MMICs, or Monolithic Microwave Integrated Circuits, are integrated circuits that operate at microwave frequencies between 300 MHz and 300 GHz. They are built on a single crystal and perform functions like microwave mixing, power amplification, and high frequency switching. MMICs are small, between 1-10 mm^2, can be mass produced, and allow cascading of multiple circuits without external matching networks. They are used in applications like communications, homeland security scanners, imaging and sensors, and new areas like automotive collision avoidance radar.

1. MMIC(Monolithic Microwave
integrated circuits)
ANKIT KUMAR PANDEY
M.TECH(2ND YR)
ALLAHABAD
UNIVERSITY
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2. Microwave Integrated Circuits
(MIC’s)
There are three types of circuit elements that either are used in chipform
or are fabricated in MIC. They are:
– Distributed transmission lines (microstrip, strip, etc.)
– Lumped elements (R, L. and C)
–Solid state devices (FETs, BJTs, diodes, etc.)
Two types of MICS are-
1. Hybrid Microwave Integrated Circuits (HMICs)
2. Monolithic Microwave Integrated Circuits (MMICs):
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3. MMIC (Monolithic Microwave integrated
circuits)
The world monolithic is derived from the Greek letter monos (Single) and lithos
(stone). Thus a monolithic integrated circuit is built on a single crystal.
MMICs, or Monolithic Microwave Integrated Circuits, are a type of integrated
circuit (IC) device that operates at microwave frequencies (300 MHz to 300 GHz).
These devices typically perform functions such as microwave mixing, power
amplification, low noise amplification, and high frequency switching.
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4.  MMICs are dimensionally small (from around 1 mm² to 10 mm²) and
can be mass produced, which has allowed the proliferation of high
frequency devices such as cellular phones.
 This makes them easier to use, as cascading of MMICs does not then
require an external matching network.
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5. Structure of Monolithic MIC
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7. Materials for Monolithic Microwave
Integrated Circuits
 Substrate material:- alumina, beryllia, ferrite/garnet, GaAs, glass,
rutile
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9. Conducting material:- aluminum, copper, gold, silver . It should have
following properties;
Dielectric films:- Al2O3, SiO, SiO2, Si3N4 and Ta2O5
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10. Resistive films:- Cr, Cr-SiO, NiCr, Ta and Ti
Resistive materials are used in MMIC for bias networks,
terminators and attenuators.
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11. Advantages of MMIC
 Low cost (because of the large quantities processed)
 Small size
 Light weight
 High reliability; all components are fabricated simultaneously
and there are no soldered joints.
 Improved reproducibility
 Improved performance
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12. Disadvantages of MMIC
 Processing difficulties.
 Low yields because of
 The effects of component tolerance & discontinuities.
 Trimming after fabrication is difficult.
 Inherent resistive losses.
 Small size limits heat dissipation.
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13. Applications of MMIC
 MMICs are suitable for space and military applications because they meet
the requirements for shock, temperature conditions, and severe
vibration. These are the major factor in the success of MMICs for
development of microwave solid state devices.
 Communications
 Next generation compact radio
 Optical and broadband microwave communications
 Homeland Security Scanners
 Portal security scanners
 Stand-off security cameras for public places
 Handheld detectors for police and special forces
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14.  Imaging & Sensors
 Missile sensors
 Environmental sensing
 Explosives
 Medical imaging
 New Applications
 Automotive collision avoidance radar
 Airport runway debris detection
 Helicopter & aircraft blind landing systems
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15. References;
 RFIC and MMIC Design and Technology published by
the IEE (London) ISBN 0-85296-786-1
 Practical MMIC Design published by Artech
House ISBN 1-59693-036-5 Author S. P. Marsh
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