, and assembly.
UL Certified Aluminum / Metal Core PCB for LEDs presentation. Featuring highly-respected thermal interface material basics expert Clemens Lasance of Philips Research Laboratories, the thermal management presentation is great for PWB Designers as it provides fabrication notes, material comparisons, and LED product calculators.
In this presentation, Fred Dimock, Manager Process Technology, gives a comprehensive overview of thermal profiling including: recipes vs. profiles, material properties, TC accuracy, profilers and test vehicles, process window, heat transfer and oven control.
TECNOLOGIE OPEN SOURCE PER INDUSTRIA 4.0 - Code_Aster & Injection MoldingAndrea Pisa
Nello stampaggio ad iniezione dei polimeri (injection molding) la termica dello stampo riveste un ruolo fondamentale sulla qualità del pezzo prodotto. Lo stampo, oltre a conferire la forma, è progettato con un circuito di condizionamento utile a smaltire omogeneamente il calore necessario a far solidificare il pezzo mantenendo allo stesso tempo una temperatura superficiale sufficientemente alta da permettere lo scorrimento del polimero nella cavità. Durante l’avvio produzione lo stampo passa da temperatura ambiente alle condizioni di regime attraverso un transitorio che dura un certo numero di cicli di stampaggio non noto a priori, normalmente i pezzi prodotti in questa fase vengono scartati in quanto non conformi. In questo lavoro Code_Aster è stato utilizzato per ottimizzare un avvio produzione simulando l’evoluzione termica derivante da una serie di cicli di stampaggio a partire da una condizione di avvio definita. Lo script di simulazione è stato inoltre progettato per interfacciare Code_Aster con un file xml contenente i parametri con cui l’operatore può facilmente modificare le condizioni del ciclo produttivo (iniezione, raffreddamento ed estrazione), i parametri del circuito di condizionamento e tutte le condizioni geometriche al contorno. Il responsabile produzione, utilizzando questo script Code_Aster, sarà così in grado di individuare preventivamente i settaggi macchina migliori per ridurre i cicli necessari al raggiungimento della condizione stazionaria, risparmiando tempo e risorse. Lo sviluppo dello script prevederà l’accoppiamento indiretto delle superfici di condizionamento con una simulazione CFD eseguita su openFoam al fine di migliorare l’accuratezza dei risultati.
Ritemp mold cooling is a technology which has lot of future scope but when it comes to impelmentation of this technology it is a challenge in its own way
Electronic manufacturing v3.0 - Fab Academy 2016seeedstudio
Open source and DIY electronics are filling Fab Labs and maker spaces with new tools for incredible creations. How can we design tools to change how people make things? How to scale DIY electronics to millions of users?
https://plus.google.com/u/0/events/ca5ss0rvia897dk3qgloqo1gjr0
About us
TTHERM GEO heat pumps are designed and distributed by Terra-Therm Inc, a wholesale distributor who has over 30 years of experience in the Geo exchange industry. Our cold climate heat pumps are built and designed in Minnesota with our customers comfort in mind. We understand what it takes to harvest Earths energy and by using our exclusive GEO LOGIC controls we can optimize both comfort and savings.
TTHERM GEO geothermal heat pumps are better by design:
Optimized efficiency in all modes of heating and cooling
Ultra-quiet operation
Highest heating discharge air temperature in the industry
Highest heating capacities per nominal size
Build to outlast the competition
10 years refrigeration parts and labor warranty
Lifetime cabinet warranty
Energy Star Certified by DOE and the EPA
Along with our technical department TTHERM GEO and Terra-Therm Inc. have earned the respect of industry professionals and we are dedicated to providing superior customer assistance for many years of trouble free operation.
