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Panduit EMEA SI Webinar 9
This document discusses grounding and bonding best practices for data centers and IT infrastructure. It covers the risks of improper grounding such as safety hazards, equipment failure from electrostatic discharge, and electrical noise. Standards for grounding and bonding like IEEE 837, TIA/EIA 607, and ANSI/TIA-942 are referenced. The document provides examples of electrostatic discharge voltages and how humidity affects ESD. Products and solutions for properly implementing grounding are also shown, like grounding busbars, bonding jumpers, and bonding hardware.
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Panduit EMEA SI Webinar 9
- 1. DPS David Palmer-Stevens Channel EnablementEMEA Mobile +44 7703194479 Email gb-dps@panduit.com Grounding and Bonding Low cost mitigation of risk
- 2. 5/6/2015 Webex series 1. Panduitis a credible partner 2. IT deployment Racks and Cabinets 3. Copper and Fibre solutions 4. PDU’s 5. Containment 6. Pathways 7. Rack Energy 8. DCIM positioning and capabilities 9. Grounding and Bonding 10.Pre-configured
- 3. 5/6/2015 Grounding and Bonding Objectives Groundingand bonding scope Solution www.panduit.com/comstor webinar Objective Overview of Panduit capability and motivate you to take a look at the solutions
- 4. The Risks ofImproper Grounding & Bonding • Safety – Shocks – Fire hazards • Lightning – Insurance data: $500 million/year due to lightning damage • Equipment failure – ESD (Electrostatic Discharge) responsible for 27-33% of IT equipment failure • The risk of electrical noise – Noise degrades the electrical signal Ethernet response is to retransmit
- 5. Electrostatic discharge (ESD) •Electrostatic charges are generated when different materials come into contact and are then separated.” • If you see or hear the ESD discharge it is a minimum of 2,900V • Here are some examples of voltages generated by ESD events: – Walking across carpet: 1,500 - 35,500 volts – Picking up a plastic bag: 1,200 – 20,000 volts – Crossing your legs: 300 volts • Cables can acquire a charge during installation when they are unreeled from a cable reel, or dragged across a floor. There have also been reports of cables developing their own charge from moving air or from building occupants walking over floor ducts.” ESD Is greatly affected by Relative Humidity > 30%
- 6. The IEEE Std.837™-2002 tests TIA/EIA 568 Copper & Fiber Cabling TIA/EIA 569 Pathways/Spaces TIA/EIA 606 Administration TIA/EIA 607 Grounding/Bonding IEEE 1100 ITE Grounding ANSI/TIA-942 Telecommunications Infrastructure Standard for Data Centers
- 7. Telecommunications Grounding Infrastructure J-STD-607-A Telecommunications Main Grounding Busbar(TMGB) Telecommunications Bonding Backbone (TBB) Telecommunications Grounding Busbar(s) (TGB) AC Feeder Cables and ACEG Building Steel AC MAIN AC AC
- 8. Integrated bonding andgrounding enhances long-term equipment reliability and safety Telecommunications room Data center Entrance and direct burial TGB Telecommunications Grounding Busbar MCBN Mesh common bonding networks TBB telecommunications bonding backbones Ground ring
- 9. Watch for thiscommon problem Common Bonding Network Jumper Kit (RGCBNJ660P22) Making this bond was in no one’s scope of work... (20% of the data centers have this problem) Specify who bonds the racks to the SBG!
- 10. Grounding and Bondingequipment
- 11. Grounding standards compliance foroperability Conductor to ground rod Conductor to building steel Conductor to rebar Conductor to grounding electrodes Conductor to conductor
- 12. HTAP Crimping • HTCTHTAPs require 12 tons of compression • CT-2930/L is recommended • Can use other manufacturers’ tools and retain UL Listing/CSA Certification • Must use Panduit locator dies Patented locating rib guarantees full- width crimp 1st time, every time! HTCT HTAP CD-930H-250 Locator Die CT-2930/L
- 13. Supplemental bonding gridconstruction per TIA-607-B Example supplemental bonding grid Hinged U-bolt design allows for “no look” installation—saving 67% of installation time
- 14. Intentional & VisuallyVerifiable
- 15. The connector isthen bonded to the patch panel The system grounding protection starts at the jacks module with 360o shielding The patch panel is bonded to the equipment rack for protection Finally, the entire system is bonded to a main bus bar located in the floor 4 2 1 3 Bonding and Grounding for Shielded Cables
- 16. Implementing the equipment groundingrequirement Bond equipment with a jumper when possible Bonding screws have thread- forming threads and serrations under the head that remove the paint off mounting flanges and patch panels (RGTBSG-C) Bonding cage nuts have teeth that cut paint when installed (CBN4K) 16
- 17. • UTP28SP8IN** 20cm/8in •UTP28SP8IN**-48 Bulk pack • Switch Port Replication • No wire managers TIA-942: “Wrist strap ports should be attached to the rack…”
- 18. Grounding Problem Detection •Finding a grounding problem is incredibly simple. • Current (Amps) should be reading Zero (0) on all ground leads, horizontals and backbones. • What to do about it is the hard part.
- 19. Bond “one-end” or“both-ends” of a channel? Same Ground Potential
- 20.