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Surface mount technology
1. SURFACE MOUNT TECHNOLOGY A method of assembling printed wiring boards or hybrid circuits, where components are attached to pads on the board surface, as distinct from through-hole technology, where component leads are inserted into holes.
2. There are 3 major types of Surface Mount Assemblies: Type I (Full SMT board with parts on one or both sides of the board) Type II (Surface mount chip components are located on the secondary side of the Printed Board (PB). Active SMCs and DIPs are then found on the primary side) Type III (They use passive chip SMCs on the secondary side, but on the primary side only DIPs are used) TYPES OF SURFACE MOUNT TECHNOLOGY
14. COMPONENT PLACEMENTComponents to be placed on the boards are usually delivered to the production line in either paper/plastic tapes wound on reels or plastic tubes. Numeric Control pick-and-place machines remove the parts from the tapes, tubes or trays and place them on the PCB. SMD pick-and-place machine (with simulated motion blurs) Feed mechanism used to load components into a pick-and-place machine
15. SOLDERING Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, the filler metal having a relatively low melting point.
16. TYPES OF SOLDERING TECHNIQUES INFRARED SOLDERING CONVENTIONAL HOT GAS SOLDERING
17. INFRARED SOLDERINGDuring infrared soldering, the energy for heating up the solder joint will be transmitted by long or short wave electromagnetic radiation
19. CONVENTIONAL HOT GAS SOLDERING During hot gas soldering, the energy for heating up the solder joint will be transmitted by a gaseous medium. This can be air or inert gas (nitrogen)