Specialties
Geothermal accessories, Technical Geothermal Heat Pump foresics, Training, Geothermal Hydronic Design and Application, Radiant Floor, and TTHERM GEO Forced Air and Hydronic Heat Pumps
www.discovergeothermal.com
www.ttherm.com
www.tthermgeo.com
Operational Problems
Catalytic Reactor Process - Prompt List
- Feed Issues:
- Pipe work type Issues
- Operational Issues
- Vessel Loading
- Vessel Designs
- Wider Process Issues
- Material Issues
- Discharge issues
- Things to look at
- Things to consider trying
End splitting during long products rolling billet quality of rolling processJorge Madias
End splitting occurs because the material being rolled has not enough ductility to withstand the stress to which it is submitted. This may happens for different reasons. Coarse cracks in the billet end, like central or diagonal cracks, weakens the end, particularly when the plane where are located coincides in part with the symmetry plane between rolls. Hot ductility of steel depends on the one hand of their intrinsic features, and on the other hand, on the temperature at which they suffer the stress, and its speed.
It is important to roll the steel within the range of higher ductility at a given deformation speed. This is more critical for steels with inherent low ductility as those containing high sulfur.
The role of MnS stringers is also clear; having S controlled at the lower level of the specification is favorable. Nevertheless it is worth to mention that if caster condition is proper and excessive thermal/mechanical stresses do not arise, very high Mn/S ratio is not necessary.
Bar ends loss temperature faster. Another factor is roll cooling, it has to be correctly oriented, not excessive and keeping the position along the processing time.
In other factors experimental and modeling results are apparently controversial. There is coincidence in the fact that more friction between bar and rolls promotes splitting, but not in factors like roll diameter and reduction.
On the basis of pilot rolling results, plane, box-box, square to round and oval to round passes are favorable to avoid splitting, while oval to square promotes splitting.
Phase Change Materials as an Alternative to Thermal Grease for Networking Applications - a technical comparison of Thermal Interface Materials in networking applications. Presented jointly by Juniper Networks and Honeywell Electronic Materials.
Phase Change Materials as an Alternative to Thermal Grease for Networking Applications - a technical comparison of Thermal Interface Materials in networking applications. Presented jointly by Juniper Networks and Honeywell Electronic Materials.
We design and manufacture automatic machine for the PCBA/SMT and Thru-hole industries in Shenzhen China. We help companies looking to low cost equipment with smart, ROI-driven assembly equipment solutions. To watch the machine working video, please search: "Auto Insertion" in Youtube. Contact us today to learn how we can help you。 info@smthelp.com
We design and manufacture automatic machine for the PCBA/SMT and Thru-hole industries in Shenzhen China. We help companies looking for low-cost equipment with smart, ROI-driven assembly equipment solutions. info@smthelp.com
We design and manufacture automatic machine for the PCBA/SMT and Thru-hole industries in Shenzhen China. We help companies looking for low-cost equipment with smart, ROI-driven assembly equipment solutions.
We specialize in Auto Insertion machine and SMT equipments, provide spare parts, sub-assembly, retrofit kit, repair kit, upgrading, training, overhaul service, quality problem free replacement.And we will provide customers with high quality after-sales service, free technical support etc., let you no worries.
Please Contact :
Email: jasonwu@smthelp.com
Skype:jasonwuuic
Website:
http://www.smthelp.com/
https://www.facebook.com/autoinsertion
http://www.linkedin.com/company/shenzhen-southern-machinery-sales-and-service-co-ltd?trk=biz-companies-cym
We design and manufacture automatic machine for the PCBA/SMT and Thru-hole industries in Shenzhen China. We help companies looking to low cost equipment with smart, ROI-driven assembly equipment solutions. To watch the machine working video, please search: "Odd form insertion machine" in Youtube. Contact us today to learn how we can help you。 info@smthelp.com
We design and manufacture automatic machine for the PCBA/SMT and Thru-hole industries in Shenzhen China. We help companies looking to low cost equipment with smart, ROI-driven assembly equipment solutions. To watch the machine working video, please search: "Odd form insertion machine" in Youtube. Contact us today to learn how we can help you。 info@smthelp.com
We design and manufacture automatic machine for the PCBA/SMT and Thru-hole industries in Shenzhen China. We help companies looking to low cost equipment with smart, ROI-driven assembly equipment solutions. To watch the machine working video, please search: "Odd form insertion machine" in Youtube. Contact us today to learn how we can help you。 info@smthelp.com
We specialize in Auto Insertion machine and SMT equipments, provide spare parts, sub-assembly, retrofit kit, repair kit, upgrading, training, overhaul service. www.smthelp.com
We design and manufacture automatic machine for the PCB/SMT and Thru-hole industries in Shenzhen China. We help companies looking to low cost equipment with smart, ROI-driven assembly equipment solutions. To watch the machine working video, please search: "Odd form insertion machine" in Youtube. Contact us today to learn how we can help you。 info@smthelp.com
We design and manufacture automatic machine for the PCB/SMT and Thru-hole industries in Shenzhen China. We help companies looking to low cost equipment with smart, ROI-driven assembly equipment solutions. To watch the machine working video, please search: "Odd form insertion machine" in Youtube. Contact us today to learn how we can help you。 info@smthelp.com
Reels or ammo packs of radial leaded components are loaded on the sequencer module, dispensed, and inserted in the PCB following the programmed sequence. Component dispensing heads remove components from the carrier tape and place them in component carrier clips located on the sequencer chain assembly. The sequencer chain assembly transports the components to the insertion area. While the components are on the sequencer chain assembly, the carrier tape is removed. The component transfer assembly transfers components from the sequencer chain assembly into the insertion head tooling. The insertion tooling guides the leads through the holes in the PC board. The cut and clinch unit cuts and then forms the leads, securing the component in the PC board.
