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MEMS
Micro-Electro-Mechanical
Systems
By:-
Vikas poonia
(2013btec001L)
What is MEMS?
 Micro-Electro-Mechanical Systems
◦ is the integration of elements, sensors, actuators, and
electronics on a common silicon substrate through micro-
fabrication technology, a manufacturing technology for
making microscopic devices
◦ Other Materials used in MEMS
 Gallium Arsinide
 Titanium Nickel
 Piezoelectric Materials
Micro Electro Mechanical Systems
 Electrical
sensing/actuation
◦ Capacitive
◦ Piezoelectric
◦ Piezoresistive
 Mechanical devices with a
third dimension
 Systems
◦ Multiple functions on one piece
of silicon
IMD
AMFitzgerald
AMFitzgerald
Size of MEMS
Birth of MEMS
 1970’s: using silicon
processing to make
mechanical devices, not
transistors
◦ Accelerometers
◦ Pressure sensors
◦ Inkjet nozzles
 1982: Petersen’s
“Silicon as a
Mechanical Material”
Popular Science, June 1984
How MEMS are made!
 There are three main building blocks in
MEMS
 Deposition process
 The ability to deposit thin films of
material
 Lithography
 is typically the transfer of a
pattern to a photosensitive
material by selective exposure to
a radiation source such as light
 Etching Process
 Wet etching where the material is
dissolved when immersed in a
chemical solution
 Dry etching where the material is
sputtered or dissolved using
reactive ions or a vapor phase
etchant
MEMS is a miniaturization
technology
Airbag sensors (1980) Airbag sensors (2005)
MEMS belong where
miniaturization is needed
 Applications using MEMS devices:
◦ Automotive: pressure, motion, sound, light, heat
◦ Consumer: motion, sound, pressure, compass
◦ RF: filters, resonators, switches, inductors
◦ Optical: network components, displays, switches,
mirrors
◦ Medical devices: needles, cell scaffolds,
ultrasound, implantables
◦ Printing: inkjet, large format nozzles
◦ Biotech: lab-on-chip microfluidics
◦ Industrial: Atomic force microscopy, chemical
sensors
 Smaller, better, cheaper
◦ But not always all three!
 Sophisticated capabilities
in small form factor:
◦ Multiple sensors
◦ Signal processing and
analysis
◦ Telemetry capability
◦ Low power
Why MEMS are exciting for so
many applications
Integrated
Pressure
Sensor
MEMS
sensor
Stacked MEMS
and ASIC chips,
wirebonded
Applications of MEMS
• MEMS-based sensors are a crucial
component in automotive electronics,
medical equipment, smart portable
electronics such as cell phones.
• PDAs, and hard disk drives, computer
peripherals, and wireless devices.
• These sensors began in the automotive
industry especially for crash detection in
airbag systems.
Explosion of MEMS in
consumer devices
 Sophisticated capability in small form
factor enabling new functions
◦ Motion sensing -> gesture input,
navigation
◦ Microphone arrays -> noise cancellation
◦ Pressure sensing -> height detection
 At the right price!
◦ MEMS took off when chip price <$3
MEMS enable exciting new
products
MEMS are not like ICs
 Yes, both are made on silicon wafers
 No building block technology, i.e. no
transistor
◦ Moore’s law does not apply
◦ No standardization of design, processes,
or materials
◦ Each MEMS is custom-crafted
 “One product, one process, one package”
What this implies
 MEMS prices will not decrease as fast
as IC chips did
 MEMS sensor performance will not
improve as fast as microprocessors,
memory chips did
 Chip packaging usually critical to
MEMS performance
 System integration can be more
challenging
Expected
Characteristics of MEMS
 In the future, MEMS
Technology compared
to Conventional
Technology should have
these effects:
◦ Cost reduction
◦ Increase functionality
◦ Improve reliability
◦ Decrease size
◦ Decrease mass
THANK YOU

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mems tech

  • 2. What is MEMS?  Micro-Electro-Mechanical Systems ◦ is the integration of elements, sensors, actuators, and electronics on a common silicon substrate through micro- fabrication technology, a manufacturing technology for making microscopic devices ◦ Other Materials used in MEMS  Gallium Arsinide  Titanium Nickel  Piezoelectric Materials
  • 3. Micro Electro Mechanical Systems  Electrical sensing/actuation ◦ Capacitive ◦ Piezoelectric ◦ Piezoresistive  Mechanical devices with a third dimension  Systems ◦ Multiple functions on one piece of silicon IMD AMFitzgerald AMFitzgerald
  • 5. Birth of MEMS  1970’s: using silicon processing to make mechanical devices, not transistors ◦ Accelerometers ◦ Pressure sensors ◦ Inkjet nozzles  1982: Petersen’s “Silicon as a Mechanical Material” Popular Science, June 1984
  • 6. How MEMS are made!  There are three main building blocks in MEMS  Deposition process  The ability to deposit thin films of material  Lithography  is typically the transfer of a pattern to a photosensitive material by selective exposure to a radiation source such as light  Etching Process  Wet etching where the material is dissolved when immersed in a chemical solution  Dry etching where the material is sputtered or dissolved using reactive ions or a vapor phase etchant
  • 7. MEMS is a miniaturization technology Airbag sensors (1980) Airbag sensors (2005)
  • 8. MEMS belong where miniaturization is needed  Applications using MEMS devices: ◦ Automotive: pressure, motion, sound, light, heat ◦ Consumer: motion, sound, pressure, compass ◦ RF: filters, resonators, switches, inductors ◦ Optical: network components, displays, switches, mirrors ◦ Medical devices: needles, cell scaffolds, ultrasound, implantables ◦ Printing: inkjet, large format nozzles ◦ Biotech: lab-on-chip microfluidics ◦ Industrial: Atomic force microscopy, chemical sensors
  • 9.  Smaller, better, cheaper ◦ But not always all three!  Sophisticated capabilities in small form factor: ◦ Multiple sensors ◦ Signal processing and analysis ◦ Telemetry capability ◦ Low power Why MEMS are exciting for so many applications Integrated Pressure Sensor MEMS sensor Stacked MEMS and ASIC chips, wirebonded
  • 10. Applications of MEMS • MEMS-based sensors are a crucial component in automotive electronics, medical equipment, smart portable electronics such as cell phones. • PDAs, and hard disk drives, computer peripherals, and wireless devices. • These sensors began in the automotive industry especially for crash detection in airbag systems.
  • 11. Explosion of MEMS in consumer devices  Sophisticated capability in small form factor enabling new functions ◦ Motion sensing -> gesture input, navigation ◦ Microphone arrays -> noise cancellation ◦ Pressure sensing -> height detection  At the right price! ◦ MEMS took off when chip price <$3
  • 12. MEMS enable exciting new products
  • 13.
  • 14.
  • 15. MEMS are not like ICs  Yes, both are made on silicon wafers  No building block technology, i.e. no transistor ◦ Moore’s law does not apply ◦ No standardization of design, processes, or materials ◦ Each MEMS is custom-crafted  “One product, one process, one package”
  • 16. What this implies  MEMS prices will not decrease as fast as IC chips did  MEMS sensor performance will not improve as fast as microprocessors, memory chips did  Chip packaging usually critical to MEMS performance  System integration can be more challenging
  • 17. Expected Characteristics of MEMS  In the future, MEMS Technology compared to Conventional Technology should have these effects: ◦ Cost reduction ◦ Increase functionality ◦ Improve reliability ◦ Decrease size ◦ Decrease mass