providing LED SMT total solutions, Auto Insertion machine and service support. Now we are working with Mr Supasak to handle one PIN auto insertion solutions.
We design and manufacture Odd Form component auto insertion machine,SMT equipment, and providing spare parts service. Worldwide Installation and on site support and training.
1,Please visit : www.smthelp.com
2, Find us more: https://www.facebook.com/autoinsertion
3, Know more our team: https://cn.linkedin.com/in/smtsupplier
4, Welcome to our factory in Shenzhen China
5, Google:Auto+Insertion
6, Looking forward to your email: info@smthelp.com
We design and manufacture Odd Form component auto insertion machine,SMT equipment, and providing spare parts service. Worldwide Installation and on site support and training.
Connector Corner: Automate dynamic content and events by pushing a buttonDianaGray10
Here is something new! In our next Connector Corner webinar, we will demonstrate how you can use a single workflow to:
Create a campaign using Mailchimp with merge tags/fields
Send an interactive Slack channel message (using buttons)
Have the message received by managers and peers along with a test email for review
But there’s more:
In a second workflow supporting the same use case, you’ll see:
Your campaign sent to target colleagues for approval
If the “Approve” button is clicked, a Jira/Zendesk ticket is created for the marketing design team
But—if the “Reject” button is pushed, colleagues will be alerted via Slack message
Join us to learn more about this new, human-in-the-loop capability, brought to you by Integration Service connectors.
And...
Speakers:
Akshay Agnihotri, Product Manager
Charlie Greenberg, Host
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...Jeffrey Haguewood
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on the notifications, alerts, and approval requests using Slack for Bonterra Impact Management. The solutions covered in this webinar can also be deployed for Microsoft Teams.
Interested in deploying notification automations for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
GraphRAG is All You need? LLM & Knowledge GraphGuy Korland
Guy Korland, CEO and Co-founder of FalkorDB, will review two articles on the integration of language models with knowledge graphs.
1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/
The Art of the Pitch: WordPress Relationships and SalesLaura Byrne
Clients don’t know what they don’t know. What web solutions are right for them? How does WordPress come into the picture? How do you make sure you understand scope and timeline? What do you do if sometime changes?
All these questions and more will be explored as we talk about matching clients’ needs with what your agency offers without pulling teeth or pulling your hair out. Practical tips, and strategies for successful relationship building that leads to closing the deal.
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Ramesh Iyer
In today's fast-changing business world, Companies that adapt and embrace new ideas often need help to keep up with the competition. However, fostering a culture of innovation takes much work. It takes vision, leadership and willingness to take risks in the right proportion. Sachin Dev Duggal, co-founder of Builder.ai, has perfected the art of this balance, creating a company culture where creativity and growth are nurtured at each stage.
Securing your Kubernetes cluster_ a step-by-step guide to success !KatiaHIMEUR1
Today, after several years of existence, an extremely active community and an ultra-dynamic ecosystem, Kubernetes has established itself as the de facto standard in container orchestration. Thanks to a wide range of managed services, it has never been so easy to set up a ready-to-use Kubernetes cluster.
However, this ease of use means that the subject of security in Kubernetes is often left for later, or even neglected. This exposes companies to significant risks.
In this talk, I'll show you step-by-step how to secure your Kubernetes cluster for greater peace of mind and reliability.
Accelerate your Kubernetes clusters with Varnish CachingThijs Feryn
A presentation about the usage and availability of Varnish on Kubernetes. This talk explores the capabilities of Varnish caching and shows how to use the Varnish Helm chart to deploy it to Kubernetes.
This presentation was delivered at K8SUG Singapore. See https://feryn.eu/presentations/accelerate-your-kubernetes-clusters-with-varnish-caching-k8sug-singapore-28-2024 for more details.
Essentials of Automations: Optimizing FME Workflows with ParametersSafe Software
Are you looking to streamline your workflows and boost your projects’ efficiency? Do you find yourself searching for ways to add flexibility and control over your FME workflows? If so, you’re in the right place.
Join us for an insightful dive into the world of FME parameters, a critical element in optimizing workflow efficiency. This webinar marks the beginning of our three-part “Essentials of Automation” series. This first webinar is designed to equip you with the knowledge and skills to utilize parameters effectively: enhancing the flexibility, maintainability, and user control of your FME projects.
Here’s what you’ll gain:
- Essentials of FME Parameters: Understand the pivotal role of parameters, including Reader/Writer, Transformer, User, and FME Flow categories. Discover how they are the key to unlocking automation and optimization within your workflows.
- Practical Applications in FME Form: Delve into key user parameter types including choice, connections, and file URLs. Allow users to control how a workflow runs, making your workflows more reusable. Learn to import values and deliver the best user experience for your workflows while enhancing accuracy.
- Optimization Strategies in FME Flow: Explore the creation and strategic deployment of parameters in FME Flow, including the use of deployment and geometry parameters, to maximize workflow efficiency.
- Pro Tips for Success: Gain insights on parameterizing connections and leveraging new features like Conditional Visibility for clarity and simplicity.
We’ll wrap up with a glimpse into future webinars, followed by a Q&A session to address your specific questions surrounding this topic.
Don’t miss this opportunity to elevate your FME expertise and drive your projects to new heights of efficiency.
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
2. www.smthelp.com
Slide 2
• Heat transfer and equipment
• How to profile, variables to consider
• Understanding and designing the “Best profile”
• Understanding what the profile does
4. www.smthelp.com
Slide 4
• Conduction
– Hot plate/travelling hot plate – Thick film guys
– Hot bar – Specific components
– Soldering iron – Repair, odd form
• Induction - Another industry another day
6. www.smthelp.com
Slide 6
Vapour Phase Reflow
• Single chamber process
• Usually batch, can be conveyorised
– Boil Inert Liquid
– Heated Vapour Condenses on Product
(All Surfaces)
– Equilibrium process, heat transfer stops
at BP of liquid
– Not mass, shape or color sensitive
– Almost No ΔT at reflow
7. www.smthelp.com
Slide 7
1980s
21st C
Elegant and simple concept
Temperature rise rate/ RAMP rate???
Anaerobic?
Cost??
Mass Production???
Generally high mix/ low volume/
prototyping
8. www.smthelp.com
Slide 8
Convection/Forced convection
• Multi chamber (zone)
• Usually always conveyorised
– Air/nitrogen is heated and circulated
– Provides Even Heat
– Moderate Price
– Not usually, but can be, in equilibrium
• The dominant technology
10. www.smthelp.com
Slide 10
• There is no universal best profile
• Profile is not determined by the paste
• Profile is not determined by the PCBA
• Profile is not determined by the reflow oven
• It’s a combination – and that combination is
unique to you
• Mostly its determined by the efficiency
of the oven and the workload. Paste is
secondary
– Any Recommended Profile is
therefore just a strong suggestion
12. www.smthelp.com
Slide 12
• Thermocouples are attached to components on the
PCBa
• The temperature of the components is measured as
the PCBa passes through the oven and is soldered.
Soak time
Time Above Liquidus
Peak Temp
Liquidus Temp
Soak Exit Temp
Soak Entry Temp
T
t
Heating Rates
°c/s
RAMP SOAK Reflow COOL
• There are 2 basic methods….
13. www.smthelp.com
Slide 13
• Uses oven/external measurement system
and long thermocouples
• Practical only on small ovens
• Measurements tend to be more variable
• Assembly is easily snagged and damaged
on moving conveyor parts
14. www.smthelp.com
Slide 14
• Use a data logger or Profiler
• Use predictive software with SPC
• What is the ‘best profile’?
16. www.smthelp.com
Slide 16
• Oven type and settings
• Solder paste and flux
• Board finish
• Components – technology
• PCB substrate and layout
• Throughput
17. www.smthelp.com
Slide 17
• Component Integrity
Max package temperatures currently 235-240C
Excess heating has unknown effect on device MTBF
Widespread use of ‘delicate’ package types.
• Reduced process window
Lead free pastes have liquidus temp 30-40C higher than Sn/
Pb
18. www.smthelp.com
Slide 18
Peak Temp Deg C
205
235
OK
TOO HOT
TOO COLD
30C
• Illustration for standard Sn63/Pb37 solder paste (TLiq = 183C)
• Solder paste spec specifies min peak of 205 C for good wetting
• Component maximum is 235C
WE HAVE A 30C PROCESS WINDOW TO WORK WITH !
19. www.smthelp.com
Slide 19
Peak Temp Deg C
227
235
OK
TOO HOT
TOO COLD
8C
• Illustration for lead free SnAgCu solder paste ( Tliq = 217C)
• Solder paste spec specifies min peak of 227 C for good wetting
• Max Peak ideally is 257C but component max is still 235C
WE NOW HAVE AN 8C PROCESS WINDOW TO WORK WITH !
20. www.smthelp.com
Slide 20
• Oven needs to maintain small delta T across the
board.
• Profiles need to be developed for each board
type
• Periodic profiling required to monitor and
maintain process
21. www.smthelp.com
Slide 21
• Follows the PCBa through the reflow
oven
• Data logger must be protected from
the heat
• Can be used on large or small ovens
• Generally more accurate and repeatable
• Must be small to pass through restricted oven tunnels
• Should be narrow to allow profiling of small PCB’s
22. www.smthelp.com
Slide 22
Method Advantage Disadvantage
Kapton Tape quick/non destructive Non permanent /
unreliable, errors
Adhesive metal foil quick/non destructive Non permanent /
unreliable, errors
High temperature
adhesive
robust/quick cure Rel. poor thermal
conductivity, errors
HMP solder
(290-305DegC)
robust/good conductivity Dedicated test PCBa req’d
23. www.smthelp.com
Slide 23
• Aim is to heat the board uniformly
• Components vary in size, mass, texture and
colour.
• PCB’s vary is size, shape, mass, component
densities
• Need to identify extremes of the profile envelope.
24. www.smthelp.com
Slide 24
• High mass/bigger components will heat up slowest
• Low mass/smaller components will heat up fastest
• Power components with integral heat-sinks
• Components connected to large copper ground planes
• Indirectly heated components ( BGA )
• Components nearer board edges
• Components nearer the centre / densely populated
• Components shadowed by others
25. www.smthelp.com
Slide 25
• DO make the TC leads long enough so that the profiler
follows at least 1 zone behind the PCB.
• DON’T pass the profiler through the oven first, always
behind the PCBa.
• DO profile an example of the actual board being processed.
• DON’T profile the test board again before it has returned to
ambient temperature.
• DO profile a populated board.
26. www.smthelp.com
Slide 26
• Allows the effect of heater and belt-speed set-point changes to be
predicted
• Saves time and money by eliminating the need to perform
unnecessary profile runs for set-up and fine tuning
• Reduces machine downtime by allowing process set-up to be
completed offline.
• Eases process set-up and change over to Lead Free paste
• Unique graphical approach intuitively provides guidance to the user
to optimise the process
• Quickly allows the user to evaluate the effect of paste changes on
the process.
28. www.smthelp.com
Slide 28
Time 265
Temp 215
Time-s 0 90 140 190 230 250 295 325
Temp-C 30 90 130 175 183 200 183 120
Thruput Calculator
Tunnel Length cm 249 Thruput Bds/min 2.84 Obeys Dwell Criteria? Yes
Belt Speed cm/min 71 Profile Time (min) 3.51
Product Length cm 20
Product Spacing cm 5
Time
Temperature183C
29. www.smthelp.com
Slide 29
• Instantly produces run
charts for each process
parameter
• Also calculates
XBar,σ,Cp and Cpk
• Source data selected
from profile database
30. www.smthelp.com
Slide 30
1. Splatter, thermal shock
2. Insufficient solvent evaporation
3. Oxidation, too much flux activation
4. Insufficient flux activity
5. TAL
a) Long/Hot: IM too thick, component damage
b) Short/Cool: trapping of flux, voids
6. Too fast: thermal shock
Too slow: large grains=> weak joint
0
50
100
150
200
250
0 50 100 150 200 250 300 350 400
Time (seconds)
Temperature(oC)
1
3
2
5
4
6
31. www.smthelp.com
Slide 31
Conventional Profile DesignTemperature(°C)
0
75
150
225
300
Time (seconds)
0 125 250 375 500
Cold spo
Hot spot
MP
IR sensitive to variation in parts feature.
Soak zone helped to reduce temperature gradient
32. www.smthelp.com
Slide 32
Optimized reflow profile via
defect mechanisms consideration
Temperature(°C)
0
75
150
225
300
Time (seconds)
0 125 250 375 500
Profile
MP
Slow ramp-up to 195°C, gradual raise to
200°C, spike to 230 °C, rapid cool down.
34. www.smthelp.com
Slide 34
Defect Mechanisms Analysis - II
• Wicking / Opens
– leads hotter than PCB
• slow ramp up rate to allow the board and
components reaching temperature equilibrium
before solder melts; more bottom side heating
35. www.smthelp.com
Slide 35
Defect Mechanisms Analysis - III• Solder balling
– spattering (slow ramp up rate to dry out paste
solvents or moisture gradually)
– excessive oxidation (minimize heat input prior to
reflow (slow ramp up rate, no plateau at soaking
zone) to reduce oxidation)
36. www.smthelp.com
Slide 36
Defect Mechanisms Analysis - IV
• Hot slump / Bridging
– viscosity drops with increasing
temperature
• slow ramp up rate to dry out paste
solvent gradually before viscosity
decreases too much
37. www.smthelp.com
Slide 37
Defect Mechanisms Analysis - V
• Solder beading
– Slumping (Viscosity drops w/ increasing temperature
– Spattering (Rapid outgassing under low standoff
components)
Beading is more often a result of poor
aperture design
38. www.smthelp.com
Slide 38
• Poor wetting
– excessive oxidation(minimize heat input prior to
reflow (minimize soaking zone, or use linear ramp-
up from ambient to solder melting temperature) to
reduce oxidation)
39. www.smthelp.com
Slide 39
Defect Mechanisms Analysis - VII
• Voiding
– excessive oxidation (minimize heat input prior to
reflow (minimize soaking zone, or use linear ramp-up
from ambient to solder melting temperature) to
reduce oxidation)
– flux remnant too high in viscosity (cooler reflow
profile to allow more solvents in flux remnant)
42. www.smthelp.com
Slide 42
• Temperature profiling forms a key part of
lead free processing.
• Used in both process setup and ongoing
process control
• Modern profiling equipment has extensive
tools to help setup and maintain your lead
free process.
44. www.smthelp.com
Slide 44
Optimizing printing and
reflow processes can alleviate
almost 80% of defects.
Solder Paste Screen Printer
64%
Incoming Components
6%
Reflow
15
%
Component Placement
15%
45. www.smthelp.com
Slide 45
Welcome inquiry
1,Please visit : www.smthelp.com
2, Find us more: https://www.facebook.com/autoinsertion
3, Know more our team: https://cn.linkedin.com/in/smtsupplier
4, Welcome to our factory in Shenzhen China
5, Look at machine running video: https://youtu.be/LdpOUo_1vLk
4, See more in Youtube: Auto+Insertion